CN105221970B - A kind of water circulation cooling LED light - Google Patents

A kind of water circulation cooling LED light Download PDF

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Publication number
CN105221970B
CN105221970B CN201510729174.6A CN201510729174A CN105221970B CN 105221970 B CN105221970 B CN 105221970B CN 201510729174 A CN201510729174 A CN 201510729174A CN 105221970 B CN105221970 B CN 105221970B
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water
radiator
cooling fin
led
water inlet
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CN105221970A (en
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严圣军
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JIANGSU TIWIN OPTO-ELECTRONICS TECHNOLOGY Co Ltd
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JIANGSU TIWIN OPTO-ELECTRONICS TECHNOLOGY Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention discloses a kind of water circulation cooling LED light, including LED wafer (1), connecting line (2), lens (3), LED chip substrate (5), system circuit board (6), cooling fin (7), the radiator (8) for heat dissipation is equipped with below cooling fin (7), the water inlet (9) of radiator (8) is located at immediately below radiator (8), radiator (8) is equipped with more than two water outlets (10), and water outlet (10) is uniformly distributed in radiator (8) side.The advantageous effect of this patent is:Water inlet is located at underface, water outlet is located at side, flow enters from below, surrounding flows out, it is flowed so that the lower water of temperature is formed from the centre of cooling fin to both sides, takes away the heat on cooling fin, realize the uniform heat absorption of flow, the heat absorption efficiency of flow is improved, ensures that the holding of each regional temperature of cooling fin is identical and stablizes.

Description

A kind of water circulation cooling LED light
Technical field
The present invention relates to lighting area more particularly to a kind of water circulation cooling LED light.
Background technology
Lighting sources of the LED as a new generation, compared to conventional light source, with making, long lifespan, low in energy consumption, brightness is high, volume The advantages such as small, thus receive more and more attention.LED chip just develops towards small size and high-power both direction, still Its luminous efficiency only has 10%-20% at present, that is to say, that has the up to electric energy of 80%-90% to be converted into heat.Mesh Preceding great power LED (the power for being applied to illumination>1W) mostly in 1mm × 1mm or more, heat flow density is more than chip size 100W/cm, if the heat of fruit chip cannot distribute in time, the junction temperature of chip is excessively high to reduce its luminous efficiency and can By property, chip aging can be made even to fail, this is the important bottleneck for restricting the development of large power white light LED light source.In order to ensure LED The normal work and use service life of device generally requires junction temperature to be no more than 80 DEG C.To realize the scale of great power LED Using must just solve the problem of its heat dissipation problem for this respect, either from internal material or encapsulation or external auxiliary Tool has carried out many researchs with regard to this both at home and abroad.
As the application for a patent for invention of Publication No. CN102606896A discloses a kind of water circulation cooling LED lamp, including Lamp body is equipped with the LED for illumination in the light-source chamber of lamp body, which further includes that the water cycle for radiating to lamps and lanterns dissipates Thermal, the water circulation heat radiation device are nested between lamp body and ambient atmosphere.Nested water cycle on lamp body on lamps and lanterns Radiator, a part are arranged in light-source chamber, are close to LED, for heat exchange in light-source chamber, the exposed air of another part In, for carrying out heat exchange with the external world, is circulated by water in water circulation heat radiation device, accelerate heat exchange, reduce lamps and lanterns Temperature in light-source chamber.Water becomes steam after being heated in the water circulation heat radiation device, and the boiling point of water is arranged in circulating system It is 79 DEG C, very high, operating difficulties is required to the sealing performance of circulating system.
For another example the application for a patent for invention of Publication No. CN103162146A discloses a kind of heat storage type LED lamp, including LED Light source substrate, the one-time formed embedded aluminum hull of non-metal shell of setting and rear liquid storing barrel after light source substrate, nonmetallic outer Heat accumulation liquid is placed in the cavity that shell is surrounded with embedded aluminum hull, be arranged one in liquid storing barrel shell nearside controls with ambient light illumination The built-in drive of LED power.The inventive structure is reasonable, shell using nonmetallic materials make as carbon fiber, glass fibre, ABS etc. can effectively reduce manufacturing cost, and improve lamps and lanterns resistance to corrosion, and coastal area or high corrosion environment can be made to use LED Lamps and lanterns are carefree.But the lamps and lanterns can not be applicable in the environment of steady illumination effect, have certain limitation.
Invention content
For overcome heat dissipation effect existing in the prior art is poor, shed heat waste the problems such as, the present invention provides one kind Water circulation cooling LED light, including LED wafer, connecting line, lens, LED chip substrate, system circuit board, cooling fin, the company Wiring connects the LED wafer and the LED chip substrate, the LED wafer, LED chip substrate, system circuit board and described Cooling fin is sequentially connected from top to bottom, and the lens are fixed in the LED chip substrate, and the LED wafer is encapsulated in institute The inner space that lens are formed with the LED chip substrate is stated, the radiator of heat dissipation is equipped with below the cooling fin, it is described to dissipate The water inlet of thermal is located at immediately below the radiator, and the radiator is equipped with more than two water outlets, it is described go out The mouth of a river is uniformly distributed in the radiator side.
Flow enters from below, surrounding outflow so that and the lower water of temperature is formed from the centre of cooling fin to both sides to be flowed, The heat on cooling fin is taken away, realizes the uniform heat absorption of flow, improves the heat absorption efficiency of flow, ensures each regional temperature of cooling fin Holding it is identical and stablize.
Preferably, the cooling fin is equipped with more than two thermal columns, Mei Gesuo backwards to the side of the system circuit board It states thermal column and is equipped with more than one through-hole.
Thermal column is set on a heat sink, can increase the contact area of cooling fin and flow, through-hole is set on thermal column, it can To realize the smooth outflow among flow to both sides, stablize the flow velocity of water body, improves the uniformity of flow heat absorption.
Preferably, the through-hole on the thermal column is in the same horizontal position, and the through-hole midpoint is from the thermal column The distance of root is the 1/4-1/3 of the thermal column height.In this way so that flow is in the position change side close to thermal column root To pressure of the balanced flow to cooling fin.
Preferably, be connected to by main pipeline between the water outlet and the water inlet, connect the water outlet with it is described The main pipeline of water inlet is equipped with water pump.The water velocity for adjusting the power controllable inlet and outlet of water pump, goes out here 3 or 4, preferably 4 can be arranged in the mouth of a river, and the area of section of water inlet is 4-8 times of water outlet, preferably 5 times so that water outlet The speed of mouth is slightly greater than the speed of water inlet.
Preferably, the thermal column root is equipped with the first temperature sensor, first temperature sensor and the water pump It is connected.When the temperature of thermal column root reaches setting value, at preferably 75 DEG C, water pump can accelerate water velocity, to make thermal column The temperature of root is reduced to 75 DEG C hereinafter, it is preferred that 70 DEG C or so.
Preferably, the main pipeline for connecting the water outlet and the water inlet is equipped with cold water inlet road and hot water effluent Pipeline, the hot water effluent's pipeline are located at the water outlet position, and the cold water inlet road and the water pump are positioned at described The hot water effluent's pipeline and the main pipeline junction are equipped with flowing water Valve at water inlet position, the cold water inlet road with The main pipeline junction is equipped with inlet valve.
Preferably, the water outlet is equipped with second temperature sensor, the second temperature sensor and the outlet valve Door, inlet valve connection.When second temperature sensor detects that outlet temperature reaches setting value, at preferably 70 DEG C, beat Output penstock and inlet valve, continue to flow out from hot water effluent's pipeline, cold water from when waterpipe enter, preferred cold water here Water temperature is 20-30 DEG C, when water outlet coolant-temperature gage is less than 65 DEG C, closes flowing water Valve and inlet valve.
Preferably, between the LED wafer and the LED chip substrate, the LED chip substrate and the circuit system Between plate, pass through one layer of cured heat conduction glue connection between the system circuit board and the cooling fin.It can be with by heat-conducting glue Increase the compactness connected between chip and substrate, substrate and circuit board, circuit board and cooling fin, improve heat-conducting area, realizes High-efficiency heat conduction.
Preferably, the heat-conducting glue by weight percentage, including following components:The terminal methyl vinyl of 20-30% Siloxanes, 20-30% hyperbranched epoxy resins, 3-8% nano aluminium oxides, 3-8% copper powders, 3-8% silver powder, 2-7% aluminium powders, 1- The solvent of 2% crosslinking agent, 30-50%.Pass through the conjunction of hyperbranched epoxy resin, terminal methyl vinylsiloxane and nano aluminium oxide Reason collocation, can effectively improve the binding performance between heat-conducting glue and substrate, chip, circuit board and cooling fin, improve it and lead It is hot, a certain amount of copper powder, silver are added, effect of the nano aluminium oxide in heat-conducting glue is further expanded, improves solidification Whole heat-conducting effect afterwards.
Preferably, the cooling fin is copper alloy, by weight percentage, including following composition:97-99% copper, 0- 0.5% silver medal, 0-0.5% aluminium titanium boron and 0-3% metal impurities.Selecting rational copper alloy proportioning, and by with a small amount of silver With aluminium titanium boron, the thinning effect and heat-conducting effect of copper alloy are improved, metal impurities therein are aluminium, iron, tin etc..
Preferably, the section of the water inlet and the water outlet is ellipse.
Preferably, the water inlet is equipped with one section of changeover portion being smoothly connected with the radiator, the changeover portion Area gradually increases from top to bottom.
Preferably, the water inlet is equipped with the third temperature sensor for detecting water temperature, the third temperature sensing Device is connected with the water pump.
Compared with prior art, the beneficial effects of the invention are as follows:
(1) water inlet is located at underface, water outlet is located at side, and flow enters from below, surrounding outflow so that temperature Lower water is formed from the centre of cooling fin to both sides to be flowed, and is taken away the heat on cooling fin, is realized the uniform heat absorption of flow, carry The heat absorption efficiency of high flow ensures that the holding of each regional temperature of cooling fin is identical and stablizes;
(2) thermal column is set on a heat sink, can increase the contact area of cooling fin and flow, is set on thermal column logical The smooth outflow to both sides among flow may be implemented in hole, stablizes the flow velocity of water body, improves the uniformity of flow heat absorption;
(3) it can be increased by heat-conducting glue and to be connected between chip and substrate, substrate and circuit board, circuit board and cooling fin Compactness improves heat-conducting area, realizes high-efficiency heat conduction;Pass through hyperbranched epoxy resin, terminal methyl vinylsiloxane and nanometer Aluminium oxide it is reasonably combined, the associativity between heat-conducting glue and substrate, chip, circuit board and cooling fin can be effectively improved Can, its thermal conductivity is improved, a certain amount of copper powder, silver are added, further expands effect of the nano aluminium oxide in heat-conducting glue, Improve heat-conducting effect whole after curing;
(4) cooling fin is by selecting rational copper alloy to match, and with a small amount of silver and aluminium titanium boron, improve copper alloy Thinning effect and heat-conducting effect;
(5) hot water temperature flowed out from hot water effluent's pipeline is 75 DEG C, just can be used for daily bathing etc., plays saving The effect of electricity consumption;The water temperature entered from cold water inlet is ordinary temperature, and source is sufficient, easy to operate.
Description of the drawings
Fig. 1 is the present invention preferably front section view;
Fig. 2 is the present invention preferably upward view;
Fig. 3 is the present invention preferably flow schematic diagram.
Specific implementation mode
With reference to embodiments, the present invention will be described in further detail.It should be appreciated that specific reality described herein Example is applied only to explain the present invention, is not intended to limit the present invention.
Be respectively the present invention preferably front section view and upward view as shown in Figs. 1-2, including LED wafer 1, connecting line 2, Lens 3, LED chip substrate 5, system circuit board 6, cooling fin 7, connecting line 2 connect LED wafer 1 and LED chip substrate 5, LED Chip 1, LED chip substrate 5, system circuit board 6 and cooling fin 7 are sequentially connected from top to bottom, and lens 3 are fixed on LED wafer base On plate 5, LED wafer 1 is encapsulated in the inner space that lens 3 are formed with LED chip substrate 5,7 lower section of cooling fin is equipped with heat dissipation The water inlet 9 of radiator 8, radiator 8 is located at immediately below radiator 8, and radiator 8 is equipped with more than two water outlets 10, water outlet 10 is uniformly distributed in 8 side of the radiator, and water inlet 9 and water outlet mouth-shaped are ellipse.
Flow enters from below, surrounding outflow so that and the lower water of temperature is formed from the centre of cooling fin to both sides to be flowed, The heat on cooling fin is taken away, realizes the uniform heat absorption of flow, improves the heat absorption efficiency of flow, ensures each regional temperature of cooling fin Holding it is identical and stablize.
Cooling fin 7 is equipped with more than two thermal columns 71 backwards to the side of system circuit board 6, and each thermal column 71 is equipped with More than one through-hole 12.Thermal column is set on a heat sink, can increase the contact area of cooling fin and flow, on thermal column If through-hole, the smooth outflow to both sides among flow may be implemented, stablize the flow velocity of water body, improve the uniformity of flow heat absorption.
Through-hole 12 on thermal column 71 is in the same horizontal position, and the distance of discrete 71 root of plume in 12 midpoint of through-hole is The 0.3 of 71 height of the thermal column.Through-hole can also set two row or multi-row, it is adjacent it is two rows of by distance it is equal.As shown in Figure 3 It for preferably flow schematic diagram of the invention, is connected to by main pipeline 13 between water outlet 10 and the water inlet 9, connects water outlet 10 are equipped with water pump 14 with the main pipeline of water inlet 9.
71 root of thermal column is equipped with the first temperature sensor 15, and the first temperature sensor 15 is connected with water pump 14.
It connects water outlet 10 and the main pipeline 13 of water inlet 9 is equipped with cold water inlet road 16 and hot water effluent's pipeline 17, Hot water effluent's pipeline 17 is located at 10 position of the water outlet, and cold water inlet road 16 and the water pump 14 are located at the water inlet At 9 positions, hot water effluent's pipeline 17 is equipped with flowing water Valve 18, cold water inlet road 16 and main pipeline 13 with 13 junction of main pipeline Junction is equipped with inlet valve 19.
Water outlet 10 is equipped with second temperature sensor 20, second temperature sensor 20 and flowing water Valve 18, inlet valve 19 connections.Between LED wafer 1 and LED chip substrate 5, between LED chip substrate 5 and system circuit board 6, system circuit board 6 with It is connected by one layer of cured heat-conducting glue 4 between cooling fin 7.
The section of water inlet 9 and the water outlet 10 is ellipse;It is equipped with one section at water inlet 9 and radiator 8 is smooth The changeover portion of connection, area gradually increases changeover portion from top to bottom.The third temperature for detecting water temperature is equipped at water inlet 9 to pass Sensor, third temperature sensor are connected with the water pump 14.
Heat-conducting glue 4 by weight percentage, including following components:25% terminal methyl vinylsiloxane 20% surpasses Branch epoxy resins, 5% nano aluminium oxide, 5% copper powder, 5% silver powder, 5% aluminium powder, 1% crosslinking agent, 34% solvent.
Heat-conducting glue 4 by weight percentage, can be with composed of the following components:20% terminal methyl vinyl silica Alkane, 25% hyperbranched epoxy resin, 4% nano aluminium oxide, 6% copper powder, 4% silver powder, 5% aluminium powder, 1% crosslinking agent, 35% Solvent.
Cooling fin 7 is copper alloy, by weight percentage, including following composition:99% bronze medal, 0.3% silver medal, 0.3% aluminium titanium Boron and 0.4% metal impurities.
Cooling fin 7 is copper alloy can also be made of by weight percentage following composition:98% bronze medal, 0.5% silver medal, 0.5% aluminium titanium boron and 1% metal impurities.
The preferred embodiment of the present invention has shown and described in above description, as previously described, it should be understood that the present invention is not office Be limited to form disclosed herein, be not to be taken as excluding other embodiments, and can be used for various other combinations, modification and Environment, and can be changed by the above teachings or related fields of technology or knowledge in the scope of the invention is set forth herein It is dynamic.And changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, then it all should be appended by the present invention In scope of the claims.

Claims (8)

1. a kind of water circulation cooling LED light, including LED wafer (1), connecting line (2), lens (3), LED chip substrate (5), it is Unite circuit board (6), cooling fin (7), connecting line (2) connection LED wafer (1) and the LED chip substrate (5), institute LED wafer (1), LED chip substrate (5), system circuit board (6) and the cooling fin (7) is stated to be sequentially connected from top to bottom, it is described Lens (3) are fixed in the LED chip substrate (5), and the LED wafer (1) is encapsulated in the lens (3) and the LED The inner space that wafer substrate (5) is formed, which is characterized in that the radiator for heat dissipation is equipped with below the cooling fin (7) (8), the water inlet (9) of the radiator (8) is located at immediately below the radiator (8), and the radiator (8) is equipped with two A above water outlet (10), the water outlet (10) are uniformly distributed in the radiator (8) side;The water inlet (9) Place is equipped with one section of changeover portion being smoothly connected with the radiator (8), and area gradually increases the changeover portion from top to bottom;Institute It states cooling fin (7) and is equipped with more than two thermal columns (71), the radiator backwards to the side of the system circuit board (6) (8) what the thermal column (71) and on cooling fin (7) was connected to, each thermal column (71) is equipped with more than one through-hole (12), between the LED wafer (1) and the LED chip substrate (5), the LED chip substrate (5) and the circuit system It is connect between plate (6), between the system circuit board (6) and the cooling fin (7) by one layer of cured heat-conducting glue (4).
2. a kind of water circulation cooling LED light as described in claim 1, which is characterized in that the through-hole on the thermal column (71) (12) it is in the same horizontal position, through-hole (12) midpoint is the thermal column with a distance from the thermal column (71) root (71) 1/4-1/3 of height.
3. a kind of water circulation cooling LED light as claimed in claim 2, which is characterized in that the water outlet (10) with it is described into It is connected to by main pipeline (13) between the mouth of a river (9), connects the water outlet (10) and the main pipeline of the water inlet (9) is equipped with Water pump (14).
4. a kind of water circulation cooling LED light as claimed in claim 3, which is characterized in that thermal column (71) root is equipped with First temperature sensor (15), first temperature sensor (15) are connected with the water pump (14).
5. a kind of water circulation cooling LED light as claimed in claim 4, which is characterized in that connect the water outlet (10) and institute The main pipeline (13) for stating water inlet (9) is equipped with cold water inlet road (16) and hot water effluent's pipeline (17), the hot water effluent Pipeline (17) is located at the water outlet (10) position, the cold water inlet road (16) and the water pump (14) be located at it is described into At the mouth of a river (9) position, the hot water effluent's pipeline (17) is equipped with flowing water Valve (18) with the main pipeline (13) junction, described Cold water inlet road (16) is equipped with inlet valve (19) with the main pipeline (13) junction.
6. a kind of water circulation cooling LED light as claimed in claim 5, which is characterized in that the water outlet (10) is equipped with the Two temperature sensors (20), the second temperature sensor (20) connect with the flowing water Valve (18), the inlet valve (19) It connects.
7. a kind of water circulation cooling LED light as claimed in claim 3, which is characterized in that the water inlet (9) and the water outlet The section of mouth (10) is ellipse.
8. a kind of water circulation cooling LED light as claimed in claim 7, which is characterized in that be equipped with and be used at the water inlet (9) The third temperature sensor of water temperature is detected, the third temperature sensor is connected with the water pump (14).
CN201510729174.6A 2015-10-30 2015-10-30 A kind of water circulation cooling LED light Active CN105221970B (en)

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Application Number Priority Date Filing Date Title
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CN108916692A (en) * 2018-10-08 2018-11-30 广东奥普特科技股份有限公司 A kind of linear light emitting device of water cooling

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