WO2023165446A1

WO2023165446A1 - Circuit board assembly and electronic device

Info

Publication number: WO2023165446A1
Application number: PCT/CN2023/078454
Authority: WO
Inventors: 赖星锟; 雷毅; 贺江山
Original assignee: 维沃移动通信有限公司
Priority date: 2022-03-01
Filing date: 2023-02-27
Publication date: 2023-09-07
Also published as: CN114679841A

Abstract

The present application relates to the technical field of semiconductors, and discloses a circuit board assembly and an electronic device. The circuit board assembly comprises: a first circuit board and at least two second circuit boards, the at least two second circuit boards being disposed on the same side surface of the first circuit board, and each second circuit board being configured as a recess structure with a recess opening facing the first circuit board. A welding structure is disposed between every two adjacent second circuit boards, and each welding structure comprises a signal welding member and a ground welding member. A stacked upper-layer circuit board is divided into at least two second circuit boards, and two adjacent second circuit boards are connected by means of the welding structure; on one hand, the size of the upper-layer circuit board can be prevented from being too large, and the strength and reliability of the upper-layer circuit board are improved, and on the other hand, the welding structure comprises the signal welding member and the ground welding member, so that signals of the at least two second circuit boards do not need to be transferred by means of the first circuit board, thereby reducing transmission loss of the signals between the second circuit boards.

Description

Circuit board assemblies and electronic devices

Cross References to Related Applications

This application claims priority to Chinese Patent Application No. 202210194620.8 filed in China on March 1, 2022, the entire contents of which are hereby incorporated by reference.

technical field

The application belongs to the technical field of semiconductors, and in particular relates to a circuit board assembly and electronic equipment.

Background technique

In the related art, the circuit boards in the electronic device can be stacked to arrange more electronic components in the space along the thickness direction of the electronic device. With the increase of electronic components that need to be stacked, the size of the upper circuit board is also increasing, which leads to the risk of cracking and collapse of the upper circuit board. This results in lower strength and reliability of the stacked circuit boards.

Contents of the invention

The purpose of the embodiments of the present application is to provide a circuit board assembly and an electronic device, which can solve the problem of low strength and reliability of stacked circuit boards.

In the first aspect, the embodiment of the present application provides a circuit board assembly, the circuit board assembly includes: a first circuit board and at least two second circuit boards; the at least two second circuit boards are arranged on the first circuit board The surface of the same side, and each second circuit board is configured such that the notch faces the groove structure of the first circuit board; wherein, a welding structure is arranged between every two adjacent second circuit boards, and each welding structure includes a signal Weldments and ground weldments.

In a second aspect, an embodiment of the present application provides an electronic device, and the electronic device includes: the circuit board assembly according to the first aspect.

In the embodiment of the present application, the circuit board assembly includes: a first circuit board and at least two second circuit boards; the at least two second circuit boards are arranged on the same side surface of the first circuit board, and each second circuit board The board is configured as a groove-type structure with the notch facing the first circuit board; wherein, a soldering structure is provided between every two adjacent second circuit boards, and each soldering structure includes a signal soldering piece and a ground soldering piece. Through this scheme, since the stacked upper circuit boards can be divided into at least two second circuit boards, and every two adjacent second circuit boards are connected by a welding structure, on the one hand, the size of the upper circuit board can be avoided. Too large, which can improve the strength and reliability of the upper circuit board; on the other hand, because the welding structure includes signal soldering parts and ground soldering parts, the signals of at least two second circuit board parts do not need to be transferred through the first circuit board , so that the transmission loss of signals between the at least two second circuit board components can be reduced.

Description of drawings

Fig. 1 is a possible structural schematic diagram of a circuit board assembly provided by an embodiment of the present application;

Figure 2 is a front/front view of a circuit board assembly in one possible implementation;

Fig. 3 is a top view of a circuit board assembly in a possible implementation;

Fig. 4 is a top view of a second circuit board in a possible implementation;

Fig. 5 is a bottom view of another second circuit board in a possible implementation manner;

Fig. 6 is a top view of a circuit board assembly in another possible implementation;

Figure 7 is a front/front view of a circuit board assembly in another possible implementation;

Fig. 8 is a side view of a second circuit board in another possible implementation;

Fig. 9 is a bottom view of a second circuit board in another possible implementation;

Fig. 10 is a top view of a circuit board assembly in another possible implementation;

Figure 11 is a front/front view of a circuit board assembly in another possible implementation;

Fig. 12 is a bottom view of the connecting plate in another possible implementation;

Wherein, the reference signs among Fig. 1 to 12 are respectively:

100-circuit board assembly;

10 - the first circuit board;

20 - at least two second circuit boards;

201-a second circuit board; 2011-the first subsidence part;

202 - another second circuit board; 2021 - extension;

30-welding structure; 301-signal welding piece; 302-ground welding piece; 303-first pad; 304-second pad; 305-connection board; 3051-board body; 3052-two connected pads ; 3053-signal routing.

1000 - electronic equipment;

1001-equipment main body;

1002-structural parts;

1003 - Fasteners.

Detailed ways

The following will clearly describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, but not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in this application belong to the protection scope of this application.

The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein, and that references to "first," "second," etc. distinguish Objects are generally of one type, and the number of objects is not limited. For example, there may be one or more first objects. In addition, "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.

The circuit board assembly and the electronic device provided by the embodiments of the present application will be described in detail below through specific embodiments and application scenarios with reference to the accompanying drawings.

FIG. 1 shows a possible schematic structural diagram of a circuit board assembly 100 provided by an embodiment of the present application. As shown in FIG. 1 , the circuit board assembly 100 includes: a first circuit board 10 and at least two second circuit boards 20 ; The at least two second circuit boards 20 are arranged on the same side surface of the first circuit board 10 , and each second circuit board is configured as a groove structure with the notch facing the first circuit board 10 .

Wherein, a soldering structure 30 is provided between every two adjacent second circuit boards, and each soldering structure 30 includes a signal soldering part 301 and a ground soldering part 302 .

Specifically, each of the above-mentioned at least two second circuit boards and the first circuit board can be stacked, and an accommodating space is enclosed between each second circuit board and the first circuit board, The accommodating space can be used for accommodating electronic components.

In the embodiment of the present application, in actual implementation, after the total size of the required upper circuit board is determined, the above-mentioned at least two second circuit boards may be used to replace the large-sized upper circuit board according to requirements. Avoid stacked boards that increase the risk of breakage and collapse due to oversizing.

It can be seen that since every two adjacent second circuit boards are also welded by a welding structure, the strength and reliability of at least two second circuit boards can be further improved.

Further, since the soldering structure includes a signal soldering part and a ground soldering part, it is possible to transmit signals between every two adjacent second circuit boards through the signal soldering part without passing through the lower circuit board (that is, the first circuit board) switching, therefore: 1, the transmission loss of the signal between the second circuit boards can be reduced; 2, the signal pin (pin) of the first circuit board can be saved, so that two adjacent second circuit boards can be connected The spacing between them is made closer to save space on the motherboard.

It should be noted that each soldering structure includes a pad, and the above-mentioned signal soldering parts and ground soldering parts are arranged on the pads.

Optionally, in the embodiment of the present application, the signal soldering parts and the ground soldering parts in the pads may be arranged at intervals, or may be arranged adjacently.

Optionally, in this embodiment of the present application, the distance between each two adjacent second circuit boards may be less than or equal to a preset distance.

Optionally, in the embodiment of the present application, the circuit board (such as the first circuit board and at least two second circuit boards) can be: a printed circuit board PCB (Printed Circuit Board, PCB), an aluminum circuit board, an impedance circuit board, etc. The circuit board in any possible form can be specifically determined according to actual use requirements, and is not limited in this embodiment of the present application.

Optionally, in the embodiment of the present application, the second circuit board may be processed by a Cavity (local depression) process to remove part of the base material of the second circuit board, so as to obtain the second circuit board with a recessed structure.

Optionally, in the embodiment of the present application, each second circuit board includes a connected main body part and an expansion part, and the main body part and the expansion part form a semi-closed groove structure. Wherein, the end of the extension part away from the main part is connected to the first circuit board.

The circuit board assembly provided by the embodiment of the present application will be described in detail below through three possible implementation manners.

a possible implementation

Referring to FIG. 1 , as shown in FIG. 2 and FIG. 3 , for any two adjacent second circuit boards: one second circuit board 201 is provided with a first sinking portion 2011 on a side close to the other second circuit board 201 ; Another second circuit board 201 is provided with an extension part 2021 on a side close to one second circuit board 201 .

In the embodiment of the present application, the extension part is located above the first sinking part, and the projections of the extension part and the first sinking part on the first circuit board at least partially overlap;

Wherein, a welding structure provided between any two adjacent second circuit boards is specifically provided between the extension part and the first sinking part.

Optionally, in the embodiment of the present application, a part of a second circuit board may be shortened to obtain the first sinking portion.

Specifically, (1) a region on the surface of a second circuit board far away from the first circuit board (this region is close to another second circuit board) can be processed by a cavity (Cavity) process, and part of the base of the region can be removed. material to get the subsidence part. Alternatively, (2) a platform may be provided at one end of one second circuit board close to the other second circuit board to obtain a sinking portion.

Exemplarily, as shown in FIG. 2 and FIG. 3 , the Cavity process can be used to treat the area close to another second circuit board 201202 on the upper surface (the surface away from the extended part) of the main body part of one second circuit board 201 processed to obtain the subsidence part.

In the embodiment of the present application, a part of another second circuit board may be extended to obtain an extension part.

For example, as shown in FIG. 2 , the main body portion of another second circuit board 202 may be extended toward one second circuit board to obtain an extension portion.

It can be understood that, in the embodiment of the present application, the first sinking portion and the extending portion are stacked/stacked in the thickness direction (ie, the z direction) of the circuit board assembly.

In this way, by making one of any two adjacent second circuit boards locally short, and partially elongating the other of any two adjacent second circuit boards, and The short part (i.e. the first subsidence part) and the elongated part (extension part) are welded by the welding structure, so that on the one hand, the collapse and deformation of the upper circuit board can be avoided due to the size; on the other hand, two adjacent second The signal transmission of the circuit board does not need to pass through the main board (the first circuit board), which saves the wiring space of the main board and reduces signal loss. 3) Since there is no need to transmit signals through the main board between two adjacent second circuit boards, the signal pins (pins) of the first circuit board can be saved, so that the distance between any two adjacent second circuit boards can be reduced. Do it closer to save space on the first board.

Optionally, in the embodiment of the present application, the shape of the extension part may be elongated, L-shaped, or any other possible shape.

Optionally, in this embodiment of the present application, the surface of the extension part facing away from the first circuit board is flush with the surface of another second circuit board facing away from the first circuit board. In this way, the total thickness (that is, the thickness of the soldered structure) of the stacked extension part, the first subsidence part and a soldered structure can be made the same as the thickness of the second circuit board, so that the soldered structure can be prevented from protruding from any adjacent two circuit boards. The surface of the second circuit board facing away from the first circuit board can reduce the overall thickness of the circuit board assembly, and further reduce the thickness of the electronic equipment provided with the circuit board assembly.

Optionally, in the embodiment of the present application, the above-mentioned one welding structure includes two connected pads. Wherein, one of the two pads is disposed on the surface of the first sinking part facing the extension part; the other pad of the two pads is disposed on the surface of the extension part facing the first sinking part. That is, the two welding pads are respectively disposed on opposite surfaces of the first sinking portion and the extension portion.

Exemplarily, as shown in FIG. 2, a second circuit board 201 is set adjacent to another second circuit board 201 (that is, any adjacent two second circuit boards), by partially Make it shorter to obtain the first sinking part 2011 , and partially extend the other second circuit board 201 to obtain the extension part 2021 . FIG. 4 is a bottom view of a second circuit board 201. As shown in FIG. 4, one of the above two pads is provided on the top surface of the first sinking portion 2011 (that is, the surface facing the extension portion 2021), FIG. 5 is a bottom view of the extension part 2021. As shown in FIG. 5, the bottom surface of the extension part 2021 (ie, the surface facing the first sinking part 2011) is provided with another pad connected to the one pad. As shown in FIG. 4 and FIG. 5 , both the above-mentioned one pad and the above-mentioned other pad include a ground signal soldering part 301 and a ground soldering part 302 .

It can be understood that in the embodiment of the present application, the ground soldering piece in the above-mentioned one pad is connected to the ground soldering piece in the other pad; the signal soldering piece in the above-mentioned one pad is connected to the signal soldering piece in the other pad .

In this way, on the one hand, pads can be respectively provided on the first sinking part and the extension part, so as to realize signal transmission between two adjacent second circuit boards through these two pads. On the other hand, the reliability and stability of any two adjacent second circuit boards can be increased.

Another possible implementation

Referring to FIG. 1, as shown in FIG. 6 and FIG. 7, for a soldering structure 30 provided between any two adjacent second circuit boards, the soldering structure 30 may include two connected pads, the two The welding pads are respectively arranged on the facing surfaces of any two adjacent second circuit boards.

It can be seen that in the embodiment of the present application, the connection of any two adjacent second circuit boards is realized by providing welding structures on the opposite (facing) sides of any two adjacent second circuit boards.

It can be understood that, in the embodiment of the present application, the distance between any two adjacent second circuit boards is equal to the thickness of the one soldering structure (that is, the two connected pads).

It can be understood that in the second possible implementation manner, the welding point in the two connected pads

Optionally, in the embodiment of the present application, in the second possible implementation manner, the welding parts in the two connected pads are correspondingly arranged.

Optionally, in this embodiment of the present application, the soldering parts (including signal soldering points and ground soldering points) in the second possible implementation manner may be in any possible shape such as dots, squares, or strips.

Optionally, in the embodiment of the present application, when the soldering piece is elongated, in order to increase the number of soldering pieces in the two connected pads, each soldering piece may extend along the thickness direction of the second circuit board.

Exemplarily, as shown in Figures 8 and 9, one of the two pads is set on a first circuit board 201; as shown in Figure 8, the soldering part in the one pad is elongated , and the ground soldering piece 302 in the one pad is spaced apart from the signal soldering point.

Further, as shown in FIG. 9 , the soldering piece in the one pad (specifically, the soldering piece in the dotted line box in FIG. 9 ) protrudes from a second circuit board 201 .

In this way, by arranging the welding structure on the opposite sides of any two adjacent second circuit boards, not only can the signal transmission between the two second circuit boards be realized through the welding structure, but also the number of the two second circuit boards can be reduced. The assembly distance between the circuit boards saves the space of the first circuit board and increases the strength and reliability of the two second circuit boards.

Yet another possible implementation:

1, as shown in FIG. 10 to FIG. 12, for a soldering structure 30 provided between any two adjacent second circuit boards, the soldering structure 30 may include: a first pad 303, a second pad 304 and connecting plate 305.

In the embodiment of the present application, the first pad 303 is set on the first area of the first surface of one second circuit board 201, and the second pad 304 is set on the second area of the second surface of the other second circuit board 201 The connecting plate 305 covers the first pad 303 and the second pad 304 and is soldered to the first pad 303 and the second pad 304 ;

Wherein, both the first surface and the second surface are away from the first circuit board 10 , and the first area and the second area are opposite to each other. That is, the first area is an area on the first surface close to another second circuit board 201 , and the second area is an area on the second surface close to one second circuit board 201 , that is, the first area and the second area are adjacent.

In the embodiment of the present application, for any two adjacent second circuit boards, the opposite sides of one second circuit board and the other second circuit board can be closely attached, so that the gap between the two adjacent second circuit boards can be The distance between them reaches the minimum, so that the space of the first circuit board can be cleaned to the greatest extent.

Optionally, in this embodiment of the present application, the first region is provided with a second settlement part, and the second region is provided with a third settlement part. The first welding pad is specifically arranged on the surface of the second sinking part away from the first circuit board; the second welding pad is specifically arranged on the surface of the third sinking part away from the first circuit board.

It can be seen that the orientations of the first surface and the second surface are the same.

For the description of the second settling part and the third settling part, for details, refer to the related description of the first settling part in the above-mentioned possible implementation manner, and in order to avoid repetition, details are not repeated here.

In this way, since the connection between any two adjacent second circuit boards and the soldering structure can be shortened, the total thickness of the circuit board assembly (ie, the height in the Z direction) can be reduced.

Optionally, in the embodiment of the present application, as shown in FIG. 11 , the connection board 305 may include: a board body 3051 and two connected pads 3052 .

In the embodiment of the present application, the board body 3051 covers the first pad 303 and the second pad 304; on the third surface. Wherein, one of the two pads (specifically, the pad located in the left dotted line box in FIG. 12 ) is welded to the first pad 303 (specifically, the welding point in the first pad 303 ), The other pad of the two pads (specifically, the pad located in the dotted line box on the right side of FIG. 12 ) is welded to the second pad 304 (specifically, the welding point in the first pad 303 ).

Optionally, in the embodiment of the present application, the board body 3051 may be any of the following: single/multi-layer hard board, single/multi-layer flexible board, metal board.

Optionally, in this embodiment of the present application, as shown in FIG. 12 , the connection board 305 may further include: signal traces 3053 (including signal wires and ground wires) disposed on the third surface, and wires disposed on the board body 3051 The two pad points are connected through the signal trace 3053 .

In this way, in yet another implementation, since the welding structure can be covered on two adjacent second circuit boards, on the one hand, the loss of signal transmission between the two adjacent second circuit boards can be reduced; On the one hand, the distance between two adjacent second circuit board parts can be made smaller, thereby saving the space of the first circuit board; on the other hand, the welding structure can increase the connection strength of two adjacent second circuit board parts .

It should be noted that, in the circuit board assembly of the embodiment of the present application, at least one of the above three implementation manners may be used for connection between two second circuit boards that are not adjacent to each other.

Optionally, in this embodiment of the present application, each second circuit board of the at least two second circuit boards may be welded to the first circuit board through a welding piece.

In the embodiment of the present application, signal transmission may be implemented between each second circuit board and the first circuit board through pad groups.

Optionally, the circuit board assembly provided in the embodiment of the present application may further include: at least two first electronic components, the at least two first electronic components are arranged on the above-mentioned at least two second circuit boards, and each second One or more first electronic components of the at least two first electronic components are arranged on the circuit board.

Optionally, in this embodiment of the present application, for each first electronic component, a first electronic component may be disposed on a second circuit board; and the first electronic component may be located in a corresponding capacity of the second circuit board. in the accommodating space, or may be located outside the accommodating space corresponding to the second circuit board.

It should be noted that the accommodating space corresponding to the second circuit board is: the accommodating space enclosed by the second circuit board and the first circuit board.

Optionally, in the embodiment of the present application, the circuit board assembly may further include at least one second electronic component, and the at least one second electronic component is disposed on the first circuit board.

In the circuit board assembly provided in the embodiment of the present application, since the stacked upper circuit board can be divided into at least two second circuit boards, and every two adjacent second circuit board parts are connected by a welding structure, a On the one hand, the size of the upper circuit board can be avoided, thereby improving the strength and reliability of the upper circuit board; on the other hand, since the welding structure includes signal soldering parts and ground soldering parts, the signal of at least two second circuit board parts The transmission loss of signals between the at least two second circuit board components can be reduced without passing through the first circuit board.

The embodiment of the present application also provides an electronic device, which may include: the circuit board assembly 100 in the above embodiment.

As shown in FIG. 1 , the above-mentioned electronic device 1000 may further include a device main body 1001 and a structural member 1002 disposed on the device main body, and the structural member 1002 is used to support the circuit board assembly 100 . The circuit board assembly 100 can be Fasteners 1003 are disposed on the structural member 1002 to improve the installation stability between the circuit board assembly 100 and the device main body 1001 .

Further optionally, the above-mentioned fasteners may be screws, bolts and the like.

Optionally, in this embodiment of the present application, the electronic device may be a terminal, or may be other devices except the terminal. Exemplarily, the electronic device can be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR)/virtual reality (virtual reality, VR) ) equipment, robots, wearable devices, ultra-mobile personal computer (ultra-mobile personal computer, UMPC), netbook or personal digital assistant (personal digital assistant, PDA), etc., can also be a personal computer (personal computer, PC), TV TV (television, TV), teller machine or self-service machine, etc., which are not specifically limited in this embodiment of the present application.

It should be noted that, in this document, the term "comprising", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, It also includes other elements not expressly listed, or elements inherent in the process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved. Functions are performed, for example, the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

Through the description of the above embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus a necessary general-purpose hardware platform, and of course also by hardware, but in many cases the former is better implementation. Based on such an understanding, the technical solution of the present application can be embodied in the form of computer software products, which are stored in a storage medium (such as ROM/RAM, magnetic disk, etc.) , optical disc), including several instructions to enable a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in various embodiments of the present application.

The embodiments of the present application have been described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementations. The above-mentioned specific implementations are only illustrative and not restrictive. Those of ordinary skill in the art will Under the inspiration of this application, without departing from the purpose of this application and the scope of protection of the claims, many forms can also be made, all of which belong to the protection of this application.

Claims

A circuit board assembly, comprising: a first circuit board and at least two second circuit boards; the at least two second circuit boards are arranged on the same side surface of the first circuit board, and each second circuit board a groove-type structure configured with a notch facing the first circuit board;

Wherein, a soldering structure is provided between every two adjacent second circuit boards, and each soldering structure includes a signal soldering part and a ground soldering part.
The circuit board assembly according to claim 1, wherein, for any two adjacent second circuit boards: a first sinking portion is provided on a side of one second circuit board close to the other second circuit board; An extension is provided on one side of a second circuit board close to the second circuit board;

The extension part is located above the first sinking part, and projections of the extension part and the first sinking part on the first circuit board at least partially coincide;

Wherein, one of the welding structures disposed between any two adjacent second circuit boards is specifically disposed between the extension portion and the first sinking portion.
The circuit board assembly according to claim 2, wherein a surface of the extending portion facing away from the first circuit board is flush with a surface of the other second circuit board facing away from the first circuit board.
The circuit board assembly according to claim 2 or 3, wherein said one said soldering structure comprises two pads connected;

Wherein, one of the two welding pads is arranged on the surface of the first sinking part facing the extension part; the other of the two welding pads is arranged on the surface of the extension part facing the extension part. on the surface of the first subsidence part.
The circuit board assembly according to claim 1, wherein, for one of the welding structures arranged between any two adjacent second circuit boards, the one of the welding structures includes two connected pads, so The two pads are respectively arranged on the facing surfaces of any two adjacent second circuit boards.
The circuit board assembly according to claim 1, wherein, for one of the welding structures arranged between any two adjacent second circuit boards, the one of the welding structures comprises: a first solder pad, a second solder pad, Plates and connection plates;

The first welding pad is arranged on the first area of the first surface of a second circuit board; the second welding pad is arranged on the second area of the second surface of the other second circuit board; the connecting board covers on the first pad and the second pad, and soldered to the first pad and the second pad;

Wherein, both the first surface and the second surface are away from the first circuit board, and the first area and the second area are disposed opposite to each other.
The circuit board assembly according to claim 6, wherein the first region is provided with a second sinking portion, and the second region is provided with a third sinking portion;

The first pad is specifically arranged on the surface of the second sinking part away from the first circuit board; the second pad is specifically arranged on the surface of the third sinking part away from the first circuit board superior.
The circuit board assembly according to claim 6 or 7, wherein the connecting board comprises a board body and a connected The two pads;

The board covers the first pad and the second pad;

The two pads are both arranged on the third surface of the board facing the first circuit board;

Wherein, one of the two pads is soldered to the first pad, and the other pad of the two pads is soldered to the second pad.
The circuit board assembly according to claim 8, wherein the connecting board further comprises signal traces disposed on the third surface, and the two pads are communicated through the signal traces.
The circuit board assembly according to claim 1, wherein the distance between each two adjacent second circuit boards is less than or equal to a predetermined distance.
An electronic device, comprising: the circuit board assembly according to any one of claims 1-10.