CN107509361A - Exempt from encapsulating waterproof power supply and preparation method thereof - Google Patents
Exempt from encapsulating waterproof power supply and preparation method thereof Download PDFInfo
- Publication number
- CN107509361A CN107509361A CN201710671309.7A CN201710671309A CN107509361A CN 107509361 A CN107509361 A CN 107509361A CN 201710671309 A CN201710671309 A CN 201710671309A CN 107509361 A CN107509361 A CN 107509361A
- Authority
- CN
- China
- Prior art keywords
- power supply
- adhesive layer
- side plate
- conducting adhesive
- outer casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Road Signs Or Road Markings (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention discloses one kind and exempts from encapsulating waterproof power supply and preparation method thereof, and this method includes：Power panel and outer casing of power supply are provided, outer casing of power supply includes groove housing, cover plate, the first side plate and the second side plate, and bottom surface and the two sides junction of groove housing are respectively arranged with the first neck and the second neck；Power panel is fastened in groove housing by the first neck and the second neck, and bonded the bottom surface of power panel and groove housing using the first conducting adhesive layer；Cover plate is bonded by the second conducting adhesive layer and groove housing tip, while the aluminium flake for upwardly extending and being connected with cover plate is provided with power panel；First side plate and the second side plate are bonded into closure by the both ends of the 3rd conducting adhesive layer and the 4th conducting adhesive layer and groove housing respectively and form outer casing of power supply, power panel is sealed in outer casing of power supply.Prepared by the present invention exempt from encapsulating waterproof power source internal is without encapsulating, and rapid heat dissipation, is advantageous to energy-saving and emission-reduction, reduces environmental pollution, reduces cost.
Description
Technical field
The invention belongs to power technique fields, and in particular to one kind exempts from encapsulating waterproof power supply and preparation method thereof.
Background technology
Waterproof power supply refers to be used under certain dustproof and waterproof level condition, has the multiple protectives such as short circuit, excessively stream, overload
Driving power is mainly LED spotlight, LED light bar, LED street lamp, LED bulb, LED underground lamp, LED Ceiling lights, LED flat plate
The various LED lamps such as lamp, LED wall wash lamp provide driving force；Its most important feature is waterproof, can in outdoor application, and
Do not fear it is rainy, towards adverse circumstances such as mist, big positive direct projections.
Power supply waterproof mainly takes the mode of encapsulating in the market, and this method has the defects of very big：In power supply
Electronic component generates heat when working, and produces substantial amounts of heat, and the relatively low (0.6~2.0W/ (m of silica gel glue thermal conductivity factor poured into
K)), it is impossible to heat is timely and effectively conducted, if heat cannot be distributed timely, it will influence its service life.In addition,
General each power supply need to irrigate 200-600g glue, and glue cost is approximately three to nine yuans, glue material cost and
Cost of transportation is high, and is unfavorable for energy-saving and emission-reduction.
The content of the invention
It is an object of the invention to overcome the above-mentioned deficiency of prior art, there is provided one kind exempts from encapsulating waterproof power supply and its preparation
Method, it is intended to solve the technical problem that existing waterproof power supply heat sinking effect is undesirable and cost is high.
For achieving the above object, the technical solution adopted by the present invention is as follows：
One aspect of the present invention provides a kind of preparation method for exempting from encapsulating waterproof power supply, comprises the following steps：
There is provided power panel and outer casing of power supply, the outer casing of power supply includes groove housing, cover plate, the first side plate and the second side
Plate, bottom surface and the two sides junction of the groove housing are respectively arranged with the first neck and the second neck；
The power panel is fastened in the groove housing by first neck and second neck, and adopted
The bottom surface of the power panel and the groove housing is bonded with the first conducting adhesive layer；
The cover plate is bonded by the second conducting adhesive layer and the groove housing tip, while in the power panel
On be provided with the aluminium flake for upwardly extending and being connected with the cover plate；
By first side plate and second side plate respectively by the 3rd conducting adhesive layer and the 4th conducting adhesive layer with
The both ends bonding closure of the groove housing forms the outer casing of power supply, the power panel is sealed in the outer casing of power supply
It is interior.
The preparation method provided by the invention for exempting from encapsulating waterproof power supply, power panel is completely fixed and is sealed in outer casing of power supply
Inside, outer casing of power supply are internally formed one and are fully sealed cavity, and inside is without encapsulating, you can the waterproof sealing of power supply is realized,
Power panel is bonded in the bottom surface of groove housing by the first conducting adhesive layer, at the same with the first neck and the second neck clamping,
So power panel is firm and rapid heat dissipation；And the aluminium flake for upwardly extending and being connected with cover plate set on power panel, both may be used
Fixed power source panel, and heat is directly reached outer casing of power supply, effectively increase radiating efficiency.Power panel generates heat when working,
Heat gradually fills up whole closed housing, and whole heat can be regarded as a thermal source, heat loss through radiation, directly be radiated the aluminium
On shell, the thermal conductivity factor of aluminium is 237W/ (mK), and the structure setting is more beneficial for the Quick diffusing of heat.In a word, this exempts to fill
Glue waterproof power supply preparation technology is simple, and whole process is advantageous to energy-saving and emission-reduction, reduced environmental pollution, reduce cost without encapsulating.
Another aspect of the present invention provides one kind and exempts from encapsulating waterproof power supply, and the encapsulating waterproof power supply of exempting from is prevented by above-mentioned encapsulating of exempting from
The preparation method in water power source is made, including the power panel and the outer casing of power supply, the outer casing of power supply include groove housing,
Cover plate, the first side plate and the second side plate, the power panel are fastened on described by first neck and second neck
In groove housing, and the power panel is bonded by the bottom surface of the first conducting adhesive layer and the groove housing, the cover plate
Bonded by the second conducting adhesive layer and the groove housing tip, while be provided with and upwardly extended simultaneously on the power panel
The aluminium flake being connected with the cover plate；First side plate and second side plate are led by the 3rd conducting adhesive layer and the 4th respectively
The both ends bonding closure of hot adhesion layer and the groove housing forms the outer casing of power supply.
Encapsulating waterproof power supply provided by the invention of exempting from is made by the distinctive preparation method for exempting from encapsulating waterproof power supply of the present invention,
The inside of the waterproof power supply is without encapsulating, and rapid heat dissipation, is advantageous to energy-saving and emission-reduction, reduces environmental pollution, reduces cost.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description be only the present invention some
Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 exempts from encapsulating waterproof power source internal structure chart for prepared by the embodiment of the present invention；
Wherein, each reference in figure：
1：Power panel；
11：Aluminium flake；
2：Outer casing of power supply；
21：Groove housing；
22：Cover plate；
23：First neck；
24：Second neck；
3：First conducting adhesive layer；
4：Second conducting adhesive layer.
Embodiment
In order that technical problems, technical solutions and advantageous effects to be solved by the present invention are more clearly understood, below in conjunction with
Embodiment, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only explaining
The present invention, it is not intended to limit the present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.
On the one hand, the embodiments of the invention provide a kind of preparation method for exempting from encapsulating waterproof power supply, also referring to Fig. 1,
Now the preparation method provided in an embodiment of the present invention for exempting from encapsulating waterproof power supply is illustrated.The encapsulating of exempting from of the embodiment of the present invention is prevented
The preparation method in water power source comprises the following steps：
S01：Power panel 1 and outer casing of power supply 2 are provided, outer casing of power supply 2 includes groove housing 21, cover plate 22, the first side plate
(figure does not mark) and the second side plate (figure does not mark), bottom surface and the two sides junction of groove housing 21 are respectively arranged with the first card
The neck 24 of groove 23 and second；
S02：Power panel 1 is fastened in groove housing 21 by the first neck 23 and the second neck 24, and using the
One conducting adhesive layer 3 bonds the bottom surface of power panel 1 and groove housing 21；
S03：Cover plate 22 is bonded by the second conducting adhesive layer 4 with the top of groove housing 21, while on power panel 1
It is provided with the aluminium flake 11 for upwardly extending and being connected with cover plate 22；
S04：First side plate and the second side plate are passed through into the 3rd conducting adhesive layer and the 4th conducting adhesive layer and groove respectively
The both ends bonding closure of housing 21 forms outer casing of power supply 2, power panel 1 is sealed in outer casing of power supply 2.
The above-mentioned preparation method for exempting from encapsulating waterproof power supply provided in an embodiment of the present invention, power panel 1 is completely fixed close
It is enclosed in inside outer casing of power supply 2, outer casing of power supply 2 is internally formed one and is fully sealed cavity, and inside is without encapsulating, you can realizes electricity
The waterproof sealing in source, power panel 1 is bonded in the bottom surface of groove housing 21 by the first conducting adhesive layer 3, while blocks with first
The clamping of 23 and second neck of groove 24, such power panel 1 consolidates and rapid heat dissipation；And what is set on power panel 1 upwardly extends
And the aluminium flake 11 being connected with cover plate 22, both can fixed power source panel 1, and heat is directly reached outer casing of power supply, effectively increased
Radiating efficiency.Power panel 1 is typically provided with electronic component, heating element and heat radiation elements, and power panel 1 is sent out when working
Heat, heat gradually fill up whole closed housing, and whole heat can be regarded as a thermal source, heat loss through radiation, directly be radiated
In the aluminum shell, the thermal conductivity factor 237W/ (mK) of aluminium, the structure setting is more beneficial for the Quick diffusing of heat.In a word, this is exempted from
Encapsulating waterproof power supply preparation technology is simple, and whole process is advantageous to energy-saving and emission-reduction, reduces environmental pollution, reduce into without encapsulating
This.
Further, in the preparation method for exempting from encapsulating waterproof power supply of the embodiment of the present invention, aluminium flake 11 is arranged on voltage plane
Heater members MOS adjacent regions on plate 1, are more beneficial for radiating, can the very first time heat transfer to aluminum shell.Aluminium flake simultaneously
Certain contact area between 11 and cover plate 22 be present, in a preferred embodiment, the contact area of the aluminium flake 11 and cover plate 22
For 8-15cm2, it is specifically as follows 8cm2、10cm2、12cm2、15cm2Deng.Contact area is too big, and preparation technology has obstacle, unfavorable
In improve production efficiency, contact area is too small, and radiating effect is undesirable, in the range of the preferable contact area, thermal diffusivity and
Production efficiency reaches optimal.Outer casing of power supply is preferably made up of aluminium and/or aluminium alloy, so, aluminium flake 11, aluminium and/or aluminium alloy
Manufactured outer casing of power supply 2 is combined, and heat transfer radiating effect is best.
Further, in the preparation method for exempting from encapsulating waterproof power supply of the embodiment of the present invention, power panel 1 is sealed in power supply
Also include after in shell 2：The first side plate and the second side plate are fixedly connected on groove housing 21 and cover plate 22 with fastener.Fastening
Part is stainless steel bolt or stainless steel screw, and the fastener number on first side plate and the second side plate is four, and
It is respectively distributed on four corners on the first side plate and the second side plate.I.e. with four stainless steel bolts or stainless steel screw by
Side plate is fixedly connected on one end of slot shell 21 and cover plate 22；With four stainless steel bolts or stainless steel screw by the second side plate
It is fixedly connected on the other end of slot shell 21 and cover plate 22.Because of the 3rd conducting adhesive layer and the 4th conducting adhesive layer and fastener
Presence, the sealing and fastness of outer casing of power supply 2 reach optimal.Further, the embodiment of the present invention exempts from the anti-water power of encapsulating
In the preparation method in source, the first conducting adhesive layer 3, the second conducting adhesive layer 4, the 3rd conducting adhesive layer and the 4th conducting adhesive layer
It is layer of silica gel.Silica gel can bond and can radiating, can improve power supply service life.In a preferred embodiment, the first heat conduction
The thickness of tack coat is 1-2mm, and the second conducting adhesive layer, the 3rd conducting adhesive layer, the thickness of the 4th conducting adhesive layer are 0.2-
0.5mm.Because the first conducting adhesive layer is inside outer casing of power supply 2, it suitably need to more add thickness and keep caking property and thermal diffusivity, and second
Conducting adhesive layer, the 3rd conducting adhesive layer, the 4th conducting adhesive layer outside outer casing of power supply 2, should try one's best and reduce its thickness
Sealing is kept, in the preferred scheme, the effect of sealing and caking property is best.
Further, in the preparation method for exempting from encapsulating waterproof power supply of the embodiment of the present invention, there is provided the surface of power panel 1
Coated with one layer of three proofings layer of silica gel (figure does not mark).The three proofings layer of silica gel has the characteristics of high temperature resistant and waterproof, it is possible to achieve right
Second of waterproof efficacy of power panel.It is arranged such, both the three proofings layer of silica gel and outer casing of power supply 2 are combined, can be further
Improve the water proofing property for exempting from encapsulating waterproof power supply.
On the other hand, the embodiment of the present invention additionally provides one kind and exempts from encapsulating waterproof power supply, and this exempts from encapsulating waterproof power supply by this
The above-mentioned preparation method for exempting from encapsulating waterproof power supply of inventive embodiments is made, including power panel 1 and outer casing of power supply 2, outside power supply
Shell 2 includes groove housing 21, cover plate 22, the first side plate and the second side plate, and power panel 1 passes through the first neck 23 and the second neck
24 are fastened in groove housing 21, and power panel 1 is bonded by the bottom surface of the first conducting adhesive layer 3 and groove housing 21, lid
Plate 22 is bonded by the second conducting adhesive layer 4 with the top of groove housing 21, while is provided with and is upwardly extended simultaneously on power panel 1
The aluminium flake 11 being connected with cover plate 22；First side plate and the second side plate pass through the 3rd conducting adhesive layer and the 4th conducting adhesive layer respectively
Both ends bonding closure with groove housing 21 forms outer casing of power supply 2.
The embodiment of the present invention exempts from encapsulating waterproof power supply by the distinctive preparation for exempting from encapsulating waterproof power supply of the embodiment of the present invention
Method is made, and the inside of the waterproof power supply is without encapsulating, and rapid heat dissipation, is advantageous to energy-saving and emission-reduction, reduces environmental pollution, reduces
Cost.
It is of the invention successively to carry out test of many times, it is further detailed as reference pair invention progress now to lift A partial experiment result
Thin description, is described in detail with reference to specific embodiment.
Embodiment 1
One kind exempts from encapsulating waterproof power supply, and its internal structure is as shown in figure 1, this exempts from the system of the preparation method of encapsulating waterproof power supply
Preparation Method comprises the following steps：
S11：It is aluminum shell to provide power panel 1 and outer casing of power supply 2, the outer casing of power supply 2, and outer casing of power supply 2 includes groove shell
Body 21, cover plate 22, the first side plate (figure does not mark) and the second side plate (figure does not mark), bottom surface and the two sides of groove housing 21 connect
The place of connecing is respectively arranged with the first neck 23 and the second neck 24.
S12：The bottom surface of the first conducting adhesive layer 3 and groove housing 21 that power panel 1 passes through 2mm is bonded, and by electricity
Source panel 1 is connected on the first neck 23 and the second neck 24.
S13：Cover plate 22 is bonded by 0.5mm the second conducting adhesive layer 4 with the top of groove housing 21, while in power supply
The aluminium flake 11 for upwardly extending and being connected with cover plate 22 is provided with panel 1；The contact area of the aluminium flake 11 and cover plate 22 is
10cm2。
S14：First side plate and the second side plate are led by 0.5mm the 3rd conducting adhesive layer and the 4th of 0.5mm respectively
The both ends of hot adhesion layer and groove housing bond to form outer casing of power supply 2, so that power panel 1 is sealed in outer casing of power supply 2, then
The first side plate and the second side plate are fixedly connected on slot shell 21 and cover plate 22 with stainless steel screw (figure does not mark).
Performance test
Encapsulating waterproof power supply of exempting from prepared by above-described embodiment 1 carries out performance test, and testing standard is：GB 7000.1-
2007/1EC 60598-1:2003.In test process：Specified input：100-240V~, 50/60Hz, 3.6A, PF >=0.94；Volume
Fixed output：8.4A 3.6Vdc, Max.39Vdc, Max.300W.The result data of test is as shown in table 1, and the data are shown, this hair
Encapsulating waterproof power supply of exempting from prepared by bright embodiment 1 meets IP67 grades.
Table 1
Judge explanation：
(1)P：Test sample meets standard requirement.
(2)N：The test event is not suitable for sample.
(3)F：Test sample is not inconsistent standardization requirement.
(4)-：The project experiment is not carried out.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of preparation method for exempting from encapsulating waterproof power supply, it is characterised in that comprise the following steps：
There is provided power panel and outer casing of power supply, the outer casing of power supply includes groove housing, cover plate, the first side plate and the second side plate,
The bottom surface of the groove housing is respectively arranged with the first neck and the second neck with two sides junction；
The power panel is fastened in the groove housing by first neck and second neck, and using the
One conducting adhesive layer bonds the bottom surface of the power panel and the groove housing；
The cover plate is bonded by the second conducting adhesive layer and the groove housing tip, while set on the power panel
It is equipped with the aluminium flake for upwardly extending and being connected with the cover plate；
By first side plate and second side plate respectively by the 3rd conducting adhesive layer and the 4th conducting adhesive layer with it is described
The both ends bonding closure of groove housing forms the outer casing of power supply, the power panel is sealed in the outer casing of power supply.
2. the preparation method as claimed in claim 1 for exempting from encapsulating waterproof power supply, it is characterised in that the power panel is sealed in
Also include after in the outer casing of power supply：First side plate and second side plate are fixedly connected on the groove with fastener
Housing and the cover plate.
3. the preparation method as claimed in claim 2 for exempting from encapsulating waterproof power supply, it is characterised in that the fastener is stainless steel
Bolt or stainless steel screw.
4. the as claimed in claim 2 preparation method for exempting from encapsulating waterproof power supply, it is characterised in that first side plate and described
The fastener number on second side plate is four, and is respectively distributed on first side plate and second side plate
On four corners.
5. the preparation method as claimed in claim 1 for exempting from encapsulating waterproof power supply, it is characterised in that first conducting adhesive
Layer, the second conducting adhesive layer, the 3rd conducting adhesive layer and the 4th conducting adhesive layer are layer of silica gel.
6. the preparation method as claimed in claim 5 for exempting from encapsulating waterproof power supply, it is characterised in that the first conducting adhesive layer
Thickness be 1-2mm；And/or
The second conducting adhesive layer, the 3rd conducting adhesive layer, the thickness of the 4th conducting adhesive layer are 0.2-
0.5mm。
7. the preparation method as claimed in claim 1 for exempting from encapsulating waterproof power supply, it is characterised in that the power panel of offer
Surface is coated with three proofings layer of silica gel.
8. the preparation method for exempting from encapsulating waterproof power supply as described in claim any one of 1-7, it is characterised in that the aluminium flake with
The contact area of the cover plate is 2-4cm2。
9. the preparation method for exempting from encapsulating waterproof power supply as described in claim any one of 1-7, it is characterised in that outside the power supply
Shell is made up of aluminium and/or aluminium alloy.
10. one kind exempts from encapsulating waterproof power supply, it is characterised in that the encapsulating waterproof power supply of exempting from is by any one of claim 1-9 institutes
The preparation method for exempting from encapsulating waterproof power supply stated is made, including the power panel and the outer casing of power supply, the outer casing of power supply
Including groove housing, cover plate, the first side plate and the second side plate, the power panel passes through first neck and second card
Groove is fastened in the groove housing, and the power panel is glued by the bottom surface of the first conducting adhesive layer and the groove housing
Close, the cover plate is bonded by the second conducting adhesive layer and the groove housing tip, while is set on the power panel
There is the aluminium flake for upwardly extending and being connected with the cover plate；First side plate and second side plate are glued by the 3rd heat conduction respectively
The both ends bonding closure of knot layer and the 4th conducting adhesive layer and the groove housing forms the outer casing of power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710671309.7A CN107509361A (en) | 2017-08-08 | 2017-08-08 | Exempt from encapsulating waterproof power supply and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710671309.7A CN107509361A (en) | 2017-08-08 | 2017-08-08 | Exempt from encapsulating waterproof power supply and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107509361A true CN107509361A (en) | 2017-12-22 |
Family
ID=60690663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710671309.7A Pending CN107509361A (en) | 2017-08-08 | 2017-08-08 | Exempt from encapsulating waterproof power supply and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN107509361A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040718A (en) * | 2020-07-28 | 2020-12-04 | 湖北清江水电开发有限责任公司 | Glue-pouring waterproof fire detector terminal box |
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| CN102055303A (en) * | 2009-10-27 | 2011-05-11 | 胡建龙 | Waterproof power supply |
| CN201910993U (en) * | 2011-02-25 | 2011-07-27 | 常州诚联电源制造有限公司 | Waterproof power supply |
| CN203099757U (en) * | 2013-01-18 | 2013-07-31 | 佛山科学技术学院 | Power source cooling device of light-emitting diode (LED) street lamp |
| CN203968533U (en) * | 2014-06-23 | 2014-11-26 | 刘乃东 | A kind of Switching Power Supply compartment |
| CN205859943U (en) * | 2016-06-30 | 2017-01-04 | 常州市武进红光无线电有限公司 | Waterproof high-power LED power structure |
| CN206251486U (en) * | 2016-11-25 | 2017-06-13 | 广州视源电子科技股份有限公司 | LED power and its shell |
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- 2017-08-08 CN CN201710671309.7A patent/CN107509361A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102055303A (en) * | 2009-10-27 | 2011-05-11 | 胡建龙 | Waterproof power supply |
| CN201910993U (en) * | 2011-02-25 | 2011-07-27 | 常州诚联电源制造有限公司 | Waterproof power supply |
| CN203099757U (en) * | 2013-01-18 | 2013-07-31 | 佛山科学技术学院 | Power source cooling device of light-emitting diode (LED) street lamp |
| CN203968533U (en) * | 2014-06-23 | 2014-11-26 | 刘乃东 | A kind of Switching Power Supply compartment |
| CN205859943U (en) * | 2016-06-30 | 2017-01-04 | 常州市武进红光无线电有限公司 | Waterproof high-power LED power structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040718A (en) * | 2020-07-28 | 2020-12-04 | 湖北清江水电开发有限责任公司 | Glue-pouring waterproof fire detector terminal box |
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Application publication date: 20171222 |
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