CN106973495A - Internal layer circuit connection, adjustment method and the printed circuit board (PCB) of printed circuit board (PCB) - Google Patents
Internal layer circuit connection, adjustment method and the printed circuit board (PCB) of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN106973495A CN106973495A CN201710311252.XA CN201710311252A CN106973495A CN 106973495 A CN106973495 A CN 106973495A CN 201710311252 A CN201710311252 A CN 201710311252A CN 106973495 A CN106973495 A CN 106973495A
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- Prior art keywords
- pad
- circuit board
- hole
- pcb
- printed circuit
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
Abstract
The invention provides a kind of connection of the internal layer circuit of printed circuit board (PCB), adjustment method and printed circuit board (PCB), it is related to electronic technology field, printed circuit board (PCB) includes：First circuit board layer, second circuit flaggy and the tertiary circuit flaggy stacked gradually, first circuit board layer is provided with the first pad and the first wire electrically connected with the first pad, second circuit flaggy is provided with the first Jin Bu areas, tertiary circuit flaggy is provided with the second pad and the second wire electrically connected with the second pad, and the first pad, the first Jin Bu areas and the second pad overlap to form break-make area in direction perpendicular to the printed-circuit board.The printed circuit board (PCB) can allow the paste conductive material in the internal layer conducting break-make area of printed circuit board (PCB), it is convenient that break-make is carried out to the circuit turn-on at the break-make area in the case of not by other electronic components and the paste conductive material can be removed after liquefaction out of through hole.
Description
Technical field
The present invention relates to electronic technology field, in particular to internal layer circuit connection, the debugging of a kind of printed circuit board (PCB)
Method and printed circuit board (PCB).
Background technology
Developing rapidly and popularizing with electronic product, and electronic product is to the development of lightening and high densification, it is electric
Components' placement density in sub- product particularly smart mobile phone product is also increasing.Electronic product in the design phase, it is necessary to
The mechanism of reserved substantial amounts of achievable connecting and disconnecting of the circuit switching, to ensure in follow-up hardware debugging process, signal is various in circuit
Verifying and debugging under break-make assembled state.
In current design of electronic circuits, this mechanism for realizing connecting and disconnecting of the circuit switching is mainly come using 0 Europe resistance
Realize：Reserved on pcb board, i.e. printed circuit board (PCB) and realize circuit with conventional, electric-resistance identical electric-conductor structure, 0 Europe resistance of attachment
Conducting, remove the cut-out that 0 Europe resistance realizes circuit.But, the circuit of existing electronic product is all relatively complicated, it is necessary to debug
Network it is numerous, this result in needs substantial amounts of 0 Europe resistance is mounted on PCB, improve cost.And circuit debugging is completed
Afterwards, after the break-make situation that interlock circuit needs is determined, 0 Europe resistance has lost the meaning of presence, if changing PCB at this moment, will
The circuit connected is needed to be connected with cabling, deletion needs the cabling of dead circuit.But this mode adds workload, causes
Product development cycle is lengthened, and adds R＆D costs
The content of the invention
In view of the above problems, it is proposed that the present invention connects to provide a kind of internal layer circuit of printed circuit board (PCB), debugging side
Method and printed circuit board (PCB), to improve above mentioned problem.
In a first aspect, the embodiments of the invention provide a kind of internal layer circuit connection method of printed circuit board (PCB), printing electricity
Road plate includes first circuit board floor, second circuit flaggy and the tertiary circuit flaggy stacked gradually, and first circuit board layer is set
There are the first pad and the first wire electrically connected with first pad, the second circuit flaggy is provided with the first Jin Bu areas, should
Tertiary circuit flaggy is provided with the second pad and the second wire electrically connected with second pad, and first pad, first are prohibited
Cloth area overlaps to form break-make area with second pad on the direction perpendicular to the printed circuit board (PCB), and this method includes：At this
Break-make area opens up through hole, and the through hole runs through first pad, the first Jin Bu areas and the second pad；Paste is filled in the through hole
Conductive material, to turn on first pad and second pad.
With reference in a first aspect, in the first embodiment of first aspect, paste conductive material is filled in the through hole,
To turn on first pad and second pad, including：In side of the first circuit board layer away from the second circuit flaggy
Arranging thing plate, the thing plate is provided with perforate corresponding with the lead to the hole site；The one end of the through hole away from its correspondence perforate is blocked；
Paste conductive material is set on the thing plate, and paste conductive material is entered the corresponding through hole of the perforate by the perforate
It is interior；After the paste conductive material is set, the printed circuit board (PCB) is heated, so that the paste conductive material conversion in perforate
For liquid and the corresponding through hole of entrance；The conductive material of liquid is cooled and solidified, to turn on first pad and second weldering
Disk.
With reference to the first embodiment of first aspect, in second of embodiment of first aspect, the thing plate is steel
Plate.
With reference to second of embodiment of first aspect, in the third embodiment of first aspect, the tapping is set
It is equipped with steel mesh.
Second of embodiment or first of the first embodiment, first aspect with reference to first aspect, first aspect
The third embodiment of aspect, in the 4th kind of embodiment of first aspect, the conductive material is tin cream.
Second of embodiment or first of the first embodiment, first aspect with reference to first aspect, first aspect
The third embodiment of aspect, in the 5th kind of embodiment of first aspect, through hole bag is opened up on the printed circuit board (PCB)
Include：Through hole is opened up on the printed circuit board (PCB) using taper bit, and the diameter of the through hole prolongs and opens up direction and diminish.
Second aspect, the embodiments of the invention provide a kind of internal layer circuit adjustment method of printed circuit board (PCB), printing electricity
Road plate includes first circuit board floor, second circuit flaggy and the tertiary circuit flaggy stacked gradually, and first circuit board layer is set
There are the first pad and the first wire electrically connected with first pad, the second circuit flaggy is provided with the first Jin Bu areas, should
Tertiary circuit flaggy is provided with the second pad and the second wire electrically connected with second pad, and first pad, first are prohibited
Cloth area overlaps to form break-make area with second pad on the direction perpendicular to the printed circuit board (PCB), and the break-make area offers logical
Hole, the through hole run through first pad, the first Jin Bu areas and the second pad, this method, including：
If not being pre-charged with paste conductive material in the through hole, conducting tune is carried out needing the break-make area to the through hole
During examination, in the through hole fill paste conductive material, with by the paste conductive material turn on first pad and this second
Pad turns on first wire and the second wire；
If being pre-filled with paste conductive material in the through hole, needing to turn off tune to the break-make area of the through hole
During examination, then the paste conductive material being pre-charged with the through hole is heated, heating is converted to the paste conduction material of liquid
Material removes the through hole, to disconnect first wire and second by disconnecting the conducting of first pad and second pad
The conducting of wire.
The third aspect, the embodiments of the invention provide a kind of printed circuit board (PCB), the printed circuit board (PCB) includes what is stacked gradually
First circuit board layer, second circuit flaggy and tertiary circuit flaggy, first circuit board layer be provided with the first pad and with this
First wire of the first pad electrical connection, the second circuit flaggy is provided with the first Jin Bu areas, and the tertiary circuit flaggy is provided with
Second pad and the second wire electrically connected with second pad, first pad, the first Jin Bu areas and second pad exist
Overlap to form break-make area on the direction of the printed circuit board (PCB), this method includes：Through hole is opened up in the break-make area, this leads to
First pad, the first Jin Bu areas and the second pad are run through in hole；Paste conductive material is filled in the through hole, with turn on this
One pad and second pad.
With reference to the third aspect, in the first embodiment of the third aspect, first circuit board layer is away from second electricity
The one side of road flaggy is also laminated with the 4th board layer, and the 4th board layer is provided with the second Jin Bu areas, the tertiary circuit plate
One side of the layer away from the second layer is also laminated with the 5th board layer, and the 5th board layer is provided with the 3rd Jin Bu areas, and this leads to
Disconnected area is by the second Jin Bu areas, first pad, the first Jin Bu areas, second pad and the three Jin Bu areas perpendicular to the printing
Overlap to be formed on the direction of circuit board, the through hole runs through the second Jin Bu areas, the first pad, the first Jin Bu areas, the second pad
And the 3rd Jin Bu area.
With reference to the first embodiment of the third aspect or the third aspect, in second of embodiment of the third aspect
In, the paste conductive material is tin cream.
Compared with prior art, printed circuit board (PCB) provided in an embodiment of the present invention internal layer circuit connection, adjustment method and
Printed circuit board (PCB), by the first wire for being provided with the first pad in first circuit board layer and being electrically connected with first pad,
The first Jin Bu areas are set in the second circuit flaggy, the second pad is set in tertiary circuit flaggy and is electrically connected with second pad
The second wire connect, and in first pad, the first Jin Bu areas and second pad in the side perpendicular to the printed circuit board (PCB)
Overlap the break-make area to be formed upwards, and opens up the through hole that first pad, the first Jin Bu areas and the second pad are run through in hole,
Filling paste conductive material turns on first pad and the mode of second pad in the through hole so that the paste conductive material
Can be in internal layer conducting break-make area, and the paste conductive material can be removed after liquefaction out of through hole, so as to not by
Other electronic components are carried out in the case of carrying out circuit turn-on from the outside of printed circuit board (PCB) to the circuit turn-on at the break-make area
Break-make is controlled.
Other features and advantages of the present invention will be illustrated in subsequent specification, also, partly be become from specification
It is clear that or by implementing understanding of the embodiment of the present invention.The purpose of the present invention and other advantages can be by saying for being write
Specifically noted structure is realized and obtained in bright book, claims and accompanying drawing.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be attached to what is used required in embodiment
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore is not construed as pair
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is a kind of structural representation of printed circuit board (PCB) provided in an embodiment of the present invention；
Fig. 2 is the setting signal of the first pad and the second pad in a kind of printed circuit board (PCB) provided in an embodiment of the present invention
Figure；
Fig. 3 fills schematic diagram for the middle paste conductive material of printed circuit board (PCB) provided in an embodiment of the present invention；
Fig. 4 is the structural representation of another printed circuit board (PCB) provided in an embodiment of the present invention；
Fig. 5 is that the setting of the first pad and the second pad in another printed circuit board (PCB) provided in an embodiment of the present invention is shown
It is intended to；
Fig. 6 is the flow chart of the internal layer circuit connection method of another printed circuit board (PCB) provided in an embodiment of the present invention；
Fig. 7 is the flow chart of the internal layer circuit adjustment method of another printed circuit board (PCB) provided in an embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Ground is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Generally exist
The component of the embodiment of the present invention described and illustrated in accompanying drawing can be arranged and designed with a variety of configurations herein.Cause
This, the detailed description of the embodiments of the invention to providing in the accompanying drawings is not intended to limit claimed invention below
Scope, but it is merely representative of the selected embodiment of the present invention.Based on embodiments of the invention, those skilled in the art are not doing
The every other embodiment obtained on the premise of going out creative work, belongs to the scope of protection of the invention.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it further need not be defined and explained in subsequent accompanying drawing.Meanwhile, the present invention's
In description, term " first ", " second " etc. are only used for distinguishing description, and it is not intended that indicating or implying relative importance.
Fig. 1 and Fig. 2 are referred to, shows that one kind provided in an embodiment of the present invention can implement print provided in an embodiment of the present invention
The internal layer circuit connection of printed circuit board, the printed circuit board (PCB) 100 of adjustment method.The printed circuit board (PCB) 100 includes what is stacked gradually
First circuit board layer 110, second circuit flaggy 120 and tertiary circuit flaggy 130, first circuit board layer 110 are provided with the first weldering
Disk 111 and the first wire 112 electrically connected with the first pad 111, second circuit flaggy 120 are provided with the first Jin Bu areas 121,
Tertiary circuit flaggy 130 is provided with the second pad 131 and the second wire 132 electrically connected with the second pad 131, the first pad
111st, the first Jin Bu areas 121 and the second pad 131 overlap to form break-make area in direction perpendicular to the printed-circuit board.And
The through hole 200 through the first pad 111, the first Jin Bu areas 121 and the second pad 131 is opened up in break-make area, in through hole 200
Paste conductive material 210 is filled, to turn on the first pad 111 and the second pad 131.
As a kind of mode, the shape at longitudinal interface of through hole 200 can be the shape such as rectangle, trapezoidal.In the present embodiment
In, for the ease of accelerating the flowing of the inner stuffing matter of through hole 200, longitudinal interface of through hole 200 is shaped to trapezoidal.And
During actual processing, taper brick can be used to obtain longitudinal interface come processing printed circuit board for trapezoidal through hole 200.
As a kind of mode, as shown in figure 3, first circuit board 110 one side away from second circuit flaggy 120 of layer are also laminated
There is the 4th board layer 140, the 4th board layer 140 is provided with the second Jin Bu areas 141, and tertiary circuit flaggy 130 is away from second
The one side of board layer 120 is also laminated with the 5th board layer 150, and the 5th board layer 150 is provided with the 3rd Jin Bu areas 151,
In this case, as shown in figure 4, break-make area is welded by the second Jin Bu areas 141, the first pad 111, the first Jin Bu areas 121, second
Disk 131 overlaps to be formed in direction perpendicular to the printed-circuit board with three Jin Bu areas 151, accordingly, and through hole 200 runs through second
Jin Bu areas 141, the first pad 111, the first Jin Bu areas 121, the second pad 131 and the 3rd Jin Bu areas 151.
It should be noted that the number of plies of printed circuit board (PCB) 100 can be set according to actual conditions, above-mentioned first circuit board
Layer 110, second circuit flaggy 120 and tertiary circuit flaggy 130 etc. are exemplary proposition, accordingly, each circuit board
The quantity of pad set by layer is also that can be set according to actual conditions, for example, when wanted on printed circuit board (PCB) 100 it is integrated compared with
During polyelectron element, the quantity of pad can be correspondingly arranged more.
It should be noted that in the present embodiment, paste conductive material is tin cream, except of course that outside tin cream, can also adopt
With other paste conductive materials, as long as the paste conductive material can be changed between liquid and solid-state.
Compared with prior art, printed circuit board (PCB) provided in an embodiment of the present invention, by being set in first circuit board layer 110
There are the first pad 111 and the first wire 112 electrically connected with first pad 111, the is set in the second circuit flaggy 120
One Jin Bu areas 121, second lead what tertiary circuit flaggy 130 set the second pad 131 and electrically connected with second pad 131
Line 132, and in first pad 111, the first Jin Bu areas 121 and second pad 131 perpendicular to the printed circuit board (PCB)
Overlap the break-make area to be formed on direction, and opens up hole through first pad 111, the first Jin Bu areas 121 and the second pad
131 through hole 200,200 filling paste conductive materials turn on first pad 111 and second pad 131 in the through hole
Mode so that the paste conductive material can be in internal layer conducting break-make area, and the paste conductive material can be after liquefaction
Removed in from through hole 200, not carry out the situation of circuit turn-on from the outside of printed circuit board (PCB) by other electronic components
Under at the break-make area circuit turn-on carry out break-make control.
Referring to Fig. 5, a kind of internal layer circuit connection method of printed circuit board (PCB) provided in an embodiment of the present invention, this method should
For above-mentioned printed circuit board (PCB), methods described includes：
Step S310：Open up through hole in the break-make area, the through hole through first pad, the first Jin Bu areas and
Second pad.
For the ease of accelerating the flowing of through hole inner stuffing matter, can on the printed circuit board it be opened using taper bit
If through hole so that the diameter of through hole prolongs and opens up direction and diminish so that the side wall of through hole can relative tilt, be easy in through hole
's.
Step S320：Paste conductive material is filled in the through hole, to turn on first pad and described second
Pad.
As shown in fig. 6, when being not filled by paste conductive material 210 in through hole, the first pad and the second pad are in and not led
It is also at not between second wire of logical state, the first wire electrically connected accordingly with the first pad and the electrical connection of the second pad
Conducting state.And after paste conductive material 210 are filled in through hole, the first pad and the second pad can be conductive with paste
Material 210 is contacted, so as to be switched on, accordingly, the first wire electrically connect with the first pad and the second pad electrically connect the
Conducting state is also between two wires.
, can be in side arranging thing of the first circuit board layer away from the second circuit flaggy as a kind of mode
Plate, the thing plate is provided with perforate corresponding with the lead to the hole site；The one end of the through hole away from its correspondence perforate is blocked；
Paste conductive material is set on the thing plate, and paste conductive material 210 is entered perforate correspondence by the perforate
Through hole in；After the paste conductive material 210 is set, the printed circuit board (PCB) is heated, so that the cream in perforate
Shape conductive material 210 is converted into liquid and enters corresponding through hole；The conductive material of liquid is cooled and solidified, to turn on described the
One pad and second pad.
Wherein, when being heated to the printed circuit board (PCB), printed circuit board (PCB) can be placed into reflow soldering stove heat.
As a kind of mode, the thing plate can be that steel plate can also be iron plate.
As a kind of mode, the tapping can be provided with steel mesh, wherein, the diameter phase with perforate of the steel mesh diameter
With or more than the diameter of perforate, and thickness can be 0.1~0.5mm.
Referring to Fig. 7, a kind of internal layer circuit adjustment method of printed circuit board (PCB) provided in an embodiment of the present invention, the printing
Circuit board includes first circuit board layer, second circuit flaggy and the tertiary circuit flaggy stacked gradually, the first circuit board layer
The first pad and the first wire electrically connected with first pad are provided with, the second circuit flaggy is provided with the first taboo
Cloth area, the tertiary circuit flaggy is provided with the second pad and the second wire electrically connected with second pad, described
One pad, the first Jin Bu areas and second pad overlap to form break-make on the direction perpendicular to the printed circuit board (PCB)
Area, the break-make area offers through hole, and the through hole runs through first pad, the first Jin Bu areas and the second pad, described
Method, including：
Step S410：If not being pre-charged with paste conductive material in the through hole, the break-make to the through hole is being needed
When area carries out conducting debugging, paste conductive material is filled in the through hole, it is described to be turned on by the paste conductive material
First pad and second pad turn on first wire and the second wire；
Step S420：If being pre-filled with paste conductive material in the through hole, needing to lead to the through hole
When disconnected area turns off debugging, then the paste conductive material being pre-charged with the through hole is heated, heating is converted to
The paste conductive material of liquid removes the through hole, to be broken by disconnecting the conducting of first pad and second pad
Open the conducting of first wire and the second wire.
The method provided by the present embodiment, can be in the circuit debugging stage of printed circuit board (PCB), by controlling paste to lead
Filling of the electric material in through hole, realizes the selection of connecting and disconnecting of the circuit.And break-make area can also act as signal testing point and use.In electricity
After the completion of the debugging of road, during batch production, in the SMT stages, by controlling the paste conductive material in break-make area to fill, wherein, for
Need conducting break-make area through hole, the perforate of homologue plate keep it is unimpeded, it is necessary to disconnect, homologue plate perforate it is closed (for example,
It is tight with gummed paper patch), so as to realize the control of connecting and disconnecting of the circuit.
In several embodiments provided herein, it should be understood that disclosed method, others can also be passed through
Mode is realized.Embodiments described above is only schematical, for example, the flow chart in accompanying drawing.It should also be noted that having
In a little implementations as replacement, the function of being marked in square frame can also be with different from the order marked in accompanying drawing hair
It is raw.For example, two continuous square frames can essentially be performed substantially in parallel, they can also hold in the opposite order sometimes
OK, this is depending on involved function.It is also noted that each square frame and block diagram in block diagram and/or flow chart and/
Or the combination of the square frame in flow chart, can be with function as defined in execution or the special hardware based system of action come real
It is existing, or can be realized with the combination of specialized hardware and computer instruction.
In addition, each functional module in each embodiment of the invention can integrate to form an independent portion
Point or modules individualism, can also two or more modules be integrated to form an independent part.
Moreover, term " comprising ", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that
Process, method, article or the equipment of a series of key elements, which must be included, not only includes those key elements, but also including not arranging clearly
Other key elements gone out, or also include for this process, method, article or the intrinsic key element of equipment.Not more
In the case of limitation, the key element limited by sentence "including a ...", it is not excluded that in the process including the key element, side
Also there is other identical element in method, article or equipment.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.It should be noted that：Similar label and letter exists
Similar terms is represented in following accompanying drawing, therefore, once being defined in a certain Xiang Yi accompanying drawing, is then not required in subsequent accompanying drawing
It is further defined and explained.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.
Claims (10)
1. the internal layer circuit connection method of a kind of printed circuit board (PCB), it is characterised in that the printed circuit board (PCB) includes stacking gradually
First circuit board layer, second circuit flaggy and tertiary circuit flaggy, the first circuit board layer be provided with the first pad and
The first wire electrically connected with first pad, the second circuit flaggy is provided with the first Jin Bu areas, the tertiary circuit
Flaggy is provided with the second pad and the second wire electrically connected with second pad, first pad, the first Jin Bu areas
Overlap to form break-make area on the direction perpendicular to the printed circuit board (PCB) with second pad, methods described includes：
Through hole is opened up in the break-make area, the through hole runs through first pad, the first Jin Bu areas and the second pad；
Paste conductive material is filled in the through hole, to turn on first pad and second pad.
2. according to the method described in claim 1, it is characterised in that described that paste conductive material is filled in the through hole, with
First pad and second pad are turned on, including：
The first circuit board layer away from the second circuit flaggy side arranging thing plate, the thing plate be provided with it is described
The corresponding perforate of lead to the hole site；
The one end of the through hole away from its correspondence perforate is blocked；
Paste conductive material is set on the thing plate, and paste conductive material is entered perforate correspondence by the perforate
Through hole in；
After the paste conductive material is set, the printed circuit board (PCB) is heated, so that the paste conduction material in perforate
Material is converted into liquid and enters corresponding through hole；
The conductive material of liquid is cooled and solidified, to turn on first pad and second pad.
3. method according to claim 2, it is characterised in that the thing plate is steel plate.
4. method according to claim 3, it is characterised in that the tapping is provided with steel mesh.
5. according to any described methods of claim 1-4, it is characterised in that the conductive material is tin cream.
6. according to any described methods of claim 1-4, it is characterised in that open up through hole bag on the printed circuit board
Include：
Through hole is opened up using taper bit on the printed circuit board, and the diameter of the through hole prolongs and opens up direction and diminish.
7. the internal layer circuit adjustment method of a kind of printed circuit board (PCB), it is characterised in that the printed circuit board (PCB) includes stacking gradually
First circuit board layer, second circuit flaggy and tertiary circuit flaggy, the first circuit board layer be provided with the first pad and
The first wire electrically connected with first pad, the second circuit flaggy is provided with the first Jin Bu areas, the tertiary circuit
Flaggy is provided with the second pad and the second wire electrically connected with second pad, first pad, the first Jin Bu areas
Overlap to form break-make area on the direction perpendicular to the printed circuit board (PCB) with second pad, the break-make area is offered
Through hole, the through hole run through first pad, the first Jin Bu areas and the second pad, methods described, including：
If not being pre-charged with paste conductive material in the through hole, conducting debugging is carried out needing the break-make area to the through hole
When, paste conductive material is filled in the through hole, to turn on first pad and institute by the paste conductive material
The second pad is stated to turn on first wire and the second wire；
If being pre-filled with paste conductive material in the through hole, needing to turn off tune to the break-make area of the through hole
During examination, then the paste conductive material being pre-charged with the through hole is heated, the paste that heating is converted into liquid is conductive
Material removes the through hole, to disconnect first wire by disconnecting the conducting of first pad and second pad
And second wire conducting.
8. a kind of printed circuit board (PCB), it is characterised in that first circuit board layer that the printed circuit board (PCB) includes stacking gradually, second
Board layer and tertiary circuit flaggy, the first circuit board layer are provided with the first pad and electrically connected with first pad
The first wire, the second circuit flaggy is provided with the first Jin Bu areas, the tertiary circuit flaggy be provided with the second pad with
And the second wire electrically connected with second pad, first pad, the first Jin Bu areas are with second pad vertical
In overlapping to form break-make area on the direction of the printed circuit board (PCB), methods described includes：Through hole is opened up in the break-make area, institute
Through hole is stated through first pad, the first Jin Bu areas and the second pad；Paste conductive material is filled in the through hole, with
Turn on first pad and second pad.
9. printed circuit board (PCB) according to claim 8, it is characterised in that the first circuit board layer is away from the described second electricity
The one side of road flaggy is also laminated with the 4th board layer, and the 4th board layer is provided with the second Jin Bu areas, the 3rd electricity
One side of the road flaggy away from the second layer is also laminated with the 5th board layer, and the 5th board layer is provided with the 3rd taboo cloth
Area, the break-make area is prohibited by the second Jin Bu areas, first pad, the first Jin Bu areas, second pad with described three
Cloth area overlaps to be formed on the direction perpendicular to the printed circuit board (PCB), and the through hole runs through the second Jin Bu areas, first
Pad, the first Jin Bu areas, the second pad and the 3rd Jin Bu areas.
10. printed circuit board (PCB) according to claim 8 or claim 9, it is characterised in that the paste conductive material is tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710311252.XA CN106973495B (en) | 2017-05-04 | 2017-05-04 | Debugging method for inner layer circuit of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710311252.XA CN106973495B (en) | 2017-05-04 | 2017-05-04 | Debugging method for inner layer circuit of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106973495A true CN106973495A (en) | 2017-07-21 |
| CN106973495B CN106973495B (en) | 2019-12-13 |
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| CN201710311252.XA Active CN106973495B (en) | 2017-05-04 | 2017-05-04 | Debugging method for inner layer circuit of printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110010581A (en) * | 2018-01-05 | 2019-07-12 | 意法半导体(格勒诺布尔2)公司 | Insulated contact spacer |
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| US6429389B1 (en) * | 2000-11-15 | 2002-08-06 | Intel Corporation | Via-in-pad apparatus and methods |
| US20060042831A1 (en) * | 2004-08-31 | 2006-03-02 | Synergy Microwave Corporation | Visually inspectable surface mount device pad |
| CN105190497A (en) * | 2013-04-15 | 2015-12-23 | 富士胶片株式会社 | Method for manufacturing touch-panel conductive sheet, and touch-panel conductive sheet |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6429389B1 (en) * | 2000-11-15 | 2002-08-06 | Intel Corporation | Via-in-pad apparatus and methods |
| US20060042831A1 (en) * | 2004-08-31 | 2006-03-02 | Synergy Microwave Corporation | Visually inspectable surface mount device pad |
| CN105190497A (en) * | 2013-04-15 | 2015-12-23 | 富士胶片株式会社 | Method for manufacturing touch-panel conductive sheet, and touch-panel conductive sheet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110010581A (en) * | 2018-01-05 | 2019-07-12 | 意法半导体(格勒诺布尔2)公司 | Insulated contact spacer |
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| CN106973495B (en) | 2019-12-13 |
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