CN216285842U - Optical module - Google Patents

Abstract

The application discloses optical module includes: the upper shell and the lower shell are covered to form a wrapping cavity, the middle of the lower shell is provided with a barrier, one side of the barrier is provided with a circuit board, and the other side of the barrier is provided with an external optical fiber. The optical transceiver is arranged on the circuit board, and one end of the optical transceiver is provided with an optical fiber array. The barrier is provided with a yielding hole, and an opening of the yielding hole faces the upper shell; one end of the optical fiber array penetrates through the abdicating hole to be connected with the external optical fiber, so that optical signal transmission is realized. A filling part is arranged between the upper part of the barrier and the upper shell, the filling part can deform under stress, the upper shell is tightly connected with the lower shell, and a relatively closed inner cavity is formed on one side of the optical module, so that the electromagnetic shielding effect of the optical module is improved. The barrier and the filling component physically separate a packaging cavity formed by the upper shell and the lower shell into two parts, so that the sealing performance in the optical port direction is improved and the electromagnetic shielding effect of the optical port of the optical module is improved under the condition that the transmission of optical signals is not influenced.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

EMI (Electromagnetic Interference) is an Interference phenomenon generated after Electromagnetic waves and electronic components act, and the emitted Electromagnetic waves can affect the normal operation of other systems or other self-systems in the system.

When the system works, the interference of external electromagnetic waves is not expected, the electromagnetic waves radiated by the system are not expected to interfere other equipment, and radiation damage is caused to human bodies. This requires that the system produces as little electromagnetic radiation as possible.

With the development of informatization, the optical module packages are smaller and smaller, the requirement on the working frequency is higher and higher, the requirement on the number of optical modules which work on one system at the same time is higher and higher, and the electromagnetic radiation generated by the superposition of the whole system is increased. Therefore, the EMI radiation of the optical module itself must be as small as possible, so that the EMI performance of the whole system is within the protocol requirement range, and external interference or interference of the system itself to the outside is avoided.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to improve anti-electromagnetic interference capability of the optical module.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes: an upper housing;

the lower shell comprises a bottom plate, a first lower side plate and a second lower side plate, wherein the first lower side plate and the second lower side plate are arranged on two sides of the bottom plate;

the upper shell and the lower shell are covered to form a wrapping cavity;

the circuit board is arranged in the wrapping cavity;

the optical transceiver is arranged on the circuit board, and one end of the optical transceiver is provided with an optical fiber array;

the middle part of the lower shell is provided with a barrier; the barrier protrudes out of the bottom plate, one end of the barrier is connected with the first lower side plate, and the other end of the barrier is connected with the second lower side plate;

the middle part of the barrier is provided with a yielding hole, and the opening of the yielding hole faces the upper shell; one end of the optical fiber array penetrates through the abdicating hole and is connected with an external optical fiber.

Compared with the prior art, the beneficial effect of this application:

the application provides an optical module, including: the upper shell and the lower shell are covered to form a wrapping cavity, the middle of the lower shell is provided with a barrier, one side of the barrier is provided with a circuit board, and the other side of the barrier is provided with an external optical fiber. The optical transceiver is arranged on the circuit board, and one end of the optical transceiver is provided with an optical fiber array. The middle part of the barrier is provided with a yielding hole, and the opening of the yielding hole faces the upper shell; one end of the optical fiber array penetrates through the abdicating hole to be connected with the external optical fiber, so that optical signal transmission is realized. A filling part is arranged between the upper part of the barrier and the upper shell, the filling part can deform under stress, the upper shell is tightly connected with the lower shell, and a relatively closed inner cavity is formed on one side of the optical module, so that the electromagnetic shielding effect of the optical module is improved. The barrier and the filling component physically separate a packaging cavity formed by the upper shell and the lower shell into two parts, the sealing performance in the optical port direction is improved under the condition that the transmission of optical signals is not influenced, and the circuit board is arranged on one side close to the electric port, so that the electromagnetic shielding effect of the optical port of the optical module is improved.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a diagram of an optical communication system connection according to some embodiments;

figure 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a patterning of a light module provided according to some embodiments;

FIG. 4 is an exploded block diagram of a light module according to some embodiments;

fig. 5 is a schematic cross-sectional view of an optical module according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a lower housing according to an embodiment of the present disclosure;

FIG. 7 is a partial schematic view of a lower housing structure provided in accordance with an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of an upper housing according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of an upper housing and a filling member according to an embodiment of the present disclosure;

fig. 10 is a schematic structural view of a lower housing and a conductive connecting portion according to an embodiment of the present disclosure;

fig. 11 is an exploded view of a lower housing and a conductive connection portion according to an embodiment of the present disclosure.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so that the transmission of the information is completed. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a diagram of optical communication system connections according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structure diagram of an optical network terminal according to some embodiments, and fig. 2 only shows the structure of the optical module 200 of the optical network terminal 100 in order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a diagram of an optical module provided according to some embodiments, and fig. 4 is an exploded structural view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver 400;

the shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two openings 204 and 205; the outer contour of the housing generally appears square.

In some embodiments, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two openings 204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (left end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (right end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 300 and the optical transceiver can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when the devices such as the circuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located on an outer wall of a housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking member 203 is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit member that mates with a cage of an upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as MCU, laser driver chip, amplitude limiting amplifier chip, clock data recovery CDR, power management chip, and data processing chip DSP).

The circuit board 300 connects the above devices in the optical module 200 together according to circuit design through circuit routing to implement functions of power supply, electrical signal transmission, grounding, and the like.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the hard circuit board can also be inserted into an electric connector in the cage of the upper computer, and in some embodiments disclosed in the application, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

Flexible circuit boards are also used in some optical modules; the flexible circuit board is generally used in combination with the rigid circuit board, and for example, the rigid circuit board may be connected to the optical transceiver device to supplement the rigid circuit board.

The optical transceiver comprises an optical transmitter subassembly and an optical receiver subassembly.

In the embodiment of the present application, the optical transceiver is connected to the outside through the optical fiber array 500, so as to realize transmission of optical signals.

Fig. 5 is a schematic cross-sectional view of an optical module according to an embodiment of the present application, and as shown in fig. 5, in order to improve an anti-electromagnetic interference capability of the optical module, the present application provides an optical module, including: the barrier 2024 is disposed inside the lower housing 202 and between the circuit board 300 and the optical port 204. The grid 2024 is provided with a relief hole 2025 for the optical fiber array 500 to pass through. The filling component 206 is arranged between the upper part of the barrier 2024 and the upper shell, the filling component 206 can deform under stress, so that the upper shell and the lower shell 202 are tightly connected, the cavity is separated into two parts, and various electric devices are arranged on one side close to the electric port, so that the electromagnetic shielding effect of the optical module is improved. The middle part of the barrier 2024 is provided with a relief hole 2025, and the opening of the relief hole 2025 faces the upper casing 201. The circuit board 300 is provided with an optical transceiver, one end of the optical transceiver is provided with an optical fiber array 500, and the other end of the optical fiber array 500 passes through the abdicating hole 2025 to be connected with the optical fiber connector 600, so that the connection with an external optical fiber is realized. The upper shell is provided with a first shielding baffle 2014 which is positioned in the middle of the upper shell and matched with the barrier 2024.

The application provides an optical module including: the upper shell and the lower shell are covered to form a wrapping cavity, the middle of the lower shell is provided with a barrier, one side of the barrier is provided with a circuit board, and the other side of the barrier is provided with an external optical fiber. A filling component 206 is arranged between the upper part of the barrier 2024 and the upper shell, and the filling component 206 can deform under stress, so that the upper shell and the lower shell 202 are tightly connected to form a relatively closed inner cavity, and the electromagnetic shielding effect of the optical module is improved.

Fig. 6 is a schematic structural diagram of a lower housing according to an embodiment of the present application. Fig. 7 is a partial schematic view of a lower housing structure according to an embodiment of the present disclosure. As shown in fig. 6, in particular, in the embodiment of the present application, the lower housing 202 includes: a bottom plate 2021, and a first lower side plate 2022 and a second lower side plate 2023 vertically disposed at two sides of the bottom plate 2021. The barrier 2024 is located between the first lower side plate 2022 and the second lower side plate 2023, and the barrier 2024 is located in the middle of the lower case 202. The circuit board 300 is located on one side of the circuit board 300 of the grid 2024 close to the electric port, and the other side is used for installing an unlocking component and an optical fiber connector.

Further, the grills 2024 may be disposed perpendicular to the first lower side plate 2022, or may not be perpendicular to each other. The grid 2024 and the first lower side plate 2022 may be connected by conductive paste, welded, or integrally formed.

Further, the grills 2024 may be disposed perpendicular to the second lower side plate 2023, or may not be perpendicular to each other. The barrier 2024 and the second lower side plate 2023 may be connected by conductive paste, by soldering, or by integral molding.

To further improve the sealing performance of the optical module, the barrier 2024 and the lower housing 202 are integrally formed. In the present embodiment, the material of the barrier 2024 and the upper and lower cases 202 includes, but is not limited to, tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial, Cold rolled carbon Steel), copper, and the like.

The shape of the relief hole 2025 may be various, such as rectangular, circular arc, trapezoid, etc., and the relief hole 2025 is used for the fiber array 500 to pass through the grid 2024, and the specific form thereof is not particularly limited. Generally, the relief hole 2025 has a rectangular structure for easy manufacturing and molding.

The opening of the avoiding hole 2025 is arranged towards the upper shell, during installation, the optical fiber array 500 is embedded into the avoiding hole from the opening of the avoiding hole, then the upper shell and the lower shell 202 are covered, the circuit board 300 is separated into two spaces in the direction of the optical port 204 through the upper shell, the lower shell 202 and the barrier 2024, the circuit board 300 is positioned on one side of the barrier 2024 close to the electrical port, and no electric device is arranged on the optical port side, so that the overall electromagnetic shielding effect of the optical module is improved.

The position of the receding hole 2025 on the grid 2024 may be specifically set according to the position of the optical fiber array 500 on the circuit board 300. For the flatness of the optical fiber array 500, the optical fiber connectors at the optical ports 204 are usually located at the middle part of the lower housing 202, so that the distance from the edge of the relief hole to the first lower side plate 2022 is similar to or the same as the distance from the edge of the relief hole 2025 to the second lower side plate 2023 at the middle part of the grid 2024.

The number of the relief holes 2025 on the barrier 2024 may be plural, or may be one, and the specific data may be set according to the number of the optical fiber arrays 500. As shown in the figure, the number of the relief holes 2025 on the barrier 2024 may be 4. In the embodiment of the present application, the grid is provided with 4 yielding holes 2025, which are a first yielding hole 20251, a second yielding hole 20252, a third yielding hole 20253 and a fourth yielding hole 20254 along the direction from the first lower side plate 2022 to the second lower side plate 2023.

Fig. 8 is a schematic structural diagram of an upper housing according to an embodiment of the present application. Fig. 9 is a schematic structural diagram of an upper housing and a filling member according to an embodiment of the present disclosure. As shown in fig. 8 and 9, in order to improve the connection tightness between the grille 2024 and the upper housing, the upper housing is provided with a first shielding baffle 2014, which is located at the middle part of the upper housing and matches the position of the grille 2024. The filling component 206 is disposed between the first shielding baffle 2014 and the barrier 2024, and the filling component 206 is deformed by a force, so that the upper housing and the lower housing 202 are tightly connected to form a relatively closed inner cavity, thereby improving an electromagnetic shielding effect of the optical module.

Specifically, the upper case 201 includes: a cover 2011, and a first upper plate 2012 and a second upper plate 2013 vertically disposed at two sides of the cover 2011. The cover 2011 is disposed on the opposite side of the bottom plate 2021, the first upper side plate 2012 is connected to the first lower side plate 2022, and the second lower side plate 2023 is connected to the second upper side plate 2013. The first shielding shutter 2014 is disposed between the first upper board 2012 and the second upper board 2013. The opening of the relief hole 2025 is disposed toward the cap 2011.

The first shielding plates 2014 may be disposed perpendicular to the first upper board 2012, or may not be perpendicular to each other. The first shielding plate 2014 and the first upper board 2012 may be connected by conductive paste or by soldering. In order to further improve the sealing performance of the optical module, the first shielding plate 2014 and the upper housing 201 are integrally formed. In the embodiment of the present application, the materials of the first shielding baffle 2014 and the upper and lower shells 201 and 202 include, but are not limited to, tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial), copper, and the like.

The first shielding baffle 2014 is provided with a mounting notch 20141 corresponding to the offset hole 2025. Specifically, the projection of the installation notch on the bottom plate 2021 covers the first yielding hole 20251, the second yielding hole 20252, the third yielding hole 20253 and the fourth yielding hole 20254.

A filling member 206 is further disposed between the upper case 201 and the lower case 202, and is inserted into the mounting gap. Specifically, the filling member 206 is a U-like structure and is disposed inside the installation gap. The filler member 206 has compressive deformation characteristics including, but not limited to, a conductive foam material.

Further, in the present embodiment, the cover 2011 of the upper housing 201 includes: the first sub-cover plate and the second sub-cover plate are connected with each other, the inner surface of the cover plate 2011 is arranged in a ladder manner, and the inner surface of the first sub-cover plate is higher than the inner surface of the second sub-cover plate. The first shielding baffle 2014 is disposed on the second sub-cover plate, and the first shielding baffle 2014 is disposed adjacent to the first sub-cover plate.

The first lower side plate 2022 and the second lower side plate 2023 are symmetrically disposed on two sides of the lower housing 202, and in order to facilitate the installation of the unlocking component, in this embodiment, a first fastening portion is disposed on an outer wall of the first lower side plate 2022 and connected to one side of the unlocking device. The first fastening portion is disposed in the middle of the first lower side plate 2022 and is recessed relative to the outer wall of the first lower side plate 2022. The inner wall of the first lower side plate 2022 is positioned and mounted on the circuit board 300, and is configured as a trapezoid structure. Specifically, the first lower side plate 2022 includes: the first sub-lower side plate 20221, the second sub-lower side plate 20222 and the third sub-lower side plate 20223 are connected in sequence, wherein inner walls of the first sub-lower side plate 20221, the second sub-lower side plate 20222 and the third sub-lower side plate 20223 are protruded to the outer side of the wrapping cavity in sequence.

The middle part of the first sub-lower side plate 20221 is connected with the barrier 2024, and the barrier 2024 is arranged perpendicular to the first sub-lower side plate 20221; the other end is connected to the first end of the second sub-lower side plate 20222. The second end of the second sub lower side plate 20222 is connected to the third sub lower side plate 20223. The inner wall of the first sub-lower side plate 20221 protrudes inward of the cavity than the inner wall of the second sub-lower side plate 20222, and the inner wall of the second sub-lower side plate 20222 protrudes inward of the cavity than the inner wall of the third sub-lower side plate 20223.

The inner wall of the second lower side plate 2023 is positioned and installed with the circuit board 300, and is configured as a trapezoid structure. Specifically, the second lower side plate 2023 includes: the fourth sub-lower side plate 20231, the fifth sub-lower side plate 20232 and the sixth sub-lower side plate 20233 are connected in sequence, wherein inner walls of the fourth sub-lower side plate 20231, the fifth sub-lower side plate 20232 and the sixth sub-lower side plate 20233 are protruded towards the outer side of the wrapping cavity in sequence. The middle part of the fourth sub-lower side plate 20231 is connected with the barrier 2024, and the barrier 2024 is arranged vertically to the fourth sub-lower side plate 20231; the other end is connected to the first end of the fifth sub-lower side plate 20232. The second end of the fifth sub lower side plate 20232 is connected to the sixth sub lower side plate 20233. The inner wall of the fourth sub-lower side plate 20231 protrudes inward of the cavity than the inner wall of the fifth sub-lower side plate 20232, and the inner wall of the fifth sub-lower side plate 20232 protrudes inward of the cavity than the inner wall of the sixth sub-lower side plate 20233.

The upper case 201 includes: a cover 2011, and a first upper plate 2012 and a second upper plate 2013 vertically disposed at two sides of the cover 2011. The cover 2011 is disposed on the opposite side of the bottom plate 2021, and the first upper plate 2012 and the second lower plate 2023 are symmetrically disposed on the two sides of the cover 2011. The first upper side plate 2012 is provided with a first sub upper side plate 20121, a second sub upper side plate 20122 and a third sub upper side plate 20123 which are connected in sequence. And the outer walls of the first sub-lower side plate 20221, the second sub-lower side plate 20222 and the third sub-lower side plate 20223 are sequentially protruded to the outer side of the wrapping cavity.

In the embodiment of the present application, one end of the first sub upper side plate 20121 is connected to the first shielding shutter 2014, and the other end of the first sub upper side plate 20121 is connected to one end of the second sub upper side plate 20122. The outer wall of the second sub upper side panel 20122 is convex outward of the cavity than the outer wall of the first sub upper side panel 20121. The other end of the second sub upper side panel 20122 is connected to one end of the third sub upper side panel 20123. The outer wall of the third sub upper side panel 20123 is convex outward of the cavity than the outer wall of the second sub upper side panel 20122.

The cover plate 2011 is provided with a first upper side plate connecting portion 2015, located outside the first upper side plate 2012 and connected to the upper surface of the first lower side plate. The outer wall of the first sub upper panel 20121 is connected to the inner wall of the first sub lower panel 20221, and the upper surface of the first upper panel 20121 is connected to a first upper panel connection portion 2015.

The cover plate 2011 is provided with a second upper side plate connecting portion 2016 located outside the second upper side plate 2013 and connected to the upper surface of the second lower side plate. The outer wall of the first sub upper side plate 20121 is connected to the inner wall of the first sub lower side plate 20221, and the upper surfaces of the fourth sub lower side plate, the fifth sub lower side plate, and the sixth sub lower side plate are connected to the second upper side plate connection 2016.

In order to further improve the sealing performance between the upper casing 201 and the lower casing 202, a conductive connecting portion 207 is further provided between the upper casing 201 and the lower casing 202. Fig. 10 is a schematic structural diagram of a lower housing and a conductive connection portion according to an embodiment of the present disclosure. Fig. 11 is an exploded view of a lower housing and a conductive connection portion according to an embodiment of the present disclosure. As shown in fig. 10 and 11, the conductive connection portion 207 includes: the adhesive comprises a first adhesive part, a second adhesive part, a third adhesive part and a fourth adhesive part.

The first upper board connecting portion and the upper surface of the first lower board 2022 are provided with a first bonding portion 2071, so that the first upper board connecting portion and the upper surface of the first lower board 2022 are bonded, and the sealing performance of the optical module is improved. Specifically, the first bonding part 2071 may be a conductive adhesive layer. The first adhesive part 2071 is connected to the upper surfaces of the first, second and third sub-lower panels 20221, 20222 and 20223, and has a specific shape corresponding to the upper surfaces of the first, second and third sub-lower panels 20221, 20222 and 20223.

The first bonding parts 2071 are disposed in a plurality of bends, and are used for realizing connection between the first lower side plate 2022 and the cover plate 2011 with the upper surfaces of the first lower side plate 20221, the second lower side plate 20222 and the third lower side plate 20223, so as to improve the air tightness of the optical module and improve the electromagnetic shielding effect of the entire optical module.

The cover plate 2011 is further provided with a second upper side plate connecting portion, which is located outside the second upper side plate 2013 and connected to the upper surface of the second lower side plate. The outer wall of the second upper side plate 2013 is connected to the inner wall of the second sub-lower side plate 20222, and the upper surface of the second lower side plate 2023 is connected to the second upper side plate connecting portion.

A second bonding part 2072 is provided on the upper surfaces of the second upper board connecting part and the second lower board 2023, so that the second upper board connecting part and the upper surface of the second lower board 2023 are bonded to each other, thereby improving the sealing property of the optical module. Specifically, the second bonding portion may be a conductive adhesive layer.

The second adhesive part 2072 is connected to the upper surfaces of the fourth sub lower panel 20231, the fifth sub lower panel 20232 and the sixth sub lower panel 20233, and has a specific shape corresponding to the upper surfaces of the fourth sub lower panel 20231, the fifth sub lower panel 20232 and the sixth sub lower panel 20233.

The second bonding parts 2072 are disposed in a plurality of bends, and are connected to the upper surfaces of the fourth sub-lower side plate 20231, the fifth sub-lower side plate 20232 and the sixth sub-lower side plate 20233, so as to achieve connection between the second lower side plate 2023 and the cover plate 2011, improve the air tightness of the optical module, and facilitate improvement of the electromagnetic shielding effect of the entire optical module.

Further, a third adhesive part 2073 and a fourth adhesive part 2074 are provided between the barrier 2024 and the first shield plate 2014, and a filler member 206 is provided between the third adhesive part 2073 and the fourth adhesive part 2074. One end of the third adhesive part 2073 is connected to the first adhesive part 2071, and the other end is connected to the filling member 206. One end of the fourth adhesive part 2074 is connected to the second adhesive part 2072, and the other end is connected to the filling member 206.

In the embodiment provided in the present application, the first bonding part 2071, the second bonding part 2072, the third bonding part 2073 and the fourth bonding part 2074 may be conductive adhesive layers of the same material or conductive adhesive layers of different materials.

The application provides an optical module includes: the upper shell and the lower shell are covered to form a wrapping cavity, the middle of the lower shell is provided with a barrier, one side of the barrier is provided with a circuit board, and the other side of the barrier is provided with an external optical fiber. A filling component 206 is arranged between the upper part of the barrier 2024 and the upper shell, and the filling component 206 can deform under stress, so that the upper shell and the lower shell 202 are tightly connected to form a relatively closed inner cavity, and the electromagnetic shielding effect of the optical module is improved. The barrier and the filling component physically separate a packaging cavity formed by the upper shell and the lower shell into two parts, the sealing performance in the optical port direction is improved, and the circuit board is arranged on one side close to the electric port, so that the electromagnetic shielding effect of the optical port of the optical module is improved.

Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.

It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims (9)

1. A light module, comprising:

an upper housing;

the lower shell comprises a bottom plate, a first lower side plate and a second lower side plate, wherein the first lower side plate and the second lower side plate are arranged on two sides of the bottom plate;

the upper shell and the lower shell are covered to form a wrapping cavity;

the middle part of the lower shell is provided with a barrier; the barrier protrudes out of the bottom plate, one end of the barrier is connected with the first lower side plate, and the other end of the barrier is connected with the second lower side plate;

the circuit board is arranged in the packaging cavity and is positioned on one side of the barrier;

the optical transceiver is arranged on the circuit board, and one end of the optical transceiver is provided with an optical fiber array;

the optical fiber connector is arranged in the wrapping cavity and is positioned on the other side of the barrier; the middle part of the barrier is provided with a yielding hole, and the opening of the yielding hole faces the upper shell; and the other end of the optical fiber array penetrates through the abdicating hole and is connected with the optical fiber connector.

2. The optical module of claim 1, further comprising: and the filling component is arranged between the upper shell and the barrier and can deform under stress.

3. The optical module of claim 2, wherein the projection of the filling member on the bottom plate covers the relief hole.

4. The light module of claim 2, wherein the upper housing comprises: the cover plate is arranged on the opposite side of the bottom plate;

the first upper side plate is arranged on one side of the cover plate and is connected with the first lower side plate;

the second upper side plate is arranged on the opposite side of the first upper side plate and is connected with the second lower side plate;

the first shielding baffle protrudes out of the lower surface of the cover plate, one end of the first shielding baffle is connected with the first upper side plate, and the other end of the first shielding baffle is connected with the second upper side plate; the optical fiber connector is positioned on one side of the first shielding baffle, and the circuit board is arranged on the other side of the first shielding baffle;

the mounting notch is arranged in the middle of the first shielding baffle;

the filling component is arranged between the installation gap and the barrier.

5. The light module of claim 4, wherein the cover plate comprises: the first upper side plate connecting part is arranged on one side of the first upper side plate and is connected with the upper surface of the first lower side plate; the inner wall of the first lower side plate is connected with the outer wall of the first upper side plate;

the second upper side plate connecting part is arranged on one side of the second upper side plate and is connected with the upper surface of the second lower side plate;

the inner wall of the second lower side plate is connected with the outer wall of the second upper side plate.

6. The light module of claim 5, wherein the first lower side plate comprises: the first sub lower side plate, the second sub lower side plate and the third sub lower side plate are sequentially connected;

the inner walls of the first sub lower side plate, the second sub lower side plate and the third sub lower side plate are raised towards the wrapping cavity in sequence.

7. The optical module of claim 2, wherein the filler member has a U-shaped configuration.

8. The optical module of claim 2, wherein a conductive connection is provided between the upper housing and the lower housing.

9. The optical module of claim 8, wherein the conductive connection sites are a layer of conductive glue.

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