CN206251486U - LED power supply and shell thereof - Google Patents
LED power supply and shell thereof Download PDFInfo
- Publication number
- CN206251486U CN206251486U CN201621276434.5U CN201621276434U CN206251486U CN 206251486 U CN206251486 U CN 206251486U CN 201621276434 U CN201621276434 U CN 201621276434U CN 206251486 U CN206251486 U CN 206251486U
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- Prior art keywords
- led power
- pcb board
- stud
- power shell
- shell
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- 239000000463 material Substances 0.000 abstract description 7
- 238000006073 displacement reaction Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 101100285000 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) his-3 gene Proteins 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a LED power and shell thereof, LED power shell includes: the bottom plate is provided with at least one stud for fixing the PCB, and the side baffle is provided with at least one boss for limiting the PCB. The LED power supply comprises an LED power supply shell and a PCB. The utility model discloses replace the fixed mode of traditional double-screw bolt and bolt with the boss, not only played certain limiting displacement to the PCB board for the PCB board can not upwarp in the use, still reduced the quantity of double-screw bolt and bolt simultaneously, improved assembly efficiency, reduced material cost and cost of labor; and at least one stud is reserved for fixing the PCB, so that the stability of fixing the PCB and the LED power supply shell is ensured.
Description
Technical field
The utility model is related to electronic applications, more particularly, to a kind of LED power and its shell.
Background technology
Printed circuit board (PCB) (Printed Circuit Board, abbreviation pcb board) is the important electronic unit of LED power, is
The supporter of electronic component, is the carrier of electronic component electrical connection.In traditional LED power, pcb board need to be solid with screw
Be scheduled on the lower casing of outer casing of power supply, it is necessary to set 4 studs in housing, and four bolts need to be equipped with and fix pcb board, stud with
Bolt quantity is more, and efficiency of assembling is low, and Material Cost and cost of labor are high.
Utility model content
Based on this, the utility model is the defect for overcoming prior art, there is provided a kind of LED power and its shell.
Its technical scheme is as follows：
A kind of LED power shell, the LED power shell includes：Base plate and the lateral side baffle being connected with bottom edge, institute
The base plate for stating LED power shell is provided with least one for fixing the stud of pcb board, the lateral side baffle of the LED power shell
It is provided with least one pair of spacing boss of pcb board.Boss is replaced the fixed form of traditional stud and bolt, not only to PCB
Plate serves certain position-limiting action so that pcb board will not be upwarped in use, while also reducing stud and bolt
Quantity, improves efficiency of assembling, reduces Material Cost and cost of labor；At least one stud is left to be fixed pcb board, it is ensured that
The stability that pcb board is fixed with LED power shell.
Wherein in one embodiment, the base plate is rectangular configuration with lateral side baffle.Usual pcb board is rectangular configuration,
Therefore using the shape design LED power shell being adapted with pcb board so that the use to space is more reasonable.
Wherein in one embodiment, the LED power shell is L-type shell or U-shaped shell.The side gear of L-type shell
Plate is arranged at base plate side, and the lateral side baffle of U-shaped shell is arranged at the relative both sides of base plate.
Wherein in one embodiment, height of the boss lower edge away from base plate, height and the thickness of pcb board with stud
Sum is adapted.So that pcb board be fixed on stud after height, be placed exactly under boss along position, make boss to pcb board
It is further spacing, prevent pcb board from upwarping.
Wherein in one embodiment, also including heat conductive pad, the heat conductive pad is on base plate.Due to being posted under pcb board
SMD components, therefore, setting heat conductive pad contributes to SMD components to radiate between pcb board and base plate, meanwhile, heat conductive pad sets
Between pcb board and base plate so that pcb board is difficult, it is ensured that the integrality and stability of pcb board.
Wherein in one embodiment, the thickness of the thickness of the heat conductive pad and the SMD components being affixed under pcb board it
With the height more than stud.SMD components, therefore heat conductive pad are posted because pcb board is fixedly connected on stud, and under pcb board
Located at SMD components lower section, when it is more than the height of stud with the thickness sum of SMD components, because heat conductive pad is soft
Property material, then cause assembling when, SMD components are pressed into heat conductive pad, are brought into close contact with heat conductive pad, preferably to transmit heat
Can, improve heat conduction efficiency.Under normal circumstances, the thickness of heat conductive pad is more than the height of stud with the thickness sum of SMD components
Difference is 1mm or so.
Wherein in one embodiment, the heat conductive pad is silica gel heat conductive pad.Silica gel heat conductive pad has good thermal conductivity
Can and it is high-grade pressure-resistant, so as to reach best heat conduction and radiating purpose.
Wherein in one embodiment, the boss is located at the side of lateral side baffle.Located at the side locations of lateral side baffle,
Certain angle of pcb board or the position at certain multiple angle are defined, because pcb board upwarps the multiple boundary member for being born in pcb board, boss sets
The medium position of lateral side baffle is located at compared to boss in the side locations of lateral side baffle, is more beneficial for preventing pcb board from upwarping.
Wherein in one embodiment, the stud for fixing pcb board is located at the corner location of base plate.Stud is located at
The corner location of base plate, that is, correspond to the position at each angle of pcb board, and stud fixes at least one jiao of pcb board, and works as spiral shell
During post only one of which, its position for being arranged on base plate is, in other the several corners in addition to the corner location below boss
A corner.Stud coordinates with boss, improves the stability that pcb board is fixed with LED power shell.
Wherein in one embodiment, the quantity of the boss is 1, and the quantity of stud is 3.Due to lateral side baffle and drain pan
All it is rectangle, then boss is located at lateral side baffle side, stud is located at its in addition to the position at the angle below boss on base plate
His 3 positions at angle.3 angle stud bolts of pcb board are fixed, and 1 angle is spacing with boss, reduces the number of stud bolt
Amount, and improve efficiency of assembling.
The technical program also includes a kind of LED power, including LED power shell and pcb board, and the LED power shell is
LED power shell any one of in above-described embodiment, the stud and boss fix the pcb board jointly.
The beneficial effects of the utility model are：
Boss is replaced the fixed form of traditional stud and bolt, certain position-limiting action is not only served to pcb board, made
Obtaining pcb board will not upwarp in use, while also reducing the quantity of stud and bolt, improve efficiency of assembling, reduce thing
Material cost and cost of labor；Leave at least one stud to be fixed pcb board, more ensure that pcb board and LED power shell
Fixed stability.
Heat conductive pad is set between pcb board and base plate contributes to SMD components to radiate, meanwhile, heat conductive pad is located at pcb board
Between base plate so that pcb board is difficult, it is ensured that the integrality and stability of pcb board.Stud coordinates with boss, improves
The stability that pcb board is fixed with LED power shell, reduces the quantity of stud bolt, and improve efficiency of assembling.
Brief description of the drawings
Fig. 1 is the utility model LED power shell mechanism schematic diagram；
Fig. 2 is the utility model LED power shell assembling schematic diagram；
Fig. 3 is that the utility model LED power shell assembles explosive view；
Description of reference numerals：
10th, base plate；11st, stud；20th, lateral side baffle；21st, boss；30th, pcb board；31st, SMD components；40th, heat conductive pad；
Specific embodiment
It is below in conjunction with accompanying drawing and specifically real to make the purpose of this utility model, technical scheme and advantage become more apparent
Mode is applied, the utility model is described in further detail.It should be appreciated that specific embodiment described herein
Only it is used to explain the utility model, does not limit protection domain of the present utility model.
As shown in figure 1, a kind of LED power shell, the LED power shell includes：Base plate 10 and it is connected with bottom edge
Lateral side baffle 20, the base plate 10 is provided with least one for fixing the stud 11 of pcb board, and the lateral side baffle 20 is provided with
The spacing boss 21 of at least one pair of pcb board.Boss 21 is replaced the fixed form of traditional stud 11 and bolt, not only to PCB
Plate serves certain position-limiting action so that pcb board will not be upwarped in use, while also reducing stud 11 and bolt
Quantity, improve efficiency of assembling, reduce Material Cost and cost of labor；At least one stud 11 is left to be fixed pcb board,
More ensure that the stability that pcb board is fixed with LED power shell.
In the present embodiment, the base plate 10 is rectangular configuration with lateral side baffle 20.Usual pcb board is rectangular configuration, therefore
LED power shell is designed using the shape being adapted with pcb board so that the use to space is more reasonable.
LED power shell described in the present embodiment be L-type shell, in other embodiments can also for U-shaped shell or other
Shell with lateral side baffle 20.The lateral side baffle 20 of L-type shell is arranged at base plate side, and the lateral side baffle 20 of U-shaped shell sets
It is placed in the relative both sides of base plate 10.
As shown in Fig. 2 height of the lower edge of the boss 21 away from base plate 10, height and the thickness of pcb board 30 with stud 11
Sum is adapted.So that pcb board 30 be fixed on stud 11 after height, be placed exactly under boss 21 along position, make boss
21 pairs of pcb boards 30 are further spacing, prevent pcb board 30 from upwarping.
As shown in Figures 2 and 3, in an embodiment, the LED power shell also includes heat conductive pad 40.The heat conductive pad 40 sets
In on base plate 10.Due to posting SMD components 31 under pcb board 30, therefore, SMD components 31 and base plate under pcb board 30
Heat conductive pad 40 is set between 10 contributes to SMD components 31 to radiate, meanwhile, heat conductive pad 40 located at pcb board 30 and base plate 10 it
Between so that pcb board 30 is difficult, it is ensured that the integrality and stability of pcb board 30.
The thickness of the heat conductive pad 40 is more than stud 11 with the thickness sum of the SMD components 31 being affixed under pcb board 30
Highly.SMD components 31 are posted because pcb board 30 is fixedly connected on stud 11, and under pcb board 30, therefore heat conductive pad 40 sets
In the lower section of SMD components 31, when it is more than the height of stud 11 with the thickness sum of SMD components 31, due to heat conductive pad
40 is flexible material, then when causing assembling, SMD components 31 are pressed into heat conductive pad 40, are brought into close contact with heat conductive pad 40, with
Preferably transferring heat energy, improves heat conduction efficiency.Under normal circumstances, the thickness of the thickness of heat conductive pad 40 and SMD components 31 it
It is 1mm or so with the difference in height more than stud 11.
In the present embodiment, the heat conductive pad 40 is silica gel heat conductive pad.Silica gel heat conductive pad has good heat conductivility and height
Grade it is pressure-resistant, so as to reach best heat conduction and radiating purpose.
The boss 21 located at the side locations of lateral side baffle 20, that is, is defined located at the side of the inner side of lateral side baffle 20
Certain angle of pcb board 30 or the position at certain multiple angle, because pcb board 30 upwarps the multiple boundary member for being born in pcb board 30, boss 21 sets
The medium position of lateral side baffle 20 is located at compared to boss 21 in the side locations of lateral side baffle 20, is more beneficial for preventing pcb board
30 upwarp.
The stud 11 for fixing pcb board 30 is located at the corner location of base plate 10.Stud 10 is located at the angle of base plate 10
Dropping place is put, that is, correspond to the position at each angle of pcb board 30, and stud 11 fixes at least one jiao of pcb board 30, and works as stud
During 11 only one of which, its position for being arranged on base plate 10 is, other the several angles in addition to the corner location below boss 21
Any one corner in falling.Stud 11 coordinates with boss 21, improves the stability that pcb board 30 is fixed with LED power shell.
With reference to Fig. 1 and Fig. 2, in the present embodiment, the quantity of the boss 21 is 1, and the quantity of stud 11 is 3.Due to side
Baffle plate 20 and drain pan are all rectangle 11, then boss 21 is located at the side of lateral side baffle 20, and stud 11 is removed in boss on base plate 10
Other 3 positions at angle outside the position at the angle of 21 lower sections.3 angle studs 11 and bolt of pcb board 30 are fixed, 1 angle
It is spacing with boss 21, the quantity of stud 11 and bolt is reduced, and improve efficiency of assembling.
One embodiment also includes a kind of LED power, and the LED power includes LED power shell and pcb board 30, the LED
Outer casing of power supply is LED power shell any one of in above-described embodiment, and the stud 11 and boss 21 fix institute jointly
State pcb board.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore can not be interpreted as the limitation to utility model patent scope.It should be pointed out that for the common skill of this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
Protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of LED power shell, it is characterised in that the LED power shell includes：Base plate and the side being connected with bottom edge
Side guard, the base plate of the LED power shell is provided with least one is used to fix the stud of pcb board, the LED power shell
Lateral side baffle is provided with least one pair of spacing boss of pcb board.
2. LED power shell according to claim 1, it is characterised in that the base plate is rectangular configuration with lateral side baffle.
3. LED power shell according to claim 1, it is characterised in that the LED power shell is L-type shell or U-shaped
Shell.
4. the LED power shell according to claim any one of 1-3, it is characterised in that the boss lower edge is away from LED power
The height of shell bottom plate, is adapted with the height of stud and the thickness sum of pcb board.
5. the LED power shell according to claim any one of 1-3, it is characterised in that also including heat conductive pad, the heat conduction
Pad is on the base plate of LED power shell.
6. LED power shell according to claim 5, it is characterised in that the thickness of the heat conductive pad be affixed under pcb board
SMD components thickness sum more than stud height.
7. the LED power shell according to claim any one of 1-3, it is characterised in that the boss is located at lateral side baffle
Side.
8. LED power shell according to claim 7, it is characterised in that the stud for fixing pcb board is located at bottom
The corner location of plate.
9. LED power shell according to claim 8, it is characterised in that the quantity of the boss is 1, the quantity of stud
It is 3.
10. a kind of LED power, including LED power shell and pcb board, it is characterised in that the LED power shell will for right
1-9 any one of LED power shell, the stud and boss is asked to fix the pcb board jointly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621276434.5U CN206251486U (en) | 2016-11-25 | 2016-11-25 | LED power supply and shell thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621276434.5U CN206251486U (en) | 2016-11-25 | 2016-11-25 | LED power supply and shell thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206251486U true CN206251486U (en) | 2017-06-13 |
Family
ID=59002417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621276434.5U Active CN206251486U (en) | 2016-11-25 | 2016-11-25 | LED power supply and shell thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206251486U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509361A (en) * | 2017-08-08 | 2017-12-22 | 深圳市钧泰丰新材料有限公司 | Exempt from encapsulating waterproof power supply and preparation method thereof |
-
2016
- 2016-11-25 CN CN201621276434.5U patent/CN206251486U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509361A (en) * | 2017-08-08 | 2017-12-22 | 深圳市钧泰丰新材料有限公司 | Exempt from encapsulating waterproof power supply and preparation method thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |