Liquid Crystal Module
Technical field
The present invention relates to flat-panel screens, relate in particular to the Liquid Crystal Module framework that is used for flat-panel screens.
Background technology
Fig. 1 is known Liquid Crystal Module (LCM) framework 100, comprises a glass substrate 102, an one source pole control panel 104 and a grid control panel 108.Between glass substrate 102 and source electrode control panel 104, there are a plurality of source driving chips 110 to link to each other, between glass substrate 102 and grid control panel 108, have a plurality of grid drive chip 106 to link to each other.Described grid drive chip 106 includes image element circuit array (not icon), is subjected to the control of source driving chip 110 and grid drive chip 106 and display frame.Described source driving chip 110 and grid drive chip 106 respectively receive data-signal to control the picture demonstration of described glass substrate 102 from source electrode control panel 104 and grid control panel 108.Described grid drive chip 106 and source driving chip 110 engage (COF) technology with coil type chip carrier packages (TCP) and make with the crystal grain soft mode.TCP and COF are the main packaged type of chip for driving in the Liquid Crystal Module.COF can utilize the rolled over characteristic of soft board with originally placing in the lump on the soft board together with chip for driving at the passive component on the printed circuit board (PCB), makes that the design of product is more full of elasticity.
Fig. 2 is known Liquid Crystal Module framework 200.In described Liquid Crystal Module, comprised glass substrate 202 and source electrode control panel 204, connected with a plurality of FPC 208 between the two.Described source electrode control panel 204 is in order to the required data-signal of input display frame.On glass substrate 202, comprised a plurality of grid drive chip 206 and source driving chip 210, engaged (COG) technology with ambetti and engage on it, seen through FPC 208, received data-signal from described source electrode control panel 204.It is the technology of utilizing FlipChip that ambetti engages (COG), with the long chip that golden projection is arranged, is intermediary interface with ACF, is bonded on the glass substrate.So-called projection is meant the derby of manufacturing gold or slicker solder on the contact of chip, just by melting the contact of chip is engaged with circuit when assembling.Described FPC 208 is P.e.c. made from flexible insulating substrate, has the advantage that many rigid printed circuit boards do not possess.For example it can free bend, spiral, folding, can require to arrange arbitrarily according to space layout, and move arbitrarily and flexible, thereby reach the integrated of assembled and private line access at three dimensions.Utilize FPC can dwindle the volume of electronic product greatly, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.FPC also have good thermal diffusivity and weldability and be easy to assembling, advantage such as cost is lower.
Summary of the invention
The invention provides a Liquid Crystal Module, be used for flat-panel screens, comprise a glass substrate, a plurality of source driving chip, a control panel, and at least one main channel.Described source driving chip is to be engaged on the described glass substrate in COG (ambetti encapsulation) mode, and divides into first part and second part.Described control panel is in order to import a plurality of data-signals, a power supply signal and a Gamma correction signal, and described main channel comprises first passage and second channel, described first passage is connected in series described control panel and first a plurality of source driving chips partly, described second channel is connected in series described control panel and second a plurality of source driving chips partly, so that described first partly see through described first passage and described second channel with described second partly the source driving chip, receive data-signal, power supply signal and the Gamma correction signal of correspondence individually from described control panel.Described data-signal is transistor logic (TTL) signal, the transmitting on described main channel of tandem.Described main channel is a flexible printer circuit (FPC).
The present invention also provides a Liquid Crystal Module, is used for flat-panel screens, comprises: a glass substrate comprises a plurality of glass substrate passages; A plurality of source driving chips are engaged on the described glass substrate with the ambetti packaged type; One control panel is in order to import a plurality of data-signals, a power supply signal and a Gamma correction signal; And at least one main channel, couple described control panel and described source driving chip one of them, and data-signal, described power supply signal and the described Gamma correction signal of corresponding each source driving chip, in point-to-point mode, be sent to each source driving chip, and described data-signal transmits on described main channel with the signal format string type ground of transistor logic.
In one embodiment, described glass substrate passage is connected in series in twos with the adjacent source chip for driving, feasible described signal with point-to-point transmission, from the in twos serial connection of control panel, be sent to each source driving chip via described main channel and described glass substrate passage.
In another embodiment, described Liquid Crystal Module also further comprises a plurality of subchannels, and each subchannel is connected in series the adjacent source chip for driving in twos.Wherein said glass substrate comprises a plurality of glass substrate passages, and the adjacent source chip for driving is connected in series in twos, and described main channel couple described control panel and described source driving chip one of them.The data-signal of corresponding each source driving chip sees through control panel, be sent to each source driving chip in point-to-point mode from the serial connection in twos of described glass substrate passage, and described power supply signal and described gamma correction parameter see through described control panel via described main channel, are sent to each source driving chip from the serial connection in twos of described subchannel.Described subchannel also is a flexible printer circuit (FPC).
In embodiment further, described glass substrate passage is to be equipped with the technology manufacturing with copper, or with low-impedance metal alloy manufacturing.
Description of drawings
Fig. 1 is known Liquid Crystal Module framework;
Fig. 2 is known Liquid Crystal Module framework;
Fig. 3 a is the point-to-point transmission Organization Chart of display panel;
Fig. 3 b is the Liquid Crystal Module package shelf composition of one of embodiment of the invention;
Fig. 4 is the Liquid Crystal Module package shelf composition of one of embodiment of the invention;
5a and 5b figure are the Liquid Crystal Module package shelf composition of one of embodiment of the invention.
Main drawing reference numeral explanation:
102~glass substrate, 104~source electrode control panel
106~grid drive chip, 108~grid control panel
110~source driving chip, 202~glass substrate
204~source electrode control panel, 206~grid drive chip
208~FPC, 210~source driving chip
302~glass substrate, 304~control panel
306~grid drive chip, 308~FPC
310~source driving chip, 312~time schedule controller
316~gamma reference voltage table
402~glass substrate, 404~control panel
406~grid drive chip, 408~FPC
410~FPC, 412~source driving chip
502~glass substrate, 504~control panel
506~grid drive chip, 508~FPC
510~source driving chip, 512~glass substrate passage
Embodiment
Fig. 3 a is the point-to-point transmission Organization Chart of display panel.Wherein comprise eight source driving chips 310, each source driving chip 310 respectively comprises one group of R, G, the B transmission line connects time schedule controller 312.Described time schedule controller 312 see through described transmission line R1, G1, B1 to R8, G8, B8 respectively to each source driving chip 310 data signal.Data-signal then is the form transmission with transistor logic (TTL) signal, for example CMOS (Complementary Metal Oxide Semiconductor) (CMOS) signal.Described time schedule controller 312 comprises a clock pulse line in addition, in order to each control panel 304 is transmitted synchronous clock signal.Described in addition display panel still comprises a gamma reference voltage table 316, in order to each control panel 304 is transmitted the Gamma correction signal.
Fig. 3 b is the Liquid Crystal Module package shelf composition of one of embodiment of the invention, in order to realize the display panel of Fig. 3 a.On a glass substrate 302, a plurality of grid drive chip 306 and source driving chip 310 engage on it in the mode of COG.One control panel 304 couples with glass substrate 302 with two FPC 308, and each is responsible for the binding of left side and a plurality of source driving chips 310 of right-hand part.The data-signal that described control panel 304 is produced in order to the time schedule controller 312 among the input Fig. 3 a, the Gamma correction signal that gamma reference voltage table 316 is produced, and required power supply signal (not icon) on the glass substrate 302.Comprise the point-to-point transmission line shown in Fig. 3 a among described two FPC 308, make have between the time schedule controller 312 of each source driving chip 310 and Fig. 3 a exclusive online.Because the data-signal that described transmission line transmits is the TTL signal, can reach low current loss and good EMI characteristic on the COG encapsulation architecture so be implemented into, also can reduce the overall liquid crystal module cost.
Fig. 4 is the Liquid Crystal Module Organization Chart of another embodiment.On a glass substrate 402, there are a plurality of grid drive chip 406 and source driving chip 412 to engage on it in the mode of COG.One control panel 404 engages with described glass substrate 402 with a FPC 408.Comprise a plurality of FPC 410 on this external described glass substrate 402, adjacent source driving chip 412 is connected in series in twos.412 of two source driving chips near FPC 408 are coupled to described FPC 408.By this, the data-signal of importing from control panel 404 sees through described serial connection in twos, is orderly sent to each source driving chip 412.Transmission line framework wherein still can be the framework of continuity Fig. 3 a.In other words, near the source driving chip 412 of FPC 408, except receiving one's own signal from described FPC 408, also need that the signals under other source driving chip 412 are seen through FPC 410 and down pass on, remaining the rest may be inferred.Described FPC 410 can be used for transmitting power supply signal and Gamma correction signal because conduction is good.Reach (not icon) as for the wiring (on panel wiring) that point-to-point data-signal can see through on the glass substrate 402.Present embodiment can reduce the use amount of FPC compared to Fig. 3 b.
Fig. 5 a is the Liquid Crystal Module Organization Chart of another embodiment.On a glass substrate 502, there are a plurality of grid drive chip 506 and source driving chip 510 to engage on it in the mode of COG.Only need a FPC508 and control panel 504 to couple, receive Point-to-Point Data signal, power supply signal and Gamma correction signal from control panel 504.As for the required wiring of described source driving chip 510, all be equipped with technology or other Low ESR preparation technology etching on described glass substrate 502 with copper, form glass substrate passage 512.Existing glass substrate passage has the too high problem of impedance, causes distorted signals.Copper is equipped with technology and other Low ESR fabricating technology can make the signal transmitting quality of glass substrate passage significantly promote.Through years of development, copper begins to become the main flow of semiconductor material, because the resistivity of copper is also littler than aluminium, therefore can carry bigger electric current on less area, allow manufacturer be able to that speed of production is faster, circuit is more intensive, and usefulness can promote the chip of about 30-40%.Also, therefore can alleviate its electromigration effect, improve the fiduciary level of chip because the anti-electromigration (electro migration) of copper energy force rate aluminium is good.
In addition, when copper was treated as main conductor material, most chip manufacturers all can adopt a kind of brand-new conductor structure, are called dual-damascene structure (dual damascene), simultaneously as the usefulness of plain conductor and connector, can reach the effect that reduces processing step with copper.
When making dual-damascene structure in fact, all the conductor structure with traditional is identical for most technologies, and unique difference is exactly the production method of structure.Traditional method is to etch circuit pattern on metallic film, centers on these circuit patterns with dielectric material again; And the method for making of dual-damascene structure then is to etch circuit pattern on dielectric material film, then metal (copper) is inserted in this pattern groove.The resistivity of copper is 2 μ Ω cm, is low than 4 μ Ω cm of aluminium.
Fig. 5 b is the Liquid Crystal Module Organization Chart of another embodiment.Two source driving chips 510 near FPC couple FPC 508, and with other source driving chip 510 between be connected in series in twos with glass substrate passage 512.By this near the source driving chip 510 of FPC 508 except receiving one's own signal, still can see through glass substrate passage 512 other source driving chip 510 required signals are transferred to next source driving chip 510.Because copper is equipped with technology considering of technology and cost is arranged, present embodiment mat source driving chip 510 pass on function, the minimizing copper is equipped with the use amount of technology and other Low ESR preparation technology glass substrate passage, has reduced the difficulty of real work.
The embodiment that more than provides has highlighted many characteristics of the present invention.Though the present invention discloses as above with preferred embodiment, so it is not in order to limiting scope of the present invention, anyly is familiar with those skilled in the art of the present invention, without departing from the spirit and scope of the present invention, and when doing various changes and retouching.The branch section header carried according to regulation of this instructions is not used in the described scope of its content that limits in addition; especially carrying in the background technology may not be the known invention that has disclosed; invention description is also non-in order to limit technical characterictic of the present invention, and the present invention is as the criterion with the scope that claim of the present invention is asked for protection.