CN203675488U - Liquid-electrical integrated liquid-cooling chassis - Google Patents
Liquid-electrical integrated liquid-cooling chassis Download PDFInfo
- Publication number
- CN203675488U CN203675488U CN201420005030.7U CN201420005030U CN203675488U CN 203675488 U CN203675488 U CN 203675488U CN 201420005030 U CN201420005030 U CN 201420005030U CN 203675488 U CN203675488 U CN 203675488U
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- liquid
- cooling
- plug
- motherboard
- frame
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- Expired - Fee Related
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Abstract
The utility model relates to a liquid-electrical integrated liquid-cooling chassis. The chassis comprises a frame, a mother board horizontally placed in the frame and a plurality of plug-in components vertically plugged in the mother board. Each plug-in component comprises a liquid cooling plate card and a panel which is used for placing an application port and is vertical to the liquid cooling plate card, wherein a liquid cooling channel is arranged in the liquid cooling plate card. A lower edge of the liquid cooling plate card is provided with a cooling liquid inlet plug and a cooling liquid outlet plug. The liquid cooling channel is arranged in the mother board. A cooling liquid inlet socket and a cooling liquid outlet socket are arranged at positions correspondingly to the positions of the cooling liquid inlet plug and the cooling liquid outlet plug of each liquid cooling plate card. Two ends of the liquid cooling channel on the mother board pass through a side wall of the frame and are connected with an outer cold source. By using the integrated liquid-cooling chassis of the utility model, mechanical and electrical performance requirements can be satisfied and effective heat dissipation of an electronic device can be realized.
Description
Technical field
The utility model belongs to electronic equipment cooling technology field, particularly a kind of liquid electricity one Liquid cooling chasis.
Background technology
Along with the develop rapidly of electronic technology, a large amount of uses of high power density element, make electronic equipment power density increasing, therefore also more and more higher to the requirement of cooling technology.Especially Military Electronic Equipment work under bad environment, for meeting " three is anti-" requirement, generally adopts hermetically-sealed construction, has dispelled the heat into the subject matter of sealed electronic cabinet.
Forced air cooling due to its simplicity of design, easy to use, reliability is high, low cost and other advantages, is the most frequently used a kind of type of cooling.But be subject to the restriction of the factors such as air ratio thermal capacitance is little, fan performance, conventional air-cooled ability, below 1W/cm2, is not suitable for the occasion that power density is higher.
Summary of the invention
The purpose of this utility model is to provide a kind of liquid electricity one Liquid cooling chasis, has both met machinery, electric property requirement, can realize again electronic device efficiently radiates heat.
Realizing the technical solution of the utility model is: a kind of liquid electricity integral type Liquid cooling chasis, comprise frame, also comprise that motherboard and polylith that level is placed in frame are vertically plugged on the plug-in unit on motherboard, in described plug-in unit comprises, establish the liquid cooling board of cooling liquid passage with for placing application port the panel vertical with liquid cooling board, the lower edge of liquid cooling board is provided with a cooling liquid inlet plug and a cooling liquid outlet plug, described motherboard inside is provided with cooling liquid passage, be provided with cooling liquid inlet socket and cooling liquid outlet socket with each liquid cooling board cooling liquid inlet plug and the outlet corresponding position of plug, cooling liquid passage two ends on motherboard are connected with outer low-temperature receiver through frame side wall.
Compared with prior art, its remarkable advantage is the utility model:
1, cooling effectiveness is high, and heat radiation power consumption can reach 40w/cm
2, by heat is taken out of by cooling fluid, complete heat radiation in cabinet outside, for the electronic device of cabinet inside provides comfortable operational environment;
2, integrated level is high, and compact in design has extensibility.Total arrangement adopts amalgamation casing plug-in type, has good associativity, dismounting property, and wherein number of slots amount can increase and decrease according to the actual requirements, to realize different systemic-functions;
3, accommodative ability of environment is strong, and reliability is high.Adopt closed case structure, there is good environmental suitability, comprise the usefulness such as electromagnetic shielding, salt spray resistance, humidity;
4, generalization degree is high, good economy performance.Adopt modularized design, and each plug-in unit and the frame inside dimension etc. that coordinates are with it all in strict accordance with international standard, have good versatility.And by optimization, combination to each plug-in unit, can realize the multipurpose of cabinet.
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Brief description of the drawings
Fig. 1 is cabinet total arrangement schematic diagram.
Fig. 2 is plug-in unit schematic diagram.
Fig. 3 is frame plan.
Wherein: 1 frame, 1-1-front shroud, 1-2-back shroud, 1-3-left plate, 1-4-right plate, 1-5-base plate, 1-6-leg, 1-7-handle, 2 plug-in units, 21 panels, 22 liquid cooling boards, 221 cooling liquid inlet plugs, 222 cooling liquid outlet plugs, 3 motherboards, 31 cooling liquid inlet sockets, 32 cooling liquid outlet sockets.
Embodiment
As Fig. 1, shown in Fig. 3, the utility model liquid, electricity integral type Liquid cooling chasis, comprise frame 1, also comprise that motherboard 3 and polylith that level is placed in frame are vertically plugged on the plug-in unit 2 on motherboard, in described plug-in unit 2 comprises, establish the liquid cooling board 22 of cooling liquid passage with for placing application port the panel 21 vertical with liquid cooling board, the lower edge of liquid cooling board 22 is provided with a cooling liquid inlet plug 221 and a cooling liquid outlet plug 222, described motherboard 3 inside are provided with cooling liquid passage, be provided with cooling liquid inlet socket 31 and cooling liquid outlet socket 32 with each liquid cooling board cooling liquid inlet plug 221 and the outlet corresponding position of plug 222, cooling liquid passage two ends on motherboard are connected with outer low-temperature receiver through frame side wall.
As shown in Figure 2, liquid cooling board 22 is electronic device mounting panel, is again heat exchanger, and liquid circulates between plug-in unit and motherboard, the heat of electronic device is flowed out to cabinet by cooling fluid and bring to external source, reaches the object of high efficiency and heat radiation.Motherboard 3 is liquid cooling plates, and it is arranged in frame, is arranging fluid connector and signal of telecommunication socket above.Fluid connector on motherboard and plug-in unit liquid cooling plate card docking, can realize board and be connected with the quick of liquid in motherboard; Signal of telecommunication socket has ensured that the exchanges data between each plug-in unit can be undertaken by motherboard, makes system have good compatibility, can adopt the plug-in unit collaborative work in same cabinet with difference in functionality of the mode that plays with building blocks, thereby realize different systemic-functions.Liquid in liquid in motherboard and plug-in unit board circulates, and by the caloric value of components and parts on flowing liquid absorbent insert board, brings to external source carry out coolingly by motherboard, and provides support for the exchanges data between each plug-in unit.
Cooling fluid import and export socket on cooling fluid import and export plug and motherboard on described liquid cooling board is self sealss snap joint.
As shown in Figure 2, described panel 21 upper surfaces are provided with drawing-aid device, to facilitate plug.
Claims (3)
1. a liquid electricity integral type Liquid cooling chasis, comprise frame (1), it is characterized in that: also comprise that motherboard (3) and polylith that level is placed in frame are vertically plugged on the plug-in unit (2) on motherboard, in described plug-in unit (2) comprises, establish the liquid cooling board (22) of cooling liquid passage with for placing application port the panel (21) vertical with liquid cooling board, the lower edge of liquid cooling board (22) is provided with a cooling liquid inlet plug (221) and a cooling liquid outlet plug (222), described motherboard (3) inside is provided with cooling liquid passage, be provided with cooling liquid inlet socket (31) and cooling liquid outlet socket (32) with each liquid cooling board cooling liquid inlet plug (221) and the corresponding position of outlet plug (222), cooling liquid passage two ends on motherboard are connected with outer low-temperature receiver through frame side wall.
2. Liquid cooling chasis according to claim 1, is characterized in that: the cooling fluid import and export socket on cooling fluid import and export plug and motherboard on described liquid cooling board is self sealss snap joint.
3. Liquid cooling chasis according to claim 1, is characterized in that: described panel (21) upper surface is provided with drawing-aid device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420005030.7U CN203675488U (en) | 2014-01-03 | 2014-01-03 | Liquid-electrical integrated liquid-cooling chassis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420005030.7U CN203675488U (en) | 2014-01-03 | 2014-01-03 | Liquid-electrical integrated liquid-cooling chassis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203675488U true CN203675488U (en) | 2014-06-25 |
Family
ID=50971730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420005030.7U Expired - Fee Related CN203675488U (en) | 2014-01-03 | 2014-01-03 | Liquid-electrical integrated liquid-cooling chassis |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203675488U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125757A (en) * | 2014-07-02 | 2014-10-29 | 北京无线电测量研究所 | Through type liquid cooling case |
| CN104244682A (en) * | 2014-10-08 | 2014-12-24 | 上海航天电子通讯设备研究所 | Liquid-cooling plug-in box for radar antennas |
| CN105992495A (en) * | 2015-02-10 | 2016-10-05 | 中兴通讯股份有限公司 | Heat-dissipation plug-in box |
| CN106912183A (en) * | 2017-03-15 | 2017-06-30 | 北京北广科技股份有限公司 | A kind of casing cooling recirculation system |
| CN107529325A (en) * | 2017-09-26 | 2017-12-29 | 天津七所精密机电技术有限公司 | Universal liquid cold plate test equipment |
| CN112543575A (en) * | 2019-09-23 | 2021-03-23 | 上海微电子装备（集团）股份有限公司 | Board card plug-in module and electric control box |
-
2014
- 2014-01-03 CN CN201420005030.7U patent/CN203675488U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125757A (en) * | 2014-07-02 | 2014-10-29 | 北京无线电测量研究所 | Through type liquid cooling case |
| CN104244682A (en) * | 2014-10-08 | 2014-12-24 | 上海航天电子通讯设备研究所 | Liquid-cooling plug-in box for radar antennas |
| CN105992495A (en) * | 2015-02-10 | 2016-10-05 | 中兴通讯股份有限公司 | Heat-dissipation plug-in box |
| CN106912183A (en) * | 2017-03-15 | 2017-06-30 | 北京北广科技股份有限公司 | A kind of casing cooling recirculation system |
| CN107529325A (en) * | 2017-09-26 | 2017-12-29 | 天津七所精密机电技术有限公司 | Universal liquid cold plate test equipment |
| CN112543575A (en) * | 2019-09-23 | 2021-03-23 | 上海微电子装备（集团）股份有限公司 | Board card plug-in module and electric control box |
| CN112543575B (en) * | 2019-09-23 | 2022-03-04 | 上海微电子装备（集团）股份有限公司 | Board card plug-in module and electric control box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140625 Termination date: 20170103 |