CN206429876U - Great power LED outdoor water-proof module lamp - Google Patents
Great power LED outdoor water-proof module lamp Download PDFInfo
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- CN206429876U CN206429876U CN201621107737.4U CN201621107737U CN206429876U CN 206429876 U CN206429876 U CN 206429876U CN 201621107737 U CN201621107737 U CN 201621107737U CN 206429876 U CN206429876 U CN 206429876U
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- heat
- power led
- great power
- outdoor water
- proof module
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Abstract
The utility model is related to a kind of single power in 2W or more than 2W and has the good great power LED outdoor water-proof module lamp of good waterproof performance, thermal diffusivity under water, substrate front side is welded with high-power LED chip, substrate back is connected with LED chip by heat transfer bond medium, in addition to local in the middle part of the heat-conducting base back side, heat-conducting base, substrate and high-power LED chip are hermetically sealed by transparent encapsulant shell, in lens carrier and lens carrier and transparent encapsulant shell are engaged by clamping.Advantage：One is to not only ensure LED chip junction temperature to be operated in its setting range, avoid the too high caused LED luminous intensity of junction temperature, luminous flux decline, service life reduction, the defect burnt, and the volume of radiator is considerably reduced, realize miniaturization, the miniaturization of great power LED outdoor water-proof module lamp；Two be the efficiency high of pyroconductivity, and vital technique effect is served to ensure that LED chip PN junction temperature is reduced；Three be can for a long time it is outdoor, in the rain, underwater operation, water resistance is safe and reliable.
Description
Technical field
The utility model is related to a kind of single power in 2W or more than 2W and has the good big work(of good waterproof performance, thermal diffusivity under water
Rate LED outdoor water-proof module lamps, the high-power spot light manufacture field in category family.
Background technology
In CN 203258608U, title " great power LED drive module ", Fig. 1, set between drive circuit board and radiator
Space is equipped with, or thermal insulation layer is provided between radiator, space, substrate and driving electricity are provided between thermal insulation layer and radiator
Road plate is fixed on by the lower end and upper end for passing perpendicularly through radiator strut 3, the inner side of pillar by screw and set between radiator
Wire guide, drive circuit board passes through wire guide and substrate connection by wire；Drive circuit board is arranged in seal casinghousing, housing bottom
Portion is fixedly connected with pillar, or the upper end of housing bottom and pillar is structure as a whole, and the side of housing is provided with incoming line.Or drive
Dynamic circuit board is potted in housing with heat-conducting glue, and the port of housing is provided with heat sink, and heat sink is aluminium alloy closure, and with
Heat-conducting glue fully contacts the heat dispersed produced by drive circuit element.Above-mentioned two drive module when in use, is led to by screw
Mounting hole is crossed to be connected with optical element.
In Fig. 2, thereon is provided with above LED, drive circuit and component, LED and is provided with heating column and radiating
Device, face thermal contact conductance connection, face contact position is coated with the heat-conducting silicone grease that thermal conductivity factor is more than 1.8, and substrate and radiator are fixed on branch
The lower end and upper end of post.The module is adapted to the LED illuminating lamps with housing；Thereon is around heating column to the edge of substrate
Portion sets housing.Gap is constituted around housing and heating column, thermal insulation layer is constituted between radiator, between thermal insulation layer and radiator
Space is constituted, thermal insulation layer and space are to prevent the heat baking between substrate and radiator, reduce hot stack.Housing is protective substrate
And component, gap silica gel sealing between housing and heating column, apply silica gel with substrate and be screwed again.The electricity of thereon
Road and component apply three-proofing coating protective layer, prevent that rainwater is moist, it is ensured that driving oscillation circuit it is safe and reliable.Will support when using
In U type grooves above ring insertion optical element outer bottom, silica gel is coated if necessary more reliable.Drive module does not include in Fig. 2
Radiator, only mixes suitable radiator and is together fixed on drive module on optical element when in use.Drive module by
Screw is connected by mounting hole and optical element.
In Fig. 3, optical element outer bottom is provided with pillar, centre bore and support platform, and the substrate in figure is put into optics
The outer bottom of element makes LED insert in centre bore, is reloaded into radiator, and radiator is fixed on above pillar, and drive circuit board is solid
It is scheduled on above radiator.The outer bottom that substrate in Fig. 2 is put into optical element makes LED insert in centre bore, positive and negative electrode piece
The outside of centre bore is invested, support platform is fixedly connected with substrate by silica gel, then order loads heating column and radiator, radiator
It is fixed on pillar.This two be the setup module on optical element drive component, without water proofing property, it is adaptable to shell
The illuminating lamp of body.In Fig. 3, be included in the outer bottom of optical element around substrate to being provided with housing between radiator, housing with
Silica gel sealing is applied between radiator.
Its weak point：One be can only be moistureproof, it is impossible to waterproof, more cannot be introduced into underwater operation；Two be can not solve 2W or
The upper heat dissipation problems with great power LED of 2W, and easily occur the generation that overheat causes great power LED drive module to burn phenomenon；
Two be that can not solve the profiling sealing of LED point light source, can only be sealed using housing, seal washer.
Utility model content
Purpose of design：The weak point in background technology is avoided, design one kind can be worked under water, and LED is can ensure that again
Junction temperature temperature is in the working range of its setting, while can realize that the LED great power LEDs open air of the hermetically sealed radiating of anti-shape is anti-again
Water module lamp.
Design：In order to realize above-mentioned purpose of design.1st, substrate front side is welded with veneer great power LED luminescence chip, base
The design that back and LED chip radiating surface are directly connected to by heat transfer bond medium, be technical characteristic of the present utility model it
One.The purpose so designed is：Because substrate back uses heat-conducting medium（As tin spreads out aluminium）Directly with LED chip heatsink welding
Connect, both eliminated the air gap between chip thermal conductive surface and real estate, make chip thermal conductive surface directly by substrate and heat-conducting base it
The overall structure without any heat-insulated air gap is formed, the direct air-gap-free of chip thermal conductive surface heat is transferred to heat-conducting base, improves
Heat conduction efficiency.2nd, in addition to local in the middle part of the heat-conducting base back side, heat-conducting base, substrate and great power LED luminescence chip are by printing opacity
The hermetically sealed design of encapsulating shell, is the two of technical characteristic of the present utility model.The purpose so designed is：Due to printing opacity envelope
The material that dress shell is used both has good high temperature resistant, resistance to acids and bases, has good heat conductivility again, and the application is noted
Modeling is coated on heat-conducting base, substrate and great power LED luminescence chip, sends out the heat-conducting base, substrate and great power LED that are wrapped by
There is no air to deposit between optical chip and transparent encapsulant shell inwall, it is to avoid influence of the air to heat transfer, receive heat-conducting base
Heat by transparent encapsulant shell Quick diffusing, can ensure that LED luminescence chips junction temperature be in work in the range of.
3rd, the transparent encapsulant shell is partially formed groove in the middle part of the heat-conducting base back side and groove is built-in with height after sealing heat-conducting base
The design of heat conduction heatproof glue, is the three of technical characteristic of the present utility model.The purpose so designed is：The groove can be met
To the positioning of heat-conducting base when hermetically sealed, heat-conducting base and transparent encapsulant shell edge can be realized by the way that high heat conduction heatproof glue is secondary again
Between secondary seal, it is ensured that transparent encapsulant housing is not intake in the rain, under water；Secondly, had by high heat conduction heatproof glue good
The good coefficient of heat conduction, it can be with sealing the conduction heat sealable plate shape of cover it into good heat transfer, it is ensured that heat conduction bottom
Heat on seat is transferred to conduction heat sealable plate by high heat conduction heatproof glue, and the setting of conduction heat sealable plate makes opening for transparent encapsulant shell
Oral area is in three seal structures, so as to ensure that power LED outdoor water-proof module is outdoor, under water reliable anti-perfectly safely
It is aqueous.4th, both made at a temperature of 50 DEG C~60 DEG C extreme operating conditions, heat-conducting base heat dissipation capacity makes the junction temperature of high-power LED light source
The design that is fluctuated in junction temperature temperature range of temperature, be the four of technical characteristic of the present utility model.The purpose so designed is：
Because there is fever phenomenon in LED, working time and the increase of operating current with LED, its luminous intensity and luminous flux can under
Drop, service life reduction, and when also resulting in the decline of launching efficiency, and PN junction junction temperature temperature beyond the scope of its setting, then
LED is caused to burn.People generally reduce PN junction to solve this technical barrier by increasing the area of dissipation of radiator
Junction temperature temperature, this method is although effective, but volume is big, be not suitable for the making of outdoor and underwater LED lamp, and makes
Make cost high.It is this utility model by setting LED under conditions of extreme operating conditions, by controlling heat-conducting base
Volume size, to ensure that the PN junction junction temperature of LED is in set working range, so that the volume of heat-conducting base greatly subtracts
It is small.5th, lens are located at the design being engaged by clamping in lens carrier and between lens carrier and spot light body shell, are this practicalities
The five of new technical characteristic.The purpose so designed is：Because the apolegamy of lens is sent out according to high-power point-source light ray
Firing angle degree difference and client demand and set, the application will be designed to split knot between lens and spot light module bodies
Structure, the technical parameter of lens can either be adjusted in time according to the demand of client（Luminous intensity distribution）, again can be according to the high-power spot lights of LED
Technical parameter adjust lens technical parameter（Coordinate）.
Technical scheme：A kind of great power LED outdoor water-proof module lamp, substrate front side is welded with high-power LED chip, the substrate back of the body
Face is connected with LED chip radiating surface by heat transfer bond medium, in addition to local in the middle part of the heat-conducting base back side, heat-conducting base, substrate
Hermetically sealed by transparent encapsulant shell with high-power LED chip, lens are located in lens carrier and lens carrier and transparent encapsulant shell
It is engaged by clamping.
The utility model is compared with background technology, and one is according to great power LED light emitting source PN junction junction temperature fluctuation range, design
The volume of LED chip PN radiators, not only ensure LED chip junction temperature and be operated in its setting range, it is to avoid junction temperature is too high
Caused LED luminous intensity, luminous flux decline, and service life reduction, the defect burnt, and considerably reduce radiating
The volume of device, realizes miniaturization, the miniaturization of great power LED outdoor water-proof module lamp；Two be heat-conducting base, substrate and high-power
Design without the air gap between LED luminescence chips and transparent encapsulant shell, it is ensured that the heat that heat-conducting base is received directly is passed
Transparent encapsulant shell is handed to, the efficiency of pyroconductivity is greatly improved, served to ensure that LED chip PN junction temperature is reduced to pass weight
The technique effect wanted；Three be close without the air gap between heat-conducting base, substrate and great power LED luminescence chip and transparent encapsulant shell
The design that three seals technology is used between injection molding and transparent encapsulant shell injection positioning port is sealed, enables transparent encapsulant shell long-term
It is outdoor, in the rain, underwater operation, water resistance is safe and reliable；Four be using lens carrier support lens design, realize by
Customer demand and great power LED technical parameter adjust the purpose of lens technologies parameter in time.
Brief description of the drawings
Fig. 1 is the structural representation of great power LED outdoor water-proof module lamp.
Embodiment
Embodiment 1：Referring to the drawings 1.A kind of great power LED outdoor water-proof module lamp, the front of substrate 3 is welded with great power LED
Chip 4, the back side of substrate 3 is connected with the radiating surface of LED chip 4 by heat transfer bond medium, except local in the middle part of the back side of heat-conducting base 8
Outside, heat-conducting base 8, substrate 3 and high-power LED chip 4 are hermetically sealed by transparent encapsulant shell 1, and lens 6 are located in lens carrier 9
And lens carrier 9 is engaged by clamping with transparent encapsulant shell 1.Both made at 50 DEG C~60 DEG C of the limit, the heat dissipation capacity of heat-conducting base 6 makes big work(
The temperature of the junction temperature of rate LED/light source is fluctuated in the scope of junction temperature temperature.
The transparent encapsulant shell 1 is partially formed groove and recessed after sealing heat-conducting base 8 in the middle part of the back side of heat-conducting base 8
Groove is built-in with high heat conduction heatproof glue 7.High heat conduction heatproof glue 7 is prior art, although similar glue title differs, property phase
Together, narration in detail therefore is not made herein.Conduction heat sealable plate 2 is equipped with the high heat conduction heatproof glue 7.
It is to seal to seal without air-gap between the heat-conducting base 8, substrate 3 and high-power LED chip 4 and transparent encapsulant shell 1
Dress.
The transparent encapsulant shell 1 uses high heat conduction heatproof high molecule resin injection molding.The high heat conduction heatproof high molecule
Resin is made up of high temperature-resistant acid-resistant alkali resin.The material system prior art, although similar material title differs, property phase
Together, narration in detail therefore is not made herein.
Embodiment 2：On the basis of embodiment 1, the diameter of the transparent encapsulant shell 1 is less than 30 millimeters.
Embodiment 3：On the basis of embodiment 1, both made at a temperature of 50 DEG C~60 DEG C of extreme operating conditions, and worked as LED
When chip power is 2~3W, the diameter of heat-conducting base 2 is more than 5 millimeters more than 20 millimeters, thickness.
It is to be understood that：The detailed word although above-described embodiment is contrasted to mentality of designing of the present utility model
Description, but these word descriptions, simply to the simple text description of the utility model mentality of designing, rather than it is new to this practicality
The limitation of type mentality of designing, any combination, increase or modification without departing from the utility model mentality of designing each falls within this practicality new
In the protection domain of type.
Claims (9)
1. a kind of great power LED outdoor water-proof module lamp, it is characterized in that：Substrate（3）Front is welded with high-power LED chip（4）, base
Plate（3）The back side and LED chip（4）Radiating surface is connected by heat transfer bond medium, except heat-conducting base（8）It is local outer in the middle part of the back side,
Heat-conducting base（8）, substrate（3）And high-power LED chip（4）By transparent encapsulant shell（1）It is hermetically sealed, lens（6）Positioned at lens
Support（9）Interior and lens carrier（9）With transparent encapsulant shell（1）It is engaged by clamping.
2. great power LED outdoor water-proof module lamp according to claim 1, it is characterized in that：The transparent encapsulant shell（1）
Seal heat-conducting base（8）Afterwards, in heat-conducting base（8）Groove is partially formed in the middle part of the back side and groove is built-in with high heat conduction heatproof glue
（7）.
3. great power LED outdoor water-proof module lamp according to claim 2, it is characterized in that：The high heat conduction heatproof glue（7）
On be equipped with conduction heat sealable plate（2）.
4. great power LED outdoor water-proof module lamp according to claim 1, it is characterized in that：The transparent encapsulant shell（1）Adopt
With high heat conduction heatproof high molecule resin injection molding.
5. great power LED outdoor water-proof module lamp according to claim 4, it is characterized in that：The high heat conduction heatproof high score
Subtree fat is made up of high temperature-resistant acid-resistant alkali resin.
6. great power LED outdoor water-proof module lamp according to claim 1, it is characterized in that：Both made in 50 DEG C of limiting temperature
At~60 DEG C, heat-conducting base（8）Heat dissipation capacity makes the temperature of the junction temperature of high-power LED light source be fluctuated in the scope of junction temperature temperature.
7. great power LED outdoor water-proof module lamp according to claim 1, it is characterized in that：The transparent encapsulant shell（1）'s
Diameter is less than 30 millimeters.
8. great power LED outdoor water-proof module lamp according to claim 1, it is characterized in that：The heat-conducting base（8）, base
Plate（3）And high-power LED chip（4）With transparent encapsulant shell（1）Between be without air-gap it is hermetically sealed.
9. the great power LED outdoor water-proof module lamp according to claim 1 or 6, it is characterized in that：Both made at 50 DEG C~60 DEG C
At a temperature of extreme operating conditions, when LED chip power is 2~3W, the diameter of heat-conducting base 2 is more than 5 more than 20 millimeters, thickness
Millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621107737.4U CN206429876U (en) | 2016-10-10 | 2016-10-10 | Great power LED outdoor water-proof module lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621107737.4U CN206429876U (en) | 2016-10-10 | 2016-10-10 | Great power LED outdoor water-proof module lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206429876U true CN206429876U (en) | 2017-08-22 |
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ID=59589196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621107737.4U Active CN206429876U (en) | 2016-10-10 | 2016-10-10 | Great power LED outdoor water-proof module lamp |
Country Status (1)
| Country | Link |
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| CN (1) | CN206429876U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287261A (en) * | 2016-10-10 | 2017-01-04 | 杭州勇电照明有限公司 | Great power LED outdoor water-proof module lamp |
-
2016
- 2016-10-10 CN CN201621107737.4U patent/CN206429876U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287261A (en) * | 2016-10-10 | 2017-01-04 | 杭州勇电照明有限公司 | Great power LED outdoor water-proof module lamp |
| CN106287261B (en) * | 2016-10-10 | 2023-07-25 | 杭州勇电照明有限公司 | High-power LED outdoor waterproof module lamp |
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