CN213302583U

CN213302583U - Optical transceiver module and optical network unit

Info

Publication number: CN213302583U
Application number: CN202021743940.7U
Authority: CN
Inventors: 朱岩涛; 陈金磊; 姬景奇; 司宝峰
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-08-20
Filing date: 2020-08-20
Publication date: 2021-05-28
Anticipated expiration: 2030-08-20

Abstract

The application discloses an optical transceiver module and an optical network unit, wherein the optical transceiver module comprises a circuit board, an optical transceiver and a metal shield, and an assembly groove is arranged on a tube body of the optical transceiver; the metal shielding cover comprises an upper cover body and a lower cover body, and the upper cover body and the lower cover body are respectively positioned on different sides of the circuit board; one side surfaces of the upper cover body and the lower cover body are provided with openings which are clamped with the assembling grooves; the upper cover body is clamped with the circuit board, and the bottom surface of the upper cover body is abutted with the upper side surface of the circuit board; the lower cover body is clamped with the circuit board, and the top surface of the lower cover body is abutted with the lower side surface of the circuit board. The metal shielding case is added to the application, the optical transceiver and part of the circuit board cover are arranged in the metal shielding case, the electromagnetic shielding of the optical transceiver component is realized by the aid of the matching mode that the optical transceiver component body structure and the metal shielding case are nested, the use of relevant auxiliary materials such as electromagnetic waves absorbed inside the optical transceiver component is reduced, and the optical transceiver component is simple in operation and convenient to assemble.

Description

Optical transceiver module and optical network unit

Technical Field

The present application relates to the field of optical communications technologies, and in particular, to an optical transceiver module and an optical network unit.

Background

In the novel business and application modes of cloud computing, mobile internet, video and the like, an optical communication technology is used, and in optical communication, an optical module is a tool for realizing the interconversion of photoelectric signals and is one of key devices in optical communication equipment. The optical module is mainly used for photoelectric and electro-optical conversion, an electric signal is converted into an optical signal by a transmitting end of the optical module and is transmitted out through an optical fiber, and a received optical signal is converted into an electric signal by a receiving end of the optical module.

The existing optical module can be an optical transceiver module, the optical transceiver module does not comprise a shell and only comprises a circuit board and an optical transceiver, the optical transceiver is electrically connected with the circuit board, and an electronic element and a chip are arranged on the circuit board so as to realize functions of power supply, electric signal transmission and the like. However, the electronic component and the chip emit high-intensity electromagnetic radiation during operation, and are also susceptible to external electromagnetic crosstalk, which affects normal operation of the electronic component and the chip on the circuit board, and further affects photoelectric conversion of the optical transceiver module.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

in a first aspect, an embodiment of the present application discloses an optical transceiver module, including:

a circuit board;

the optical transceiver is electrically connected with the circuit board, and a tube body of the optical transceiver is provided with an assembling groove; for transmitting and receiving optical signals;

the metal shielding cover comprises an upper cover body and a lower cover body, and the upper cover body and the lower cover body are respectively positioned on different sides of the circuit board; openings are formed in one side face of each of the upper cover body and the lower cover body, and the openings are clamped with the assembling grooves; the upper cover body is clamped with the circuit board, and the bottom surface of the upper cover body is abutted with the upper side surface of the circuit board; the lower cover body is clamped with the circuit board, and the top surface of the lower cover body is abutted to the lower side surface of the circuit board.

In a second aspect, an embodiment of the present application further discloses an optical network unit, including the optical transceiver module in the first aspect.

The application provides an optical transceiver component, which comprises a circuit board, an optical transceiver electrically connected with the circuit board and a metal shield, wherein an assembly groove is arranged on a tube body of the optical transceiver; the metal shielding cover comprises an upper cover body and a lower cover body, and the upper cover body and the lower cover body are respectively positioned on different sides of the circuit board; openings are formed in one side face of each of the upper cover body and the lower cover body and are clamped with the assembling grooves, so that the optical transceiver is covered in a cavity formed by the upper cover body, the circuit board and the lower cover body; the upper cover body is clamped with the circuit board, and the bottom surface of the upper cover body is abutted against the upper side surface of the circuit board so as to cover the upper cover body on the upper side of the circuit board, so that a sealed cavity is formed between the upper cover body and the upper side surface of the circuit board; the lower cover body is clamped with the circuit board, the top surface of the lower cover body is abutted to the lower side surface of the circuit board, the lower cover body is covered on the lower side of the circuit board, and a sealing cavity is formed between the lower cover body and the lower side surface of the circuit board. Therefore, the optical transceiver, the electronic component on the circuit board, the chip and the like are covered in the closed metal shielding cover, so that the electromagnetic wave conducted from the outside can be shielded, the electromagnetic wave generated by the electronic component, the chip and the like on the circuit board can also be shielded, and the influence of the external electromagnetic wave on the performance of the electronic component, the chip and the like on the circuit board can be avoided. This application utilizes the mutual nested cooperation mode of light transceiver component body structure and metal shielding case to realize the electromagnetic shield of light transceiver component, can reduce the use of light transceiver component inside absorption electromagnetic wave etc. relevant auxiliary material, easy operation, the assembly of being convenient for.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic assembly diagram of a circuit board, an electromagnetic shield, and an optical transceiver in an optical transceiver module according to an embodiment of the present disclosure;

fig. 3 is an exploded view of a circuit board, an electromagnetic shield, and an optical transceiver in an optical transceiver module according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of an optical transceiver device in an optical transceiver module according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an upper housing of an optical transceiver module according to an embodiment of the present disclosure;

fig. 6 is a schematic assembly diagram of a circuit board and an optical transceiver in an optical transceiver module according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram illustrating an assembly of an upper cage, a circuit board and an optical transceiver in an optical transceiver module according to an embodiment of the present disclosure;

fig. 8 is a schematic view of an alternative angle assembly of the upper cage, the circuit board and the optical transceiver in the optical transceiver module according to the present disclosure;

fig. 9 is a schematic structural diagram of a lower cover in an optical transceiver module according to an embodiment of the present disclosure;

fig. 10 is a schematic assembly diagram of a lower cover, a circuit board and an optical transceiver in an optical transceiver module according to an embodiment of the present disclosure.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the interconversion of optical signals and electric signals is realized inside the optical transceiver module, so that the information connection is established between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal is used as an upper computer of the optical transceiver module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

The optical module 200 inserted into the optical network terminal 100 may also be an optical transceiver module, which may be directly disposed in the optical network terminal 100 without a housing. The optical network terminal 100 has a circuit board therein, and the optical transceiver module is electrically connected to the circuit board of the optical network terminal 100.

Fig. 2 is an assembly schematic diagram of the circuit board 300, the optical transceiver 400 and the metal shielding case 500 in the optical transceiver module according to the embodiment of the present disclosure, and fig. 3 is an exploded schematic diagram of the circuit board 300, the optical transceiver 400 and the metal shielding case 500 in the optical transceiver module according to the embodiment of the present disclosure. As shown in fig. 2 and 3, the optical transceiver module includes a circuit board 300 and an optical transceiver 400, and the optical transceiver 400 is electrically connected to the circuit board 300 for transmitting and receiving signals. The circuit board 300 of the optical transceiver module may be electrically connected to a circuit board in the optical network terminal 100 by pins, soldering, and the like, so as to establish information connection between the optical transceiver module and the optical network terminal 100.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 is used to provide signal circuits for signal electrical connection, which can provide signals. The circuit board 300 connects the electrical devices in the optical transceiver module together according to circuit design by circuit routing to implement electrical functions such as power supply, electrical signal transmission, grounding, and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical transceiver assembly as a supplement of a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The optical transceiver 400 includes two parts, namely an optical transmitter and an optical receiver, for transmitting and receiving optical signals, respectively. The light emitting component and the light receiving component provided by the embodiment of the application are combined together to form the light receiving and transmitting integrated component.

In this example, the optical transceiver 400 is a coaxial package, and the optical transceiver 400 includes: the optical fiber connector comprises a light emitting piece, a tube body, a light receiving piece and an optical fiber adapter, wherein one end of the light emitting piece is connected with the circuit board 300, and the other end of the light emitting piece is fixed in the tube body; the optical fiber adapter is fixed at the other end of the tube body, and an optical signal sent by the light emitting piece enters an optical fiber inserting core in the optical fiber adapter through the tube body; the light receiving part is fixed at the third end of the tube body, the central axis of the light receiving part is generally vertical to the central axis of the light emitting part, and an optical signal emitted by an optical fiber inserting core in the optical fiber adapter enters the light receiving part after being reflected by an optical filter in the tube body.

The optical transceiver module provided in the embodiment of the present application further includes a metal shielding case 500, where the metal shielding case 500 includes an upper case 501 and a lower case 502, and the upper case 501 and the lower case 502 are respectively located on different sides of the circuit board 300; the upper cover 501 is clamped with the circuit board 300, and forms a sealed cavity with the upper side surface of the circuit board 300; the lower cover 502 is clamped with the circuit board 300, and forms a sealed cavity with the lower side surface of the circuit board 300, and the optical transceiver 400 and part of the circuit board are located in the sealed cavity formed by the upper cover 501, the circuit board 300 and the lower cover 502. That is, the metal shielding case 500 is used to cover the optical transceiver device 400 and some electronic components and chips on the circuit board 300 in the case body, so as to shield the external electromagnetic waves, thereby avoiding the electromagnetic interference of the external electromagnetic waves to the optical transceiver device 400 and some electronic components and chips on the circuit board 300, and simultaneously avoiding the electromagnetic waves generated by the electronic components and chips on the circuit board 300 from radiating to the outside.

In this example, only the receiving end of the optical transceiver 400 may be disposed in the metal shield 500, only the transmitting end of the optical transceiver 400 may be disposed in the metal shield 500, or the entire optical transceiver 400 may be disposed in the metal shield 500.

The present application will be described by taking an example in which the receiving end of the optical transceiver device 400 is disposed in the metal shield 500. The pin of the receiving end of the optical transceiver 400 is connected to the circuit board 300, and is used for transmitting the optical signal transmitted by the optical fiber adapter to the optical receiving chip on the circuit board 300, and the receiving end of the optical transceiver 400 is placed in the cover body of the metal shielding cover 500, so that electromagnetic interference of external electromagnetic waves to the optical receiving chip can be avoided.

Fig. 4 is a schematic structural diagram of an optical transceiver 400 according to an embodiment of the present disclosure. As shown in fig. 4, in order to cover the receiving end 402 of the optical transceiver 400 in the metal shielding case 500, an assembly groove 401 is formed on one side of the receiving end 402 of the tube body of the optical transceiver 400, the assembly groove 401 is an annular groove, that is, rectangular grooves with a certain width are formed on four sides of the tube body, and 4 rectangular grooves form a continuous annular groove, so that the metal shielding case 500 can be conveniently inserted into the annular groove, and the receiving end 402 can be covered in the shielding case.

Fig. 5 is a schematic structural diagram of an upper cover 501 of an optical transceiver module according to an embodiment of the present disclosure. As shown in fig. 5, the upper cover 501 is a housing with an opening on one side, the upper cover 501 is placed above the circuit board 300, one side of the upper cover 501 is inserted into the assembly slot 401 of the receiving end 402, the receiving end 402 of the optical transceiver 400 is covered in the upper cover 501, the upper cover 501 is clamped with the circuit board 300, the bottom surface of the upper cover 501 abuts against the upper side surface of the circuit board 300, so that the electronic components, chips, and the like on the circuit board 300 are also covered in the upper cover 501, and electromagnetic interference caused by external electromagnetic waves to the single component, chip, and the like on the upper side surface of the circuit board 300 is avoided.

In this example, the upper housing 501 includes a first top plate 5010 and a first side plate 5011, a second side plate 5012, a third side plate 5013, and a fourth side plate 5014 respectively connected to the sides of the first top plate 5010, the first top plate 5010 may be parallel to the circuit board 300, and the first side plate 5011, the second side plate 5012, the third side plate 5013, and the fourth side plate 5014 may be perpendicular to the circuit board 300. The first side plate 5011 is provided with a first opening 5015 with an open lower end, the first opening 5015 is nested outside the assembling groove 401, and a side edge of the first opening 5015 can abut against the assembling groove 401 to embed the receiving end 402 in the first opening 5015. That is, the first opening 5015 of the first side plate 5011 is inserted into the mounting groove 401 of the receiving end 402, the upper sidewall of the first opening 5015 abuts against the upper groove surface of the mounting groove 401, and the left and right sidewalls of the first opening 5015 abut against the left and right groove surfaces of the mounting groove 401, so that the upper cover 501 is inserted into the body of the optical transceiver 400.

Fig. 6 is a schematic structural diagram of a circuit board 300 in an optical transceiver module according to an embodiment of the present disclosure, fig. 7 is a schematic assembly diagram of an upper cover 501, an optical transceiver device 400, and the circuit board 300 in the optical transceiver module according to the embodiment of the present disclosure, and fig. 8 is a schematic assembly diagram of the upper cover 501, the optical transceiver device 400, and the circuit board 300 in the optical transceiver module according to the embodiment of the present disclosure at another angle. As shown in fig. 6, 7 and 8, the first resilient clip 5016 is disposed on the bottom edges of the first side plate 5011, the second side plate 5012, the third side plate 5013 and the fourth side plate 5014, the circuit board 300 is provided with a first insertion hole 301 matched with the first resilient clip 5016, and the first resilient clip 5016 can be inserted into the first insertion hole 301. When the upper cover body 501 is installed, firstly, the upper cover body 501 is placed above the circuit board 300, so that the first open hole 5015 on the first side plate 5011 is opposite to and correspondingly placed with the assembling groove 401 on the receiving end 402, and the first elastic buckle 5016 on the first side plate 5011, the second side plate 5012, the third side plate 5013 and the fourth side plate 5014 is opposite to and correspondingly placed with the first jack 301 on the circuit board 300; then, the upper cover 501 is moved downward, so that the first opening 5015 is inserted into the mounting groove 401, the first elastic clip 5016 is inserted into the first insertion hole 301, and the bottom surfaces of the first side plate 5011, the second side plate 5012, the third side plate 5013 and the fourth side plate 5014 are all abutted against the upper side surface of the circuit board 300, thereby realizing the fixed connection of the upper cover 501 and the circuit board 300.

In this example, the first elastic clip 5016 is a U-shaped clip, when the first elastic clip 5016 is inserted into the first insertion hole 301, the elastic piece of the first elastic clip 5016 is forced to contract inward to facilitate the insertion of the first elastic clip 5016, and meanwhile, the elastic piece generates a reaction force on the inner wall of the first insertion hole 301, and the first elastic clip 5016 interacts with the first insertion hole 301 to fix the upper cover 501. When the upper cover 501 is detached, a force is applied to the elastic piece of the first elastic buckle 5016, so that the upper cover 501 can be easily separated from the circuit board 300.

In order to further fix the upper cover 501, a first elastic sheet 5017 can be respectively arranged on the bottom edges of the second side plate 5012 and the fourth side plate 5014, and a first installation groove 5018 is arranged in the first elastic sheet 5017; the circuit board 300 is provided with a first slot 302 matched with the first elastic piece 5017, and a first boss 303 is arranged in the first slot 302. When the upper cover body 501 is installed, the first elastic piece 5017 is inserted into the first clamping groove 302, and the first boss 303 is inserted into the first mounting groove 5018.

When the upper cover 501 is detached, a force is applied to the first resilient piece 5017 in a leftward or rightward direction, i.e., the first resilient piece 5017 is snapped to separate the first boss 303 from the first mounting groove 5018, so that the upper cover 501 can be separated from the circuit board 300.

The upper cover body 501 is inserted into the assembly groove 401 of the receiving end 402 of the optical transceiver 400 through the first opening 5015, the first elastic buckle 5016 is inserted into the first jack 301 and the first clamping groove 302 on the circuit board 300 through the first elastic sheet 5017, so that the upper side of the upper cover body 501 and the upper side of the circuit board 300 are fixed, a sealed cavity is formed between the upper cover body 501 and the upper side of the circuit board 300, electronic elements and chips on the upper side of the circuit board 300 are all covered in the upper cover body 501, electromagnetic interference of external electromagnetic waves on the electronic elements and chips on the upper side of the circuit board 300 is avoided, and electromagnetic waves generated by the electronic elements and chips on the upper side of the circuit board 300 are also prevented from being radiated.

Fig. 9 is a schematic structural diagram of a lower cage 502 in the optical transceiver module according to the embodiment of the present application, and fig. 10 is an assembly diagram of the lower cage 502, the optical transceiver device 400, and the circuit board 300 in the optical transceiver module according to the embodiment of the present application. As shown in fig. 9 and 10, similarly, the lower housing 502 includes a second top plate 5020, and a fifth side plate 5021, a sixth side plate 5022, a seventh side plate 5023 and an eighth side plate 5024 respectively connected to the sides of the second top plate 5020, the second top plate 5020 may be parallel to the circuit board 300, and the fifth side plate 5021, the sixth side plate 5022, the seventh side plate 5023 and the eighth side plate 5024 may be perpendicular to the circuit board 300. A second opening 5025 with an open upper end is formed in the fifth side plate 5021, the second opening 5025 is nested outside the assembling groove 401, and a side edge of the second opening 5025 can abut against the assembling groove 401, so that the receiving end 402 is nested in the second opening 5025. That is, the second opening 5025 of the fifth side plate 5021 is inserted into the mounting groove 401 of the receiving end 402, the lower sidewall of the second opening 5025 abuts against the lower groove surface of the mounting groove 401, and the left and right sidewalls of the second opening 5025 abut against the left and right groove surfaces of the mounting groove 401, so that the lower housing 502 is inserted into the optical transceiver 400.

When the second opening 5025 of the lower housing 502 is inserted into the mounting slot 401 of the receiving end 402, the outer side of the fifth side plate 5021 of the lower housing 502 is abutted against the inner side of the first side plate 5011 of the upper housing 501, so that the first opening 5015 and the second opening 5025 are inserted into the mounting slot 401. As such, the sum of the thickness of the first side plate 5011 and the thickness of the fifth side plate 5021 may be less than or equal to the thickness of the mounting slot 401.

A second elastic buckle 5026 is arranged on the edges of the top surfaces of the fifth side plate 5021, the sixth side plate 5022, the seventh side plate 5023 and the eighth side plate 5024, a second jack 304 matched with the second elastic buckle 5026 is arranged on the circuit board 300, and the second elastic buckle 5026 is inserted into the second jack 304. When the lower cover 502 is installed, the lower cover 502 is firstly placed below the circuit board 300, so that the second opening 5025 on the fifth side plate 5021 is opposite to and correspondingly placed with the assembling groove 401 on the receiving end 402, and the second elastic buckle 5026 on the fifth side plate 5021, the sixth side plate 5022, the seventh side plate 5023 and the eighth side plate 5024 is opposite to and correspondingly placed with the second jack 304 on the circuit board 300; then, the lower cover 502 is moved upward, so that the second opening 5025 is inserted into the assembly groove 401, the second elastic buckle 5026 is inserted into the second insertion hole 304, and the top surfaces of the fifth side plate 5021, the sixth side plate 5022, the seventh side plate 5023 and the eighth side plate 5024 are all abutted against the lower side surface of the circuit board 300, thereby realizing the fixed connection between the lower cover 502 and the circuit board 300.

In this example, the second resilient latch 5026 is also a U-shaped latch, and when the second resilient latch 5026 is inserted into the second receptacle 304, the resilient tab of the second resilient latch 5026 is forced to contract inward to facilitate the insertion of the second resilient latch 5026, and meanwhile, the resilient tab generates a reaction force against the inner wall of the second receptacle 304, so that the second resilient latch 5026 interacts with the second receptacle 304 to fix the bottom housing 502. When the cover body 502 is detached, a force is applied to the elastic piece of the second elastic buckle 5026, so that the lower cover body 502 can be easily separated from the circuit board 300.

In order to further fix the lower cover 502, second elastic pieces 5027 may be respectively disposed on the bottom edges of the sixth side plate 5022 and the eighth side plate 5024, and a second mounting groove 5028 is disposed on the second elastic pieces 5027; the circuit board 300 is provided with a second slot 305 matching with the second spring piece 5027, and a second boss 306 is disposed in the second slot 305. When the lower housing 502 is installed, the second resilient piece 5027 is inserted into the second slot 305, and the second boss 306 is inserted into the second mounting groove 5028.

When the lower housing 502 is detached, a force is applied to the second resilient tab 5027 leftwards or rightwards, that is, the second resilient tab 5027 is snapped, the second boss 306 is separated from the second mounting groove 5028, and the lower housing 502 can be separated from the circuit board 300.

The lower cover body 502 is inserted into the assembly groove 401 of the receiving end 402 of the optical transceiver 400 through the second opening 5025, and is inserted into the second jack 304 and the second clamping groove 305 on the circuit board 300 through the second elastic buckle 5026 and the second elastic sheet 5027, so that the lower cover body 502 is fixed with the lower side surface of the circuit board 300, the lower cover body 502 and the lower side surface of the circuit board 300 form a sealed cavity, electronic elements, chips and the like on the lower side surface of the circuit board 300 are all covered in the lower cover body 502, electromagnetic interference of external electromagnetic waves on the electronic elements, chips and the like on the lower side surface of the circuit board 300 is avoided, and electromagnetic waves generated by the electronic elements, chips and the like on the upper side surface of the circuit board 300.

Because the upper cover 501 and the lower cover 502 are respectively provided with the first elastic piece 5017 and the second elastic piece 5027, in order to avoid the first elastic piece 5017 and the second elastic piece 5027, the upper cover 501 is provided with the third slot 5019 corresponding to the second elastic piece 5027, when the lower cover 502 is assembled on the circuit board 300, the second elastic piece 5027 is inserted into the second slot 305 on the circuit board 300, and the part exceeding the circuit board 300 can be inserted into the third slot 5019 on the upper cover 501.

In this example, the size of the upper housing 501 may be slightly larger than that of the lower housing 502, so that the lower housing 502 may not be provided with a slot corresponding to the first elastic piece 5017, and after the first elastic piece 5017 is inserted into the first slot 302 on the circuit board 300, a portion exceeding the circuit board 300 may be disposed outside the lower housing 502. The size of the upper cover 501 may also be the same as the size of the lower cover 502, so that the lower cover 502 may be provided with a fourth slot corresponding to the first elastic piece 5017, and after the first elastic piece 5017 is inserted into the first slot 302 on the circuit board 300, a portion of the first elastic piece 5017 that exceeds the circuit board 300 may be disposed in the fourth slot of the lower cover 502.

The upper cover body 501 and the lower cover body 502 are both stainless steel shielding covers, and the stainless steel shielding covers can reflect, absorb, counteract and the like electromagnetic waves conducted from the outside, so that the electromagnetic wave radiation is reduced. Meanwhile, electromagnetic waves generated by electronic elements, chips and the like in the stainless steel shielding case are reflected, absorbed and counteracted in the case body, so that the electromagnetic waves cannot be radiated out through the shielding case.

The size of the upper cover 501 and the lower cover 502 may be set according to the size of the area of the circuit board 300 where the electronic components, chips, etc. are located, as long as the electronic components, chips, etc. on the circuit board 300, which are susceptible to electromagnetic waves, can be covered.

According to the technical scheme, the optical transceiver module comprises a circuit board, an optical transceiver and a metal shielding case, wherein an electronic element and a chip which are easily affected by external electromagnetic waves are arranged on the circuit board, and a receiving end of the optical transceiver is connected with an optical receiving chip on the circuit board through a pin; in order to shield external electromagnetic waves, the receiving end of the optical transceiver, electronic components and chips on the circuit board and the like are all arranged in the metal shielding case and used for electromagnetic shielding. The metal shielding cover comprises an upper cover body and a lower cover body, and the upper cover body and the lower cover body are respectively positioned on different sides of the circuit board; an assembly groove is formed in a receiving end pipe body of the optical transceiver, a space is reserved for assembling an upper cover body and a lower cover body, openings are formed in one side face of the upper cover body and one side face of the lower cover body, and the openings are clamped with the assembly groove so that the receiving end of the optical transceiver is covered in the upper cover body and the lower cover body, and interference of external electromagnetic waves to the receiving end is avoided; the upper cover body is clamped with the circuit board, and the bottom surface of the upper cover body is abutted against the upper side surface of the circuit board so as to cover the upper cover body on the upper side of the circuit board, so that a sealed cavity is formed between the upper cover body and the upper side surface of the circuit board; the lower cover body is clamped with the circuit board, the top surface of the lower cover body is abutted to the lower side surface of the circuit board, the lower cover body is covered on the lower side of the circuit board, and a sealing cavity is formed between the lower cover body and the lower side surface of the circuit board. Therefore, part of the electronic elements, the chips and the like on the circuit board are covered in the closed metal shielding cover, so that the electromagnetic wave conducted from the outside can be shielded, the electromagnetic wave generated by the electronic elements, the chips and the like on the circuit board can also be shielded, and the influence of the external electromagnetic wave on the performance of the electronic elements, the chips and the like on the circuit board can be avoided. The metal shielding case is designed, an upper cover body-circuit board, a light receiving device-lower cover body nesting mode is formed after assembly, electromagnetic shielding of the light receiving and transmitting assembly is achieved by the aid of a matching mode that the light receiving and transmitting device body structure and the metal shielding case are nested mutually, use of relevant auxiliary materials such as electromagnetic waves absorbed in the light receiving and transmitting assembly is reduced, operation is simple, and assembly is facilitated.

Based on the optical transceiver module described in the foregoing embodiment, an embodiment of the present application further provides an optical network unit, where the optical network unit includes the optical transceiver module described in the foregoing embodiment. In the optical network unit, the optical transceiver component is designed with the metal shielding case, the nesting form of an upper cover body, a circuit board, an optical receiver and a lower cover body is formed after assembly, the electromagnetic shielding of the optical transceiver component is realized by the matching mode of nesting the optical transceiver component body structure and the metal shielding case, the use of relevant auxiliary materials such as electromagnetic waves absorbed in the optical transceiver component is reduced, and the electromagnetic shielding of the optical network unit is realized.

It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. An optical transceiver module, comprising:

a circuit board;

2. The optical transceiver module of claim 1, wherein the upper cover comprises a first top plate, and a first side plate, a second side plate, a third side plate and a fourth side plate respectively connected to the side edges of the first top plate, the first side plate is provided with a first opening hole with an open lower end, the first opening hole is nested outside the assembling slot, and the receiving end of the optical transceiver is covered in the upper cover;

the bottom edges of the first side plate, the second side plate, the third side plate and the fourth side plate are respectively provided with a first elastic buckle, a first jack matched with the first elastic buckle is arranged on the circuit board, and the first elastic buckle is inserted into the first jack;

the bottom surfaces of the first side plate, the second side plate, the third side plate and the fourth side plate are all abutted against the upper side surface of the circuit board.

3. The optical transceiver module of claim 2, wherein the bottom edges of the second side plate and the fourth side plate are respectively provided with a first elastic sheet, and the first elastic sheet is provided with a first mounting groove; a first clamping groove matched with the first elastic sheet is formed in the circuit board, and a first boss is arranged in the first clamping groove; the first elastic sheet is inserted into the first clamping groove, and the first boss is inserted into the first mounting groove.

4. The optical transceiver module as claimed in claim 2, wherein the lower housing includes a second top plate, and a fifth side plate, a sixth side plate, a seventh side plate and an eighth side plate respectively connected to the side edges of the second top plate, the fifth side plate has a second opening hole with an upper end opening, the second opening hole is nested outside the assembling groove, and the receiving end is housed in the lower housing;

the edges of the top surfaces of the fifth side plate, the sixth side plate, the seventh side plate and the eighth side plate are respectively provided with a second elastic buckle, a second jack matched with the second elastic buckle is arranged on the circuit board, and the second elastic buckle is inserted into the second jack;

the top surfaces of the fifth side plate, the sixth side plate, the seventh side plate and the eighth side plate are all abutted against the lower side surface of the circuit board.

5. The optical transceiver component of claim 4, wherein the top edges of the sixth side plate and the eighth side plate are respectively provided with a second elastic sheet, and the second elastic sheet is provided with a second mounting groove; a second clamping groove matched with the second elastic sheet is formed in the circuit board, and a second boss is arranged in the second clamping groove; the second elastic sheet is inserted into the second clamping groove, and the second boss is inserted into the second mounting groove.

6. The optical transceiver module of claim 5, wherein a third slot corresponding to the second resilient tab is disposed on the upper cover, and the second resilient tab is embedded in the third slot.

7. The optical transceiver component of claim 4, wherein the first and second resilient clips are U-shaped clips.

8. The optical transceiver module of claim 4, wherein a sum of a thickness of the first side plate and a thickness of the fifth side plate is less than or equal to a thickness of the mounting slot.

9. The optical transceiver module of claim 1 wherein the metal shield is a stainless steel shield.

10. An optical network unit comprising an optical transceiver module according to any one of claims 1 to 9.