CN104676554B - Led lamp - Google Patents
Led lamp Download PDFInfo
- Publication number
- CN104676554B CN104676554B CN201510051502.1A CN201510051502A CN104676554B CN 104676554 B CN104676554 B CN 104676554B CN 201510051502 A CN201510051502 A CN 201510051502A CN 104676554 B CN104676554 B CN 104676554B
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- Prior art keywords
- light source
- ontology
- source module
- module group
- pedestal
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
- F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
A kind of LED lamp, including ontology and the radiating subassembly, light source module group, side cover, diffusion sheet and the cover board that are connected in turn on the ontology are provided with installation position on the ontology, for installing the radiating subassembly；The radiating subassembly includes pedestal and the cooling fin for being connected to the pedestal surrounding；It is provided with connection position on the pedestal, for connecting the light source module group；The side cover is arranged around the light source module group and is fixed in the light source module group；The diffusion sheet is fixed on one end far from the light source module group of the side cover；The cover board coordinates the ontology, for the radiating subassembly, the light source module group, the side cover and the diffusion sheet to be fixed between the cover board and the ontology.Above-mentioned LED lamp, by radiating subassembly quickly by the dissipating heat of light source module group generation to surrounding, meanwhile, realize to be quickly LED lamps cooling in the way of air thermal convection current, radiating efficiency is high, simple and practical in structure.
Description
Technical field
The present invention relates to the heat dissipation technologys of electronic component, more particularly to LED lamp.
Background technology
LED is the abbreviation of English light emitting diode (light emitting diode), its basic structure is one block of electricity
Then the chip of semiconductor material of photoluminescence uses silver wire or gold thread to connect chip and electricity on elargol or latex solidified to holder
Road plate, the lamp body that then surrounding is sealed with epoxy resin.Since LED has many incandescent lamps or the do not had Optimality of energy-saving lamp
Can, it is safe and reliable etc. for example, energy-saving and environmental protection, low-heat operating at voltages, it is now just with rapid changepl. never-ending changes and improvements into.
However, the luminous efficiency of traditional LED light is low, during electric energy is converted into luminous energy, there is 80% electricity
Thermal energy can be converted into.These thermal energy again reaction effect LED light shine, thus, it is necessary to design it is a can rapidly by
The heat transfer of LED is accumulated in the Novel LED light of ambient enviroment.
Invention content
Based on this, it is necessary to for how rapid cooling the problem of, a kind of LED lamp is provided.
A kind of LED lamp, including ontology and be connected in turn on the ontology radiating subassembly, light source module group, side cover, expansion
Discrete piece and cover board are provided with installation position on the ontology, for installing the radiating subassembly；The radiating subassembly include pedestal with
And it is connected to the cooling fin of the pedestal surrounding；It is provided with connection position on the pedestal, for connecting the light source module group；It is described
Side cover is arranged around the light source module group and is fixed in the light source module group；The diffusion sheet is fixed on the separate of the side cover
One end of the light source module group；The cover board coordinates the ontology, for by the radiating subassembly, light source module group, described
Side cover and the diffusion sheet are fixed between the cover board and the ontology.
In one embodiment in fact, the side far from the radiating subassembly is provided with interconnecting piece on the ontology, is used for
Hang or lift the ontology.
In one embodiment in fact, it is provided with power interface on the ontology, for connecting external power supply.
In one embodiment in fact, it is additionally provided with power supply over-current and -load protector on the ontology, is arranged in light source
Between module and power interface.
In one embodiment in fact, it is provided with the portion of lifting on the ontology, for lifting the ontology.
In one embodiment in fact, the portion of lifting is plate annulus, welds or is spirally connected and is fixed on the ontology
On.
In one embodiment in fact, the radiating subassembly includes rectangular pedestal.
In one embodiment in fact, it is provided with connection position on the middle of the base region, for connecting the light source die
Group.
In one embodiment in fact, the light source module group includes pcb board, and the pcb board is connected to institute by adhesive
State connection position.
In one embodiment in fact, the light source module group includes several LED chips, and each LED chip is arranged at matrix
It is listed on the pcb board.
The heat conductive silica gel thickness is 0.01mm in one of the embodiments,.
In one of the embodiments, the pedestal shape be it is flat rectangular or round also, flat rectangular or
The inside of the circular pedestal of person offers closed cavity, and the cavity inside is additionally provided with several chambers to communicate with each other
And several spoilers in the chamber interior are set.
Each cooling fin opens up the perforation at several perforation cooling fin both ends in one of the embodiments, also,
Depending on the shape of the perforation is with the shape of cooling fin.
The radiating subassembly includes radiating module in one of the embodiments, for generating driving after being powered up
Power is to force driving air movement and take away heat.
The radiating subassembly includes radiating module in one of the embodiments, for generating driving after being powered up
Power is to force driving air movement and take away heat.Radiating module include shell, vibrating membrane, driving chip, several gas outlets with
And several air inlets, vibrating membrane, driving chip, several gas outlets and several air inlets are arranged on shell, also, air inlet
It is corresponding with gas outlet to be both provided with check-valves.
Above-mentioned LED lamp, by radiating subassembly quickly by the dissipating heat of light source module group generation to surrounding, meanwhile, it utilizes
The mode of air thermal convection current realizes to be quickly LED lamps cooling, and radiating efficiency is high, simple and practical in structure.
Above-mentioned LED lamp is 0.01mm by the way that heat conductive silica gel thickness is arranged, i.e., when heat conductive silica gel high temperature melting due to amount
Air less and between light source module group and pedestal is extruded into outside, and there are tension between light source module group and pedestal so that light source
Module is not easy to leave pedestal.
Above-mentioned LED lamp, by the way that cavity and spoiler in pedestal is arranged, after air encounters interference in flow process
Change former direction of travel so that air comes into full contact with chamber inner wall in chamber and takes away more heats as far as possible.
Above-mentioned LED lamp is perforated by increasing in cooling fin so that and perforation increases the contact area of cooling fin and air,
To improve the radiating efficiency of cooling fin.
Above-mentioned LED lamp generates forced convertion by radiating module, to take away the heat around radiating subassembly rapidly.
Above-mentioned LED lamp, by the gas outlet of radiating module and the chamber of pedestal, also, the chamber of pedestal also connects
The chamber of logical cooling fin so that dissipated together from the outside of the perforated inner combination cooling fin of the chamber and cooling fin of pedestal
Heat, greatly improves the radiating efficiency of LED lamp, and then improves the service life and other performances of LED lamp, practical
Property is strong, easy to spread.
Description of the drawings
Fig. 1 is the structural schematic diagram of one embodiment of LED lamp of the present invention；
Fig. 2 is the structural schematic diagram of another embodiment of LED lamp of the present invention；
Fig. 3 is the attachment structure schematic diagram of the radiating subassembly of embodiment illustrated in fig. 1；
Fig. 4 a are an attachment structure schematic diagram of the pedestal and cooling fin of embodiment illustrated in fig. 1；
Fig. 4 b are another attachment structure schematic diagram of the pedestal and cooling fin of embodiment illustrated in fig. 1；
Fig. 5 a are a structural schematic diagram of the chamber of the pedestal of embodiment illustrated in fig. 1；
Fig. 5 b are another structural schematic diagram of the chamber of the pedestal of embodiment illustrated in fig. 1；
Fig. 6 is the structural schematic diagram of another embodiment of LED lamp of the present invention；
Fig. 7 is the structural schematic diagram of the radiating module of embodiment illustrated in fig. 6；
Fig. 8 is schematic diagram of the air in the flow direction of radiating module, pedestal and cooling fin.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of violating intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
It should be noted that when element is referred to as " being fixed on ", " being set to " another element, it can be directly another
On a element or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be
It is directly connected to another element or may be simultaneously present centering elements.Term as used herein " vertically ", " level
", "left", "right" and similar statement for illustrative purposes only, be not offered as being unique embodiment.
Referring to Fig. 1, LED lamp includes：Ontology 100, radiating subassembly 110, light source module group 120, side cover 130, diffusion sheet
140 with cover board 150, radiating subassembly 110, light source module group 120, side cover 130, diffusion sheet 140 and cover board 150 are connected to this in turn
On body 100.Wherein, it is provided with installation position 101 on ontology 100, for installing radiating subassembly 110；Radiating subassembly 110 connects light source
Module 120 is simultaneously fixed on ontology 100；Side cover 130 is arranged around light source module group 120 and is fixed in light source module group 120；Diffusion
Piece 140 is fixed on one end of the separate light source module group 120 of side cover 130；Cover board 150 coordinates ontology 100, is used for radiating subassembly
110, light source module group 120, side cover 130 and diffusion sheet 140 are fixed between cover board 150 and ontology 100.
In order to support the entire LED lamp of assembling, ontology 100 includes frame structure, which is made of metal material,
For example, rectangular or circular frame structure of the ontology 100 using aluminium alloy.In this way, frame structure can provide one in structure
Fixed space is for installation radiating subassembly 110, light source module group 120, side cover 130, diffusion sheet 140 and cover board 150.Meanwhile because
The good heat conductivity of metal, especially the aluminium alloy sexual valence in heat conduction and material cost are relatively high, also, using rectangular or circle
Shape allows for certain practicability.Wherein, rectangular to be conducive to put or install in the plane, circular area is larger,
More LED chips can be installed after being adapted to also round light source module group 120.
In other embodiments, the heat-conducting plastic of hard may be used in ontology 100, for example, may be used in current material
The heat-conducting plastics such as PP, ABS, PC, PA, LCP, PPS, PEEK, in this way, due to plastics in weight generally than the weight of metal compared with
Gently, thus using heat-conducting plastic can be made it is portable or can threading formula LED light.In addition, due to heat-conducting plastic, such as heat conduction
Polymer has many characteristics, such as flexible resistance and tensible rigidity, therefore can also be made and require size more stringent LED electronics
Product.
For the ease of installing radiating subassembly 110, the surrounding positioned at same side of ontology 100 is provided with installation position 101, uses
In installation radiating subassembly 110.For example, installation position 101 is set to the different direction positioned at same side of ontology 100, that is, install
Position 101 is set to the four direction all around positioned at same side of ontology 100.For example, installation position 101 is several internal threads
Hole, it is preferred that installation position 101 is four female screw holes, and each female screw hole is opened in the quadrangle of ontology 100 respectively.This
Radiating subassembly 110 can be easily assembled on ontology 100 by sample by way of being spirally connected.In other embodiments
In, installation position 101 can also be arranged to the mode of grafting.
For the ease of LED lamp is combined with other components；For example, far from the radiating subassembly 110 on the ontology 100
Side be provided with interconnecting piece 102, for hang either lift the ontology 100 for example, interconnecting piece 102 be one hook or
Plug division.In this way, when needing to be combined LED lamp with other components, for example, when LED lamp is lifted on ceiling, in day
One is arranged on card, and for link, either LED lamp and link or slot are connected by slot.
In order to facilitate access external power supply, for example, power interface is provided on ontology 100, for connecting external power supply.Example
Such as, power interface uses the main power supply interface of 20+4pin, 4+4pin either SATA power supply interfaces or USB interface.In this way, working as LED
When lamps and lanterns do not have built-in power, it can be powered for light source module group 120 by power interface；When LED lamp is built-in with can charge and discharge
When lithium ion battery is that light source module group 120 is powered, power interface can also be crossed and provide charge and discharge for lithium ion battery, facilitate reality
With.
In order to ensure the safe handling of LED lamp, power supply over-current and -load protector, power supply mistake are additionally provided on ontology 100
It flows overload protective device to be arranged between light source module group 120 and power interface, so that external power supply connects again after power interface
It is connected to power supply over-current and -load protector, and overcurrent, quick-break and short circuit are prevented under the action of power supply over-current and -load protector, to protect
Demonstrate,prove the normal use of LED lamp.
Referring to Fig. 2, carrying LED lamp for convenience, it is provided with the portion of lifting 103 on ontology 100, for lifting ontology
100, for example, it is a plate semicircular ring to lift portion 103, it is set to the side of ontology 100, for example, it welds or be spirally connected admittedly
Due on ontology 100.In this way, can easily be carried using the portion that lifts 103 or be revolved to LED lamp according to practical use
Turn or suspension etc. modes use.
Installation position 101 is provided on ontology 100, for installing radiating subassembly 110, radiating subassembly 110 is for connecting light source
Its own heat generated by work is dispersed for light source module group 120 after module 120, and fixation is installed together with light source module group 120
Installation position 101 on ontology 100.Referring to Fig. 3, for example, radiating subassembly 110 is including pedestal 111 and is connected to pedestal 111
The cooling fin 112 of surrounding.The connection structure of cooling fin 112 and pedestal 111 is as shown in figures 4 a and 4b；For example, radiating subassembly 110
Including rectangular pedestal 111.For another example, it is provided with connection position in 111 central region of pedestal, for connecting light source module group 120.
For rapidly by the heat transfer of light source module group 120 to pedestal 111, for example, pedestal 111 is rectangular aluminum alloy base
111, also, 111 surface of pedestal applies the uniform heat conductive silica gel of last layer, and light source module group 120 is bonded in the heat conduction on 111 surface of pedestal
On silica gel, in this way, since heat conductive silica gel thermal coefficient is high and volume resistivity is low, it is possible to reduce heat source surface and LED lamp
Contact surface between the thermal contact resistance that generates and by the heat transfer of light source module group 120 to pedestal 111.
Heat conductive silica gel melts at a high temperature of light source module group 120 generates in order to prevent, and generates displacement, example after being melted down
Such as, when smearing heat conductive silica gel to pedestal 111, dosage should be moderate, for example, heat conductive silica gel thickness is 0.01mm and equably applies
It is put on pedestal 111, is more than the heat conductive silica gel for 0.01mm relative to thickness, the heat conductive silica gel of 0.01mm thickness is by high temperature melting
The amount that it can be flowed in pedestal 111 when change is considerably less, meanwhile, the heat conductive silica gel of 0.01mm thickness can meet pedestal 111 and light
The connection of source module 120, and can will be among pedestal 111 and light source module group 120 after pedestal 111 is connect with light source module group 120
The space in gap squeeze away so that form tension under the action of heat conductive silica gel between pedestal 111 and light source module group 120,
It is more reliable to make pedestal 111 connect with light source module group 120, that is, due to measuring less and light source die when heat conductive silica gel high temperature melting
Air between group 120 and pedestal 111 is extruded into outside, and there are tension between light source module group 120 and pedestal 111 so that light
Source module 120 is not easy to leave pedestal 111.For another example, when needing LED lamp being mounted on fixed component, 111 surrounding of pedestal is also set
It is equipped with the limited block that vertical feet 111 upwardly extends, i.e. limited block will surround a slot, also, light source module group among pedestal 111
120 are arranged around limited block in 111 intermediate region of pedestal.In this way, when heat conductive silica gel melted by heat, liquefied heat conductive silica gel is not
Can from pedestal 111 flow out, while can also limiting light source module 120 move, be particularly suitable for be fixedly mounted illumination occasion, example
Such as, floor-lamp.
Fig. 5 a and Fig. 5 b are please referred to, the pedestal 111 contacted in order to prevent with light source module group 120 cannot be rapid because of heat aggregation
It radiates and causes material rotten, such as 111 shape of pedestal is flat rectangular either round also, flat rectangular or circle
The inside of the pedestal 111 of shape offers closed cavity, and cavity inside is additionally provided with several chambers to communicate with each other and setting
In several spoilers of chamber interior.For example, cavity inside is provided with the first chamber to communicate with each other and the first spoiler, second
Chamber and the second spoiler and second chamber and third spoiler, each chamber is in the center of pedestal 111, also, each chamber
Between extended outward at 120 degree and by the center of pedestal 111.For example, spoiler is arranged for one in chamber interior side wall
Protrusion air is interfered to flow to so that air so that air encounters in flow process changes former direction of travel after protrusion
Chamber inner wall is come into full contact with as far as possible to take away more heats in chamber.In this way, the heat that light source module group 120 generates is through leading
Hot silica gel is transmitted to pedestal 111.The surface of 111 thermal contact conductance silica gel side of pedestal is heated.Due to the LED in light source module group 120
Chip is arranged using matrix-style, i.e., each LED chip is distributed in the different location on pedestal 111.Heat is generated when LED chip shines
When amount, heat will be transmitted to the pedestal 111 contacted with LED chip.On pedestal 111 with the temperature of LED chip contact portion
Will be higher than being not in contact with LED chip part, and indirectly reflect in 111 inside of pedestal, i.e., since 111 inside of pedestal is closed
Hollow cavity, and with first chamber, second chamber and the third chamber of being interconnected, situation is heated not in each chamber
When equal, the indoor air of chamber generates disturbance because of uneven heating, the high air of chamber indoor temperature by the air exchange low with temperature,
And in each chamber indoor moveable, and entire pedestal 111 will be diffused on pedestal 111 with the temperature of LED chip contact portion, and dissipated
It is especially suitable to the heat damages pedestal 111 for preventing LED chip to generate around being transferred heat under the action of backing 112
The case where closing the LED chip dispersed arrangement installation for generating heat source.
In order to which cooling fin 112 is mounted on 111 surrounding of pedestal, for example, 111 surrounding of pedestal is additionally provided with engagement position, for example,
Engagement position is several slots, and cooling fin 112 is fixed on pedestal 111 by way of eye-splice.In the present embodiment, engagement position is sintering
Point, cooling fin 112 are integrally formed with pedestal 111 by way of sintering.Since eye-splice mode and sintering processing can make to dissipate
Backing 112 comes into full contact with pedestal 111, reduces air between the two, prevents air from hindering heat in cooling fin 112 and pedestal
Transmission between 111 contact surface.In this way, by the way that cooling fin 112 is mounted on 111 surrounding of pedestal, when heat transfer to pedestal 111
When, pedestal 111 can conduct heat to surrounding by several cooling fins 112.
To increase the radiating efficiency of cooling fin 112, cooling fin 112 is using thermal coefficient high metal or metal compound
Object, for example, using alumal or metallic copper.For another example, each cooling fin 112 opens up wearing for several perforation 112 both ends of cooling fin
Hole, i.e., perforation be opened in cooling fin 112 along the length direction of cooling fin 112 namely cooling fin 112 be hollow piece
Shape, hollow space penetrate through cooling fin 112 both ends, depending on the shape of the shape of perforation with cooling fin 112, in this way, several perforation
The contact area that cooling fin 112 and air can be increased, to improve the radiating efficiency of cooling fin 112.For another example, each cooling fin
112 be thin cylinder, and each thin cylinder is arranged around pedestal 111, in this way, several thin cylinders can increase cooling fin 112
With the contact area of air, it can equally increase the radiating efficiency of cooling fin 112.
Referring to Fig. 6, in order to reach better heat dissipation effect, radiating subassembly 110 includes radiating module 115, for connecing
Driving force is generated behind energization source to force driving air movement and take away heat.For example, radiating module 115 is arranged in radiating subassembly
The side of 110 backlight module 120.Referring to Fig. 7, radiating module 115 includes shell 115a, vibrating membrane 115b, driving
Chip 115c, several gas outlet 115d and several air inlet 115e, vibrating membrane 115b, driving chip 115c, several gas outlets
115d and several air inlet 115e is arranged on shell 115a, also, air inlet 115e and gas outlet 115d correspondences are all arranged
There is check-valves 115f.Its working method is：Driving vibrating membrane 115b generates vibration, vibrating membrane 115b after driving chip 115c is powered
Generating rising edge after vibrating in its vibration forces the air in drive shell 115a to be flowed out from gas outlet 115d, in its vibration
Failing edge forces the air outside drive shell 115a to enter from air inlet 115e so that the air flowed out from gas outlet 115d and week
The air enclosed generates forced convertion, to take away the heat around radiating subassembly 110 rapidly.
In order to make radiating module 115 generate more strong driving force, for example, shell 115a is round or rectangular, adopt
It is made of hard material, for example, using metal or rigid plastics.Preferably, shell 115a is the modeling of circular rigid insulation
Material material is made, inner hollow sealing, in this way, rigid plastics can ensure that vibrating membrane 115b is that entire radiating module 115 is unique
The place for generating vibration, so that air is successfully flowed from several gas outlet 115d and several air inlet 115e.
The through-hole of installation vibrating membrane 115b is offered on shell 115a, vibrating membrane 115b is mounted on along the sealed around of through-hole
On shell 115a, the edge that vibrating membrane 115b is contacted with through-hole is sealed processing by fluid sealant, for example, using silicon rubber,
Polysulfide rubber, neoprene and epoxy resin sealant etc..To reduce interference of the external object to vibrating membrane 115b, vibrating membrane
115b is mounted on the side inside the close shell 115a of through-hole, also, through-hole is also set far from the other side inside shell 115a
It is equipped with the parting bead equidistantly arranged, is on the one hand divulged information, the external damage to vibrating membrane 115b on the other hand can be effectively prevent, from
And ensure the normal work of vibrating membrane 115b.
Vibrating membrane 115b is along the sealed around after shell 115a of through-hole, driving chip 115c connection vibrating membranes 115b
And it is fixed on outside shell 115a.Driving chip 115c is additionally provided with conductor wire, after driving chip 115c connection vibrating membranes 115b
It is connected to external power supply by conductor wire.For example, conductor wire is electrically in parallel with light source module group 120.In this way, working as light source module group 120
When being powered on, vibrating membrane 115b is also powered on, you can synchronous to be illuminated and radiated.
Several gas outlet 115d are opened in the region of the gap location between two cooling fins 112 on shell 115a, i.e.,
Extending direction of the gas outlet 115d airflow directions along cooling fin 112 so that the air on 112 surface of cooling fin generate forced convertion with
The heat of cooling fin 112 is taken away.Several air inlet 115e are opened in the side in 112 direction of vertical fins of shell 115a,
That is air inlet 115e is opened in the side of the shell 115a far from cooling fin 112 and pedestal 111 so that from air inlet 115e into
The air entered is cold wind, to increase efficiency.Each gas outlet 115d and air inlet 115e is provided with check-valves 115f, also, each
The airflow direction of the check-valves 115f of gas outlet 115d is by being directed toward outside shell 115a in shell 115a, and each air inlet 115e's stops
The airflow direction for returning valve 115f is by being directed toward in shell 115a outside shell 115a.By hydrodynamics formula：Q=HA Δ T,
In, the heat that Q is taken away by thermal convection current, H is coefficient of heat convection value (Hest Transfer Coefficient), and it is right that A represents heat
" effective " contact area when stream occurs, Δ T represent the temperature difference of the surface of solids and regional fluid (Local Ambient), by
This is it is found that can greatly improve the heat dissipation effect of radiating subassembly 110 using radiating module 115.
Referring to Fig. 8, in order to further increase the radiating efficiency of radiating subassembly 110, the gas outlet 115d of radiating module 115
With the chamber of pedestal 111, also, the chamber of pedestal 111 is also connected to the chamber of cooling fin 112.For example, radiating module 115
Open up first chamber, the second chamber for being corresponded respectively there are three gas outlet 115d, three gas outlet 115d and being connected to pedestal 111
And second chamber, first chamber, second chamber and the third chamber of pedestal 111 are additionally provided with several and cooling fin 112 perforation
The engaging hole of connection.That is gas outlet 115d generates the sky in the perforation of the chamber and cooling fin 112 of forcing air stream drives pedestal 111
Gas convection current, to achieve the effect that improve radiating efficiency.Specially：When radiating module 115 works, vibrating membrane 115b energization works
Make, when vibrating, air is flowed into from air inlet 115e and flowed out from gas outlet 115d, and the air flowed out from gas outlet 115d enters
The chamber of pedestal 111, due to vibrating membrane 115b continue workings, air continues into the chamber of pedestal 111, into pedestal 111
The air of chamber subsequently flows into the perforation of cooling fin 112, and last air is flowed out with heat from the perforation of cooling fin 112, from
And realize heat dissipation in chamber and perforated inner.At the same time, other not no chambers with pedestal 111 of radiating module 115
Gas outlet 115d force the air of 112 periphery of air stream drives cooling fins that convection current occurs by generation, to outside cooling fin 112
Realize heat dissipation in portion.In this way, from the outside of the perforated inner combination cooling fin 112 of the chamber and cooling fin 112 of pedestal 111 together into
Row heat dissipation, greatly improves the radiating efficiency of LED lamp, and then improve the service life and other performances of LED lamp,
It is highly practical, it is easy to spread.
Light source module group 120 includes pcb board and several LED chips, and each LED chip is distributed at matrix arrangement on pcb board,
Pcb board is fixedly connected on by adhesive in the connection position of pedestal 111.For example, light source module group 120 uses COB light source, to overcome
The defect of traditional LED lamp pearl realizes flat display light source, meanwhile, it is more convenient succinct installing, and cost control is more
It is low.For another example, light source module group 120 uses LED patch modules, that is, is burn-on again on PCB electric lead with patch type LED lamp bead Surface Mount
The component of composition so that light source module group 120 has the advantages that light emitting angle is big, brightness is high, light decay is low etc., applied widely.
Side cover 130 is made of hard heat-conducting plastic, and to be hollow rectangular or cylindrical, concrete shape is according to heat dissipation
The shape of component 110 and light source module group 120 and be adapted to.In order to increase the heat-sinking capability in terms of heat radiation of side cover 130, example
Such as, a coating is set on the side wall inside the side cover, and using bottle-green paint, either pigment or use have this to coating
Body material is bottle-green material, for example, chrome oxide green.For another example, the thickness of the coating is 0.1mm.For another example, in side cover 130
Bottle-green paint or smearing bottle green pigment are sprayed on the side wall in portion, meanwhile, basal part is also connected with radiating subassembly 110, in this way, light
The heat of the luminous production of source module 120 can also be distributed partial heat to surrounding via side cover 130 by way of heat radiation.
In order to reach different illumination effects, the top position of 120 side of separate light source module group of side cover 130 is additionally provided with
The clamping position of diffusion sheet 140 is installed, diffusion sheet 140 is connected and fixed in the top of side cover 130.For example, the base material choosing of diffusion sheet 140
Select the high material of light transmission rate, such as PET/PC/PMMA.
The LED lamp either used outdoors outdoors is installed in order to prevent to be damaged by foreign object or rainwater, LED lamp is also
It is provided with a cover board 150, cover board 150 and the ontology 100 of frame structure coordinate light source module group 120, side cover 130, diffusion sheet 140
Deng cladding in wherein sky, also, cover board 150 is used to use transparent glass or other light saturating through the middle part of the one side wall of light
The high material of rate is crossed, LED light of the light transmission from light source module group 120 is used for, in this way, light on the one hand can be penetrated, on the other hand may be used
As a protective layer, to be isolated from the outside to LED lamp to prevent from immersing damage light source by foreign object damage or rainwater
The components such as module 120.In addition, 150 surrounding of cover board is provided with the mounting hole coordinated with installation position 101, it is used for 150 spiral shell of cover board
It is connected on ontology 100.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (1)
1. a kind of LED lamp, including ontology and be connected in turn on the ontology radiating subassembly, light source module group, side cover, diffusion
Piece and cover board, which is characterized in that
It is provided with installation position on the ontology, for installing the radiating subassembly；
The radiating subassembly includes pedestal and the cooling fin for being connected to the pedestal surrounding；
It is provided with connection position on the pedestal, for connecting the light source module group；
The side cover is arranged around the light source module group and is fixed in the light source module group；
The diffusion sheet is fixed on one end far from the light source module group of the side cover；
The cover board coordinates the ontology, is used for the radiating subassembly, the light source module group, the side cover and the diffusion
Piece is fixed between the cover board and the ontology；
The side far from the radiating subassembly is provided with interconnecting piece on the ontology；
It is provided with the portion of lifting on the ontology, for lifting ontology, the portion of lifting is a plate semicircular ring, the plate semicircle
Ring is set to the side of the ontology；
The pedestal is rectangular aluminum alloy base, and the susceptor surface applies the uniform heat conductive silica gel of last layer, the light source die
Group is bonded on the heat conductive silica gel of the susceptor surface；
Heat conductive silica gel thickness is 0.01mm and is equably applied on pedestal that pedestal surrounding is additionally provided with vertical feet and upwardly extends
Limited block, light source module group around limited block be arranged in the base between region；
The installation position is set to the different direction positioned at same side of the ontology, and the installation position is four internal threads
Hole, and each female screw hole is opened in the quadrangle of the ontology respectively；
It is provided with power interface on the ontology, for connecting external power supply；
It is additionally provided with power supply over-current and -load protector on the ontology, is arranged between light source module group and power interface；
The portion of lifting, which welds or is spirally connected, to be fixed on the ontology；
The light source module group includes pcb board, and the pcb board is connected to the connection position by adhesive；
The light source module group includes several LED chips, and each LED chip is at matrix arrangement on the pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510051502.1A CN104676554B (en) | 2015-01-30 | 2015-01-30 | Led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510051502.1A CN104676554B (en) | 2015-01-30 | 2015-01-30 | Led lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104676554A CN104676554A (en) | 2015-06-03 |
| CN104676554B true CN104676554B (en) | 2018-07-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510051502.1A Active CN104676554B (en) | 2015-01-30 | 2015-01-30 | Led lamp |
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| Country | Link |
|---|---|
| CN (1) | CN104676554B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105402657A (en) * | 2015-12-04 | 2016-03-16 | 李小鹏 | Energy-saving LED ceiling lamp |
| CN110043814B (en) * | 2019-03-20 | 2020-08-28 | 浙江前程照明有限公司 | LED lamp with LLC series resonance circuit |
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| CN102052584A (en) * | 2009-10-29 | 2011-05-11 | 富士迈半导体精密工业（上海）有限公司 | Illumination device |
| CN201975622U (en) * | 2011-03-25 | 2011-09-14 | 广西贵港东森科技有限公司 | Extension cord |
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| CN202708740U (en) * | 2012-07-30 | 2013-01-30 | 鸿进科技股份有限公司 | Bulb structure and radiating device of bulb structure |
| CN202834955U (en) * | 2012-11-05 | 2013-03-27 | 陈少藩 | LED light source module |
| CN203571473U (en) * | 2013-10-10 | 2014-04-30 | 四川新力光源股份有限公司 | LED panel lamp |
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2015
- 2015-01-30 CN CN201510051502.1A patent/CN104676554B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102052584A (en) * | 2009-10-29 | 2011-05-11 | 富士迈半导体精密工业（上海）有限公司 | Illumination device |
| CN201975622U (en) * | 2011-03-25 | 2011-09-14 | 广西贵港东森科技有限公司 | Extension cord |
| CN202674968U (en) * | 2012-07-12 | 2013-01-16 | 东莞市思拓达光电科技有限公司 | LED (Light-Emitting Diode) lamp with heat radiation by seepage |
| CN202708740U (en) * | 2012-07-30 | 2013-01-30 | 鸿进科技股份有限公司 | Bulb structure and radiating device of bulb structure |
| CN202834955U (en) * | 2012-11-05 | 2013-03-27 | 陈少藩 | LED light source module |
| CN203571473U (en) * | 2013-10-10 | 2014-04-30 | 四川新力光源股份有限公司 | LED panel lamp |
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| Publication number | Publication date |
|---|---|
| CN104676554A (en) | 2015-06-03 |
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