WO2021185237A1 - Ensemble carte de circuit imprimé et dispositif électronique - Google Patents

Ensemble carte de circuit imprimé et dispositif électronique Download PDF

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Publication number
WO2021185237A1
WO2021185237A1 PCT/CN2021/081029 CN2021081029W WO2021185237A1 WO 2021185237 A1 WO2021185237 A1 WO 2021185237A1 CN 2021081029 W CN2021081029 W CN 2021081029W WO 2021185237 A1 WO2021185237 A1 WO 2021185237A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
wall
shielding
frame
shielding frame
Prior art date
Application number
PCT/CN2021/081029
Other languages
English (en)
Chinese (zh)
Inventor
叶润清
曲林
洪伟强
丁海幸
Original Assignee
华为技术有限公司
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Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021185237A1 publication Critical patent/WO2021185237A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out

Definitions

  • This application relates to the technical field of circuit board stacking, and in particular to a circuit board assembly and electronic equipment.
  • the present application provides a circuit board assembly and electronic equipment, which can improve the device integration of the circuit board.
  • a circuit board assembly in a first aspect, is provided, and the circuit board assembly can be installed in an electronic device.
  • the circuit board assembly includes a first circuit board, a second circuit board, a first shielding frame and a conductive element; the first circuit board and the second circuit board are laminated at intervals, and the first shielding frame connects the first circuit board and the second circuit board ,
  • the periphery of the first shielding frame is in contact with the periphery of the first circuit board, or the periphery of the first shielding frame is retracted within a certain distance from the periphery of the first circuit board, the first circuit board, the second circuit board and the first shielding frame Enclosed into a cavity; the conductive element is arranged in the cavity and is electrically connected with the first circuit board and the second circuit board.
  • the first circuit board and the second circuit board can be parallel or approximately parallel (the thickness directions of the two are the same or substantially the same), and the two overlap each other and have a gap.
  • the shape of the first circuit board and the second circuit board And the relative size is not limited.
  • Various devices can be arranged on the opposite sides of the first circuit board and the second circuit board.
  • the first shielding frame can be formed by connecting several segments of frame bodies end to end.
  • the first shielding frame can also be a cylindrical structure with two ends open, and the two openings are respectively facing the first circuit board and the second circuit board.
  • the periphery of the first shield frame may be substantially aligned with and contact the periphery of the first circuit board; or the periphery of the first shield frame may be located at a certain distance within the periphery (ie, contour boundary) of the first circuit board.
  • the first shield frame is close to the end of the second circuit board, and the position on the second circuit board is not limited.
  • the periphery of this end is substantially aligned with and in contact with the periphery of the second circuit board; or the periphery of this end may be located on the second circuit board. A certain distance within the periphery of the circuit board.
  • the first circuit board, the second circuit board and the first shielding frame enclose a closed cavity (closed means that the cavity has no openings, and does not mean that it is airtight), and devices and conductive parts are arranged in the cavity. It can be used as a shielding cavity to electromagnetically shield the devices and conductive parts in it.
  • the conductive element is spaced apart from the first screen shield frame. There are a number of conductive channels (specific structures such as conductive lines, conductive pins, etc.) inside the conductive member, and the first circuit board and the second circuit board are conducted through the conductive channels to realize signal conduction of the entire circuit board assembly.
  • the specific structure of the conductive element is not limited, as long as it can be electrically connected.
  • the conductive element has a certain supporting effect on the first circuit board.
  • the circuit board assembly of the present application uses conductive elements to realize the stacking interval and electrical connection between the first circuit board and the second circuit board, which can utilize the thickness space of electronic equipment to increase the number of circuit boards, thereby increasing device layout area and improving device integration Spend.
  • the first shielding frame By arranging the first shielding frame near the edge of the first circuit board, the first shielding frame with greater structural strength can be used to support the first circuit board, avoiding stress failure at the edge of the first circuit board, and improving the mechanical performance of the circuit board assembly. reliability.
  • Arranging the first shielding frame close to the edge of the first circuit board can not only ensure the electromagnetic shielding performance, but also improve the area utilization rate of the first circuit board and ensure the integration of devices.
  • the thickness of the first shield frame is small (usually only 0.15 mm), and the area occupied by the first circuit board and the second circuit board is also small.
  • the conductive member is a bumper plate, and the conductive member has a first surface facing the first circuit board and a second surface facing the second circuit board. Both surfaces have only one closed boundary, the first surface is welded to the first circuit board, and the second surface is welded to the second circuit board.
  • the bumper board may be a printed circuit board (Printed circuit board, PCB), which has the same or substantially the same structure as a conventional printed circuit board, and has internal wiring for electrical connection. Only one closed boundary means that the contour boundary of the elevated slab is a closed curve instead of containing two or more closed curves, that is, the elevated slab is a solid slab without holes.
  • the shape of the pad can be designed as required, such as rectangular, cross-shaped, T-shaped or other irregular shapes.
  • the pad can be made by cutting the whole circuit substrate. Because it is a solid board, there is no need to remove unnecessary circuit substrate materials during cutting, so the waste of circuit substrate materials is small, and the area utilization rate of the circuit substrate is large. In addition, the solid pad occupies a small area of the first circuit board and the second circuit board, which can save area to arrange more devices. In addition, since the edge stress of the first circuit board is relatively large, the internal stress is relatively small. By placing the elevated board inside the first circuit board, the stress of the elevated board can be reduced, and the reliable operation of the elevated board can be ensured.
  • the conductive member may also be other block-shaped or plate-shaped components with electrical connection properties, for example, a ceramic substrate manufactured by a low-temperature co-fired ceramic (LTCC) process.
  • the ceramic substrate It has conductive circuits; or punches holes in plastic or glass materials, and fills the holes with plate-shaped or block-shaped parts made of metal materials, where the metal materials are used to realize electrical connections.
  • the conductive member may also be a non-plate-shaped conductive member such as a conductive post and a connector.
  • the conductive member includes a base, a first elastic leg, and a second elastic leg, and the first elastic leg is protrudingly provided on a surface of the base facing the first circuit board ,
  • the second spring leg is protrudingly provided on the surface of the base facing the second circuit board, the first spring leg and the second spring leg are electrically connected through the base, the first spring leg is electrically connected with the first circuit board, and the second spring leg is electrically connected with The second circuit board is electrically connected.
  • the conductive member can be referred to as a shrapnel plate.
  • the base may be in a block shape or a plate shape, and has a circuit for signal conduction inside it; or, the base itself has no electrical connection performance, and it is only used to hold the first elastic leg and the second elastic leg.
  • the first spring leg is electrically connected to the second spring leg through the base; for a base that only has a holding function, the first spring leg and the second spring leg can be opposite to the same spring leg Both ends.
  • the first elastic leg and the second elastic leg can be welded or directly abutted with the corresponding circuit board to realize the conduction with the corresponding circuit board.
  • the shape of the first elastic foot and the second elastic foot can be designed according to requirements, for example, a sheet shape.
  • a shrapnel board is used to realize the stacked interconnection of the first circuit board and the second circuit board, which provides another alternative solution for increasing the device layout area and improving the device integration.
  • the electrical connection performance of the shrapnel board is reliable, and the signal stability of the entire circuit board assembly can be ensured.
  • the structure and manufacturing process of the shrapnel plate are relatively simple, which is convenient for mass production and saves costs.
  • the surface of the first circuit board facing the base is recessed to form a first limiting groove, and the base partially extends into the first limiting groove; and/or A surface area of the second circuit board facing the base is recessed to form a second limiting groove, and the base part extends into the second limiting groove.
  • the specific shape of the first limiting slot and the specific position on the first circuit board can be designed as required, and are not limited.
  • the base part protruding into the first limiting slot forms a fit with the first limiting slot to realize the limiting of the elastic plate and ensure that the first elastic leg can be reliably connected to the first circuit board.
  • the first elastic leg may be in the first limiting slot or outside the first limiting slot.
  • the specific shape of the second limiting slot and the specific position on the second circuit board can be designed according to requirements, and are not limited.
  • the base part that extends into the second limiting slot forms a fit with the second limiting slot to realize the limiting of the elastic plate and ensure that the second elastic leg can be reliably connected to the second circuit board.
  • the second elastic foot may be in the second limiting slot or outside the second limiting slot.
  • the first spring leg is received in the first limiting slot and contacts the bottom wall of the first limiting slot; and/or, the second spring leg is received in Inside the second limiting groove and contacting the bottom wall of the second limiting groove.
  • the first elastic leg and/or the second elastic leg are housed in the corresponding limit slot, which can ensure that the elastic leg is more stably connected with the corresponding circuit board, and the reliability of the electrical connection is improved.
  • the first shield frame is located between the first circuit board and the second circuit board, that is, the first shield frame is all located on the first circuit board and the second circuit board. Between the boards, it plays a role of supporting the first circuit board.
  • Such a first shielding frame has a simple structure, good mechanical reliability and electromagnetic shielding performance, and can improve the mass production of circuit board components.
  • the first shield frame includes a first wall, a second wall, and a third wall, and the first wall, the second wall, and the third wall are formed by bending and connecting in sequence Step, the first wall surrounds the outside of the first circuit board, the second wall is supported on the periphery of the surface of the first circuit board facing the second circuit board, and the third wall is located between the first circuit board and the second circuit board.
  • the second wall is located between the first wall and the third wall, the first wall and the second wall can be bent and connected substantially perpendicularly, and the second wall and the third wall can be bent and connected substantially perpendicularly, thereby forming Steps.
  • the first wall, the second wall and the third wall all surround a circle, and the opening enclosed by the first wall is larger than the opening enclosed by the third wall.
  • This type of first shielding frame uses the first wall to limit the first circuit board, the second wall to carry the first circuit board, and the third wall to support the first circuit board, so that the first circuit board It is firmly installed without deviation, and the assembly strength of the first shield frame and the first circuit board is increased.
  • this kind of first shielding frame is convenient for arranging the connecting material (adhesive or solder) on the side of the first circuit board, which can reduce the occupation of the device layout area of the first circuit board, so that the saved area can be more arranged. Multiple devices, thus further improving the device integration of the first circuit board.
  • an end of the first wall away from the second wall protrudes from the surface of the first circuit board facing away from the second circuit board;
  • the circuit board assembly includes a first shielding film, The first shielding film covers an end of the first wall away from the second wall and the first circuit board, and the first shielding film is opposite to the first circuit board at intervals.
  • the convex direction of the end of the first wall away from the second wall can be substantially perpendicular to the first circuit board, or form a suitable obtuse angle with the first circuit board, which facilitates the processing of the first shield frame and the installation of the first shielding film on the The end of the first wall away from the second wall.
  • the first shielding film is thin and can be bent.
  • the first shielding film is used for electromagnetic shielding. Since the first shielding film is suspended above the first circuit board, the area occupied on the surface of the first circuit board is reduced, so that more devices can be arranged in the saved area, thus further improving the device integration of the first circuit board. Spend.
  • a positioning notch is provided on the first wall, and the positioning notch penetrates the first wall along the thickness direction of the first circuit board, and a positioning protrusion is formed on the side of the first circuit board. , The positioning protrusion is inserted into the positioning notch.
  • the positioning gap makes the first wall form a gap structure similar to a city wall.
  • the shape, size, and number of the positioning gap are designed according to requirements, and the implementation manner is not limited.
  • the side surface of the first circuit board refers to the surface connected between the device placement surfaces.
  • the protrusion direction of the positioning protrusion on the side surface may be substantially perpendicular to the side surface, and the shape, size and number of the positioning protrusion are adapted to the shape, size and number of the positioning notch.
  • a positioning protrusion is correspondingly inserted into a positioning notch.
  • the positioning notch can position the first circuit board, so that the first circuit board can be accurately placed in place.
  • the matching structure of the positioning notch and the positioning protrusion can also increase assembly reliability and structural strength.
  • the first wall is provided with positioning protrusions protruding toward the surface of the first circuit board, the side surface of the first circuit board is recessed to form positioning grooves, and the positioning protrusions Insert the positioning groove.
  • the positioning protrusions can be substantially perpendicular to the surface of the first wall facing the first circuit board, and the shape, size and number of the positioning protrusions can be designed according to requirements and are not limited.
  • the positioning protrusions can be evenly distributed and circle around.
  • the shape, size and number of the positioning grooves are adapted to the shape, size and number of the positioning protrusions.
  • a positioning protrusion is correspondingly inserted into a positioning notch.
  • the first shield frame includes a fourth wall and a fifth wall, the fourth wall and the fifth wall are bent and connected, and the fourth wall covers the first circuit board away from The peripheral edge of the surface of the second circuit board, and the fifth wall surrounds the outer periphery of the first circuit board.
  • the fourth wall and the fifth wall are bent and connected substantially perpendicularly.
  • the fourth wall contacts the peripheral edge of the surface of the first circuit board away from the second circuit board and surrounds it.
  • the fifth wall is located outside the first circuit board and surrounds the first circuit board.
  • the opening enclosed by the fourth wall is smaller than that of the fifth wall.
  • the first shield frame forms an inverted structure that is crimped on the first circuit board. Such a first shielding frame can better limit the first circuit board and increase the assembly strength of the first shielding frame and the first circuit board.
  • the position of the fifth wall on the second circuit board is also moved to the outside of the second circuit board, so that the first circuit board, the first shielding frame and the second circuit board are enclosed.
  • the resulting cavity is larger, and more devices can be arranged in the cavity, thus improving the integration of devices in the cavity.
  • the first shield frame includes a sixth wall, the sixth wall, the fourth wall, and the fifth wall are sequentially bent and connected to form a step, and the sixth wall protrudes from The surface of the first circuit board facing away from the second circuit board;
  • the circuit board assembly includes a second shielding film, the second shielding film covers the end of the sixth wall away from the fourth wall and the first circuit board, the second shielding film and the first circuit board With intervals.
  • the sixth wall and the fifth wall are respectively located on opposite sides of the fourth wall, and the sixth wall and the fourth wall may be bent and connected substantially perpendicularly, or form a suitable obtuse angle.
  • the sixth wall is located on the periphery of the surface.
  • the second shielding film is thin and can be bent.
  • the second shielding film is used for electromagnetic shielding. Since the second shielding film is suspended above the first circuit board, the area occupied by the surface of the first circuit board is reduced, so that more devices can be arranged in the saved area, thus further improving the device integration of the first circuit board Spend.
  • the first shield frame includes a connecting wall, the connecting wall and the fifth wall are connected by bending, the fifth wall is located between the connecting wall and the fourth wall, and the connecting wall It is laid on the second circuit board and fixedly connected with the second circuit board.
  • the connecting wall and the fifth wall can be bent and connected substantially perpendicularly, and contact the surface of the second circuit board facing the first circuit board.
  • a number of connecting holes can be opened on the connecting wall, and a connecting piece (such as screws, bolts, rivets, etc.) can be installed in each connecting hole, and the connecting piece fixedly connects the connecting wall with the second circuit board.
  • a connecting material such as glue or solder
  • a connecting piece may be used instead of the connecting piece to realize the connection between the second circuit board and the connecting wall, which can also ensure the stable assembly of the first circuit board and the second circuit board.
  • the circuit board assembly includes a second shielding frame, the second shielding frame is provided in the cavity and connected to the first shielding frame as a whole, and the second shielding frame is connected to the first shielding frame.
  • a circuit board and a second circuit board are both connected, the second shielding frame separates the cavity into different sub-cavities, and the conductive element is arranged in one of the sub-cavities.
  • the second shielding frame is an open wall structure formed by successively connecting several sections of frame bodies, and the open end of the second shielding frame is connected to the first shielding frame (for example, to the third wall), so that the second shielding The frame and the first shield frame form an integrated shield frame.
  • the addition of the second shielding frame can strengthen the electromagnetic shielding of the conductive parts in the cavity, and the integrated shielding frame has higher structural strength, can improve the assembly strength of the circuit board assembly, and can simplify the assembly difficulty of the circuit board assembly.
  • the circuit board assembly includes a second shielding frame, the second shielding frame is provided in the cavity and spaced apart from the first shielding frame, and the second shielding frame is connected to the first shielding frame.
  • the circuit board and the second circuit board are both connected, and the second shield frame surrounds the outer circumference of the conductive element.
  • the second shielding frame may be formed by connecting several frame bodies end to end, and the second shielding frame may be approximately a square cylindrical structure with open ends, and the two openings respectively face the first circuit board and the second circuit board.
  • the second shielding frame encloses the conductive element to electromagnetically shield the conductive element and avoid mutual interference between the conductive element and other devices in the cavity.
  • the split-type second shielding frame has good versatility and can be used in combination with the first shielding frame of any structure to ensure the mass production of circuit board components.
  • the first shield frame is located between the first circuit board and the second circuit board, and the periphery of the first shield frame is in contact with the periphery of the first circuit board.
  • the first shield frame is all located between the first circuit board and the second circuit board, and plays a role of supporting the first circuit board.
  • a first shielding frame has a simple structure, good mechanical reliability and electromagnetic shielding performance, and can improve the mass production of circuit board components.
  • the periphery of the first shielding frame is in contact with the periphery of the first circuit board, that is, the periphery of the first shielding frame can be substantially aligned with and in contact with the periphery of the first circuit board, which can make the first circuit board facing the second circuit board more More area is used.
  • the space of the cavity is enlarged, so that more devices can be placed on the first circuit board and the cavity can be accommodated. More devices increase the integration level of devices.
  • all the components on the first circuit board facing the second circuit board can be electromagnetically shielded by the first shielding frame, which ensures the electromagnetic shielding performance.
  • an electronic device in a second aspect, includes a housing and a circuit board assembly, and the circuit board assembly is installed in the housing.
  • the circuit board assembly includes a first circuit board, a second circuit board, a first shielding frame and a conductive element; the first circuit board and the second circuit board are laminated at intervals, and the first shielding frame connects the first circuit board and the second circuit board ,
  • the periphery of the first shielding frame is in contact with the periphery of the first circuit board, or the periphery of the first shielding frame is retracted within a certain distance from the periphery of the first circuit board, the first circuit board, the second circuit board and the first shielding frame Enclosed into a cavity; the conductive element is arranged in the cavity and is electrically connected with the first circuit board and the second circuit board.
  • the first circuit board and the second circuit board are parallel or approximately parallel (the thickness directions of the two are the same or substantially the same), and the two overlap each other and have a gap.
  • the shape and shape of the first circuit board and the second circuit board The relative size is not limited. Various devices can be arranged on the opposite sides of the first circuit board and the second circuit board.
  • the first shielding frame may be formed by connecting several sections of frame bodies end to end.
  • the first shielding frame may be a cylindrical structure with openings at both ends, and the two openings respectively face the first circuit board and the second circuit board.
  • the periphery of the first shield frame may be substantially aligned with and contact the periphery of the first circuit board; or the periphery of the first shield frame may be located at a certain distance within the periphery (ie, contour boundary) of the first circuit board.
  • the first shield frame is close to the end of the second circuit board, and the position on the second circuit board is not limited.
  • the periphery of this end is substantially aligned with and in contact with the periphery of the second circuit board; or the periphery of this end may be located on the second circuit board. A certain distance within the periphery of the circuit board.
  • the first circuit board, the second circuit board and the first shielding frame enclose a closed cavity (closed means that the cavity has no openings, and does not mean that it is airtight), and devices and conductive parts are arranged in the cavity. It can be used as a shielding cavity to electromagnetically shield the devices and conductive parts in it.
  • the conductive element is spaced apart from the first screen shield frame. There are a number of conductive channels (specific structures such as conductive lines, conductive pins, etc.) inside the conductive member, and the first circuit board and the second circuit board are conducted through the conductive channels to realize signal conduction of the entire circuit board assembly.
  • the specific structure of the conductive element is not limited, as long as it can be electrically connected.
  • the conductive element has a certain supporting effect on the first circuit board.
  • the circuit board assembly in the electronic device uses conductive parts to realize the stacking interval and electrical connection between the first circuit board and the second circuit board, which can use the thickness space of the electronic device to increase the number of circuit boards, thereby increasing the device layout area and improving the device Degree of integration.
  • the first shielding frame By arranging the first shielding frame near the edge of the first circuit board, the first shielding frame with greater structural strength can be used to support the first circuit board, avoiding stress failure at the edge of the first circuit board, and improving the mechanical performance of the circuit board assembly. reliability.
  • Arranging the first shielding frame close to the edge of the first circuit board can not only ensure the electromagnetic shielding performance, but also improve the area utilization rate of the first circuit board and ensure the integration of devices.
  • the thickness of the first shield frame is small (usually only 0.15 mm), and the area occupied by the first circuit board and the second circuit board is also small.
  • the conductive member is a bumper plate, and the conductive member has a first surface facing the first circuit board and a second surface facing the second circuit board. Both surfaces have only one closed boundary, the first surface is welded to the first circuit board, and the second surface is welded to the second circuit board.
  • the bumper board may be a printed circuit board (Printed circuit board, PCB), which has the same or substantially the same structure as a conventional printed circuit board, and has internal wiring for electrical connection. Only one closed boundary means that the contour boundary of the elevated slab is a closed curve instead of containing two or more closed curves, that is, the elevated slab is a solid slab without holes.
  • the shape of the pad can be designed as required, such as rectangular, cross-shaped, T-shaped or other irregular shapes.
  • the pad can be made by cutting the whole circuit substrate. Because it is a solid board, there is no need to remove unnecessary circuit substrate materials during cutting, so the waste of circuit substrate materials is small, and the area utilization rate of the circuit substrate is large. In addition, the solid pad occupies a small area of the first circuit board and the second circuit board, which can save area to arrange more devices. In addition, since the edge stress of the first circuit board is relatively large, the internal stress is relatively small. By placing the elevated board inside the first circuit board, the stress in the elevated board can be reduced, and the reliable operation of the elevated board can be ensured.
  • the conductive member may also be other block-shaped or plate-shaped components with electrical connection properties, for example, a ceramic substrate manufactured by a low-temperature co-fired ceramic (LTCC) process.
  • the ceramic substrate It has conductive circuits; or punches holes in plastic or glass materials, and fills the holes with plate-shaped or block-shaped parts made of metal materials, where the metal materials are used to realize electrical connections.
  • the conductive member may also be a non-plate-shaped conductive member such as a conductive post and a connector.
  • the conductive member includes a base, a first spring leg and a second spring leg, and the first spring leg is protrudingly provided on a surface of the base facing the first circuit board ,
  • the second spring leg is protrudingly provided on the surface of the base facing the second circuit board, the first spring leg and the second spring leg are electrically connected through the base, the first spring leg is electrically connected with the first circuit board, and the second spring leg is electrically connected with The second circuit board is electrically connected.
  • the conductive member can be referred to as a shrapnel plate.
  • the base may be in a block shape or a plate shape, and has a circuit for signal conduction inside it; or, the base itself has no electrical connection performance, and it is only used to hold the first elastic leg and the second elastic leg.
  • the first spring leg is electrically connected to the second spring leg through the base; for a base that only has a holding function, the first spring leg and the second spring leg can be opposite to the same spring leg Both ends.
  • the first elastic leg and the second elastic leg can be welded or directly abutted with the corresponding circuit board to realize the conduction with the corresponding circuit board.
  • the shape of the first elastic foot and the second elastic foot can be designed according to requirements, for example, a sheet shape.
  • a shrapnel board is used to realize the stacked interconnection of the first circuit board and the second circuit board, which provides another alternative solution for increasing the device layout area and improving the device integration.
  • the electrical connection performance of the shrapnel board is reliable, and the signal stability of the entire circuit board assembly can be ensured.
  • the structure and manufacturing process of the shrapnel plate are relatively simple, which is convenient for mass production and saves costs.
  • the first circuit board is recessed to form a first limiting groove on the surface of the first circuit board facing the base, and the base part extends into the first limiting groove; and/or A surface area of the second circuit board facing the base is recessed to form a second limiting groove, and the base part extends into the second limiting groove.
  • the specific shape of the first limiting slot and the specific position on the first circuit board can be designed as required, and are not limited.
  • the base part protruding into the first limiting slot forms a fit with the first limiting slot to realize the limiting of the elastic plate and ensure that the first elastic leg can be reliably connected to the first circuit board.
  • the first elastic leg may be in the first limiting slot or outside the first limiting slot.
  • the specific shape of the second limiting slot and the specific position on the second circuit board can be designed according to requirements, and are not limited.
  • the base part that extends into the second limiting groove forms a fit with the second limiting groove to realize the limiting of the elastic plate and ensure that the second elastic leg can be reliably connected to the second circuit board.
  • the second elastic foot may be in the second limiting slot or outside the second limiting slot.
  • the first spring leg is received in the first limiting slot and contacts the bottom wall of the first limiting slot; and/or, the second spring leg is received in Inside the second limiting groove and contacting the bottom wall of the second limiting groove.
  • the first elastic leg and/or the second elastic leg are housed in the corresponding limit slot, which can ensure that the elastic leg is more stably connected with the corresponding circuit board, and the reliability of the electrical connection is improved.
  • the first shield frame is located between the first circuit board and the second circuit board, that is, the first shield frame is all located between the first circuit board and the second circuit board. Between the boards, it plays a role of supporting the first circuit board.
  • Such a first shielding frame has a simple structure, good mechanical reliability and electromagnetic shielding performance, and can improve the mass production of circuit board components.
  • the first shielding frame includes a first wall, a second wall, and a third wall, and the first wall, the second wall, and the third wall are sequentially bent and connected to form Step, the first wall surrounds the outside of the first circuit board, the second wall is supported on the periphery of the surface of the first circuit board facing the second circuit board, and the third wall is located between the first circuit board and the second circuit board.
  • the second wall is located between the first wall and the third wall, the first wall and the second wall can be bent and connected substantially perpendicularly, and the second wall and the third wall can be bent and connected substantially perpendicularly, thereby forming Steps.
  • the first wall, the second wall and the third wall all surround a circle, and the opening enclosed by the first wall is larger than the opening enclosed by the third wall.
  • This type of first shielding frame uses the first wall to limit the first circuit board, the second wall to carry the first circuit board, and the third wall to support the first circuit board, so that the first circuit board It is firmly installed without deviation, and the assembly strength of the first shield frame and the first circuit board is increased.
  • this kind of first shielding frame is convenient for arranging the connecting material (adhesive or solder) on the side of the first circuit board, which can reduce the occupation of the device layout area of the first circuit board, so that the saved area can be more arranged. Multiple devices, thus further improving the device integration of the first circuit board.
  • an end of the first wall away from the second wall protrudes from the surface of the first circuit board facing away from the second circuit board;
  • the circuit board assembly includes a first shielding film, The first shielding film covers an end of the first wall away from the second wall and the first circuit board, and the first shielding film is opposite to the first circuit board at intervals.
  • the convex direction of the end of the first wall away from the second wall can be substantially perpendicular to the first circuit board, or form a suitable obtuse angle with the first circuit board, which facilitates the processing of the first shield frame and the installation of the first shielding film on the The end of the first wall away from the second wall.
  • the first shielding film is thin and can be bent.
  • the first shielding film is used for electromagnetic shielding. Since the first shielding film is suspended above the first circuit board, the area occupied on the surface of the first circuit board is reduced, so that more devices can be arranged in the saved area, thus further improving the device integration of the first circuit board. Spend.
  • the first wall is provided with a positioning notch, the positioning notch penetrates the first wall along the thickness direction of the first circuit board, and a positioning protrusion is formed on the side of the first circuit board. , The positioning protrusion is inserted into the positioning notch.
  • the positioning gap makes the first wall form a gap structure similar to a city wall.
  • the shape, size, and number of the positioning gap are designed according to requirements, and the implementation manner is not limited.
  • the side surface of the first circuit board refers to the surface connected between the device placement surfaces.
  • the protrusion direction of the positioning protrusion on the side surface may be substantially perpendicular to the side surface, and the shape, size and number of the positioning protrusion are adapted to the shape, size and number of the positioning notch.
  • a positioning protrusion is correspondingly inserted into a positioning notch.
  • the first wall is convexly provided with positioning protrusions facing the surface of the first circuit board, the side surface of the first circuit board is recessed to form positioning grooves, and the positioning protrusions Insert the positioning groove.
  • the positioning protrusions can be substantially perpendicular to the surface of the first wall facing the first circuit board, and the shape, size and number of the positioning protrusions can be designed according to requirements and are not limited.
  • the positioning protrusions can be evenly distributed and circle around.
  • the shape, size and number of the positioning grooves are adapted to the shape, size and number of the positioning protrusions.
  • a positioning protrusion is correspondingly inserted into a positioning notch.
  • the first shield frame includes a fourth wall and a fifth wall, the fourth wall and the fifth wall are bent and connected, and the fourth wall covers the first circuit board away from The peripheral edge of the surface of the second circuit board, and the fifth wall surrounds the outer periphery of the first circuit board.
  • the fourth wall and the fifth wall are bent and connected substantially perpendicularly.
  • the fourth wall contacts the peripheral edge of the surface of the first circuit board away from the second circuit board and surrounds it.
  • the fifth wall is located outside the first circuit board and surrounds the first circuit board.
  • the opening enclosed by the fourth wall is smaller than that of the fifth wall.
  • the first shield frame forms an inverted structure that is crimped on the first circuit board. Such a first shielding frame can better limit the first circuit board and increase the assembly strength of the first shielding frame and the first circuit board.
  • the position of the fifth wall on the second circuit board is also moved to the outside of the second circuit board, so that the first circuit board, the first shielding frame and the second circuit board are enclosed.
  • the resulting cavity is larger, and more devices can be arranged in the cavity, thus improving the integration of devices in the cavity.
  • the first shield frame includes a sixth wall, the sixth wall, the fourth wall, and the fifth wall are sequentially bent and connected to form a step, and the sixth wall protrudes from The surface of the first circuit board facing away from the second circuit board;
  • the circuit board assembly includes a second shielding film, the second shielding film covers the end of the sixth wall away from the fourth wall and the first circuit board, the second shielding film and the first circuit board With intervals.
  • the sixth wall and the fifth wall are respectively located on opposite sides of the fourth wall, and the sixth wall and the fourth wall may be bent and connected substantially perpendicularly, or form a suitable obtuse angle.
  • the sixth wall is located on the periphery of the surface.
  • the second shielding film is thin and can be bent.
  • the second shielding film is used for electromagnetic shielding. Since the second shielding film is suspended above the first circuit board, the area occupied by the surface of the first circuit board is reduced, so that more devices can be arranged in the saved area, thus further improving the device integration of the first circuit board Spend.
  • the first shield frame includes a connecting wall, the connecting wall and the fifth wall are connected by bending, the fifth wall is located between the connecting wall and the fourth wall, and the connecting wall It is laid on the second circuit board and fixedly connected with the second circuit board.
  • the connecting wall and the fifth wall can be bent and connected substantially perpendicularly, and contact the surface of the second circuit board facing the first circuit board.
  • a number of connecting holes can be opened on the connecting wall, and a connecting piece (such as screws, bolts, rivets, etc.) can be installed in each connecting hole, and the connecting piece fixedly connects the connecting wall with the second circuit board.
  • a connecting material such as glue or solder
  • a connecting piece may be used instead of the connecting piece to realize the connection between the second circuit board and the connecting wall, which can also ensure the stable assembly of the first circuit board and the second circuit board.
  • the circuit board assembly includes a second shielding frame, the second shielding frame is provided in the cavity and connected to the first shielding frame as a whole, and the second shielding frame is connected to the first shielding frame.
  • a circuit board and a second circuit board are both connected, the second shielding frame separates the cavity into different sub-cavities, and the conductive element is arranged in one of the sub-cavities.
  • the second shielding frame is an open wall structure formed by successively connecting several sections of frame bodies, and the open end of the second shielding frame is connected to the first shielding frame (for example, to the third wall), so that the second shielding The frame and the first shield frame form an integrated shield frame.
  • the addition of the second shielding frame can strengthen the electromagnetic shielding of the conductive parts in the cavity, and the integrated shielding frame has higher structural strength, can improve the assembly strength of the circuit board assembly, and can simplify the assembly difficulty of the circuit board assembly.
  • the circuit board assembly includes a second shielding frame, the second shielding frame is provided in the cavity and spaced apart from the first shielding frame, and the second shielding frame is connected to the first shielding frame.
  • the circuit board and the second circuit board are both connected, and the second shield frame surrounds the outer circumference of the conductive element.
  • the second shielding frame may be formed by connecting several frame bodies end to end, and the second shielding frame may be approximately a square cylindrical structure with open ends, and the two openings respectively face the first circuit board and the second circuit board.
  • the second shielding frame encloses the conductive element to electromagnetically shield the conductive element and avoid mutual interference between the conductive element and other devices in the cavity.
  • the split-type second shielding frame has good versatility and can be used in combination with the first shielding frame of any structure to ensure the mass production of circuit board components.
  • the first shield frame is located between the first circuit board and the second circuit board, and the periphery of the first shield frame is in contact with the periphery of the first circuit board.
  • the first shield frame is all located between the first circuit board and the second circuit board, and plays a role of supporting the first circuit board.
  • a first shielding frame has a simple structure, good mechanical reliability and electromagnetic shielding performance, and can improve the mass production of circuit board components.
  • the periphery of the first shielding frame is in contact with the periphery of the first circuit board, that is, the periphery of the first shielding frame can be substantially aligned with and in contact with the periphery of the first circuit board, which can make the first circuit board facing the second circuit board more More area is used.
  • the space of the cavity is enlarged, so that more devices can be placed on the first circuit board and the cavity can be accommodated. More devices increase the integration level of devices.
  • all the components on the first circuit board facing the second circuit board can be electromagnetically shielded by the first shielding frame, which ensures the electromagnetic shielding performance.
  • an electronic device including a housing and a circuit board assembly in any one of the implementation manners of the first aspect, the circuit board assembly being installed in the housing.
  • FIG. 1 is a schematic diagram of the overall structure of the electronic device of the first embodiment
  • FIG. 2 is a schematic diagram of an exploded structure of the electronic device of FIG. 1;
  • FIG. 3 is a schematic diagram of the overall structure of an electronic device in another embodiment
  • FIG. 4 is a schematic diagram of an exploded structure of the electronic device of FIG. 3;
  • FIG. 5 is a schematic diagram of the assembly structure of the circuit board assembly in the electronic device of FIG. 2;
  • Fig. 6 is a schematic diagram of the A-A cross-sectional structure of the circuit board assembly in Fig. 5;
  • FIG. 7 is a schematic top view of the circuit board assembly in FIG. 6 after removing the outer shielding cover and the first circuit board;
  • FIG. 8 is a schematic top view of the structure of the conductive circuit board in another embodiment
  • 9-12 are schematic top views of the conductive circuit boards of other embodiments.
  • FIG. 13 is a schematic sectional view of a circuit board assembly in another solution
  • FIG. 14 is a schematic top view of the circuit board assembly in FIG. 13 after removing the outer shielding cover and the first circuit board;
  • 15 is a schematic diagram of the three-dimensional structure of the first shielding frame in the second embodiment
  • Fig. 16 is a partial enlarged schematic diagram of the structure at B in Fig. 15;
  • 17 is a schematic diagram of the assembly structure of the circuit board assembly in the second embodiment.
  • Fig. 18 is a C-C cross-sectional structural diagram of the circuit board assembly of Fig. 17;
  • 19 is a schematic diagram of the comparison of the connection design between the first circuit board and the first shielding frame in the first embodiment and the second embodiment;
  • 21 is a schematic diagram of the three-dimensional structure of the first shield frame and the first circuit board in the circuit board assembly of the fourth embodiment
  • FIG. 22 is a top view assembly structure diagram of the first shield frame and the first circuit board in FIG. 21;
  • FIG. 24 is a schematic diagram of a three-dimensional assembly structure of the first shield frame and the first circuit board in FIG. 23;
  • 25 is a schematic diagram of the exploded structure of the circuit board assembly of the sixth embodiment.
  • 26 is a schematic diagram of the assembly structure of the circuit board assembly of the sixth embodiment.
  • Fig. 27 is a D-D sectional structural diagram of the circuit board assembly of Fig. 26;
  • Fig. 29 is an E-E sectional structure diagram of the circuit board assembly of Fig. 28;
  • FIG. 30 is a schematic sectional view of the circuit board assembly of the eighth embodiment.
  • FIG. 31 is a schematic top view of the circuit board assembly of FIG. 30 after removing the second shielding film and the first circuit board;
  • 32 is a schematic diagram showing a cross-sectional structure of the circuit board assembly including an integrated shield frame in the third embodiment
  • FIG. 33 is a schematic top view of the circuit board assembly of FIG. 32 after removing the first shielding film and the first circuit board;
  • 35 is a schematic sectional view of the circuit board assembly of the tenth embodiment.
  • Fig. 36 is a schematic cross-sectional view of the circuit board assembly of the eleventh embodiment.
  • the following embodiments of this application provide an electronic device, which includes but is not limited to mobile phones, tablets, wearable devices (including but not limited to smart watches, smart bracelets, wireless headsets, virtual reality glasses, virtual reality helmets, Smart clothing), e-readers, set-top boxes, routers, switches, etc.
  • the electronic device may include a display screen (for example, a mobile phone, a tablet computer, etc.), or it may not have a display screen (for example, a wireless headset, a set-top box, etc.).
  • the electronic device is a mobile phone as an example for description.
  • the electronic device 10 of the first embodiment may include a display screen 11, a middle frame 12, a circuit board assembly 13 and a rear case 14.
  • the middle frame 12 serves as the main structural bearing member of the electronic device 10 and is used to bear the above-mentioned other components.
  • Mounting slots can be formed on opposite sides of the middle frame 12
  • the display screen 11 is installed in the mounting slot on one side of the middle frame 12
  • the circuit board assembly 13 is installed in the mounting slot on the other side of the middle frame 12.
  • the rear shell 14 covers the middle frame 12 and is located on the side of the middle frame 12 away from the display screen 11.
  • the specific structure of the middle frame 12 and the rear shell 14 can be designed according to product requirements, which is not limited in the first embodiment.
  • the middle frame 12 and the rear shell 14 constitute the housing of the electronic device. It should be understood that this is only an example. In other embodiments, the housing of the electronic device may also include other structural components.
  • the display screen 11 can be a flat 2D screen, or a curved screen such as a 2.5D screen (the display screen 11 has a flat middle part and curved parts connected to opposite sides of the middle part) or a 3D screen (in 2.5D On the basis of the screen, the middle part is also made into a curved surface).
  • the display screen 11 may include a cover plate and a display panel, and the cover plate and the display panel are laminated.
  • the cover is used to protect the display panel, and the display panel is used to display images.
  • the display panel includes, but is not limited to, a liquid crystal display panel or an organic light emitting diode display panel.
  • a touch unit can be integrated in the cover, that is, the cover has a touch function; or the display panel can have a built-in touch unit, that is, the display panel has both display and touch functions.
  • the electronic device 10 in the first embodiment is a non-folding mobile phone, and its display screen 11 is an unbendable hard screen. As shown in FIGS. 3 and 4, the difference from the first embodiment is that in other embodiments, the electronic device 20 may be a foldable mobile phone, and the display screen 24 thereof is a flexible screen that can be bent.
  • the first housing 21 and the second housing 23 of the electronic device 20 are rotatably connected by a hinge 22.
  • the hinge 22 may be a mechanism composed of several parts, capable of generating mechanism movement. Through the mechanism movement of the hinge 22, the first housing 21 and the second housing 23 can be moved closer or separated, so as to realize the folding or unfolding of the foldable mobile phone.
  • the display screen 24 is installed on the first housing 21 and the second housing 23. When the foldable mobile phone is in the folded state, the display screen 24 can be housed between the first housing 21 and the second housing 23, that is, the foldable mobile phone is an inner folding screen mobile phone.
  • the display screen 24 is located on the outside, and the first housing 21 and the second housing 23 are located on the inside, that is, the foldable mobile phone may be an outer folding screen mobile phone.
  • the circuit board assembly can be installed in the first housing 21 or the second housing 23, or both the first housing 21 and the second housing 23 are equipped with the circuit board assembly.
  • the circuit board assembly 13 may include an outer shield 131, a first circuit board 132, a first shield frame 133, a second circuit board 134, and a guide
  • the circuit board 135 is connected, the second circuit board 134 is close to the rear shell 14, and the outer shielding cover 131 is close to the middle frame 12.
  • the circuit board assembly 13 can be assembled upside down in the casing, that is, the second circuit board 134 is close to the middle frame 12 and the outer shield 131 is close to the rear casing 14.
  • the first circuit board 132 and the second circuit board 134 are stacked at intervals, that is, the first circuit board 132 and the second circuit board 134 are parallel or approximately parallel (the thickness directions of the two are the same or substantially the same). Overlap each other and have gaps.
  • the first circuit board 132 and the second circuit board 134 may have the same or similar shapes, for example, both of them are rectangular.
  • the outline boundary of the first circuit board 132 may completely fall within the outline boundary of the second circuit board 134, and the area of the first circuit board 132 may be smaller than the area of the second circuit board 134.
  • Various components can be arranged on the first circuit board 132 and the second circuit board 134 as required.
  • the first circuit board 132 can be welded with chip a1 and device b1 on one side, and chip a2 and device b2 can be welded on the other side; the second circuit One side of the board 134 can be soldered with the chip a3, the device b3, and the device b4.
  • the chip a1, chip a2, and chip a3 in FIG. 6 have relatively large volumes, and the circles between them and the corresponding circuit board represent solder ball s1, solder ball s2, and solder ball s3, respectively; device b1, device b2, and device b2.
  • the device b3 and the device b4 are small in size, and the solder balls between them and the corresponding circuit board are not shown. It should be understood that this is only an illustration, in fact, devices can be arranged on two opposite sides of the first circuit board 132 and two opposite sides of the second circuit board 134.
  • the shapes and relative sizes of the first circuit board 132 and the second circuit board 134 can be designed according to product requirements, and are not limited to the above.
  • the outline boundary of the first circuit board 132 may substantially coincide with the outline boundary of the second circuit board 134, and the areas of the two may be approximately equal; or, the outline boundary of the second circuit board 134 may completely fall on the first circuit board 132.
  • the area of the first circuit board 132 may be larger than the area of the second circuit board 134.
  • the first circuit board 132 and/or the second circuit board 134 may have an irregular shape.
  • the circuit board assembly 13 may also include a larger number of circuit boards (for example, at least three), all the circuit boards are stacked in sequence at intervals, and every two adjacent circuit boards are connected by the first shield frame 133, the uppermost layer An external shield 131 is installed on the circuit board.
  • the outer shielding cover 131 may be a cover-like structure with an open inner cavity, and the inner cavity has an opening.
  • the outer shielding cover 131 is mounted on the first circuit board 132, and the opening faces the first circuit board. 132.
  • the outer shield 131 and the first circuit board 132 can be welded or bonded.
  • the outer shield 131 is used to electromagnetically shield the devices on the first circuit board 132.
  • the boundary of the opening of the outer shielding cover 131 can be as close as possible to the outline boundary of the first circuit board 132 to enclose more devices that need to be shielded in the outer shielding cover 131.
  • the boundary of the opening of the outer shielding cover 131 may also be substantially aligned with the outline boundary of the first circuit board 132.
  • the specific shape of the outer shield 131 is not limited, for example, it may be square.
  • the outer shielding cover 131 may be made of metallic materials, or may be made of non-metallic materials with a conductive plating layer added on the surface to have electromagnetic shielding performance. According to product requirements, the external shielding cover 131 may not be provided.
  • the first shield frame 133 is supported between the first circuit board 132 and the second circuit board 134, and is connected to both the first circuit board 132 and the second circuit board 134.
  • the connection between the first shield frame 133 and the first circuit board 132 and the second circuit board 134 may be welding or bonding.
  • the first shield frame 133 may be formed by connecting several sections of frame bodies (for example, four sections of frame bodies) end to end.
  • the first shield frame 133 may be approximately a square cylindrical structure with open ends, and the two openings face the first circuit board 132 and The second circuit board 134. One end (the upper end in the viewing angle of FIG.
  • first shield frame 133 may be located on the periphery of the first circuit board 132, and the contour boundary of this end is close to the contour boundary of the first circuit board 132.
  • the other end (the lower end in the viewing angle of FIG. 6) of the first shield frame 133 can be retracted within the contour boundary of the second circuit board 134, and the contour boundary of the other end has a certain distance from the contour boundary of the second circuit board 134.
  • the first shielding frame 133, the first circuit board 132 and the second circuit board 134 enclose a cavity 13a, and all the devices on the side of the first circuit board 132 facing the second circuit board 134 are connected. Parts of the circuit board 135 and the second circuit board 134 facing the first circuit board 132 are all arranged in the cavity 13a (the second circuit board 134 facing the first circuit board 132 can also be arranged with devices, and these devices can be placed in the cavity 13a. Body 13a outside).
  • the first shield frame 133 is used to electromagnetically shield the devices in the cavity 13a.
  • the first shielding frame 133 may be made of metallic materials, or may be made of non-metallic materials with conductive plating added on the surface to achieve electromagnetic shielding. Since the wall of the first shielding frame 133 is continuous and airtight, it can better shield the electromagnetic wave energy inside and outside the cavity 13a, and thus has better electromagnetic shielding performance.
  • the upper end of the first shield frame 133 may be disposed at the periphery of the first circuit board 132 so that more area on the first circuit board 132 facing the second circuit board 134 can be used. Under the condition that the distance between the first circuit board 132 and the second circuit board 134 remains unchanged, the space of the cavity 13a is enlarged, so that more devices can be arranged on the first circuit board 132, and the cavity 13a can accommodate More devices increase the integration level of devices.
  • the outer edge of the first shielding frame 133 is substantially aligned with the outer edge of the first circuit board 132. In this case, all the devices on the first circuit board 132 facing the second circuit board 134 can be electromagnetically shielded by the first shield frame 133.
  • the upper end of the first shielding frame 133 may also be retracted within the outline boundary of the first circuit board 132, that is, the upper end of the first shielding frame 133 may be at a distance from the periphery of the first circuit board 132.
  • a certain distance the value of the distance can be selected according to specific conditions (for example, it can be 0.1mm-0.5mm), which is not limited in this application.
  • Devices can also be arranged on the side of the first circuit board 132 facing the second circuit board 134 and located outside the cavity 13a as required.
  • the first shield frame 133 may have other suitable shapes.
  • the lower end of the first shield frame 133 may also be located on the periphery of the second circuit board 134, and at this time, all the devices on the side of the second circuit board 134 facing the first circuit board 132 are located in the cavity 13a.
  • the conductive circuit board 135 is disposed in the cavity 13a.
  • the conductive circuit board 135 can be a raised board, and the raised board can be a printed circuit board (Printed circuit board, PCB), which has the same or basically the same structure as a conventional printed circuit board, and has internal components for electrical connection. ⁇ The routing.
  • PCB printed circuit board
  • the conductive circuit board 135 may also be other block-shaped or plate-shaped components with electrical connection properties, such as a ceramic substrate manufactured by using a low-temperature co-fired ceramic (LTCC) process, and the ceramic substrate has Conductive circuit; or punch a hole in a plastic or glass material, and fill the hole with a plate-shaped or block-shaped component made of metal material, where the metal material is used to realize electrical connection.
  • the conductive circuit board 135 has a first surface 135 a and a second surface 135 b.
  • the first surface 135 a faces the first circuit board 132
  • the second surface 135 b faces the second circuit board 134. Both the first surface 135a and the second surface 135b are provided with a number of pads.
  • the pads on the first surface 135a are soldered to the first circuit board 132, and the pads on the second surface 135b are soldered to the second circuit board 134.
  • the circle between the first surface 135a and the first circuit board 132 in FIG. 6 represents the solder ball s5
  • the circle between the second surface 135b and the second circuit board 134 represents the solder ball s4.
  • the conductive element has an electrical connection function to conduct the circuit board 135, and its shape is not limited.
  • the conductive member may be a conductive post, a connector, or the like.
  • the conductive circuit board 135 is a solid board without holes, and both the first surface 135a and the second surface 135b have only one closed boundary, and the closed boundary means that the contour boundary is a closed curve.
  • the edge of the hole and the boundary of the conductive circuit board outline are both closed curves, so the number of closed boundaries of the conductive circuit board is at least two.
  • the conductive circuit board 135 shown in FIG. 7 may be a rectangular solid board, and its first surface 135a has only one closed boundary, and the closed boundary encloses a rectangle (the blocked second surface 135b also has only one closed boundary, and the closed boundary Enclose the same rectangle).
  • the conductive circuit board 135 may be a cross-shaped solid board, and the widths of the upper, lower, left, and right parts of the cross-shaped solid board are substantially the same.
  • the first surface 135a of the conductive circuit board 135 has only one closed boundary, which encloses a cross-shaped area (the blocked second surface 135b also has only one closed boundary that encloses the cross-shaped area).
  • the conductive circuit board 135 may also be a cross-shaped solid board.
  • the difference from FIG. 8 is that the left and right parts of the conductive circuit board 135 are basically the same width and the smallest, the upper part has a larger width, and the lower part has the largest width.
  • FIG. 8 the difference from FIG. 8 is that the left and right parts of the conductive circuit board 135 are basically the same width and the smallest, the upper part has a larger width, and the lower part has the largest width.
  • FIG. 8 the difference from FIG. 8 is that the left and right parts of the conductive circuit board 135 are
  • the conductive circuit board 135 may also be a cross-shaped solid board. However, the difference from FIG. 8 is that the left and right parts of the conductive circuit board 135 are basically the same width and smaller, and the width of the upper and lower parts is basically the same and larger.
  • the conductive circuit board 135 can be a T-shaped solid board, and the first surface 135a of the conductive circuit board 135 has only one closed boundary, which encloses a T-shaped area (the second surface 135b that is blocked) There is also only one closed boundary, which also encloses a T-shaped area).
  • the conductive circuit board 135 can be an irregularly shaped solid board, and the first surface 135a of the conductive circuit board 135 has only one closed boundary, and the closed boundary encloses an irregularly shaped area (the blocked first surface).
  • the two surfaces 135b also have only one closed boundary, and the closed boundary also encloses the irregularly shaped area).
  • the shape of the conductive circuit board 135 shown in FIGS. 7 to 12 is only an example, and the specific shape of the conductive circuit board 135 can be designed according to requirements, and is not limited to the above.
  • the conduction circuit board 135 can be made by cutting a whole circuit substrate. In the process design, a pattern of the connection mode of the conduction circuit board 135 can be drawn on the pattern of the whole circuit substrate. The splicing mode pattern can be called a conduction circuit.
  • the imposition style of board 135. The design shape and imposition style of the conductive circuit board 135 will affect the number of cuts of the conductive circuit board 135 and the effective utilization area of the circuit substrate. For example, consider the cutting process of a conductive circuit board with holes: first cut out a solid prefabricated board from the circuit substrate, and then remove the internal area of the prefabricated board to obtain the conductive circuit board with holes.
  • the conductive circuit board with holes wastes a large area of the circuit substrate, resulting in a smaller effective area of the circuit substrate.
  • the solid conductive circuit board 135 of the first embodiment does not need to remove the internal area when cutting, so that the effective use area of the circuit board is larger.
  • Figures 13 and 14 respectively show a cross-sectional structure and a top view structure of the circuit board assembly 13' in other solutions.
  • the first circuit board 132 and the second circuit board 134 of the circuit board assembly 13' are laminated and spaced apart, and the conductive circuit board 135' is supported between the two.
  • An insulating material (for example, resin) is filled between the conductive material, and the insulating material allows electromagnetic waves to pass through.
  • the conduction circuit board 135' is not a solid board, and there are through holes h1 and h2 opened thereon.
  • the through holes h1 and the through holes h2 are both located inside the conduction circuit board 135', so that the periphery of the conduction circuit board 135' is connected to The first circuit board 132 and the second circuit board 134 are connected, and the inside of the conductive circuit board 135 ′ is also connected to the first circuit board 132 and the second circuit board 134.
  • a conductive circuit board 135' is also called a frame board.
  • the devices (such as chip a2, chip a3, device b2, device b3, and device b4) in the circuit board assembly 13' can be respectively arranged in the area where the through hole h1 is located and the area where the through hole h2 is located.
  • the structural strength of the conductive circuit board 135' is relatively weak. Using only the conductive circuit board 135' to support the first circuit board 132 and the second circuit board 134 will cause excessive stress on the circuit board assembly 13' and poor mechanical reliability. . 3.
  • the width of the connecting portion between the conductive circuit board 135' and the first circuit board 132 and the second circuit board 134 (in the viewing angles of FIG. 13 and FIG. 14, the width is the dimension in the left and right directions) is usually larger (for example, up to 2mm) ), which greatly occupies the area of the first circuit board 132 and the second circuit board 134, causing no more devices to be arranged on the first circuit board 132 and the second circuit board 134. 4. Since the conductive circuit board 135' has holes, it is necessary to waste a portion of the circuit substrate area when cutting the conductive circuit board 135' from the circuit substrate, resulting in a smaller effective area of the circuit substrate and increasing costs.
  • the solution of the first embodiment realizes the stacked spacing arrangement of the first circuit board 132 and the second circuit board 134 by conducting the circuit board 135, which can use the thickness space of the electronic device 10 to increase the number of circuit boards, thereby increasing the device layout area and improving the device Degree of integration.
  • the solution of the first embodiment has the following advantages: 1.
  • the first shielding frame 133 is used to connect the first circuit board 132 and the second circuit board 134, because the first shielding frame 133
  • the continuous and closed wall structure can well shield the electromagnetic wave energy inside and outside the cavity 13a without electromagnetic wave leakage. Therefore, electromagnetic shielding can be better realized and the electrical performance of the circuit board assembly 13 can be ensured. 2.
  • the first shield frame 133 By arranging the first shield frame 133 on the edge of the first circuit board 132, the first shield frame 133 with greater structural strength can be used to support the first circuit board 132 to avoid stress failure on the edge of the first circuit board 132.
  • the mechanical reliability of the circuit board assembly 13 is improved; by arranging the conductive circuit board 135 inside the first circuit board 132, the stress in the conductive circuit board 135 can be reduced, and the reliable operation of the conductive circuit board 135 can be ensured.
  • arranging the first shield frame 133 on the edge of the first circuit board 132 can not only ensure the electromagnetic shielding performance, but also improve the area utilization rate of the first circuit board 132 and ensure the integration of devices. 3.
  • the thickness of the first shielding frame 133 (in the view of FIG.
  • the thickness is the size in the left and right direction) is small (usually only 0.15 mm), which affects the first circuit board 132 and the second circuit board 134
  • the area occupancy is also smaller; compared to the solutions in Figures 13 and 14, after the conduction circuit board 135 changes its shape, the area occupied by the first circuit board 132 and the second circuit board 134 is also reduced, which can save area for more layout. Multiple devices. 4.
  • the area waste of the circuit board is reduced, the effective area of the circuit board can be improved, and the cost can be saved.
  • the first shielding frame can form a bearing platform structure, which is partly located between the first circuit board and the second circuit board, and partly surrounds the outer periphery of the first circuit board. To support the first circuit board. This will be described in detail below.
  • the first shield frame 233 in the second embodiment can be It includes a first wall 234, a second wall 235, and a third wall 236.
  • the second wall 235 is located between the first wall 234 and the third wall 236.
  • the first wall 234 and the second wall 235 are substantially vertically bent and connected.
  • the wall 235 and the third wall 236 are bent and connected substantially perpendicularly, thereby forming a step.
  • the first wall 234, the second wall 235 and the third wall 236 all surround a circle, and the opening enclosed by the first wall 234 is larger than the opening enclosed by the third wall 236.
  • the bending angle between the first wall 234 and the second wall 235, and the second wall 235 and the third wall 236 can be designed as required, and is not limited to a right angle, such as 135 degrees or 120 degrees, etc. .
  • the first wall 234 surrounds the outer circumference of the first circuit board 132, and the end of the first wall 234 away from the second wall 235 can be substantially flush with the upper surface of the first circuit board 132;
  • second The wall 235 carries the first circuit board 132, the second wall 235 is in contact with the surface of the first circuit board 132 facing the second circuit board 134;
  • the third wall 236 is located between the first circuit board 132 and the second circuit board 134, It supports the first circuit board 132 and the outer shield 131.
  • This design of the first shield frame 233 can better limit the first circuit board 132, and the limit refers to limiting the freedom of movement of the first circuit board 132, so that it can be installed stably without deviation.
  • the limit does not specifically refer to the size of the gap between the first shield frame 233 and the first circuit board 132.
  • the gap between the first shield frame 233 and the first circuit board 132 may be substantially zero or a certain value.
  • the limit design of the first shield frame 233 to the first circuit board 132 can increase the assembly strength of the first shield frame 233 and the first circuit board 132.
  • FIG. 19 shows the connection design of the first circuit board 132 and the first shielding frame 133 in the first embodiment and the connection design of the first circuit board 132 and the first shielding frame 233 in the second embodiment respectively in a comparative form.
  • the upper diagram of 17 shows the scheme of the first embodiment
  • the lower diagram of FIG. 17 shows the scheme of the second embodiment.
  • the lower surface 132a of the first circuit board 132 (the surface facing the second circuit board 134) and the first shield frame 133 are connected by glue or solder (hereinafter referred to as the connecting material L).
  • the connecting material L For the requirement of reliable assembly, the width of the connecting material L should be greater than the width of the first shield frame 133, and both ends of the connecting material L need to exceed the first shield frame 133 by a certain distance. Therefore, the first shield frame 133 needs to fall on the first shield frame 133.
  • the side surface of the first circuit board 132 can be expanded into a connection position, so both the side surface and the lower surface 132a of the first circuit board 132 can be connected to the first circuit board 132 through the connecting material L.
  • a shield frame 233 is connected to ensure reliable assembly. Based on this, the connection position of the first shield frame 233 on the lower surface 132a of the first circuit board 132 can move a certain distance t to the outside of the first circuit board 132, which will not affect the assembly strength, but can reduce the The area of the lower surface 132a of a circuit board 132 is occupied. The saved area can be used to arrange more devices.
  • the solution of the second embodiment can further improve the device integration of the first circuit board 132.
  • the connecting material L in the second embodiment can only be provided on the side surface of the first circuit board 132, and the first shield frame 233 is only connected to the side surface of the first circuit board 132.
  • the end of the first wall 334 of the first shield frame 333 away from the second wall 235 can protrude from the first wall 235.
  • the circuit board assembly 33 uses the first shielding film 331 instead of the outer shielding cover.
  • the first shielding film 331 is connected to the protruding end of the first wall 334, and the first shielding film 331 covers the first circuit board 132 and is spaced and opposed to the first circuit board 132.
  • the first shielding film 331 is thin and can be bent.
  • the first shielding film 331 is used for electromagnetic shielding, and the structure of the first shielding film 331 can be, for example, copper as a substrate, and an insulating plating layer is made on the surface of the copper substrate. Of course, other materials and processes that meet electromagnetic shielding requirements can also be used to manufacture the first shielding film 331. Since the first shielding film 331 is suspended above the first circuit board 132, the area occupied by the upper surface of the first circuit board 132 is reduced, so that more devices can be arranged in the saved area, thereby further improving the first circuit The device integration of the board 132.
  • the structure of the first shield frame 433 is the same as the main structure of the first shield frame 233 in the second embodiment.
  • the first wall 434 of the first shield frame 433 corresponds to the first wall 234 of the first shield frame 233
  • the second wall 435 of the first shield frame 433 corresponds to the second wall 235 of the first shield frame 233.
  • the first wall 434 and the second wall 435 are bent and connected substantially perpendicularly, and both the first wall 434 and the second wall 435 surround a circle. As shown in FIG. 21 and FIG.
  • the first wall 434 surrounds the outer circumference of the first circuit board 132, and the end of the first wall 434 away from the second wall 435 can be substantially flush with the upper surface 432b of the first circuit board 432;
  • the second wall 435 carries the first circuit board 432, and the second wall 435 is in contact with the lower surface 432 c of the first circuit board 432 facing the second circuit board 134.
  • the bending angle between the first wall 434 and the second wall 435 can be designed as required, and is not limited to a right angle, for example, it can be 135 degrees or 120 degrees.
  • the first wall 434 of the first shield frame 433 can be provided with a number of positioning notches 434a, and the shape (for example, rectangular) and size of the positioning notches 434a can be Consistently, the positioning notches 434a can be evenly distributed and circle around.
  • the positioning notch 434a may penetrate through the end of the first wall 434 connected to the second wall 435, and the end of the first wall 434 away from the second wall 435, that is, the positioning notch 434a may be along the thickness direction of the first circuit board 432 (the viewing angle of FIG. 19 The vertical direction) penetrates the first wall 434.
  • a plurality of positioning protrusions 432a are formed on the side of the first circuit board 432, and the shape, size and interval of the positioning protrusions 432a are adapted to the positioning notches 434a, and one positioning protrusion 432a is correspondingly inserted into a positioning notch 434a.
  • the positioning notch 434a can position the first circuit board 432, so that the first circuit board 432 can be accurately placed in place.
  • the mating structure of the positioning notch 434a and the positioning protrusion 432a can also increase assembly reliability and structural strength. It can be understood that the number of positioning notches 434a and positioning protrusions 432a can be designed according to assembly requirements, and is not limited to multiple, for example, it can be at least one.
  • the connecting material may be distributed at the mating place of the first circuit board 432 and the first shield frame 433.
  • the connecting material such as glue or solder, represented by black shading
  • the connecting material can be distributed on the surface of the positioning notch 434a, and the surface of the positioning notch 434a is connected to the corresponding surface of the positioning protrusion 432a; and /Or, the connecting material may be distributed on the top surface 434b of the first wall 434 and the upper surface 432b of the first circuit board 432 to connect the top surface 434b with the upper surface 432b.
  • glue or solder represented by black shading
  • the connecting material may be distributed on the top surface 434b of the first wall 434 and the upper surface 432b of the first circuit board 432 to connect the top surface 434b with the upper surface 432b.
  • the connecting material can be distributed on the upper surface 432b, the lower surface 432c and the side surface 432d of the first circuit board 432 (the side surface 432d refers to the connection between the upper surface 432b and the lower surface 432c).
  • the upper surface 432b, the side surface 432d, and the lower surface 432c all include the corresponding surfaces of the positioning protrusions 432a.
  • the connection position is on the side of the first circuit board 432, the device layout area of the first circuit board 432 is not occupied or less occupied, and the device integration of the first circuit board 432 can be ensured.
  • the first shielding film may also be used to replace the external shielding cover, thereby reducing the area occupied by the upper surface 432b of the first circuit board 432, and further improving the device integration of the first circuit board 432. That is, similar to the third embodiment, the end of the first wall 434 of the first shielding frame 433 in the fourth embodiment can also protrude from the upper surface 432b of the first circuit board 432, and the first shielding film and the first wall 434 The protruding end is connected, and the first shielding film covers the first circuit board 432 and is spaced and opposed to the first circuit board 432. Of course, the design using the first shielding film is not necessary.
  • the difference from the fourth embodiment above is that the first wall 534 of the first shield frame 533 does not form a positioning gap, but the inner surface of the first wall 534 is convexly spaced.
  • There are a number of positioning protrusions 534a the shape and size of the positioning protrusions 534a can be consistent, and the positioning protrusions 534a can be evenly distributed and circle around.
  • a number of positioning grooves 532 a are provided on the side of the first circuit board 532, and each positioning groove 532 a penetrates the first circuit board 532 along the thickness direction of the first circuit board 532.
  • the shape, size and interval of the positioning groove 532a are adapted to the positioning protrusion 534a, and a positioning protrusion 534a is correspondingly inserted into a positioning groove 532a.
  • the positioning protrusion 534a can position the first circuit board 532 so that the first circuit board 532 can be accurately placed in place.
  • the mating structure of the positioning protrusion 534a and the positioning groove 532a can also increase assembly reliability and structural strength. It can be understood that the number of positioning protrusions 534a and positioning grooves 532a can be designed according to assembly requirements, and is not limited to multiple, for example, it can be at least one. Since the solution of the fifth embodiment does not need to open a gap on the first shield frame 533, the continuous airtightness of the first shield frame 533 can be maintained, and the electromagnetic shielding effect is better.
  • the connecting material may be distributed on the side of the first circuit board 532.
  • the connecting material can be distributed on at least one of the upper surface 532b, the lower surface 532c, and the side surface 532d of the first circuit board 532 (the side surface 532d refers to the surface connected between the upper surface 532b and the lower surface 532c), wherein The side surface 532d includes the surface of the positioning groove 532a.
  • This design does not occupy or occupy less of the device layout area of the first circuit board 532, and can ensure the device integration of the first circuit board 532.
  • the first shielding film can also be used to replace the external shielding cover, thereby reducing the area occupied by the upper surface of the first circuit board 532 and further improving the device integration of the first circuit board 532. That is, similar to the third embodiment, the end of the first wall 534 of the first shielding frame 533 in the fifth embodiment can also protrude from the upper surface of the first circuit board 532, and the first shielding film and the first wall 534 protrude. The one end is connected, and the first shielding film covers the first circuit board 532 and is opposed to the first circuit board 532 at intervals. Of course, the design using the first shielding film is not necessary.
  • the first shielding frame forms an inverted structure and is buckled on the periphery of the first circuit board. This will be described in detail below.
  • the first shielding frame 633 may include a fourth wall 634 and a fifth wall 635, and the fourth wall 634 and the fifth wall 635 are substantially perpendicular Bend connection.
  • the fourth wall 634 contacts and surrounds the periphery of the upper surface of the first circuit board 132 (the surface of the first circuit board 132 away from the second circuit board 134), and the fifth wall 635 is located outside the first circuit board 132 and surrounds the first circuit board 132.
  • the circuit board 132 is round, and the opening enclosed by the fourth wall 634 is smaller than the opening enclosed by the fifth wall 635.
  • the first shield frame 633 forms an inverted structure that is crimped on the first circuit board 132.
  • the bending angle of the fourth wall 634 and the fifth wall 635 can be designed as required, and is not limited to a right angle, for example, it can be 135 degrees or 120 degrees.
  • the first shield frame 633 of the sixth embodiment can better limit the first circuit board 132 and increase the assembly strength of the first shield frame 633 and the first circuit board 132.
  • the fifth wall 635 in the sixth embodiment is located outside the first circuit board 132, and the position of the fifth wall 635 on the second circuit board 134 is also moved to the outside of the second circuit board 134, so that The cavity 63a enclosed by the first circuit board 132, the first shielding frame 633, and the second circuit board 134 is larger, and more devices can be arranged in the cavity 63a, thereby improving the integration of devices in the cavity 63a.
  • the first shielding frame 733 may further include a sixth wall 734, and the sixth wall 734 and the fifth wall 635 are respectively Located on opposite sides of the fourth wall 634, the sixth wall 734 and the fourth wall 634 are bent and connected substantially perpendicularly.
  • the sixth wall 734 protrudes from the upper surface of the first circuit board 132 and is located at the periphery of the upper surface.
  • the circuit board assembly 73 uses a second shielding film 735 instead of an external shielding cover.
  • the second shielding film 735 covers the top end of the sixth wall 734 (that is, the end of the sixth wall 734 away from the fourth wall 634), and Cover the first circuit board 132.
  • the second shielding film 735 is opposed to the first circuit board 132 at intervals.
  • the second shielding film 735 is thin and can be bent.
  • the second shielding film 735 is used for electromagnetic shielding.
  • the structure of the second shielding film 735 can be, for example, using copper as a substrate and an insulating coating on the surface of the copper substrate. Of course, other materials and processes that meet the requirements of electromagnetic shielding can be used to manufacture the second shielding film 735, which is not limited in this application.
  • the second shielding film 735 is suspended above the first circuit board 132, the area occupied by the upper surface of the first circuit board 132 is reduced, so that more devices can be arranged in the saved area, thereby further improving the first circuit The device integration of the board 132.
  • the board assembly 83 may further include a second shield frame 831.
  • the second shield frame 831 is located in the cavity 83a and is spaced apart from the first shield frame 733.
  • the second shield frame 831 is supported between the first circuit board 132 and the second circuit board 134, and the second shield frame 831 can be welded or adhered to the first circuit board 132 and the second circuit board 134.
  • the second shield frame 831 may be formed by connecting several sections of frame bodies (for example, four sections of frame bodies) end to end.
  • the second shield frame 831 may be approximately a square cylindrical structure with open ends, and the two openings respectively face the first circuit board 132 and The second circuit board 134.
  • the second shielding frame 831 encloses the conductive circuit board 135 to electromagnetically shield the conductive circuit board 135 to prevent the conductive circuit board 135 from interfering with other devices in the cavity.
  • a second shielding frame 831 can be added to the circuit board assembly 13 of the first embodiment, and the second shielding frame 831 is provided in the cavity 13 a and separated from the first shielding frame 133.
  • the second shield frame 831 and the first circuit board 132 and the second circuit board 134 can be welded or adhered.
  • the second shielding frame 831 may enclose the conductive circuit board 135.
  • a second shielding frame 831 can be added to the circuit board assembly 23 of the first embodiment.
  • the second shielding frame 831 is connected to the first circuit board 132, the second circuit board 134, the first shielding frame 233, and the guide
  • the position and connection relationship of the communication circuit board 135 are the same as described above.
  • a second shielding frame 831 can be added to the circuit board assembly 33 of the third embodiment.
  • the second shielding frame 831 is connected to the first circuit board 132, the second circuit board 134, the first shielding frame 333, and the guide
  • the position and connection relationship of the communication circuit board 135 are the same as above.
  • a second shielding frame 831 can be added to the circuit board assembly 63 of the sixth embodiment.
  • the second shielding frame 831 is connected to the first circuit board 132, the second circuit board 134, the first shielding frame 633, and the guide.
  • the position and connection relationship of the communication circuit board 135 are the same as described above.
  • the second shielding frame and the first shielding frame 333 can be connected as a whole, simplifying the structure of the shielding frame and the assembly of the circuit board assembly.
  • the circuit board assembly 33 of the third embodiment Take the circuit board assembly 33 of the third embodiment as an example, as shown in FIGS. 32 and 33 (FIG. 33 is a top view of the circuit board assembly 33 of FIG. 32 with the first shielding film 331 and the first circuit board 132 removed), the circuit board The assembly 33 may further include a second shield frame 336, which is located in the cavity 33a.
  • the second shield frame 336 is an open wall structure formed by successively connecting several segments of frame bodies (for example, three segments of frame bodies), and the open end of the second shield frame 336 is connected to the first shield frame 333 (for example, connected to the third wall 236). ), so that the second shield frame 336 and the first shield frame 333 form an integrated shield frame.
  • the second shield frame 336 divides the cavity 33a into two sub-cavities, and the conductive circuit board 135 can be located in one of the sub-cavities. According to product requirements, the size of the second shield frame 336 can be flexibly adjusted, thereby adjusting the relative size of the two sub-cavities.
  • the circuit board assembly 33 When assembling the circuit board assembly 33, first install the conductive circuit board 135 on the second circuit board 134, then install the integrated shielding frame on the second circuit board 134, and then position the first circuit board 132 on the integrated circuit board 134. Finally, the first shielding film 331 is installed on the shielding frame.
  • the circuit board assembly 93 can use an elastic plate 935 instead of the conductive circuit board.
  • the elastic plate 935 may include a base 937, a plurality of first elastic feet 938 and a plurality of second elastic feet 936.
  • the base 937 may be block-shaped or plate-shaped, and has a circuit (similar to a circuit board) for signal conduction;
  • the second spring foot 936 (equivalent to the bracket).
  • the shapes of the first elastic foot 938 and the second elastic foot 936 can be designed as required, for example, in a sheet shape.
  • the first elastic leg 938 is protruding from the surface of the base 937 facing the first circuit board 132
  • the second elastic leg 936 is protruding from the surface of the base 937 facing the second circuit board.
  • the first spring leg 938 is electrically connected to the second spring leg 936 through the base 937; for the base 937 that only plays a role of holding, the first spring leg 938 and the second spring leg 936 can be They are opposite ends of the same spring foot.
  • the first spring leg 938 is electrically connected to the first circuit board 132.
  • the first spring leg 938 can be abutted or welded to the first circuit board 132 to achieve electrical connection.
  • the second spring leg 936 is electrically connected to the second circuit board 134.
  • the second spring leg 936 can be welded to the second circuit board 134 to achieve electrical connection. Both the first elastic foot 938 and the second elastic foot 936 can be elastically deformed. Both the first spring leg 938 and the second spring leg 936 in the circuit board assembly 93 can be pressed tightly to maintain reliable contact with the first circuit board 132 and the second circuit board 134.
  • the first shield frame 933 in the ninth embodiment may further include a connecting wall 934, and the connecting wall 934 and the fourth wall 634 are located on opposite sides of the fifth wall 635, respectively.
  • the connecting wall 934 and the fifth wall 635 are bent and connected substantially perpendicularly, and are in contact with the upper surface of the second circuit board 134 (that is, the surface facing the first circuit board 132 ).
  • a number of connecting holes can be opened on the connecting wall 934, and a connecting piece 939 (such as screws, bolts, rivets, etc.) can be installed in each connecting hole.
  • the connecting piece 939 fixedly connects the connecting wall 934 with the second circuit board 134.
  • the locking of the connecting member 939 can overcome the rebound force of the first elastic leg 938 and the second elastic leg 936, ensuring the stable assembly of the first circuit board 132 and the second circuit board 134.
  • the ninth embodiment realizes the stacking and interconnection of the first circuit board 132 and the second circuit board 134 through the shrapnel plate 935, which provides another solution for increasing the device layout area and improving the device integration.
  • the ninth embodiment can also avoid stress failure on the edge of the first circuit board 132 and improve the mechanical reliability of the circuit board assembly; it can strengthen the electromagnetic shielding of the shrapnel plate 935 and avoid the shrapnel plate 935 and other devices in the cavity 93a. Interfere with each other.
  • the second shield frame 831 can be eliminated; the connection material can be used to replace the connector to realize the connection between the second circuit board 134 and the connection wall 934; on the premise of ensuring the stable assembly of the first circuit board and the second circuit board
  • the elastic plate 935 can also replace the conductive circuit board in the first to seventh embodiments.
  • the surface of the first circuit board 1032 facing the base 937 can be partially recessed to form a first limit.
  • the first limiting slot may penetrate through the side surface of the first circuit board 1032, or may be completely located within the contour boundary of the lower surface of the first circuit board 1032 (the latter solution is not shown in the figure).
  • One side of the base 937 extends into the first limiting groove and is matched with the inner wall of the first limiting groove.
  • the first spring legs 938 are all received in the first limiting groove and are in contact with the bottom surface of the first limiting groove.
  • the surface of the second circuit board 1034 facing the base 937 may be partially recessed to form a second limiting groove.
  • the other side of the base 937 extends into the second limiting groove and is matched with the inner wall of the second limiting groove.
  • the second spring legs 936 are all received in the second limiting groove and are in contact with the bottom surface of the second limiting groove.
  • the base 937 can be restricted by the first limiting slot and the second limiting slot, so that the first elastic leg 938 and the second elastic leg 936 can be stably connected to the first circuit board 1032 and the second circuit board 1034, respectively. touch.
  • the base 1136 may include a main body 1137, a first limiting portion 1139, and a second limiting portion 1138. Both the elastic leg 938 and the first limiting portion 1139 are protrudingly provided on the surface of the main body 1137 facing the first circuit board 1032, and the second elastic leg 936 and the second limiting portion 1138 are both protrudingly provided on the main body 1137 facing the second circuit board 1034. surface.
  • a first limiting slot is provided on the first circuit board 1032 in an area corresponding to the first limiting portion 1139. The first limiting portion 1139 extends into the first limiting slot to form a fit.
  • the first spring leg 938 is in the first limiting slot. outside.
  • a second limiting slot is provided on the second circuit board 1034 in an area corresponding to the second limiting portion 1138.
  • the second limiting portion 1138 extends into the second limiting slot to form a fit.
  • the second spring foot 936 is in the second limiting slot. outside. This structure can also achieve the limit of the base 1136, and ensure that the first elastic leg 938 and the second elastic leg 936 can stably contact the first circuit board 1032 and the second circuit board 1034, respectively.
  • first circuit board 1032 and the second circuit board 1034 have greater structural strength and can Ensure the structural strength of the entire circuit board assembly.

Abstract

La présente invention porte sur un ensemble carte de circuit imprimé (13). L'ensemble carte de circuit imprimé (13) comprend une première carte de circuit imprimé (132), une seconde carte de circuit imprimé (134), un premier cadre de protection (133) et un élément conducteur (135). La première carte de circuit imprimé (132) et la seconde carte de circuit imprimé (134) sont empilées à un intervalle ; le premier cadre de protection (133) est relié à la première carte de circuit imprimé (132) et à la seconde carte de circuit imprimé (134) ; la périphérie du premier cadre de protection (133) vient en contact avec la périphérie de la première carte de circuit imprimé (132), ou la périphérie du premier cadre de blindage (133) est rétractée dans la périphérie de la première carte de circuit imprimé (132) d'une certaine distance ; la première carte de circuit imprimé (132), la seconde carte de circuit imprimé (134), et le premier cadre de protection (133) renferment une cavité (13a) ; et l'élément conducteur (135) est disposé à l'intérieur de la cavité (13a) et est électriquement connecté à la première carte de circuit imprimé (132) et à la seconde carte de circuit imprimé (134).
PCT/CN2021/081029 2020-03-20 2021-03-16 Ensemble carte de circuit imprimé et dispositif électronique WO2021185237A1 (fr)

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