CN114206000A - Circuit board assembly and electronic device - Google Patents
Circuit board assembly and electronic device Download PDFInfo
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- CN114206000A CN114206000A CN202111603514.2A CN202111603514A CN114206000A CN 114206000 A CN114206000 A CN 114206000A CN 202111603514 A CN202111603514 A CN 202111603514A CN 114206000 A CN114206000 A CN 114206000A
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- 239000004020 conductor Substances 0.000 claims abstract description 28
- 210000000988 bone and bone Anatomy 0.000 claims description 24
- 238000003466 welding Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The application discloses a circuit board assembly and electronic equipment, and belongs to the technical field of communication equipment, wherein the circuit board assembly comprises a first circuit board, a second circuit board and at least one bonding pad, the second circuit board comprises a board main body and a skeleton frame plate which are mutually connected, the board main body and the first circuit board are stacked and arranged at intervals along the thickness direction, the skeleton frame plate is clamped between the first circuit board and the board main body, and the bonding pad is arranged at one end, far away from the board main body, of the skeleton frame plate and is electrically connected with the first circuit board; the framework plate is provided with at least one conductive connecting hole group which is arranged in one-to-one correspondence to the bonding pad, conductive materials are arranged in each conductive connecting hole group, and the plate main body is electrically connected with the bonding pad through the conductive connecting hole group; at least one of the conductive connection hole groups is a first conductive connection hole group comprising a plurality of conductive single holes, the projection of the bonding pad corresponding to the first conductive connection hole group in the thickness direction covers the first conductive connection hole group, and the bonding pad is connected with one end of each of the plurality of conductive single holes of the corresponding first conductive connection hole group.
Description
Technical Field
The application belongs to the technical field of communication equipment, and particularly relates to a circuit board assembly and electronic equipment.
Background
With the continuous improvement of the functions of electronic equipment such as a smart phone, the number of functional devices in the electronic equipment is gradually increased, and the size of a battery of the electronic equipment is correspondingly increased, so that the internal space of the electronic equipment in the length and width directions is gradually reduced, and the area of the electronic equipment, in which a circuit board can be arranged, is seriously compressed.
At present, Cavity (translated into holes or holes and the like) plate type circuit boards are mostly adopted to utilize the space in the thickness direction of electronic equipment, the Cavity plate type circuit boards comprise a skeleton frame plate structure, one end of the skeleton frame plate structure is provided with a bonding pad, so that the skeleton frame plate structure and the bonding pad are connected with two circuit boards which are arranged in a stacked mode in the thickness direction, and the two circuit boards are enabled to form an electrical connection relation. In addition, in the Cavity board type circuit board, the width of the bone rack board is relatively small, so that the space occupied by the bone rack board can be reduced.
However, the size of the pad at one end of the framework is relatively small due to the influence of the width of the framework, and therefore when the pad and the framework are connected through the conductive via hole, the pad can only correspond to one conductive via hole, and the mechanical connection performance and the overcurrent capacity between the pad and the framework are relatively poor.
Disclosure of Invention
The embodiment of the application aims to provide a circuit board assembly and electronic equipment, and aims to solve the problem that in the existing laminated circuit board, the mechanical connection performance and the overcurrent capacity between a bonding pad and a frame plate are relatively poor.
In a first aspect, an embodiment of the present application discloses a circuit board assembly, which includes a first circuit board, a second circuit board and at least one pad, where the second circuit board includes a board main body and a skeleton frame plate, the board main body and the first circuit board are stacked and arranged at intervals along a thickness direction of the first circuit board, the skeleton frame plate is clamped between the first circuit board and the board main body, one end of the skeleton frame plate is connected with the board main body, the pad is arranged at one end of the skeleton frame plate, which is far away from the board main body, and the pad is electrically connected with the first circuit board;
the framework plate is provided with at least one conductive connecting hole group, conductive materials are arranged in each conductive connecting hole group, the conductive connecting hole groups and the bonding pads are arranged in a one-to-one correspondence mode, and the plate main body is electrically connected with the bonding pads through the conductive connecting hole groups; at least one of the conductive connection hole groups is a first conductive connection hole group comprising a plurality of conductive single holes, the projection of the pad in the thickness direction of the first circuit board, corresponding to the first conductive connection hole group, covers the first conductive connection hole group, and the pad is connected with one end of each conductive single hole corresponding to the first conductive connection hole group.
In a second aspect, an embodiment of the present application discloses an electronic device, which includes the above circuit board assembly.
The embodiment of the application discloses circuit board assembly, it includes first circuit board, second circuit board and pad, and the board main part of second circuit board is range upon range of setting with first circuit board along the thickness direction of first circuit board, and the position of bone frame plate clamp of second circuit board is established between first circuit board and board main part, and the one end and the board main part of position of bone frame plate are connected, and the pad setting is kept away from the one end of board main part at the position of bone frame plate. And at least one conductive connecting hole group is arranged on the framework plate, conductive materials are arranged in the conductive connecting hole groups, and the conductive connecting hole groups and the bonding pads are arranged in a one-to-one correspondence mode, so that the bonding pads are electrically connected with the plate main body, and the first circuit board is further electrically connected with the plate main body.
Meanwhile, at least one of the conductive connection hole groups is a first conductive connection hole group comprising a plurality of conductive single holes, so that the overcurrent capacity of the first conductive connection hole group can be improved; meanwhile, the projection of the pad corresponding to the first conductive connection hole group in the thickness direction of the first circuit board covers the first conductive connection hole group, and the pad is connected with one end of each of the plurality of conductive single holes in the corresponding first conductive connection hole group, so that the connection area between the first conductive connection hole group and the pad is increased, the connection reliability between the pad and the pad is relatively high, the adhesion capability between the pad and the bone position frame plate is improved, and the overall performance of the circuit board assembly is relatively good.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic cross-sectional view of a circuit board assembly disclosed in an embodiment of the present application;
FIG. 2 is an enlarged view of a portion of one embodiment of a circuit board assembly disclosed in embodiments herein;
FIG. 3 is a schematic view of a portion of the circuit board assembly shown in FIG. 2 in another orientation;
fig. 4 is an enlarged view of a portion of another embodiment of a circuit board assembly according to an embodiment of the present disclosure;
FIG. 5 is a schematic view of a portion of the structure shown in FIG. 4 in another orientation;
fig. 6 is an enlarged view of a portion of a circuit board assembly according to still another embodiment of the disclosure;
fig. 7 is a schematic view of a portion of the structure in another direction in the circuit board assembly shown in fig. 6.
Description of reference numerals:
100-a first circuit board,
210-plate body, 220-bone rack plate, 230-mechanical hole, 240-first conductive connection hole group, 241-conductive single hole, 241 a-first hole, 241 b-second hole, 250-conductive layer,
300-first bonding pad,
400-solder ball,
500-electronic components,
600-pad external connection.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The folding mechanism and the electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
As shown in fig. 1 to 7, an embodiment of the present application discloses a circuit board assembly and an electronic device, where the circuit board assembly can be applied to the electronic device. The circuit board assembly includes a first circuit board 100, a second circuit board, and at least one pad.
The first circuit board 100 may be a conventional flat circuit board, and the electronic component 500 may be soldered on the first circuit board; of course, the first circuit board 100 may also be a special-shaped circuit board, which is not limited herein.
As shown in fig. 1, the second circuit board includes a board main body 210 and a skeletal frame plate 220, wherein the board main body 210 is a portion of the second circuit board for mounting the electronic component 500, that is, the electronic component 500 to be mounted on the second circuit board can be soldered to the board main body 210. In other words, the board main body 210 in the second circuit board may be identical in structure and function to the first circuit board 100 described above.
The board main body 210 and the first circuit board 100 are stacked and spaced apart in the thickness direction of the first circuit board 100, so that the circuit board assembly can maximally utilize the space in the thickness direction of the electronic device, and the space for accommodating the circuit board assembly in the electronic device is increased. Also, the bone bay plate 220 is sandwiched between the first circuit board 100 and the plate body 210 to provide a structural foundation for the connection between the first circuit board 100 and the plate body 210.
Meanwhile, one end of the rib position shelf plate 220 is connected with the plate main body 210, so that the plate main body 210 and the rib position shelf plate 220 are connected into a whole; alternatively, the board body 210 and the bone rack 220 may be integrally formed to improve the structural reliability of the second circuit board and the reliability of the electrical connection between the board body 210 and the first circuit board 100.
And, the pad is disposed at an end of the rib shelf 220 far away from the board main body 210, that is, the pad is disposed at an end of the rib shelf 220 close to the first circuit board 100, and the pad can provide a bridging effect for the electrical connection between the first circuit board 100 and the second circuit board. The pads are electrically connected to the first circuit board 100, and specifically, the pads may be directly electrically connected to corresponding positions on the first circuit board 100 by welding or the like; in another embodiment of the present application, optionally, the bonding pad is electrically connected to the first circuit board 100 through the solder ball 400, which can improve the connection reliability between the bonding pad and the first circuit board 100 and reduce the connection difficulty between the bonding pad and the first circuit board 100.
In order to enable the board body 210 to be electrically connected to the bonding pad through the bone rack board 220, as shown in fig. 1, at least one conductive connection hole set is provided on the bone rack board 220, and a conductive material is provided in each conductive connection hole set, the conductive material is provided in a manner including, but not limited to, filling, electroplating, or bonding, and the conductive material includes, but not limited to, a metal conductive material such as copper, tin, and the like; and the conductive connection hole groups and the pads are arranged in a one-to-one correspondence, so that the board body 210 can form an electrical connection relationship with the pads through the conductive connection hole groups under the action of the conductive material in the conductive connection hole groups. The conductive connecting hole group can be formed in a laser processing mode so as to reduce the processing difficulty of the conductive connecting hole group and improve the processing precision of the conductive connecting hole group.
The size of the conductive connection hole group in the thickness direction of the first circuit board 100 may be determined according to specific conditions such as a processing technology and actual requirements, and is not limited herein. The number of the conductive connection hole groups between the board main body 210 and the pads may be one or more, and the pads may be ensured to be disposed in one-to-one correspondence with the conductive connection hole groups by making the number of the conductive connection hole groups between the board main body 210 and the pads correspond to the number of the pads. In the case that the number of the conductive connection hole groups is multiple, the bone rack 220 may have a multi-layer structure, and the ends of the conductive connection hole groups departing from the bonding pads are respectively connected to different positions of the bone rack 220. The conductive material may be copper, and copper may be injected into the conductive via set through a copper injection process, so that the board body 210 and the pad are electrically connected. In addition, a conductive layer 250 may be embedded in the skeletal plate 220, so that the conductive material in the conductive via set can be electrically connected to the plate body 210 through the conductive layer 250.
Meanwhile, in order to further improve the overcurrent capability between the first circuit board 100 and the board main body 210 in the circuit board assembly, as shown in fig. 2, 4 and 6, the at least one conductive connection hole group may be made to include a plurality of conductive single holes 241. Specifically, as described above, the number of the conductive connection hole groups may be one or more, in this case, at least one of the conductive connection hole groups may be the first conductive connection hole group 240, and the first conductive connection hole group 240 includes a plurality of conductive single holes 241, and in a case where the sectional area of each conductive single hole 241 is kept unchanged, the amount of the conductive material that the first conductive connection hole group 240 can accommodate is relatively larger, so that the sectional area of the first conductive connection hole group 240 can be increased, and by connecting the pad to one end of each of the plurality of conductive single holes 241 in the corresponding first conductive connection hole group 240, an effect of increasing the overcurrent capacity of the first conductive connection hole group 240 can be achieved. Even if the size of the single conductive via 241 in the first conductive via group 240 is reduced compared to the cross-sectional area of the conventional conductive via, the cross-sectional area of the entire first conductive via group 240 may be increased when the first conductive via group 240 includes a plurality of single conductive vias 241.
Certainly, in order to ensure that the connection reliability between the first conductive connection hole group 240 and the pad is relatively high, it is further required to make the projection of the pad corresponding to the first conductive connection hole group 240 in the thickness direction of the first circuit board 100 cover the first conductive connection hole group 240, so that the conductive material in each conductive single hole 241 in the first conductive connection hole group 240 can "fall" on the surface of the pad, so as to improve the adhesion capability between the pad and the first conductive connection hole group 240, and further improve the overall performance of the circuit board assembly.
Specifically, the arrangement manner of the plurality of conductive single holes 241 in the first conductive connection hole group 240 may be determined based on the size of the pad, so as to determine the specific relative positions of the plurality of conductive single holes 241 under the condition that the correspondence relationship between the pad and the plurality of conductive single holes 241 is satisfied. More specifically, the number of the conductive single holes 241 may be two, and two conductive single holes 241 may be arranged at an area with the largest size span on the pad, and a plurality of conductive single holes 241 may be arranged in a structure corresponding to the pad. For example, the bonding pad may be a circular structure, in which case the conductive single hole 241 may be arranged corresponding to a straight line on the bonding pad where any diameter is located.
The embodiment of the application discloses a circuit board assembly, it includes first circuit board 100, second circuit board and pad, and the board main part 210 and the first circuit board 100 of second circuit board are along the range upon range of setting of the thickness direction of first circuit board 100, and the position of bone frame 220 clamp of second circuit board is established between first circuit board 100 and board main part 210, and the one end and the board main part 210 of position of bone frame 220 are connected, and the pad setting is kept away from the one end of board main part 210 at position of bone frame 220. Furthermore, at least one conductive connection hole set is disposed on the skeleton frame plate 220, and the conductive connection hole sets and the pads are disposed in a one-to-one correspondence manner, so that the pads are electrically connected to the board main body 210, and the first circuit board 100 and the board main body 210 form an electrical connection relationship.
Meanwhile, at least one of the conductive via groups is the first conductive via group 240 including a plurality of conductive single holes 241, which enables the overcurrent capability of the first conductive via group 240 to be improved; meanwhile, the projection of the pad corresponding to the first conductive connection hole group 240 in the thickness direction of the first circuit board 100 covers the first conductive connection hole group 240, so that the connection area between the first conductive connection hole group 240 and the pad is increased, the connection reliability between the first conductive connection hole group 240 and the pad is relatively high, the adhesion capability between the pad and the bone frame plate 220 is improved, and the overall performance of the circuit board assembly is relatively good.
Optionally, the number of the conductive single holes 241 in the first conductive connection hole group 240 is two, which may improve the over-current capability of the conductive material in the first conductive connection hole group 240 and the connection reliability between the conductive material in the first conductive connection hole group 240 and the pad without changing the structure of the existing pad.
On this basis, the two conductive single holes 241 in the first conductive connection hole group 240 may be a first conductive single hole and a second conductive single hole, respectively, and optionally, a projection of the first conductive single hole in the thickness direction of the first circuit board 100 is located outside the second conductive single hole. In other words, the first conductive via and the second conductive via are independent of each other. Under the condition of adopting the technical scheme, the positions of the two conductive single holes 241 (namely the first conductive single hole and the second conductive single hole) are determined, so that the conductive single holes can be formed in a laser processing mode, the processing difficulty of the first conductive connection hole group 240 is relatively low, and the cost cannot be obviously increased while the overcurrent capacity of the first conductive connection hole group 240 is improved.
In the above embodiment, the cross-sectional areas of the conductive single holes 241 at different positions are optionally the same, and the first conductive single hole and the second conductive single hole may be arranged in a tangential manner.
In another embodiment of the present application, optionally, the cross-sectional area of each conductive single hole 241 in the first conductive connection hole group 240 is different at different positions, and in detail, the cross-sectional area of each conductive single hole 241 may be gradually reduced along a direction in which a first aperture 241a of the conductive single hole 241 points to a second aperture 241b thereof, wherein the first aperture 241a is an aperture of the conductive single hole 241 towards the pad, and the second aperture 241b is an aperture of the conductive single hole 241 towards the mechanical hole 230. Under the condition of adopting the technical scheme, the forming difficulty of the conductive single hole 241 can be reduced.
Based on the above embodiment, as shown in fig. 3, the first aperture 241a of the first conductive single hole and the first aperture 241a of the second conductive single hole may be arranged at an interval, so as to further reduce the processing difficulty of the first conductive single hole and the second conductive single hole; in addition, the processing processes of the first conductive single hole and the second conductive single hole can be prevented from being interfered with each other as much as possible, and the processing precision and reliability of the first conductive single hole and the second conductive single hole are improved.
Specifically, the distance between the first aperture 241a of the first conductive single hole and the first aperture 241a of the second conductive single hole may be determined according to the actual conditions such as the size of the pad, and the size of the interval between the first apertures 241a of the first conductive single hole and the first aperture 241a of the second conductive single hole may be made as large as possible within a feasible range, so as to reduce the processing difficulty of the first conductive single hole and the second conductive single hole to the maximum.
In addition, in the case that the cross-sectional areas at different positions on each conductive single hole 241 are different, the cross-sectional area at the second opening of each conductive single hole 241 facing the mechanical hole 230 is the smallest, i.e. the cross-sectional area of the conductive material in the conductive single hole 241 represents the overcurrent capacity of the conductive single hole 241. In the case where the first conductive connection hole group 240 includes two conductive single holes 241 of the above-described structure, the overcurrent capacity of the first conductive connection hole group 240 is twice the sectional area of the second orifice of the conductive single hole 241.
In the case where the first conductive single hole group 240 includes two conductive single holes 241, and the sectional area of each conductive single hole 241 is gradually reduced along the direction in which the first hole 241a is directed to the second hole, the two conductive single holes 241 may also be a first conductive single hole and a second conductive single hole, respectively. On this basis, in order to further improve the overcurrent capacity of the first conductive via group 240, a communication cavity may be disposed at the second aperture of each of the first conductive single hole and the second conductive single hole, so that the portion between the second apertures of each of the first conductive single hole and the second conductive single hole may also be filled with a conductive material, thereby further improving the conductive capacity of the first conductive via group 240.
In detail, the first conductive connection hole group 240 further includes a communication cavity, and the communication cavity may be filled with a conductive material, similar to each conductive single hole 241. In the process of laying the first conductive single hole and the second conductive single hole, the arrangement positions of the first conductive single hole and the second conductive single hole can be determined based on the sizes of the second orifices of the first conductive single hole and the second conductive single hole, so that the second orifices of the first conductive single hole and the second orifices of the second conductive single hole are spaced from each other. Furthermore, the interval between the second apertures of the two conductive single holes 241 can be removed by laser drilling to form a communicating cavity, so that the communicating cavity is communicated between the second aperture of the first conductive single hole and the second aperture of the second conductive single hole, and thus, in the process of filling the conductive material, the second apertures of the two conductive single holes 241 are connected with the conductive material in the communicating cavity to form a whole, and the overcurrent capacity is provided together. Obviously, in the case that the first electrically conductive connection hole group 240 includes two electrically conductive single holes 241, the overcurrent capacity of the first electrically conductive connection hole group 240 may be further increased by adopting the above technical solution.
In the above embodiment, the first apertures of the first conductive single hole and the second conductive single hole may also be spaced from each other, in which case, the communication cavity may further extend from the second aperture of the conductive single hole 241 to the first aperture 241a, and the first aperture 241a of the first conductive single hole and the first aperture 241a of the second conductive single hole are also communicated with each other through the communication cavity, so as to further ensure that the overcurrent capability of the conductive connection aperture set disclosed in this embodiment is significantly increased.
In another embodiment of the present application, as shown in fig. 4 and 5, a projection portion of the first conductive single via and the second conductive single via in the thickness direction of the first circuit board 100 may be made to coincide; alternatively, a part of a projection of the first aperture 241a of the first conductive single hole in the thickness direction of the first circuit board 100 may be located inside the first aperture 241a of the second conductive single hole.
Of course, in this embodiment, since the first conductive single hole and the second conductive single hole are partially overlapped in the thickness direction, the hole walls of the first conductive single hole and the second conductive single hole have a portion connected to each other, and the communication cavity is communicated with the second openings of the first conductive single hole and the second conductive single hole, on the basis, in order to prevent the formation material of the bone frame plate 220 from being still sandwiched between the first conductive single hole and the second conductive single hole, the communication cavity may extend from the position where the second opening of the first conductive single hole is located to the connection position of the hole walls of the first conductive single hole and the second conductive single hole. That is, in the conductive connection hole group disclosed in this embodiment, the first conductive single hole and the second conductive single hole are respectively directly connected along one portion of the hole walls in the thickness direction of the first circuit board 100, and the other portions are indirectly connected through the cavity walls of the communication cavity, so that the first conductive single hole and the second conductive single hole are integrally connected together.
Under the condition of adopting the technical scheme, the processing difficulty of the first conductive single hole and the second conductive single hole can be reduced to a certain extent, and the processing difficulty of the communicating cavity is relatively low. Of course, in the case that the first apertures 241a of the two single conductive holes 241 overlap each other, it is necessary to ensure that the second apertures of the two single conductive holes 241 are still spaced apart from each other, so as to ensure that the overcurrent capacity of the first conductive connection hole set 240 is relatively large.
In another embodiment of the present application, the first conductive via group 240 may include at least three conductive vias 241, in which case, the utilization rate of the bonding area on the pad may be further improved, so that the overcurrent capability of the conductive material in the first conductive via group 240 may be further increased, and the adhesion reliability between the conductive material in the first conductive via group 240 and the pad may be improved. Of course, in the process of laying out at least three conductive single holes 241 in the first conductive connection hole group 240, it is necessary to ensure that any two conductive single holes 241 cannot be completely overlapped.
As described above, the number of the pads may be one or more, in which case, at least one of the pads may be the first pad 300, the first pad 300 is disposed corresponding to the first conductive connection hole group 240, and accordingly, the number of the first conductive connection hole group 240 is the same as the number of the first pad 300, and corresponds to one.
Based on the above embodiments, optionally, the circuit board assembly disclosed in the embodiments of the present application may further include a pad external-connection portion 600, and the outer edge of the first pad 300 is externally connected with the pad external-connection portion 600, so that the first pad 300 and the pad external-connection portion 600 are combined to form a "new pad" with a larger size, and the butt-joint area on the "new pad" is relatively larger, so that the circuit board assembly may be matched with a larger number of conductive single holes 241.
Accordingly, when the first conductive connection hole set 240 includes at least three conductive single holes 241, the projections of the conductive single holes 241 of the first conductive connection hole set 240 in the thickness direction of the first circuit board 100 may not overlap each other. Furthermore, the difficulty of processing at least three conductive single holes 241 in the first conductive connection hole group 240 is relatively small.
In addition, as described above, the size of the pad can be made as small as possible by connecting the pad and the board main body 210 by combining the mechanical hole 230 and the set of conductive connection holes through the bone rack board 220, and in the above embodiment, since the outer edge of the first pad 300 is externally connected with the pad external portion 600, the butt joint area on the "new pad" is relatively large, for this reason, in this embodiment, the insulating layer can be covered on the side of the pad external portion 600 away from the first circuit board 100 to cover the pad external portion 600 through the insulating layer, so that the pad external portion 600 can provide a larger bearing area for the set of conductive connection holes, and at the same time, the exposed portion, i.e., the portion capable of conducting electricity, remains unchanged, and the portion capable of electrically connecting the surface of the pad is still relatively small.
Specifically, in the processing process, the first pad 300 and the pad external connection portion 600 on the outer edge thereof may be integrally formed, so that the forming difficulty of the first pad 300 and the pad external connection portion 600 is reduced, the connection reliability between the first pad 300 and the pad external connection portion 600 is relatively higher, and the bearing capacity of a new pad is improved. In addition, the insulating layer may be solder resist ink, so as to ensure that the conductive material in the plurality of conductive single holes 241 can form a reliable insulating relationship with the pad external connection 600 through the insulating layer.
In the case that the number of the conductive single holes 241 in the first conductive connection hole group 240 is at least three, and the outer edge of the first pad 300 is externally connected with the pad external connection part 600, further, any two conductive single holes 241 in the first conductive connection hole group 240 may be spaced from each other toward the hole opening of the first pad 300, that is, the projections of any two conductive single holes 241 in the first conductive connection hole group 240 in the thickness direction of the first circuit board 100 are spaced from each other, which may further reduce the difficulty in forming each conductive single hole 241 in the first conductive connection hole group 240, and may prevent the processing processes of any two conductive single holes 241 from interfering with each other.
Alternatively, as shown in fig. 7, the first conductive connection hole group 240 may include three conductive single holes 241, in which case, the distances between any two adjacent conductive single holes 241 may also be equal, or in which a connection line of the centers of the first apertures 241a (or the second apertures) of the three conductive single holes 241 may form an equilateral triangle, in which case, the size of the area occupied by the whole first conductive connection hole group 240 can be reduced as much as possible, and thus the size of the pad external-connection portion 600 that needs to be added can be reduced; meanwhile, the sectional area of the conductive material filled in the first conductive connection hole group 240 can be maximized, the overcurrent capability of the conductive material in the first conductive connection hole group 240 can be improved, and the connection reliability between the conductive material in the first conductive connection hole group 240 and the first pad 300 can be improved.
In addition, based on the circuit board assemblies disclosed in the above embodiments, in the process of forming the rib position frame plate 220 in the second circuit board, the respective advantages of the conductive connection hole groups disclosed in different embodiments can be utilized, and the conductive connection hole groups with different structures are respectively formed at different positions of the rib position frame plate 220, so that the whole rib position frame plate 220 has various advantages of superior performance, lower processing difficulty and the like, and the market competitiveness of the circuit board assembly is maximally improved.
As described above, the conductive connection hole group may be processed by laser processing, that is, the conductive connection hole group is a laser hole group, in this case, limited by factors such as a maximum cross-sectional area of the conductive connection hole group, the depth of the conductive connection hole group needs to be within a preset range, and if the size of the space between the conductive connection hole group and the first circuit board 100 is relatively large in the process of connecting the board body 210 and the first circuit board 100, optionally, a mechanical hole 230 is further disposed on the framework 220, that is, a via hole formed by mechanical processing is used, the mechanical hole 230 communicates with the conductive connection hole group, and the mechanical hole 230 can be filled with a conductive material, so that the board body 210 can be electrically connected to the pad through the conductive connection hole group and the mechanical hole 230.
Further, along the thickness direction of the first circuit board 100, at least one first conductive connection hole set 240 may be disposed at both ends of the mechanical hole 230 opposite to each other, that is, at least one conductive connection hole set is disposed at both ends of the mechanical hole 230 opposite to each other, and at least one first conductive connection hole set 240 is correspondingly included in at least one conductive connection hole set at both ends of the mechanical hole 230 opposite to each other, and each first conductive connection hole set includes a plurality of conductive single holes 241. One end of each of the plurality of conductive single holes 241 in the first conductive connection hole group on the side of the mechanical hole 230 away from the pad is connected to the board body 210, so as to improve the reliability and overcurrent capacity of the mechanical connection between the bone rack plate 220 and the board body 210.
Based on any of the above embodiments, the present application further discloses an electronic device, where the electronic device includes the circuit board assembly disclosed in any of the above embodiments, and of course, the electronic device may further include other devices such as a chip and a battery, and the details are not described here in detail in view of brevity of text.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. A circuit board assembly is characterized by comprising a first circuit board, a second circuit board and at least one welding pad, wherein the second circuit board comprises a board main body and a bone position frame plate, the board main body and the first circuit board are stacked and arranged at intervals along the thickness direction of the first circuit board, the bone position frame plate is clamped between the first circuit board and the board main body, one end of the bone position frame plate is connected with the board main body, the welding pad is arranged at one end, far away from the board main body, of the bone position frame plate, and the welding pad is electrically connected with the first circuit board;
the framework plate is provided with at least one conductive connecting hole group, conductive materials are arranged in each conductive connecting hole group, the conductive connecting hole groups and the bonding pads are arranged in a one-to-one correspondence mode, and the plate main body is electrically connected with the bonding pads through the conductive connecting hole groups; at least one of the conductive connection hole groups is a first conductive connection hole group comprising a plurality of conductive single holes, the projection of the pad in the thickness direction of the first circuit board, corresponding to the first conductive connection hole group, covers the first conductive connection hole group, and the pad is connected with one end of each conductive single hole corresponding to the first conductive connection hole group.
2. The circuit board assembly according to claim 1, wherein the number of the conductive single holes in the first conductive connection hole group is two, and is a first conductive single hole and a second conductive single hole, respectively, and a projection of the first conductive single hole in the thickness direction is located outside the second conductive single hole.
3. The circuit board assembly according to claim 2, wherein the cross-sectional area of each of the conductive single holes is gradually reduced along a direction in which the first aperture of the conductive single hole toward the pad points toward the second aperture of the board body, and the first aperture of the first conductive single hole is spaced apart from the first aperture of the second conductive single hole.
4. The circuit board assembly according to claim 1, wherein the number of the conductive single holes in the first conductive connection hole group is two, and is a first conductive single hole and a second conductive single hole respectively, and the cross-sectional area of each conductive single hole is gradually reduced along the direction from the first aperture of the conductive single hole towards the pad to the second aperture of the conductive single hole towards the second aperture of the board body;
the first conductive connecting hole group further comprises a communicating cavity, conductive materials are arranged in the communicating cavity, the second hole opening of the first conductive single hole and the second hole opening of the second conductive single hole are arranged at intervals, and the communicating cavity is communicated between the second hole opening of the first conductive single hole and the second hole opening of the second conductive single hole.
5. The circuit board assembly according to claim 4, wherein a projection of the first conductive single via and the second conductive single via in a thickness direction of the first circuit board partially overlap.
6. The circuit board assembly of claim 1, wherein the first set of conductive connection holes comprises at least three of the conductive vias.
7. The circuit board assembly according to claim 6, further comprising a pad external connection portion, wherein at least one of the pads is a first pad, the first pad is disposed corresponding to the first conductive connection hole set, the pad external connection portion is externally connected to an outer edge of the first pad, an insulating layer covers a side of the pad external connection portion away from the first circuit board, and projections of the conductive single holes of the first conductive connection hole set in the thickness direction do not overlap with each other.
8. The circuit board assembly of claim 7, wherein any two of the conductive vias of the first set of conductive vias are spaced apart from each other toward the aperture of the first pad.
9. The circuit board assembly according to claim 7, wherein the first set of conductive connection holes comprises three conductive vias, and a distance between any two adjacent conductive vias is equal.
10. The circuit board assembly of claim 1, wherein the set of conductive vias are laser vias, the bone frame plate is provided with mechanical vias, and the plate body is electrically connected to the pads through the set of conductive vias and the mechanical vias.
11. The circuit board assembly of claim 10, wherein at least one of the first set of conductive vias is disposed at opposite ends of the mechanical hole along a thickness direction of the first circuit board.
12. An electronic device comprising the circuit board assembly of any one of claims 1-11.
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| CN202111603514.2A CN114206000B (en) | 2021-12-24 | 2021-12-24 | Circuit board assembly and electronic equipment |
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| CN202111603514.2A CN114206000B (en) | 2021-12-24 | 2021-12-24 | Circuit board assembly and electronic equipment |
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