CN110177428A - Intermediary layer and printed circuit board including the intermediary layer - Google Patents
Intermediary layer and printed circuit board including the intermediary layer Download PDFInfo
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- CN110177428A CN110177428A CN201810501415.5A CN201810501415A CN110177428A CN 110177428 A CN110177428 A CN 110177428A CN 201810501415 A CN201810501415 A CN 201810501415A CN 110177428 A CN110177428 A CN 110177428A
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of intermediary layer and including the printed circuit board of the intermediary layer.Intermediary layer connection first substrate according to an aspect of the present invention and the second substrate, first substrate is being pasted with multiple first electronic components on one side, the second substrate is being pasted with multiple second electronic components on one side, it and include: insulating layer, it is arranged between first substrate and the second substrate, so that insulating layer with the first substrate while it is opposite, keep the another side of the insulating layer and the one side of the second substrate opposite；Multiple first cavitys, the one side open of Xiang Suoshu insulating layer, and then accommodate first electronic component；The another side of multiple second cavitys, Xiang Suoshu insulating layer is open, and then accommodates second electronic component；And through-hole, it is penetrated through from the one of the insulating layer towards another side, to be electrically connected the first substrate and the second substrate, wherein the through-hole passes through between the multiple first cavity and between the multiple second cavity.
Description
Technical field
The present invention relates to a kind of intermediary layer (interposer) and including the printed circuit board of the intermediary layer.
Background technique
Since the use of various electronic equipments explosively increases, the hair of digital technology and semiconductor technology etc. at the same time
Exhibition, so that the application field of accurate and complicated electronic equipment becomes extensive.As the closeness of electronic equipment internal component mentions
Height, PCB (printed circuit board) area needed for connection all parts (active, passive) are also increasing.In addition, battery
Size is in increased trend, it is therefore desirable to effectively arrange in the confined space of electronic equipment and install PCB.
[existing technical literature]
[patent document]
Korean Patent Publication 10-1324595 (authorization: 2013-10-28).
Summary of the invention
The purpose of the present invention is to provide the intermediary layers that one kind can reduce the area that printed circuit board occupies.
One side according to the present invention provides a kind of intermediary layer, connects first substrate and the second substrate, first base
Plate is being pasted with multiple first electronic components on one side, and the second substrate is being pasted with multiple second electronic components on one side, and wraps
Include: insulating layer is arranged between the first substrate and the second substrate, so that the one side of the insulating layer and described first
The one side of substrate is opposite, keeps the another side of the insulating layer and the one side of the second substrate opposite；Multiple first cavitys, to institute
The one side open of insulating layer is stated, and then accommodates first electronic component；Multiple second cavitys, the institute of Xiang Suoshu insulating layer
It is open to state another side, and then accommodates second electronic component；And through-hole, it is passed through from the one of the insulating layer towards another side
It is logical, to be electrically connected the first substrate and the second substrate, wherein the through-hole passes through between the multiple first cavity
And between the multiple second cavity.
One side according to the present invention provides a kind of intermediary layer, connects first substrate and the second substrate, first base
Plate is being pasted with multiple second electronic components being pasted with multiple first electronic components, the second substrate on one side on one side, wherein
Include: insulating layer, be arranged between the first substrate and the second substrate, so that the one side of the insulating layer and described
The one side of one substrate is opposite, keeps the another side of the insulating layer and the one side of the second substrate opposite；Multiple first cavitys, to
The one side open of the insulating layer, and then accommodate first electronic component；Multiple second cavitys, Xiang Suoshu insulating layer
The another side is open, and then accommodates second electronic component；And through-hole, it is passed through from the one of the insulating layer towards another side
It is logical, to be electrically connected the first substrate and the second substrate, wherein the insulating layer is described logical by multiple layers of composition
Hole includes via conductors, and each layer of the via conductors in multiple layers of the insulating layer stacks along the vertical direction
(stack) it is formed.
One side according to the present invention provides a kind of printed circuit board, wherein includes: first substrate, is being pasted on one side
Multiple first electronic components；The second substrate is being pasted with multiple second electronic components on one side；And intermediary layer, connect described the
One substrate and the second substrate, wherein the intermediary layer includes: insulating layer, is arranged in the first substrate and described second
Between substrate so that the insulating layer with the first substrate while it is opposite, make the another side of the insulating layer with
The one side of the second substrate is opposite；Multiple first cavitys, the one side open of Xiang Suoshu insulating layer, and then accommodate described the
One electronic component；The another side of multiple second cavitys, Xiang Suoshu insulating layer is open, and then accommodates the second electronics member
Part；And through-hole, it is penetrated through from the one of the insulating layer towards another side, to be electrically connected the first substrate and second base
Plate, wherein the through-hole passes through between the multiple first cavity and between the multiple second cavity.
One side according to the present invention provides a kind of printed circuit board, wherein includes: first substrate, is being pasted on one side
Multiple first electronic components；The second substrate is being pasted with multiple second electronic components on one side；And intermediary layer, connect described the
One substrate and the second substrate, wherein the intermediary layer includes: insulating layer, is arranged in the first substrate and described second
Between substrate so that the insulation with the first substrate while it is opposite, make the another side of the insulation with it is described
The one side of the second substrate is opposite；Multiple first cavitys, the one side open of Xiang Suoshu insulating layer, and then accommodate first electricity
Subcomponent；The another side of multiple second cavitys, Xiang Suoshu insulating layer is open, and then accommodates second electronic component；With
And through-hole, it is penetrated through from the one of the insulating layer towards another side, so that it is electrically connected the first substrate and the second substrate,
In, the insulating layer is by multiple layers of composition, and the through-hole includes via conductors, and the via conductors are more the insulating layer
Each layer in a layer stacks (stack) formation along the vertical direction.
According to the present invention it is possible to provide the intermediary layer that can reduce the area that printed circuit board occupies.
Detailed description of the invention
Fig. 1 is the figure for showing the electronic equipment for being equipped with printed circuit board.
Fig. 2 is the figure for showing the printed circuit board of embodiment according to the present invention.
Fig. 3 and Fig. 4 is the figure for showing the intermediary layer of embodiment according to the present invention.
Fig. 5 and Fig. 6 is the figure for showing the manufacturing method of intermediary layer of embodiment according to the present invention.
Fig. 7 to Fig. 9 is the figure for showing the intermediary layer of various embodiments according to the present invention.
Symbol description
100: first substrate 110: on one side
120: 130: the first pad of another side
E1: the first electronic component E3: third electronic component
200: the second substrate 210: on one side
220: 230: the second pad of another side
E2: the second electronic component 300: intermediary layer
310: insulating layer 311,312,313: layer
320: the first cavity, 330: the second cavity
340: through-hole 341,342,343: via conductors
350: 360: the second through-hole of via pad
361,362,363: via conductors 370: via pad
400: metal layer 400': circuit
500: thermal component
Specific embodiment
Referring to attached drawing, the embodiment of intermediary layer according to the present invention and the printed circuit board for including the intermediary layer is carried out detailed
Thin explanation assigns identical reference numeral to identical or corresponding constituent element during being described with reference to the accompanying drawings,
And repeated explanation of the omission to it.
Also, the equal terms of used below first, second are only to be used to distinguish identical or corresponding constituent element
Identification sign, identical or corresponding constituent element are not limited by the first, second equal terms.
Also, " in conjunction with " this concept uses to indicate the contact relation between each component, does not mean only that each
It further include thering are other compositions to be located between each component, and then constitute between constituent element the case where direct physical contact
Element is contacted with the case where other compositions respectively.
Fig. 1 is the figure for showing the electronic equipment for being equipped with printed circuit board, and Fig. 2 shows embodiment according to the present invention
The figure of printed circuit board, Fig. 3 and Fig. 4 are the figures for showing the intermediary layer of embodiment according to the present invention.
Printed circuit board is installed in the various electronic including smart phone.Electronics is pasted in printed circuit board to set
Standby required component, and the electrical connection between component is realized by printed circuit board, so as to execute the function of electronic equipment
Energy.Such printed circuit board can be mainboard (main board).
As shown in Figure 1, printed circuit board 10, battery especially in portable electronic device 1, as mainboard
(battery) it 20 etc. is installed in casting of electronic device, if since the size of display unit increases, camera has the function of high-resolution
Deng and get higher the configuration of electronic device 1, then power consumption increases, therefore the capacity of battery 20 should also increase with size.If electric
The size in pond 20 increases, then the area that printed circuit board 10 can occupy is opposite to be reduced.In turn, if printed circuit can be reduced
The area that plate 10 occupies, then the area that can distribute to battery 20 increases, therefore can be realized the enlargement of battery 20.
The printed circuit board 10 of embodiment according to the present invention has multilayered structure as illustrated in fig. 2, stacks (stack) knot
Structure or interlayer (sandwich) structure, therefore the area that occupies in electronic equipment of printed circuit board 10 minimizes, and then can be with
Increase the area that battery 20 can occupy.
Referring to Fig. 2, the printed circuit board 10 of embodiment according to the present invention include first substrate 100, the second substrate 200 and
Intermediary layer 300.First substrate 100 and 200 mounted with electronic components of the second substrate and play the Essential Action as printed circuit board,
Intermediary layer 300 plays while supporting first substrate 100 with the second substrate 200 and is electrically connected first substrate 100 and the second substrate
200 effect.
First substrate 100, the second substrate 200 are arranged as being spaced from each other up and down and constituting multilayered structure, stacked structure, interlayer
Structure.Specifically, first substrate 100 and the second substrate 200 are with the one side 110 of first substrate 100 and the one of the second substrate 200
The opposite mode in face 210 is arranged apart.
First substrate 100 and the second substrate 200 are respectively formed as plate, and can be using multiple insulation material layers and
The multilager base plate that multiple circuit layers are constituted, and can be 8 layers or 10 laminar substrates on the basis of circuit layer.
First substrate 100 and the insulation material layer of the second substrate 200 be by such as epoxy resin, polyimide resin,
The layer of the megohmite insulants such as BT resin, liquid crystal polymer (LCP:Liquid Crystal Polymer) composition.Circuit layer passes through all
The conductive materials of such as copper (Cu) metal etc. are formed and are designed as with specific pattern.Circuit layer can be formed in insulation material layer
One or two sides, and the circuit layer of mutually different layer can pass through perforation insulation material layer connection conductor electrical connection.
Multiple first electronic component E1 are pasted in the one side 110 of first substrate 100.Here, the first electronic component E1 can
To include active component, passive element, integrated circuit etc., however type is not limited and determines.Also, in the another of first substrate 100
120 it can be pasted with multiple third electronic component E3 on one side.
First substrate 100 one side 110 equipped with the first pad 130.First pad 130 can by circuit layer with
First electronic component E1 and/or third electronic component E3 electrical connection.In particular, the first pad 130 and third electronic component E3 is not only
It is connected by circuit layer, is also connected by the through-hole that perforation first substrate 100 is formed.
First pad 130, which can be, is located at a part of outermost circuit layer in 110 side of one side of first substrate 100.
Specifically, the first pad 130 can be formed at the outermost insulation material layer of first substrate 100 and be covered by solder resist
Circuit layer a part, the first pad 130 can expose by the opening of solder resist.
First pad 130 can be formed as multiple.
Multiple second electronic component E2 are pasted in the one side 210 of the second substrate 200.Here, the second electronic component E2 can
To include active component, passive element, integrated circuit etc., however type is not limited and determines.
Also, in the one side of the second substrate 200 210 equipped with the second pad 230.Second pad 230 can pass through circuit
Layer and be electrically connected with the second electronic component E2.
Second pad 230, which can be, is located at a part of outermost circuit layer in a surface side of the second substrate 200.Specifically
For, the second pad 230 can be formed at the outermost insulation material layer of the second substrate 200 and by the electricity of solder resist covering
A part of road floor, the second pad 230 can be exposed by the opening of solder resist.
Second pad 230 can be formed as multiple.
First substrate 100 110 with the second substrate 200 while 210 opposite to each other, and the first pad 130 and the
Two pads 230 are opposite to each other.Here, the first pad 130 is corresponded to each other with the position of the second pad 230, specifically, from first
Line from pad 130 to the second pad 230 (or opposite) connection (for example, the first pad 130 of connection and the second pad 230 is respective
The line at center) it can be vertical with first substrate 100 and the second substrate 200 respectively.But the first pad 130 and the second pad 230
Position and inaccurately consistent, the position of the first pad 130 and the second pad 230 can be in the range of can be connected with each other
It is staggered.That is, from the first pad 130 to the line of second pad 230 (or opposite) connection (for example, the first pad 130 and second of connection
The line at the respective center of pad 230) it can be oblique line relative to first substrate 100 and the second substrate 200.
In addition, the first pad 130 can be respectively formed as with the second pad 230 it is multiple, and multiple first pads 130 with
Multiple second pads 230 can be corresponded to each other singly and be formed.
Intermediary layer 300 is located between first substrate 100 and the second substrate 200.That is, intermediary layer 300 can be with the first base
Plate 100 110 and the second substrate 200 while 210 combine, first substrate 100 and the second substrate 200 separate state
It can be maintained by intermediary layer 300.
Referring to Fig. 2 and Fig. 3, intermediary layer 300 includes insulating layer 310, the first cavity 320, the second cavity 330 and through-hole 340.
Insulating layer 310 is the plate being made up of megohmite insulants such as epoxy resin, polyimide resin, BT resins
Layer specifically can be preimpregnation material (PPG:prepreg), increasing layer film (build up film) (for example, aginomoto is multiple
Close film (Ajinomoto Build up Film)) etc..
Insulating layer 310 with first substrate 100 while it is opposite, another side and the one side of the second substrate 200 are opposite,
And it is located between first substrate 100 and the second substrate 200.
Insulating layer 310 can be made up of multiple layers 311,312,313.For example, as shown in Fig. 2, insulating layer 310 can lead to
Cross the composition of three layers 311,312,313.Three layers 311,312,313 can be made up of the material being same or different to each other.?
In the case where being made up of mutually different material, middle layer 311 and two sides layer 312,313 can pass through mutually different material
Composition.
It could be formed with solder resist SR with another side in the one side of insulating layer 310, solder resist SR can be formed in through-hole 340
And around via pad 350.
First cavity 320 is formed as the one side open to insulating layer 310, and then opposite with first substrate 100, the second cavity
330 are formed as opening to the another side of insulating layer 310, and then opposite with the second substrate 200.The first electricity of first cavity 320 receiving
Subcomponent E1, the second cavity 330 accommodate the second electronic component E2.That is, the position of the first cavity 320 and the second cavity 330 can be with
It is determined according to the position of the first electronic component E1 and the second electronic component E2.Due to the first electronic component E1 and the second electronics member
Part E2 substantially has the shape close to cuboid, therefore the first cavity 320 and the second cavity 330 can have cuboid
Shape, however be not limited to this.
First cavity 320 is formed as multiple.It is also multiple for being mounted on the first electronic component E1 of first substrate 100.One
First cavity 320 can accommodate a first electronic component E1.But it's not limited to that relationship, first cavity 320 can
To accommodate the two or more in multiple first electronic component E1.In this case, first cavity 320 accommodates adjacent
One electronic component E1.The depth (height) of first cavity 320 can be according in more than two first electronic component E1 of receiving
Maximum one and determine.Alternatively, the shape of the first cavity 320 can correspond to the height for the first electronic component E1 being received
It spends and is formed.For example, if the high electronic component (referred to as electronic component A) of the height electronic component low with height (referred to as electronics is first
Part B) it is accommodated in the first cavity 320 together, then the first cavity 320 corresponds to electronic component A and electronic component B, can wrap
Include the relatively deep part of depth and the relatively shallow part of depth.
Second cavity 330 is formed as multiple.It is also multiple for being mounted on the second electronic component E2 of the second substrate 200.One
Second cavity 330 can accommodate a second electronic component E2.But it is not limited to this form, second cavity 330
The two or more in multiple second electronic component E2 can be accommodated.In this case, second cavity 330 accommodates adjacent
Second electronic component E2.The depth (height) of second cavity 330 can be according to more than two second electronic component E2 of receiving
In maximum one and determine.Alternatively, the shape of the second cavity 330 can correspond to the second electronic component E2's being received
Highly formed.For example, if the high electronic component (referred to as electronic component C) of height electronic component (the referred to as electronics low with height
Element D) it is accommodated in the second cavity 330 together, then the second cavity 330 corresponds to electronic component C and electronic component D, can be with
Including the relatively shallow part in the relatively deep part of depth and depth.
First cavity 320 and the second cavity 330 are formed in the two sides of insulating layer 310, the first cavity 320 and the second cavity
330 without corresponding to each other.But in the case where the first cavity 320 is corresponded to each other with the second cavity 330, in the first cavity 320
Remain unprocessed insulating layer 310 between the second cavity 330, so that the first cavity 320 can not phase with the second cavity 330
Mutually merge.
It could be formed with metal layer 400 in the first cavity 320 and 330 interior surface of the second cavity.First cavity 320 and
The interior surface of two cavitys 330 indicates bottom surface and the inner wall of the first cavity 320 and the second cavity 330, therefore, the first cavity
320 are covered with the second cavity 330 interior surface entirety by metal layer 400.It is dry that such metal layer 400 can play shielding electromagnetism
Disturb the effect of (EMI).Metal layer 400 can be formed by metals such as copper (Cu).
Being formed in the first cavity 320 and the metal layer 400 of 330 interior surface of the second cavity can be grounded, and can lead to
It crosses grounding through hole and is grounded.That is, metal layer 400 can execute shielding EMI function, grounding function, and thermally conductive due to metal
Rate is higher, therefore also may be performed simultaneously heat sinking function.In particular, electronic component generate heat can by metal layer 400 to
Ground dispersion.
In addition, thermal component 500 can be contained in the first cavity 320 and the second cavity 330.Therefore, in the first chamber
It can be folded with thermal component 500 between body 320 and the first electronic component E1, between the second cavity and the second electronic component E2
Thermal component 500 can be folded with.In particular, being formed with metal layer 400 in the first cavity 320 and 330 interior surface of the second cavity
In the case where, it, can be with shape between metal layer 400 and the second electronic component E2 between metal layer 400 and the first electronic component E1
At there is thermal component 500.Thermal component 500 plays radiator (heat spreader) function, object that can be high by thermal conductivity
Matter composition.
In the case where insulating layer 310 is made up of multiple layers 311,312,313, the first cavity 320 or the second cavity 330
Depth can independently be determined with the thickness of each layer of composition insulating layer 310.That is, the first cavity 320 or the second cavity
330 depth can be greater than a layer thickness of insulating layer 310, and be less than the two layers of thickness of insulating layer 310.Also, the first cavity
320 or second the depth of cavity 330 might be less that a layer thickness of insulating layer 310.
Through-hole 340 is penetrated through from the one side of insulating layer 310 to another side, to be electrically connected first substrate 100 and the second substrate
200.Specifically, through-hole 340 is engaged with the first pad 130 and the second pad 230, to be electrically connected first substrate 100 and
Two substrates 200.
Through-hole 340 passes through between multiple first cavitys 320, and by between multiple second cavitys 330.That is, 340 shape of through-hole
Cheng Yuyu the first cavity 320 and the adjacent region of the second cavity 330.When such through-hole 340 is electrically connected first substrate 100 and the
When two substrates 200, path (path) can be reduced and then reduce the loss (loss) of signal.
In the case where insulating layer 310 passes through multiple layers of composition, through-hole 340 may include folding (stack) in each layer heap
The via conductors 341,342,343 of formation.Here, " stacking " indicates that via conductors 341,342,343 are vertically connected with, it is specific and
Speech indicates in neighbouring two via conductors (assuming that via conductors A is located at lower part, via conductors B is located at top) that there are through-holes
The upper surface of the conductor A point vertically be overlapped with the lower surface of via conductors B.But it is formed in the upper surface via conductors A
In the case where having via pad, even if not there is the upper surface of via conductors A and the lower surface of via conductors B clearly along vertical
Point from histogram to overlapping, as long as via conductors B be located at connect by via pad with via conductors A in the range of, so that it may
It is considered stacking.
In addition, being respectively formed in the case where insulating layer 310 is made up of three layers 311,312,313 positioned at outside
Two layers 312,313 via conductors 342,343 cross-sectional area can more it is smaller inwardly.In this case, with Fig. 2
On the basis of when being observed, in the via conductors 342 that the layer 312 for being located at upside compared to centrally located layer 311 is formed
Vertical section is inverted trapezoidal, is (just) trapezoidal in the vertical section for the via conductors 343 that the layer 313 for being located at downside is formed.
In the case where insulating layer 310 is made up of multiple layers 311,312,313, since through-hole 340 is included in each layer
311,312,313 via conductors 341,342,343 stacked, therefore be easy to independently be formed with the integral thickness of insulating layer 310
Through-hole 340.In the case where insulating layer 310 is formed as single layer, the length of the up and down direction of through-hole 340 should be with insulating layer 310
Integral thickness it is suitable, such through-hole 340 is likely difficult to be completely filled (fill) coating.On the contrary, if insulating layer 310 passes through
Multiple layers 311,312,313 form, then become smaller since the lower-upper length of each via conductors 341,342,343 is opposite and fill coating
Volume reduce, therefore be easy to be filled coating, and then the reliability of raising through-hole 340.
Via pad 350 is formed at the both ends of through-hole 340.The via pad 350 for being formed in the both ends of through-hole 340 is distinguished
It is opposite with the first pad 130 and the second pad 230.The 100 side through hole pad 350 of first substrate of through-hole 340 and the first pad 130
Engagement, the 200 side through hole pad 350 of the second substrate of through-hole 340 are engaged with the second pad 230.The first substrate 100 of through-hole 340
Side through hole pad 350 can be engaged with the first pad 130 by solder, the 200 side through hole pad 350 of the second substrate of through-hole 340
It can be engaged by solder with the second pad 230.
The intermediary layer 300 of embodiment according to the present invention can also include the second through-hole 360.
Fig. 2 to Fig. 4 illustrates second through-hole 360 at the edge for being formed in insulating layer 310.Second through-hole 360 is from insulating layer
310 one side is penetrated through to another side, to be electrically connected to first substrate 100 and the second substrate 200.That is, the two of the second through-hole 360
End can be combined with the first pad 130 and the second pad 230 by solder etc..
Second through-hole 360 can execute function identical with through-hole 340, that is, electrical connection first substrate 100 and the second substrate
200 function.
Alternatively, a part can execute function identical with above-mentioned through-hole 340 by multiple the second through-holes 360 formed
Can, another part can be the grounding through hole of ground connection (ground).The second through-hole 360 as grounding through hole can with it is above-mentioned
The metal layer 400 of 330 interior surface of first cavity 320 and the second cavity is electrically connected.Second through-hole 360 and metal layer 400 can be with
By being formed in the one side of insulating layer 310 and/or the circuit 400' connection of another side.Also, second through-hole 360 can be with
It is formed with via pad 370, circuit 400' can be contacted with via pad 370.Therefore, the heat generated in electronic component E1, E2
It can disperse and discharge to thermal component 500, metal layer 400, the second through-hole 360 and ground moving.
In addition, the second through-hole 360 may include insulating layer 310 the folded via conductors 361 formed of each layer heap, 362,
363.Second through-hole 360 can identically as through-hole 340, with each center line alignment of via conductors 361,362,363 or slightly
The mode being staggered stacks.
Hereinafter, being illustrated to the method for forming intermediary layer 300.
Fig. 5 and Fig. 6 is the figure for showing 300 manufacturing method of intermediary layer of embodiment according to the present invention.Fig. 5 and Fig. 6 diagram
The case where insulating layer 310 is made up of three layers 311,312,313.
Referring to Fig. 5, first preparation doublesided copperclad laminate ((a) of Fig. 5).Doublesided copperclad laminate is copper foil M layers
It is laminated on and is set to without one during manufacturing during interlayer 300 by the plate on 311 two sides of insulating materials of the compositions such as PPG and covers copper
Foil laminate also can replace copper foil and use other metal foils.First via conductors is formed in the copper-clad laminate of preparation
341,361 ((b) of Fig. 5).The two sides copper foil of copper-clad laminate is patterned as the through-hole contacted with via conductors 341,361
Pad.Here, the via conductors 341,361 formed are used for through-hole 340 and the second through-hole 360.
In (c) of Fig. 5, singlesided copperclad laminate is laminated on 311 two sides of insulating materials.Here, in insulating materials 311
Different insulating materials 312,313 is laminated respectively up and down.But in this step, singlesided copperclad laminate can not be laminated,
But can be laminated first after insulating materials 312,313, stack gradually copper foil or metal foil M.In (d) of Fig. 5, insulating
The processing of material 312 forms via hole VH.Via hole VH is process by laser etc..Fig. 5 (d) in processing formed via hole VH with
Connect with via conductors 341,361 stack manners formed in Fig. 5 (b) with via pad and is formed.
In (e) of Fig. 5, the first cavity 320 is formed.First cavity 320 can by laser, keyway planer (router),
CNC drilling machine etc. is process.The width of first cavity 320 determines according to the width of the first electronic component E1 to be accommodated, the
The depth of one cavity 320 is determined according to the height of the first electronic component E1 to be accommodated.First cavity 320 is formed as multiple.
In (a) of Fig. 6, via hole VH and the second cavity 330 are formed.Via hole VH can be formed with processing in (d) with Fig. 5
The identical mode of via hole VH formed.That is, via hole VH with the via conductors 341,361 formed in Fig. 5 (b) in a manner of stacking
Connect with via pad and is formed.
Second cavity 330 can be process by laser, milling cutter (router), CNC drilling machine etc..Second cavity 330
Width according to the width of the second electronic component E2 to be accommodated determine, the depth of the second cavity 330 is according to be accommodated second
The height of electronic component E2 determines.Second cavity 330 is formed as multiple.
In (b) of Fig. 6, the interior surface and insulating layer 310 of the first cavity 320 and the second cavity 330 one side and
Metal layer 400 is formed on another side.Metal layer 400 can be formed with coating method.Also, in this step, via hole VH is filled out
It fills coating and forms via conductors 342,343,362,363.Through-hole is completed by forming via conductors 342,343,362,363
340 and second through-hole 360.Metal layer 400 and via conductors 342,343,362,363 can be by wet application modes by simultaneously
Coating.
In (c) of Fig. 6, metal layer 400 is patterned, and then forms circuit 400' and via pad 350,370.But
It is to have metal layer 400 in the interior surface maintenance of the first cavity 320, the second cavity 330.As a result, metal layer 400 can with it is logical
Hole 340 is insulated, and is connect by circuit 400' with the second through-hole 360.In (d) of Fig. 6, according to the figure of metal layer 400
Case coats solder resist SR in the position of removal metal layer 400.The via pad 350 of through-hole 340 can lead to metal layer 400
Cross solder resist SR and completely insulated.
Hereinafter, being illustrated to the various embodiments about intermediary layer 300 of the invention.
Fig. 7 to Fig. 9 is the figure for showing the intermediary layer 300 of various embodiments according to the present invention.
Referring to Fig. 7, in the intermediary layer 300 of embodiment according to the present invention, in through-hole 340, via conductors 341,
342, it 343 is stacked, as described above, neighbouring through-hole is led even if the center line of each via conductors 341,342,343 is staggered
Body also can have the point being vertically overlapped, or is connected with each other by via pad.
Through-hole 340 is being caused not to be formed in along the vertical direction due to the position of electronic component and cavity, the influence of size
In the case where one straight line, that is, the center of the first pad 130 and the second pad 230 is mutually slightly staggered, rather than the first pad 130
Center and the second pad 230 center vertically under unanimous circumstances, if via conductors 341,342,343 are with each center
The mode that line is slightly staggered stacks, then can connect the first pad 130 with oblique line with the second pad 230.
That is, even if in the case where the position of the first pad 130 and the second pad 230 mutually staggers, if being led using through-hole
The stacked relation of body 341,342,343 is also readily able to realize being electrically connected for first substrate 100 and the second substrate 200.
Referring to Fig. 8, in the intermediary layer 300 of embodiment according to the present invention, the first cavity 320 and the second cavity 330 can
Mutually to merge.That is, accordingly being formed along the vertical direction in the first cavity 320 and the second cavity 330, and due to the first electronics
The height of element E1 and the height of the second electronic component E2 are higher, so being difficult between the first cavity 320 and the second cavity 330
In the case where remaining insulating layer 310, the first cavity 320 can merge with the second cavity 330.In this case, metal layer 400
Also it is integrally formed in the inner wall of the inner wall and the second cavity 330 of the first cavity 320.In fig. 8, although illustrating the first cavity
The 320 size situation different from the size of the second cavity 330, however the ruler of the size of the first cavity 320 and the second cavity 330
It is very little can be identical, in this case, in 300 manufacturing process of intermediary layer, the first cavity 320 can be same with the second cavity 330
When be machined from.
Referring to Fig. 9, as shown in figure 8, the first cavity 320 merges with the second cavity 330, and the first cavity 320 and two
Second cavity 330 merges.The merging of this cavity can diversely be realized according to size, the position of electronic component.
More than, one embodiment of the present of invention is illustrated, however but all has base in this technical field
The personnel of this knowledge pass through constituent element in the range of the thought of the invention that can be recorded in not departing from claims
Additional, change is deleted or modifications and changes additional etc. and that multiplicity is carried out to the present invention, and these also are regarded as being contained in this
In the interest field of invention.
Claims (25)
1. a kind of intermediary layer, connects first substrate and the second substrate, the first substrate are being pasted with multiple first electronics on one side
Element, the second substrate are being pasted with multiple second electronic components on one side, wherein include:
Insulating layer is arranged between the first substrate and the second substrate, so that the one side of the insulating layer and described
The one side of one substrate is opposite, keeps the another side of the insulating layer and the one side of the second substrate opposite；
Multiple first cavitys, the one side open of Xiang Suoshu insulating layer, and then accommodate first electronic component；
The another side of multiple second cavitys, Xiang Suoshu insulating layer is open, and then accommodates second electronic component；And
Through-hole is penetrated through from the one of the insulating layer towards another side, so that it is electrically connected the first substrate and the second substrate,
Wherein, the through-hole passes through between the multiple first cavity and between the multiple second cavity.
2. intermediary layer as described in claim 1, wherein
The insulating layer passes through multiple layers of composition.
3. intermediary layer as claimed in claim 2, wherein
The through-hole includes stacking the via conductors of formation along the vertical direction in the multiple layer.
4. intermediary layer as claimed in claim 3, wherein
The insulating layer is made up of three layers,
The cross-sectional area of the via conductors being respectively formed positioned at two layers in outside in three layers is got over smaller inwardly.
5. intermediary layer as described in claim 1, wherein
Be formed at the both ends of the through-hole: via pad, respectively with the first pad of the one side for being formed in the first substrate,
It is formed in the second pad engagement of the one side of the second substrate.
6. intermediary layer as described in claim 1, wherein further include:
Second through-hole is penetrated through from the one side of the insulating layer to another side, thus with the first substrate and the second substrate
Electrical connection, and it is formed in the edge of the insulating layer.
7. intermediary layer as claimed in claim 6, wherein
It is formed with metal layer in the interior surface of first cavity, the interior surface of second cavity,
The metal layer is electrically connected with second through-hole.
8. intermediary layer as described in claim 1, wherein
Metal layer is formed in the interior surface of first cavity, the interior surface of second cavity.
9. intermediary layer as described in claim 1, wherein
The first cavity of at least one of the multiple first cavity accommodates at least two in the multiple first electronic component
First electronic component.
10. intermediary layer as described in claim 1, wherein
The second chamber of at least one of the first cavity of at least one of the multiple first cavity and the multiple second cavity
Body merges along the vertical direction.
11. a kind of intermediary layer, connects first substrate and the second substrate, the first substrate are being pasted with multiple first electronics on one side
Element, the second substrate are being pasted with multiple second electronic components on one side, wherein include:
Insulating layer is arranged between the first substrate and the second substrate, so that the one side of the insulating layer and described
The one side of one substrate is opposite, keeps the another side of the insulating layer and the one side of the second substrate opposite；
Multiple first cavitys, the one side open of Xiang Suoshu insulating layer, and then accommodate first electronic component；
The another side of multiple second cavitys, Xiang Suoshu insulating layer is open, and then accommodates second electronic component；And
Through-hole is penetrated through from the one of the insulating layer towards another side, so that it is electrically connected the first substrate and the second substrate,
Wherein, the insulating layer is formed by multiple layers,
The through-hole includes via conductors, and each layer of the via conductors in multiple layers of the insulating layer is along the vertical direction
It stacks and is formed.
12. a kind of printed circuit board, wherein include:
First substrate is being pasted with multiple first electronic components on one side；
The second substrate is being pasted with multiple second electronic components on one side；And
Intermediary layer connects the first substrate and the second substrate,
Wherein, the intermediary layer includes:
Insulating layer is arranged between the first substrate and the second substrate, so that the one side of the insulating layer and described
The one side of one substrate is opposite, keeps the another side of the insulating layer and the one side of the second substrate opposite；
Multiple first cavitys, the one side open of Xiang Suoshu insulating layer, and then accommodate first electronic component；
The another side of multiple second cavitys, Xiang Suoshu insulating layer is open, and then accommodates second electronic component；And
Through-hole is penetrated through from the one of the insulating layer towards another side, so that it is electrically connected the first substrate and the second substrate,
Wherein, the through-hole passes through between the multiple first cavity and between the multiple second cavity.
13. printed circuit board as claimed in claim 12, wherein
The insulating layer passes through multiple layers of composition.
14. printed circuit board as claimed in claim 12, wherein
The through-hole includes stacking the via conductors of formation along the vertical direction in the multiple layer.
15. printed circuit board as claimed in claim 14, wherein
The insulating layer is made up of three layers,
The cross-sectional area of the via conductors being respectively formed positioned at two layers in outside in three layers is got over smaller inwardly.
16. printed circuit board as claimed in claim 12, wherein
It is formed with the first pad on one side in the first substrate,
It is formed with the second pad on one side in the second substrate,
It is formed with via pad at the both ends of the through-hole,
The via pad is engaged with first pad and second pad.
17. printed circuit board as claimed in claim 16, wherein
It is folded between the via pad and first pad and between the via pad and second pad
Solder.
18. printed circuit board as claimed in claim 12, wherein further include:
Second through-hole is penetrated through from the one of the insulating layer towards another side, to be electrically connected to the first substrate and described the
Two substrates, and it is formed in the edge of the insulating layer.
19. printed circuit board as claimed in claim 18, wherein
It is formed with metal layer in the interior surface of first cavity, the interior surface of second cavity,
The metal layer is electrically connected with second through-hole.
20. printed circuit board as claimed in claim 12, wherein
Metal layer is formed in the interior surface of first cavity, the interior surface of second cavity.
21. printed circuit board as claimed in claim 20, wherein
It is folded between the metal layer and first electronic component, between the metal layer and second electronic component
Thermal component.
22. printed circuit board as claimed in claim 12, wherein
The first cavity of at least one of the multiple first cavity accommodates at least two in the multiple first electronic component
First electronic component.
23. printed circuit board as claimed in claim 12, wherein
The second chamber of at least one of the first cavity of at least one of the multiple first cavity and the multiple second cavity
Body merges along the vertical direction.
24. printed circuit board as claimed in claim 12, wherein further include:
Third electronic component is mounted on the another side of the first substrate.
25. a kind of printed circuit board, wherein include:
First substrate is being pasted with multiple first electronic components on one side；
The second substrate is being pasted with multiple second electronic components on one side；And
Intermediary layer connects the first substrate and the second substrate,
Wherein, the intermediary layer includes:
Insulating layer is arranged between the first substrate and the second substrate, so that the one side of the insulating layer and described
The one side of one substrate is opposite, keeps the another side of the insulating layer and the one side of the second substrate opposite；
Multiple first cavitys, the one side open of Xiang Suoshu insulating layer, and then accommodate first electronic component；
The another side of multiple second cavitys, Xiang Suoshu insulating layer is open, and then accommodates second electronic component；And
Through-hole is penetrated through from the one of the insulating layer towards another side, so that it is electrically connected the first substrate and the second substrate,
Wherein, the insulating layer is formed by multiple layers,
The through-hole includes via conductors, and each layer of the via conductors in multiple layers of the insulating layer is along the vertical direction
It stacks and is formed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180019561A KR20190099739A (en) | 2018-02-19 | 2018-02-19 | Interposer and printed circuit board having the same |
| KR10-2018-0019561 | 2018-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110177428A true CN110177428A (en) | 2019-08-27 |
Family
ID=67688937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810501415.5A Pending CN110177428A (en) | 2018-02-19 | 2018-05-23 | Intermediary layer and printed circuit board including the intermediary layer |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2019145760A (en) |
| KR (1) | KR20190099739A (en) |
| CN (1) | CN110177428A (en) |
| TW (1) | TW201936022A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113840449A (en) * | 2021-09-06 | 2021-12-24 | 华为技术有限公司 | Substrate and electronic equipment |
| CN114206000A (en) * | 2021-12-24 | 2022-03-18 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210031303A (en) | 2019-09-11 | 2021-03-19 | 삼성전자주식회사 | An electronic device having a connector mounted on a circuit |
| JP7471538B2 (en) | 2022-04-28 | 2024-04-19 | 三菱電機株式会社 | Semiconductor Device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101324595B1 (en) | 2013-08-07 | 2013-11-01 | (주)드림텍 | Main board for mobil terminal with excellent assembling and mobility |
-
2018
- 2018-02-19 KR KR1020180019561A patent/KR20190099739A/en unknown
- 2018-05-23 CN CN201810501415.5A patent/CN110177428A/en active Pending
- 2018-05-30 JP JP2018104100A patent/JP2019145760A/en active Pending
- 2018-06-25 TW TW107121743A patent/TW201936022A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113840449A (en) * | 2021-09-06 | 2021-12-24 | 华为技术有限公司 | Substrate and electronic equipment |
| CN114206000A (en) * | 2021-12-24 | 2022-03-18 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190099739A (en) | 2019-08-28 |
| JP2019145760A (en) | 2019-08-29 |
| TW201936022A (en) | 2019-09-01 |
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Application publication date: 20190827 |