CN2552022Y - Small plug-type light emitting/receiving module - Google Patents
Small plug-type light emitting/receiving module Download PDFInfo
- Publication number
- CN2552022Y CN2552022Y CN 01265469 CN01265469U CN2552022Y CN 2552022 Y CN2552022 Y CN 2552022Y CN 01265469 CN01265469 CN 01265469 CN 01265469 U CN01265469 U CN 01265469U CN 2552022 Y CN2552022 Y CN 2552022Y
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- China
- Prior art keywords
- circuit board
- receiving module
- housing
- light transmitting
- pcb
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a small plug-type light emitting/receiving module, which comprises a shell, a light emitting/receiving device, a socket, a printing circuit board and a shielding cover. The light emitting/receiving device is arranged in the socket and is welded with the printing circuit board through a circuit down-lead; the shell comprises an upper shell body, a lower shell body and a base, wherein, the printing circuit board is fixed and supported on the base through a bolt; the upper shell body is fixed and connected with the base through a fixing groupware and is buckled and combined with the lower shell body so as to seal the base, the socket and the printing circuit board. The shielding cover is covered on the printing circuit board so as to prevent the crossfire of signals on the printing circuit board so as to gain comparatively good signal emitting/receiving effect.
Description
[technical field]
The utility model is about a kind of light transmitting-receiving module, the magnetic shielding of especially a kind of tool better electrical, electrostatic defending, can avoid radiating circuit and receiving circuit mutually the SFP light of mutual interference receive and dispatch module.
[background technology]
Light transmitting-receiving module is a kind of light communication system that is applied to, and the device of bidirectional data transfers is provided between optical interface and electric interface.For adapting to the demand that network transfer speeds promotes, external connection port density improves, industry is devoted to provide at a high speed always, the light transmitting-receiving module of miniaturization, along with development of science and technology, how the optical fiber backbone network speed of network has surpassed 10Gbps, therefore how the connection speed with the electric communication of traditional cable transmission has surpassed 1Gbps, institute thinks that reaching photosignal changes mutually, and the circuit in the light transmitting-receiving module mostly is very high frequency circuit.In addition, along with the development of light transmitting-receiving module is more small-sized and accurate, make printed circuit board (PCB) must print more accurate high-frequency circuit, and each electronic component distance is more approaching, thereby electronic component causes damage with easier accumulation static, or forms electromagnetic interference (EMI) mutually.
General light transmitting-receiving module can comprise light signal radiating circuit and the two-part high-frequency circuit of optical signal receiving circuit, usually partly comprise driving circuit at the light signal radiating circuit, signal generating circuit and signal modulation circuit, the optical signal receiving circuit part then comprises amplification and rectification circuit, driving circuit and signal demodulating circuit, and the electromagnetic wave that high-frequency circuit produced of optical signal launcher and light signal receiving tends to the phase mutual interference, as: the feeble signal electric current that the high-frequency circuit meeting electromagnetic interference (EMI) photodiode of optical signal launcher is produced, marking current is not entered before the amplification and rectification circuit as yet, just produce distortion.So, between the high-frequency circuit of optical signal launcher and light signal receiving, must be shielded, take place to prevent mutual electromagnetic interference (EMI).
United States Patent (USP) the 6th, 213 has disclosed a kind of small light transmitting-receiving module for 651B1 number, and this light transmitting-receiving module tool prevents the function that electromagnetic radiation (EMI) and printed circuit board signal are crosstalked.Its optical signal receiving circuit and light signal transtation mission circuit all adopt the printed circuit board (PCB) of each self-separation, two printed circuit board (PCB)s are parallel to each other and tool certain space interval, separate with dividing plate therebetween, preventing crosstalking of electric signal, and can avoid complicated wiring to design with ground connection.But, it adopts the PCB design of separation to be not easy to integrated and dwindles overall dimensions, and the design of its dividing plate does not form sealing, is not enough to prevent electromagnetism mutual interference mutually between light signal radiating circuit and the optical signal receiving circuit, so this baffle design does not still have essence electromagnetic protection effect.
United States Patent (USP) the 5th, 047, then disclosed another kind of light transmitting-receiving module for No. 835, it adopts, lower house is positioned over printed circuit board (PCB) wherein, shroud whole printed circuit board (PCB) to realize electromagnetic screen and electrostatic defending by a crown cap that is positioned at the upper shell downside, and arrange in this crown cap that a partition wall is used to separate the radiating circuit and the receiving circuit of light transmitting-receiving module, to reduce electromagnetic radiation that radiating circuit produces influence to receiving circuit, this partition wall contacts with printed circuit board (PCB) with heat radiation, this crown cap only is connected on the printed circuit board (PCB) with a plurality of shell fragments in both sides, and by the pressure of loam cake this crown cap is fixed.Even if constituting with P.e.c. with the both sides shell fragment, this metal contacts, but forming sealing between the separation wall energy of still not guaranteeing this crown cap and printed circuit board (PCB) contacts, even still can between partition wall and printed circuit board (PCB), produce the slit, disturb so still be difficult to prevent the mutual electromagnetic between radiating circuit and receiving circuit.
In view of this, provide a kind of electromagnetic isolation that can between light signal radiating circuit and optical signal receiving circuit, form to receive and dispatch very necessity of module with the light that produces preferable electromagnetic screen, electrostatic defending.
[summary of the invention]
The purpose of this utility model is to provide a kind of can produce shielding to prevent the light transmitting-receiving module of light signal emission high-frequency circuit to its formation electromagnetic interference (EMI) at optical signal receiving circuit.
The purpose of this utility model is achieved in that provides light transmitting-receiving module, and it comprises a housing, a light emitting devices, an optical pickup apparatus, a printed circuit board (PCB) and screening cover.Light emitting devices can be light signal with electrical signal conversion and be emitted to the module outside, optical pickup apparatus can receive the light signal of module outside and be converted to electric signal, radiating circuit and receiving circuit are set on this printed circuit board (PCB), this radiating circuit is to electrically connect with this light emitting devices, this receiving circuit is to electrically connect with this optical pickup apparatus, this housing is packaged in printed circuit board (PCB) wherein, this housing comprises upper and lower casing and pedestal, and wherein this printed circuit board (PCB) is to be immobilizated on the pedestal by fastening assembly.Screening cover is fixed in the receiving circuit part of printed circuit board (PCB) in the mode of welding or see through the conducting foam contact.
Compare with existing light transmitting-receiving module, the utlity model has following advantage: it can form electromagnetic screen on optical signal receiving circuit, with the electromagnetic interference (EMI) that prevents that the light signal radiating circuit from producing it, thereby realize that preferable light signal receives and electrostatic protection effect.
[description of drawings]
Fig. 1 is the decomposition view of the utility model light transmitting-receiving module.
Fig. 2 is the decomposition view of another angle of the utility model light transmitting-receiving module.
Fig. 3 is the decomposition view of the another angle of the utility model light transmitting-receiving module.
Fig. 4 is the stereographic map of the screening cover of the utility model light transmitting-receiving module.
Fig. 5 is the assembled view of the utility model light transmitting-receiving module.
[embodiment]
Please refer to Fig. 1, Fig. 2 and Fig. 3, is the decomposition view of the utility model light transmitting-receiving module 99.This light transmitting-receiving module 99 mainly comprises a housing, a socket 4, a printed circuit board (PCB) 5, a light R-T unit 6 and screening cover 9, and wherein, this housing comprises a upper shell 1, a lower house 2 and pedestal 3.
This socket 4 is roughly a rectangular parallelepiped, comprises fore-end 43 and rear end part 44.The physical dimension of this fore-end 43 is bigger slightly than rear end part 44, so form a cascaded surface in two-part junction, is used for restriction and location upper shell 1.This fore-end 43 offers two openings 41,42 that run through whole socket 4, this two opening 41,42 is accommodated light R-T unit 6 and is leaned on rear end part 44 places in it, these two openings, 41,42 forward end parts, 43 places then can supply the joints of optical fibre (scheming not shown) to peg graft, and are used for input and output light signal.These socket 4 rear end parts 44 lower surfaces are offered a T type groove 441, are used for matching (detailed aftermentioned) with the ad hoc structure of upper shell 1, and its upper surface is established a pair of rectangular preiection 442.
This light R-T unit 6 is housed in two openings 41 of socket 4, in 42, it comprises light emitting devices 61 and optical pickup apparatus 62, normally laser diode or light emitting diode of this light emitting devices 61 wherein, optical pickup apparatus 62 is photodiode normally, this light emitting devices can be light signal with electrical signal conversion and be emitted to the module outside, this optical pickup apparatus can receive the light signal of module outside and be converted to electric signal, this light emission, receiving trap 61, a plurality of circuit leads 605 are all stretched out at 62 rear portion, are connected with corresponding circuit and electronic component (scheming not shown) on the printed circuit board (PCB) 5 respectively.
Printed circuit board (PCB) 5 comprises before one wide 51 and narrow 52 of a back, and wide 51 is provided with three pilot holes 511 before it, is used for fixing printed circuit board (PCB) 5 in pedestal 3 (detailed aftermentioned).This printed circuit board (PCB) 5 also comprises a radiating circuit (scheming not shown), one receiving circuit (scheming not shown) and grounding circuit (scheming not shown), this radiating circuit electrically connects by circuit lead 605 and light emitting devices 61, receiving circuit also electrically connects by circuit lead 605 and optical pickup apparatus 62, and grounding circuit can be grounded to light transmitting-receiving module outside.
Please also refer to Fig. 4, screening cover 9 is the receiving circuit parts that cover plated circuit 5, and it comprises two screening cover sidewall 91,92, one screening cover loam cakes, 94, one screening cover rear walls 93 and sidewall recesses 95.Wherein, screening cover sidewall 91,92, screening cover rear wall 93 is all offered a plurality of louvres 941 on screening cover loam cake 94 and the sidewall recess 95.This screening cover can be with the whole machine-shaping of metal material, to reduce manufacturing cost.In addition, screening cover sidewall 91,92 and screening cover rear wall 93 include pin 931, and this pin 931 is connected by welding manner or by the conducting foam way of contact with printed circuit board (PCB) 5, and with printed circuit board (PCB) on corresponding grounding circuit form and electrically connect.
The circuit lead 605 of this light R-T unit 6 is to be welded in preceding wide 51 of printed circuit board (PCB) 5, with Primary Location printed circuit board (PCB) 5.Signal transmission between light R-T unit 6 and the circuit board 5 realizes by this lead-in wire 605.Back narrow 52 of printed circuit board (PCB) 5 is provided with row's electric terminal (golden finger) 520, electrically connects by this electric terminal 520 and an electric connector (scheming not shown).
This pedestal 3 is roughly a rectangle housing; in order to settle, to protect printed circuit board (PCB) 5; its upper surface 31 is roughly a rectangular flat plate structure; offer three screws 312 on it; be corresponding with three pilot holes 511 of printed circuit board (PCB) 5 respectively; a double-screw bolt 313 is extended in the lower end of each screw 312, and this screw 312 connects whole double-screw bolt 313.Pedestal 3 rear ends are a container 33, and a saddle 330 is stretched out in its bottom.In addition, further offer two-screw counterbore 311 on the upper surface 31 of this pedestal 3, and on the two side 32 of pedestal 3, offer two ladder platforms 320 of each interval respectively, to join (detailed aftermentioned) with the ad hoc structure card of lower house 2.
Lower house 2 comprises a rectangle base plate 20 and the two side 21 of extending vertically upward along the both sides of base plate 20.There are two lugs 212 at the two ends at every sidewall 21 tops, and the ladder platform 320 of its size and pedestal 3 is roughly suitable.This lower house 2 is to join and combine with pedestal 3 by lug 212 and ladder platform 320 cards.In addition, each lug 212 bottom has a slit 213, respectively offers a rectangular aperture 211 on the sidewall 21 below each slit 213, and this slit 213 is to cooperate (aftermentioned of knowing clearly) with upper shell 1 corresponding construction with rectangular aperture 211, with the upper and lower casing 1,2 that is connected.
Please consult Fig. 5 simultaneously, during assembling, back narrow 52 of printed circuit board (PCB) 5 is inserted in the container 33, and double-screw bolt 313 is pressed against on the printed circuit board (PCB) 5, and printed circuit board (PCB) 5 is supported in saddle 330 holders simultaneously, with fixed printed circuit board 5.Three fastening assemblies 8, as screw (only indicating one among the figure) be respectively the pilot hole 511 corresponding snap closes by printed circuit board (PCB) 5 in the screw 312 of pedestal 3 and printed circuit board (PCB) 5 is immobilizated in pedestal 3.Be appreciated that ground, this fastening assembly 8 also can be one-body molded with pedestal 3, and join with pilot hole 511 cards of printed circuit board (PCB) 5, and when this fastening assembly 8 and pedestal 3 when having the made of thermal conductive resin, this fastening assembly 8 can realize that pedestal 3 contacts so that dispel the heat with multiple spot between the printed circuit board (PCB) 5.When assembling whole housing, the lug 212 of lower house 2 snaps on the ladder platform 320 of pedestal 3, the elastic collet 13 of upper shell 1 joins hangnail 131 and rectangular aperture 211 cards by the slit 213 of lower house 2 simultaneously, thereby upper and lower casing 1,2 is combined, circuit board 5, screening cover 9, socket 4 and pedestal 3 are packaged in wherein.This light transmitting-receiving module can prevent signal cross-talk, and method is simple.
Claims (10)
1. a SFP light is received and dispatched module, be used for the convert light electric signal, comprise: a light emitting devices, one optical pickup apparatus, one printed circuit board (PCB) and housing, this light emitting devices can be light signal with electrical signal conversion and be emitted to the module outside, this optical pickup apparatus can receive the light signal of module outside and be converted to electric signal, radiating circuit and receiving circuit are set on this printed circuit board (PCB), this radiating circuit is to electrically connect with this light emitting devices, this receiving circuit is to electrically connect with this optical pickup apparatus, this housing is packaged in printed circuit board (PCB) wherein, it is characterized in that: this SFP light transmitting-receiving module also comprises at least one screening cover, this screening cover is to be installed on this printed circuit board (PCB), and hides this receiving circuit.
2. SFP light transmitting-receiving module as claimed in claim 1 is characterized in that this printed circuit board (PCB) also comprises at least one grounding circuit.
3. SFP light transmitting-receiving module as claimed in claim 2 is characterized in that this screening cover comprises that at least one pin and grounding circuit electrically connect.
4. SFP light transmitting-receiving module as claimed in claim 1 is characterized in that this housing comprises a pedestal.
5. SFP light transmitting-receiving module as claimed in claim 1 is characterized in that this screening cover is directly to be soldered on the printed circuit board (PCB).
6. SFP light transmitting-receiving module as claimed in claim 1 is characterized in that this screening cover is to see through conducting foam to install.
7. SFP light transmitting-receiving module as claimed in claim 1 is characterized in that this screening cover is an one-body molded metal shell, and it also has at least one louvre.
8. SFP light transmitting-receiving module as claimed in claim 4 is characterized in that this housing comprises at least one fastening assembly fixed printed circuit board on pedestal, and this fastening assembly is by the made with thermal conductive resin.
9. SFP light transmitting-receiving module as claimed in claim 1, it is characterized in that this housing comprises one first housing and one second housing, first housing is roughly a covering plate structure, a plurality of elastic collets are extended in its both sides, on this second housing a plurality of slits are set, the corresponding elastic collet of this slit buckle and combining with first housing.
10. SFP light transmitting-receiving module as claimed in claim 9, the elastic collet centre that it is characterized in that this first housing further is provided with opening towards being provided with a hangnail on this second housing, can be clasped with the hangnail of this elastic collet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01265469 CN2552022Y (en) | 2001-11-03 | 2001-11-03 | Small plug-type light emitting/receiving module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01265469 CN2552022Y (en) | 2001-11-03 | 2001-11-03 | Small plug-type light emitting/receiving module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2552022Y true CN2552022Y (en) | 2003-05-21 |
Family
ID=33672358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01265469 Expired - Lifetime CN2552022Y (en) | 2001-11-03 | 2001-11-03 | Small plug-type light emitting/receiving module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2552022Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100437185C (en) * | 2004-09-02 | 2008-11-26 | 日本电气株式会社 | Photoelectric composite module |
| CN101535860B (en) * | 2006-09-28 | 2011-12-28 | 菲尼萨公司 | Insertable emi shield clip for use in optical transceiver modules |
| CN102914835A (en) * | 2012-11-20 | 2013-02-06 | 索尔思光电（成都）有限公司 | SFP (Small Form-Factor Pluggable) optical module |
| CN103064158A (en) * | 2013-01-18 | 2013-04-24 | 无锡市吉义润商贸有限公司 | Miniature light transmitting-receiving integrated modular structure capable of hot plug |
| CN107526137A (en) * | 2016-06-21 | 2017-12-29 | 住友电工光电子器件创新株式会社 | Optical transceiver |
| CN111381330A (en) * | 2020-04-27 | 2020-07-07 | 东南大学 | Optical module packaging structure applying improved cut-off waveguide heat dissipation hole array |
| US11641247B2 (en) | 2003-06-10 | 2023-05-02 | Alexander Soto | System and method for performing high-speed communications over fiber optical networks |
| JP7466386B2 (en) | 2020-06-12 | 2024-04-12 | 株式会社デンソー | Optical transmission module and electronic control device |
-
2001
- 2001-11-03 CN CN 01265469 patent/CN2552022Y/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11641247B2 (en) | 2003-06-10 | 2023-05-02 | Alexander Soto | System and method for performing high-speed communications over fiber optical networks |
| CN100437185C (en) * | 2004-09-02 | 2008-11-26 | 日本电气株式会社 | Photoelectric composite module |
| CN101535860B (en) * | 2006-09-28 | 2011-12-28 | 菲尼萨公司 | Insertable emi shield clip for use in optical transceiver modules |
| CN102914835A (en) * | 2012-11-20 | 2013-02-06 | 索尔思光电（成都）有限公司 | SFP (Small Form-Factor Pluggable) optical module |
| CN102914835B (en) * | 2012-11-20 | 2014-12-10 | 索尔思光电（成都）有限公司 | SFP (Small Form-Factor Pluggable) optical module |
| CN103064158A (en) * | 2013-01-18 | 2013-04-24 | 无锡市吉义润商贸有限公司 | Miniature light transmitting-receiving integrated modular structure capable of hot plug |
| CN107526137A (en) * | 2016-06-21 | 2017-12-29 | 住友电工光电子器件创新株式会社 | Optical transceiver |
| CN107526137B (en) * | 2016-06-21 | 2021-03-26 | 住友电工光电子器件创新株式会社 | Optical transceiver |
| CN111381330A (en) * | 2020-04-27 | 2020-07-07 | 东南大学 | Optical module packaging structure applying improved cut-off waveguide heat dissipation hole array |
| JP7466386B2 (en) | 2020-06-12 | 2024-04-12 | 株式会社デンソー | Optical transmission module and electronic control device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20111103 Granted publication date: 20030521 |