CN220493216U - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
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- CN220493216U CN220493216U CN202321883860.5U CN202321883860U CN220493216U CN 220493216 U CN220493216 U CN 220493216U CN 202321883860 U CN202321883860 U CN 202321883860U CN 220493216 U CN220493216 U CN 220493216U
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- circuit board
- main board
- enclosing
- hollow cavity
- cover plate
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- 239000002184 metal Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Abstract
The disclosure provides a circuit board and electronic equipment, wherein the circuit board comprises a main board and a connecting plate, and the connecting plate is arranged on the main board; the connecting plate comprises a first connecting part and a second connecting part connected with the first connecting part, wherein the first connecting part and the second connecting part are arranged along a first direction, and the first direction is parallel to the main board. The first connecting portion and the main board enclose to form a first hollow cavity, the second connecting portion and the main board enclose to form a second hollow cavity, the second hollow cavity penetrates through the second connecting portion along the second direction, and the second direction is perpendicular to the main board. Through setting up first cavity and second cavity can be used to increase the volume of the component that the circuit board held, increases the utilization ratio in circuit board space, simple structure, cost are lower.
Description
Technical Field
The disclosure relates to the technical field of circuit boards of electronic equipment, and in particular relates to a circuit board and electronic equipment.
Background
A printed circuit board (Printed Circuit Board PCB) is a base assembly for supporting and connecting electronic components. It plays a key role in almost all electronic devices, from simple computer keyboards to complex smartphones and computer motherboards, almost all using PCB boards. The conventional PCB adopts a Cavity scheme, and a Cavity is formed on the PCB for placing components, which easily results in a problem that higher components cannot be placed.
Disclosure of Invention
The present disclosure provides a circuit board and an electronic device to solve at least some of the problems in the related art.
The present disclosure provides a circuit board comprising:
a main board;
the connecting plate is arranged on the main board; the connecting plate comprises a first connecting part and a second connecting part connected with the first connecting part, the first connecting part and the second connecting part are arranged along a first direction, and the first direction is parallel to the main board;
the first connecting portion and the main board enclose to form a first hollow cavity, the second connecting portion and the main board enclose to form a second hollow cavity, the second hollow cavity penetrates through the second connecting portion along a second direction, and the second direction is perpendicular to the main board.
Further, the circuit board further comprises a cover plate, wherein the cover plate is covered on the second connecting part, and the second hollow cavity penetrates through one end sealing cover of the second connecting part; the sum of the heights of the second connecting portion and the cover plate is not greater than the height of the first connecting portion.
Further, the circuit board further comprises at least one sub-cover plate arranged on the cover plate; the sum of the heights of the second connecting portion, the cover plate and the sub-cover plate is not larger than the height of the first connecting portion.
Further, the cover plate is a sub-circuit board.
Further, the cover plate is a shielding metal plate.
Further, the first connecting portion deviates from one side of the main board and the second connecting portion deviates from one side of the main board and is provided with connecting holes.
Further, the first connecting portion comprises a first enclosing portion and a cover sealing portion, and the first enclosing portion, the cover sealing portion and the main board enclose to form the first hollow cavity;
the second connecting part comprises a second enclosing part, and at least part of the second enclosing part and at least part of the first enclosing part are of a shared structure; the second enclosing part and the main plate enclose to form the second hollow cavity.
Further, the circuit board further comprises a shielding layer, and the shielding layer is arranged on one surface, away from the main board, of at least one of the first enclosing part and the second enclosing part.
Further, the circuit board further comprises a conducting layer, and the conducting layer is arranged on one surface, away from the main board, of at least one of the first enclosing part and the second enclosing part.
Further, the circuit board further comprises a shielding layer and a conducting layer, wherein the shielding layer and the conducting layer are arranged on one surface, away from the main board, of at least one of the first enclosing part and the second enclosing part in a staggered mode.
Further, the circuit board further comprises a shielding layer and a conducting layer, the conducting layer is arranged on one surface, deviating from the main board, of at least one of the first enclosing part and the second enclosing part, and the shielding layer is arranged on one surface, deviating from the main board, of at least part of the conducting layer.
Further, the first enclosing part comprises an adapter plate.
Further, the cover part comprises a radio frequency plate.
Further, the second enclosing part comprises an adapter plate.
Further, the sum of the area of the first connection portion and the area of the second connection portion is the same as the area of the main board.
The disclosure provides an electronic device, which comprises at least one component and the circuit board according to any one of the embodiments, wherein the component is arranged on the circuit board.
Further, the component is disposed on at least one of the main board, the first hollow cavity, the second hollow cavity, and a surface of the first connecting portion facing away from the main board.
The circuit board that this disclosure provided, including mainboard and connecting plate, and the connecting plate includes first connecting portion and second connecting portion, encloses first well cavity through first connecting portion and mainboard and closes and form the second well cavity, and second connecting portion and main board enclose, and the second well cavity runs through second connecting portion along the second direction to the second direction is perpendicular with the mainboard, through setting up first well cavity and second well cavity, is favorable to forming great utilization space on PCB, and then is convenient for place great component.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a schematic diagram of an exemplary embodiment of a circuit board of the present disclosure;
FIG. 2 is a schematic diagram of an exemplary embodiment of an electronic device of the present disclosure;
FIG. 3 is a schematic diagram illustrating the structure of another exemplary embodiment of an electronic device of the present disclosure;
fig. 4 is a schematic structural view of still another exemplary embodiment of the electronic device of the present disclosure.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like in the description and in the claims, are not used for any order, quantity, or importance, but are used for distinguishing between different elements. Likewise, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" or "plurality" means two or more. Unless otherwise indicated, the terms "front," "rear," "lower," and/or "upper" and the like are merely for convenience of description and are not limited to one location or one spatial orientation. The word "comprising" or "comprises", and the like, means that elements or items appearing before "comprising" or "comprising" are encompassed by the element or item recited after "comprising" or "comprising" and equivalents thereof, and that other elements or items are not excluded. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
The present disclosure provides a circuit board and an electronic device. The circuit board and the electronic device of the present disclosure will be described in detail with reference to the accompanying drawings. The features of the examples and embodiments described below may be combined with each other without conflict.
Fig. 1 is a schematic diagram of a circuit board according to an exemplary embodiment of the present disclosure. Fig. 2 is a schematic structural diagram of an exemplary embodiment of an electronic device of the present disclosure. In connection with the embodiments shown in fig. 1-2, the present disclosure provides a circuit board 111 including a motherboard 112 and a connection board 113, and in some embodiments, the connection board 113 may include a Cavity board and an interser board. Wherein, the connecting plate 113 is arranged on the main board 112; the connection plate 113 includes a first connection portion 114 and a second connection portion 115 connected to the first connection portion 114. In some embodiments, the first connection 114 comprises a Cavity board and the second connection 115 comprises an interser board. The first connection part 114 and the second connection part 115 are arranged along a first direction L1, and the first direction L1 is parallel to the main board 112. The first connecting portion 114 and the main board 112 enclose to form a first hollow cavity 116, the second connecting portion 115 and the main board 112 enclose to form a second hollow cavity 117, the second hollow cavity 117 penetrates the second connecting portion 115 along a second direction L2, and the second direction L2 is perpendicular to the main board 112. The first hollow cavity 116 and the second hollow cavity 117 can be used for placing components to be connected to the circuit board 111, and the first hollow cavity 116 and the second hollow cavity 117 can be used for increasing the volume of the components accommodated by the circuit board 111 and increasing the space utilization rate of the circuit board 111. Also, the first direction L1 is disposed parallel to the main board 112, and the second direction L2 is disposed perpendicular to the main board 112, so that the space of the carrier element can be spatially and stereoscopically widened. Alternatively, the motherboard may be a PCB printed circuit board.
In some embodiments, the circuit board 111 further includes a cover plate 118, which covers the second connection portion 115, and seals one end of the second hollow cavity 117 penetrating the second connection portion 115; the sum of the heights of the second connection portion 115 and the cover plate 118 is not greater than the height of the first connection portion 114. Through setting up apron 118, can establish the component and realize the connection of component on apron 118, and the high less than or equal to of second connecting portion 115 and apron 118 is high of first connecting portion 114, is convenient for set up higher component in second connecting portion 115, is favorable to solving the problem that can't install at circuit board 111 because of the component size is great to be favorable to improving the space utilization of second connecting portion 115, simple structure and saving cost.
In some embodiments, the circuit board 111 further includes at least one sub-cover 119 disposed on the cover 118; the sum of the heights of the second connection portion 115, the cover plate 118, and the sub-cover plate 119 is not greater than the height of the first connection portion 114. The sub-cover plate 119 is arranged to realize the connection layer required by continuously superposing the connecting elements on the second connecting part 115, so that the connection of the elements under different conditions is realized, the sum of the heights of the second connecting part 115, the cover plate 118 and the self-cover plate 118 is smaller than or equal to the height of the first connecting part 114, the expansion of the space caused by continuously superposing the original first connecting part 114 is avoided, the space utilization rate of the circuit board 111 is improved, and the space waste of the circuit board 111 is reduced.
Fig. 3 is a schematic structural view of another exemplary embodiment of an electronic device of the present disclosure. As shown in fig. 3, in some embodiments, the cover 118 is a daughter board. Alternatively, the sub-circuit board may be a PCB printed circuit board. The sub-circuit board may continue to have components 127 stacked thereon. Fig. 4 is a schematic structural view of still another exemplary embodiment of the electronic device of the present disclosure. In other embodiments, as shown in fig. 4, the cover plate 118 may be a shielding metal plate that may be used to block connections between some of the components 127 and the circuit board 111. As shown in fig. 2, further, when components need to be added, a sub-cover plate 119 may be added to the shielding metal plate, so as to continue to stack the components.
In some embodiments, the surface of the first connecting portion 114 facing away from the main board 112 and the surface of the second connecting portion 115 facing away from the main board 112 are both provided with connecting holes 120. The first connection part 114 and the second connection part 115 may be connected to the main board 112 through connection holes 120, respectively, and the first connection part 114 and the second connection part 115 are connected to the cover plate 118 or the sub-cover plate 119 through connection holes 120. In some embodiments, the first connection portion 114 or the second connection portion 115 may be welded to the cover plate 118 and the sub-cover plate 119.
In some embodiments, the first connection portion 114 includes a first enclosing portion 121 and a cover portion 122, and the first enclosing portion 121, the cover portion 122, and the main board 112 enclose to form the first hollow cavity 116. The second connecting portion 115 includes a second enclosing portion 123, at least part of the second enclosing portion 123 and at least part of the first enclosing portion 121 are of a shared structure; the second enclosing part 123 encloses the main board 112 to form a second hollow cavity 117. The first hollow cavity 116 and the second hollow cavity 117 can be used for placing components to be connected to the circuit board 111, and the first hollow cavity 116 and the second hollow cavity 117 can be used for increasing the volume of the components accommodated by the circuit board 111 and increasing the space utilization rate of the circuit board 111. Also, the first direction L1 is disposed parallel to the main board 112, and the second direction L2 is disposed perpendicular to the main board 112, so that the space of the carrier element can be spatially and stereoscopically widened.
In some embodiments, the circuit board 111 further includes a shielding layer 124 disposed on a surface of at least one of the first enclosing portion 121 and the second enclosing portion 123 facing away from the motherboard 112. The shielding layer 124 may be used to block the connection between the components placed on the circuit board 111 and the main board 112, and also to block the connection of the components with other devices because the main board 112 may be connected with other devices. The shielding layer 124 is arranged on one surface away from the main board 112, so that the shielding layer 124 can be conveniently disassembled and overhauled.
In some embodiments, the circuit board 111 further includes a conductive layer 125 disposed on a surface of at least one of the first enclosing portion 121 and the second enclosing portion 123 facing away from the motherboard 112. The conductive layer 125 may be used to connect the component placed on the circuit board 111 to the motherboard 112, and thus, connection of the component to other devices may be achieved since the motherboard 112 may be connected to other devices. The conducting layer 125 is arranged on one surface away from the main board 112, so that the conducting layer 125 can be conveniently disassembled and overhauled.
In some embodiments, the shielding layer 124 and the conducting layer 125 are staggered on a surface of at least one of the first enclosing portion 121 and the second enclosing portion 123 facing away from the motherboard 112. The staggered arrangement of the shield layer 124 and the via layer 125 facilitates meeting the via or shield requirements of the different components. In implementations, connection or disconnection of different locations of the device to motherboard 112 may be accomplished by connecting the device to different pins of the PCB.
In some embodiments, the conducting layer 125 is disposed on a surface of at least one of the first enclosing portion 121 and the second enclosing portion 123 facing away from the motherboard 112, and the shielding layer 124 is disposed on a surface of at least part of the conducting layer 125 facing away from the motherboard 112. The conducting layer 125 is used for conducting the main board 112 and the connected element, and the shielding layer 124 is arranged on the conducting layer 125 to block the conduction between the main board 112 and the connected element, so that the conduction between part of the elements and the shielding of the other part of the elements can be simultaneously realized, the space is saved, and the structure is simple and the cost is saved.
In some embodiments, the first enclosure 121 includes an interposer, the second enclosure 123 also includes an interposer, and the cover 122 includes a radio frequency board. The adapter board and the radio frequency board are used for receiving and transmitting signals between the component and the main board 112, and connection between the component and the main board 112 is achieved.
In some embodiments, the sum of the area of the first connection portion 114 and the area of the second connection portion 115 is the same as the area of the main board 112. The sum of the area of the first connecting portion 114 and the area of the second connecting portion 115 is the same as the area of the main board 112, which is beneficial to improving the space utilization rate of the PCB, and has simple structure and cost saving.
In the embodiment shown in fig. 2, the disclosure further provides an electronic device 126, including at least one component 127 and the circuit board 111, where the component 127 is disposed on the circuit board 111. The component 127 is connected to and communicates with other devices via the circuit board 111.
In some embodiments, the component 127 is disposed on at least one of the motherboard 112, the first hollow cavity 116, the second hollow cavity 117, and a side of the first connection portion 114 facing away from the motherboard 112. By providing the component 127 at least one of the main board 112, the first hollow cavity 116, the second hollow cavity 117, etc., the space utilization of the PCB can be improved.
In some embodiments, by placing the components 127 on the first hollow cavity 116, the second hollow cavity 117, or the cover plate 118 of the circuit board 111 of the present disclosure, the motherboard 112 is connected with more components 127 on the basis of not increasing the space occupation rate of the circuit board 111, which is beneficial to improving the space utilization rate of the PCB, reducing the space waste, and saving the cost when connecting more components 127.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (11)
1. A circuit board, comprising:
a main board;
the connecting plate is arranged on the main board; the connecting plate comprises a first connecting part and a second connecting part connected with the first connecting part, the first connecting part and the second connecting part are arranged along a first direction, and the first direction is parallel to the main board;
the first connecting portion and the main board enclose to form a first hollow cavity, the second connecting portion and the main board enclose to form a second hollow cavity, the second hollow cavity penetrates through the second connecting portion along a second direction, and the second direction is perpendicular to the main board.
2. The circuit board of claim 1, further comprising a cover plate covering the second connection portion and sealing one end of the second hollow cavity passing through the second connection portion; the sum of the heights of the second connecting portion and the cover plate is not greater than the height of the first connecting portion.
3. The circuit board of claim 2, further comprising at least one sub-cover plate disposed on the cover plate; the sum of the heights of the second connecting portion, the cover plate and the sub-cover plate is not larger than the height of the first connecting portion.
4. The circuit board of claim 2, wherein the circuit board is configured to,
the cover plate is a sub-circuit board; or (b)
The cover plate is a shielding metal plate.
5. The circuit board of claim 1, wherein the first connection portion has a connection hole formed on a surface facing away from the main board and the second connection portion has a surface facing away from the main board.
6. The circuit board of claim 1, wherein the first connection portion comprises a first enclosing portion and a cover portion, the first enclosing portion, the cover portion, and the motherboard enclosing to form the first hollow cavity;
the second connecting part comprises a second enclosing part, and at least part of the second enclosing part and at least part of the first enclosing part are of a shared structure; the second enclosing part and the main plate enclose to form the second hollow cavity.
7. The circuit board of claim 6, further comprising a shielding layer disposed on a side of at least one of the first enclosure and the second enclosure facing away from the motherboard; and/or
The conducting layer is arranged on one surface of at least one of the first enclosing part and the second enclosing part, which is away from the main board; and/or
The shielding layer and the conducting layer are arranged on one surface of at least one of the first enclosing part and the second enclosing part, which is away from the main board, in a staggered manner; and/or
Still include shielding layer and switch on the layer, switch on the layer set up in first enclose and close the portion with the second encloses and close one side that deviates from of at least one of portion the mainboard, the shielding layer set up in at least part switch on the layer and deviate from the one side of mainboard.
8. The circuit board of claim 6, wherein the circuit board is further configured to,
the first enclosing part comprises an adapter plate; and/or
The cover part comprises a radio frequency plate; and/or
The second enclosing part comprises an adapter plate.
9. The circuit board of claim 1, wherein a sum of an area of the first connection portion and an area of the second connection portion is the same as an area of the main board.
10. An electronic device comprising at least one component and a circuit board according to any one of claims 1-9, said component being arranged on said circuit board.
11. The electronic device of claim 10, wherein the component is disposed on at least one of a side of the motherboard, the first hollow cavity, the second hollow cavity, and the first connection portion facing away from the motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321883860.5U CN220493216U (en) | 2023-07-17 | 2023-07-17 | Circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321883860.5U CN220493216U (en) | 2023-07-17 | 2023-07-17 | Circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220493216U true CN220493216U (en) | 2024-02-13 |
Family
ID=89839310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321883860.5U Active CN220493216U (en) | 2023-07-17 | 2023-07-17 | Circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220493216U (en) |
-
2023
- 2023-07-17 CN CN202321883860.5U patent/CN220493216U/en active Active
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