TWM454585U - Touch control panel device and a transparent conductive substrate - Google Patents
Touch control panel device and a transparent conductive substrate Download PDFInfo
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Description
本新型是有關於一種面板裝置及透明導電基板,特別是指一種觸控面板裝置及其透明導電基板。The present invention relates to a panel device and a transparent conductive substrate, and more particularly to a touch panel device and a transparent conductive substrate thereof.
觸控面板廣泛應用於各種電子產品中,其中例如中華民國專利1235623號專利案,揭露一種以金屬鍍膜技術在觸控面板上布設電路的方式,該案主要是利用銀作為靶材,並以濺鍍方式於透明導電基板上布設銀導線所形成的電控線路,此即為一種圖案化的導線層。但由於銀靶材的價格較高,若為了生產成本之考量,除了銀靶材以外,也可以使用價格較便宜的銅靶材並透過濺鍍方式形成導線層。此外,鍍膜材料還可以為銅鎳合金、鈦、鋁等材料。The touch panel is widely used in various electronic products, for example, the Patent No. 1235623 of the Republic of China discloses a method of laying a circuit on a touch panel by a metal plating technique, which mainly uses silver as a target and splashes. The electroplating method is an electronic control circuit formed by disposing a silver wire on a transparent conductive substrate, which is a patterned wire layer. However, due to the high price of the silver target, in addition to the silver target, in addition to the silver target, a relatively inexpensive copper target can be used and the wiring layer can be formed by sputtering. In addition, the coating material may also be a material such as copper-nickel alloy, titanium or aluminum.
而布設有圖案化導線層的導電基板後續還要與軟性電路板(FPC)結合,結合過程主要是在軟性電路板的底面塗布異方性導電黏膠(ACF),並將該軟性電路板置於該導線層的上方,後續透過加壓加熱的方式將該軟性電路板與該透明導電基板的金屬導線相對熱壓貼合,即完成黏著結合的製程,且該導線層與該軟性電路板之間可透過該異方性導電黏膠形成電連接。但由於該導線層的厚度薄,通常為120~170nm左右,而透明導電膜基板通常為PET等透明塑膠材質,容易因前述加壓過程中受到上方的軟性電路板壓迫而造成熱變形,所述熱變形量多半超過100nm,並因此容易導致鍍膜金屬導線層斷裂。如此將影響該導線層與其 它膜層間的導電效果,進而影響產品可靠度。The conductive substrate with the patterned conductive layer is subsequently combined with a flexible circuit board (FPC). The bonding process is mainly to apply an anisotropic conductive adhesive (ACF) on the bottom surface of the flexible circuit board, and the flexible circuit board is placed. Above the wire layer, the flexible circuit board and the metal wire of the transparent conductive substrate are pressed against each other by pressure heating, that is, the adhesive bonding process is completed, and the wire layer and the flexible circuit board are The electrical connection can be made through the anisotropic conductive adhesive. However, since the thickness of the wire layer is thin, it is usually about 120 to 170 nm, and the transparent conductive film substrate is usually made of a transparent plastic material such as PET, and is easily deformed by the compression of the upper flexible circuit board during the pressing process. The amount of thermal deformation is mostly more than 100 nm, and thus it is easy to cause the coated metal wire layer to break. This will affect the wire layer and its The conductive effect between the layers affects product reliability.
因此,本新型之目的,即在提供一種具有良好導電性,且產品可靠度高的透明導電基板及觸控面板裝置。Therefore, the object of the present invention is to provide a transparent conductive substrate and a touch panel device having good electrical conductivity and high product reliability.
於是,本新型透明導電基板,包含:一基材、一位於該基材上的透明導電層、一導線層,及一導電膠層。Thus, the novel transparent conductive substrate comprises: a substrate, a transparent conductive layer on the substrate, a wire layer, and a conductive adhesive layer.
該基材包括一可視區,以及一圍繞該可視區的邊框區。該導線層對應該基材的邊框區地位於該透明導電層上,並包括數個間隔的第一導電區。該導電膠層位於該導線層上,並包括數個間隔且分別覆蓋該等第一導電區的導電部,每一導電部具有一覆蓋在相對應的該第一導電區上的本體,以及一連接在該本體周圍並包覆在相對應的該第一導電區周圍的延伸體。The substrate includes a viewing zone and a bezel zone surrounding the viewing zone. The wire layer is located on the transparent conductive layer corresponding to the frame area of the substrate, and includes a plurality of spaced first conductive regions. The conductive adhesive layer is disposed on the wire layer, and includes a plurality of conductive portions spaced apart from each other to cover the first conductive regions, each conductive portion having a body covering the corresponding first conductive region, and a body An extension connected around the body and wrapped around the corresponding first conductive region.
本新型觸控面板裝置包含:一個如上述的透明導電基板,及一結合在該透明導電基板的導電膠層上的軟性電路板。該軟性電路板包括數個分別對應且接觸該導電膠層的該等導電部的第二導電區。The touch panel device of the present invention comprises: a transparent conductive substrate as described above, and a flexible circuit board bonded to the conductive adhesive layer of the transparent conductive substrate. The flexible circuit board includes a plurality of second conductive regions respectively corresponding to and contacting the conductive portions of the conductive adhesive layer.
本新型之功效:藉由該導電膠層的創新結構設計,可以將各個第一導電區一一包覆住,進而使各層體之間維持良好的導電效果,並使產品具有良好的可靠度。The effect of the novel: by the innovative structural design of the conductive adhesive layer, each of the first conductive regions can be covered one by one, thereby maintaining a good electrical conduction effect between the layers, and the product has good reliability.
有關本新型之前述及其他技術內容、特點與功效,在以下配合參考圖式之一個較佳實施例的詳細說明中,將可清楚的呈現。The foregoing and other technical aspects, features and advantages of the present invention will be apparent from the following description of the preferred embodiments.
參閱圖1、2、3,本新型觸控面板裝置之較佳實施例包含:一透明導電基板1,及一軟性電路板(FPC)2。Referring to FIGS. 1 and 2, a preferred embodiment of the touch panel device includes a transparent conductive substrate 1 and a flexible circuit board (FPC) 2.
該透明導電基板1包括一基材3、一透明導電層4、一導線層5,及一導電膠層6。該基材3為可透光的玻璃基材或塑膠基材,本實施例是使用聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)基材,可透光且具有撓性,但實施時不限於此。該基材3包括一可視區31,及一圍繞在該可視區31的周圍的邊框區32。該可視區31對應於顯示器之畫面顯示部位,該邊框區32可在該透明導電基板1與其他元件組裝構成顯示器時被顯示器邊框遮蔽住。The transparent conductive substrate 1 includes a substrate 3, a transparent conductive layer 4, a wire layer 5, and a conductive adhesive layer 6. The substrate 3 is a light transmissive glass substrate or a plastic substrate. In this embodiment, a polyethylene terephthalate (PET) substrate is used, which is transparent and flexible, but is implemented. Not limited to this. The substrate 3 includes a viewing zone 31 and a bezel area 32 surrounding the viewing zone 31. The visible area 31 corresponds to a screen display portion of the display, and the frame area 32 can be shielded by the display frame when the transparent conductive substrate 1 and other components are assembled to form a display.
該透明導電層4位於該基材3上,其範圍涵蓋該可視區31與該邊框區32。該透明導電層4為金屬氧化物薄膜,其材料例如氧化銦錫(ITO)、氧化鋁鋅(AZO)、氧化鎵鋅(GZO)…等等,該透明導電層4用於傳遞電訊號,並且利用具有高度透光性的材料製成,可提升顯示器的亮度。The transparent conductive layer 4 is located on the substrate 3 and covers the visible area 31 and the frame area 32. The transparent conductive layer 4 is a metal oxide film, such as indium tin oxide (ITO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), etc., the transparent conductive layer 4 is used for transmitting electrical signals, and Made of a highly translucent material that enhances the brightness of the display.
該導線層5對應該基材3的邊框區32地位於該透明導電層4上,並包括數個間隔的第一導電區51,以及數個連接該等第一導電區51的導線52。該導線層5的材料例如銅或銅鎳合金,使用銅導線層具有良好的導電效能,使用銅鎳合金導線層則能進一步地提升硬度與耐蝕性。The wire layer 5 is located on the transparent conductive layer 4 corresponding to the frame region 32 of the substrate 3, and includes a plurality of spaced first conductive regions 51, and a plurality of wires 52 connecting the first conductive regions 51. The material of the wire layer 5, such as copper or copper-nickel alloy, has good electrical conductivity using a copper wire layer, and the use of a copper-nickel alloy wire layer can further improve hardness and corrosion resistance.
需要說明的是,實際上為了配合觸控面板之電訊號傳導設計,該透明導電層4與該導線層5都是圖案化設計,但由於其圖案結構非本新型的改良重點,在此不詳細說明,圖式也只是示意繪出,並非用於限制本新型。It should be noted that, in order to cooperate with the telecommunication design of the touch panel, the transparent conductive layer 4 and the wire layer 5 are both patterned, but the pattern structure is not the improvement focus of the present invention, and is not detailed here. The drawings are only schematic and not intended to limit the present invention.
該導電膠層6位於該導線層5上,並包括數個間隔且分別覆蓋該等第一導電區51的導電部61,每一導電部61具有一覆蓋在相對應的該第一導電區51上的本體611,以及一連接在該本體611周圍並包覆在相對應的該第一導電區51周圍的延伸體612,藉由該延伸體612的設計可以使每一導電部61將相對應的該第一導電區51完全包覆於其中。較佳地,該延伸體612突出於該本體611的長度L大於0.05mm,藉此可確保該等導電部61達成上述的完全包覆效果。The conductive adhesive layer 6 is disposed on the conductive layer 5 and includes a plurality of conductive portions 61 spaced apart from each other and covering the first conductive regions 51. Each conductive portion 61 has a covering portion corresponding to the first conductive region 51. The upper body 611, and an extension 612 connected around the body 611 and wrapped around the corresponding first conductive region 51, by the design of the extension 612, each conductive portion 61 will be corresponding The first conductive region 51 is completely covered therein. Preferably, the extension body 612 protrudes from the body 611 by a length L of more than 0.05 mm, thereby ensuring that the conductive portions 61 achieve the above-mentioned complete coating effect.
該導電膠層6的材料例如高分子導電材料,所述高分子導電材料可以為一般兼具導電性與黏性的高分子材料,也可以使用由樹脂與導電粒子混合而形成的異方性導電膠(Anisotropic Conductive Film,ACF)。由於本新型之導電膠層6不一定要具有異方向導電特性,而且ACF的成本較高,因此該導電膠層6可以使用一般具黏性的高分子導電材料,可達到成本低的優點。若該導電膠層6使用ACF則可因為其在垂直方向(即上下方向)可導電,以使該等第一導電區51與該軟性電路板2形成電連接,而ACF在水平方向上的絕緣特性,可以輔助避免原本就互相間隔的該等第一導電區51導通。The material of the conductive adhesive layer 6 is, for example, a polymer conductive material, and the polymer conductive material may be a polymer material generally having both conductivity and viscosity, or an anisotropic conductive material formed by mixing a resin and conductive particles. Anisotropic Conductive Film (ACF). Since the conductive adhesive layer 6 of the present invention does not have to have the opposite-direction conductive property, and the cost of the ACF is high, the conductive adhesive layer 6 can use a generally viscous polymer conductive material, which can achieve the advantage of low cost. If the conductive adhesive layer 6 uses ACF, it can be electrically conductive in the vertical direction (ie, the up and down direction), so that the first conductive regions 51 are electrically connected to the flexible circuit board 2, and the ACF is insulated in the horizontal direction. The characteristics can assist in avoiding the conduction of the first conductive regions 51 which are originally spaced apart from each other.
該軟性電路板2結合在該導電膠層6上,並包括一朝向該基材3的結合面21,以及數個位於該結合面21上的第二導電區22。該等第二導電區22分別對應且接觸該導電膠層6的該等導電部61,也分別對應該等第一導電區51,而 且第二導電區22與第一導電區51之間分別藉由該等導電部61形成電連接。The flexible circuit board 2 is bonded to the conductive adhesive layer 6, and includes a bonding surface 21 facing the substrate 3, and a plurality of second conductive regions 22 on the bonding surface 21. The second conductive regions 22 respectively correspond to and contact the conductive portions 61 of the conductive adhesive layer 6, and respectively correspond to the first conductive regions 51, and The second conductive region 22 and the first conductive region 51 are electrically connected by the conductive portions 61, respectively.
本新型在製作時,首先在該基材3上依序形成該透明導電層4及該導線層5,並且於該導線層5的該等第一導電區51上分別塗布該導電膠層6的該等導電部61,接著將該軟性電路板2覆蓋在該基材3上方,並使該軟性電路板2的該等第二導電區22分別對應該等導電部61,此時透過一圖未示出的加壓設備將該軟性電路板2朝該基材3壓合,而且在此過程中維持一定以上的溫度,以使該導電膠層6軟化。當壓合後且該導電膠層6冷卻固化後,該軟性電路板2與該基材3即黏著固定住。The transparent conductive layer 4 and the wire layer 5 are sequentially formed on the substrate 3, and the conductive adhesive layer 6 is coated on the first conductive regions 51 of the wire layer 5, respectively. The conductive portions 61 are then overlaid on the substrate 3, and the second conductive regions 22 of the flexible circuit board 2 respectively correspond to the conductive portions 61. The pressurizing apparatus shown presses the flexible circuit board 2 toward the substrate 3, and maintains a certain temperature or higher during this process to soften the conductive paste layer 6. After the pressing and the conductive adhesive layer 6 is cooled and solidified, the flexible circuit board 2 and the substrate 3 are adhered and fixed.
其中,由於該等導電部61將該等第一導電區51包覆住,可以減少熱壓合製程後該等第一導電區51的斷裂問題。正因為該等導電部61將該等第一導電區51完全覆蓋,而且該等導電部61具有黏性而能與該基材3固定黏著結合,該等導電部61不會有脫落之虞,因此即使第一導電區51斷裂後仍可受到該等導電部61包覆住,該等導電部61同樣具有導電功能,所以電訊號的傳遞不會受到影響。而且導電部61之間為間隔設置,使導電部61之間或第一導電區51之間不會有短路問題。Wherein, because the conductive portions 61 cover the first conductive regions 51, the problem of fracture of the first conductive regions 51 after the thermocompression bonding process can be reduced. Because the conductive portions 61 completely cover the first conductive regions 51, and the conductive portions 61 have adhesiveness and can be fixedly bonded to the substrate 3, the conductive portions 61 do not fall off. Therefore, even if the first conductive region 51 is broken, it can be covered by the conductive portions 61. The conductive portions 61 also have a conductive function, so the transmission of the electrical signal is not affected. Further, the conductive portions 61 are spaced apart from each other so that there is no short-circuit problem between the conductive portions 61 or between the first conductive regions 51.
綜上所述,藉由該導電膠層6的創新結構設計,可以將各個第一導電區51一一包覆住,使該透明導電基板1與該軟性電路板2經由熱壓合製程結合後,各層體之間仍可穩固地連接且維持良好的導電效果,並使產品具有良好的 可靠度。In summary, by the innovative structural design of the conductive adhesive layer 6, each of the first conductive regions 51 can be covered one by one, so that the transparent conductive substrate 1 and the flexible circuit board 2 are combined via a thermocompression bonding process. , the layers can still be firmly connected and maintain good electrical conductivity, and the product has good Reliability.
惟以上所述者,僅為本新型之較佳實施例而已,當不能以此限定本新型實施之範圍,即大凡依本新型申請專利範圍及新型說明內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent.
1‧‧‧透明導電基板1‧‧‧Transparent conductive substrate
2‧‧‧軟性電路板2‧‧‧Soft circuit board
21‧‧‧結合面21‧‧‧ joint surface
22‧‧‧第二導電區22‧‧‧Second conductive area
3‧‧‧基材3‧‧‧Substrate
31‧‧‧可視區31‧‧‧visible area
32‧‧‧邊框區32‧‧‧Border area
4‧‧‧透明導電層4‧‧‧Transparent conductive layer
5‧‧‧導線層5‧‧‧ wire layer
51‧‧‧第一導電區51‧‧‧First conductive area
52‧‧‧導線52‧‧‧Wire
6‧‧‧導電膠層6‧‧‧Electrical adhesive layer
61‧‧‧導電部61‧‧‧Electrical Department
611‧‧‧本體611‧‧‧Ontology
612‧‧‧延伸體612‧‧‧Extensions
L‧‧‧長度L‧‧‧ length
圖1是本新型觸控面板裝置之一較佳實施例的俯視分解示意圖;圖2是該較佳實施例的俯視組合示意圖;及圖3是沿圖2的3-3線所取的該較佳實施例的局部組合剖視示意圖。1 is a top plan exploded view of a preferred embodiment of the touch panel device of the present invention; FIG. 2 is a top plan view of the preferred embodiment; and FIG. 3 is a view taken along line 3-3 of FIG. A schematic cross-sectional view of a partial combination of a preferred embodiment.
1‧‧‧透明導電基板1‧‧‧Transparent conductive substrate
2‧‧‧軟性電路板2‧‧‧Soft circuit board
21‧‧‧結合面21‧‧‧ joint surface
22‧‧‧第二導電區22‧‧‧Second conductive area
3‧‧‧基材3‧‧‧Substrate
32‧‧‧邊框區32‧‧‧Border area
4‧‧‧透明導電層4‧‧‧Transparent conductive layer
5‧‧‧導線層5‧‧‧ wire layer
51‧‧‧第一導電區51‧‧‧First conductive area
6‧‧‧導電膠層6‧‧‧Electrical adhesive layer
61‧‧‧導電部61‧‧‧Electrical Department
611‧‧‧本體611‧‧‧Ontology
612‧‧‧延伸體612‧‧‧Extensions
L‧‧‧長度L‧‧‧ length
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI488101B (en) * | 2013-06-20 | 2015-06-11 | Focaltech Systems Ltd | Capacitive touch screen and method for making the same |
TWI684121B (en) * | 2019-01-22 | 2020-02-01 | 大陸商業成科技(成都)有限公司 | Curved surface self-alignment bonding device and method thereof |
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2013
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI488101B (en) * | 2013-06-20 | 2015-06-11 | Focaltech Systems Ltd | Capacitive touch screen and method for making the same |
TWI684121B (en) * | 2019-01-22 | 2020-02-01 | 大陸商業成科技(成都)有限公司 | Curved surface self-alignment bonding device and method thereof |
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Legal Events
Date | Code | Title | Description |
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MM4K | Annulment or lapse of a utility model due to non-payment of fees |