CN205137096U - Hydrologic cycle heat dissipation LED lamp - Google Patents
Hydrologic cycle heat dissipation LED lamp Download PDFInfo
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- CN205137096U CN205137096U CN201520859112.2U CN201520859112U CN205137096U CN 205137096 U CN205137096 U CN 205137096U CN 201520859112 U CN201520859112 U CN 201520859112U CN 205137096 U CN205137096 U CN 205137096U
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- water
- fin
- delivery port
- water inlet
- led wafer
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Abstract
The utility model discloses a hydrologic cycle heat dissipation LED lamp, including LED wafer (1), connecting wire (2), lens (3), LED wafer base plate (5), system circuit board (6), fin (7), fin (7) below is equipped with and is used for radiating heat abstractor (8), and under water inlet (9) of heat abstractor (8) were located heat abstractor (8), heat abstractor (8) were equipped with delivery port (10) more than two, delivery port (10) evenly distributed in heat abstractor (8) side. Provided is a beneficial effect is: establish the water inlet under, the delivery port is established laterally, and rivers get into from the below, flow all around for the lower water of temperature forms to both sides from the centre of fin and flows, takes away the heat on the fin, realizes the even heat absorption of rivers, improves the endothermic efficiency of rivers, guarantees that each area temperature's of fin keeps the same and stably.
Description
Technical field
The utility model relates to lighting field, particularly relates to a kind of water circulation heat radiating LED lamp.
Background technology
LED, as the lighting source of a new generation, has compared to conventional light source and makes life-span long, low in energy consumption, the advantage such as brightness is high, volume is little, thus receive increasing concern.LED chip is just towards small size and the development of high-power both direction, but its luminous efficiency only has 10%-20% at present, that is has the electric energy up to 80%-90% to be converted into heat.Be applied to great power LED (power >1W) chip size of illumination at present mostly at 1mm × more than 1mm, heat flow density has exceeded 100W/cm, heat as fruit chip can not distribute in time, the junction temperature of chip is too high can reduce its luminous efficiency and reliability, can make that chip is aging even to lose efficacy, this is the important bottleneck of restriction large power white light LED light source development.In order to ensure the normal work and use life-span of LED component, General Requirements junction temperature is no more than 80 DEG C.Scale application to realize great power LED just must solve its heat dissipation problem, for the problem of this respect, is no matter from internal material or encapsulation or external auxiliary instrument, just this has been many research both at home and abroad.
The utility application being CN102606896A as publication number discloses a kind of water circulation heat-dissipating LED lamp, comprise lamp body, LED for throwing light on is installed in the light-source chamber of lamp body, this light fixture also comprises the water circulation heat radiation device for dispelling the heat to light fixture, and this water circulation heat radiation device is nested between lamp body and ambient atmosphere.A nested water circulation heat radiation device on lamp body on light fixture, a part is arranged in light-source chamber, be close to LED, for heat exchange in light-source chamber, another part exposes in air, for carrying out heat exchange with the external world, by circulating of water in water circulation heat radiation device, accelerate heat exchange, reduce the temperature in lamp light source chamber.In this water circulation heat radiation device, water becomes steam after being heated, and the boiling point arranging water in circulating system is 79 DEG C, requires very high, operating difficulties to the sealing property of circulating system.
And for example publication number is that the utility application of CN103162146A discloses a kind of heat storage type LED lamp, comprise LED light source substrate, non-metal shell one-time formed embedded aluminum hull with rear liquid storing barrel is set after light source substrate, in the cavity that non-metal shell and embedded aluminum hull surround, place heat accumulation liquid, a built-in drive with ambient light illumination control LED power is set at liquid storing barrel shell nearside.This utility model is rational in infrastructure, and shell adopts nonmetallic materials to make as carbon fiber, glass fibre, ABS etc., effectively can reduce manufacturing cost, and improve light fixture resistance to corrosion, and coastal area or high corrosive environment can be made to use LED lamp carefree.But this light fixture cannot be applicable to need, in the environment of steady illumination effect, to have certain limitation.
Utility model content
Poor for overcoming the radiating effect existed in prior art, shed the problems such as heat waste, the utility model provides a kind of water circulation heat radiating LED lamp, comprise LED wafer, connecting line, lens, LED wafer substrate, system circuit board, fin, described connecting line connects described LED wafer and described LED wafer substrate, described LED wafer, LED wafer substrate, system circuit board is connected from top to bottom successively with described fin, described lens are fixed on described LED wafer substrate, described LED wafer is encapsulated in the inner space that described lens and described LED wafer substrate are formed, it is characterized in that, the heat abstractor of heat radiation is provided with below described fin, the water inlet of described heat abstractor is positioned at immediately below described heat abstractor, described heat abstractor is provided with plural delivery port, described delivery port is uniformly distributed in described heat abstractor side.
Current enter from below, and surrounding flows out, and the water making temperature lower forms flowing from the centre of fin to both sides, take away the heat on fin, realize the even heat absorption of current, improve the heat absorption efficiency of current, ensure that the maintenance of each regional temperature of fin is identical and stable.
Preferably, the side of described fin described system circuit board is dorsad provided with plural thermal column, and each described thermal column is provided with more than one through hole.
Establish thermal column on a heat sink, the contact area of fin and current can be increased, thermal column establishes through hole, the smooth outflow to both sides in the middle of current can be realized, stablize the flow velocity of water body, improve the uniformity of current heat absorption.
Preferably, the through hole on described thermal column is all in same level position, and described through hole mid point is the 1/4-1/3 of described thermal column height from the distance of described thermal column root.Make current in the change direction, position near thermal column root like this, balanced current are to the pressure of fin.
Preferably, be communicated with between described delivery port with described water inlet by main pipeline, the main pipeline connecting described delivery port and described water inlet is provided with water pump.Regulate the power controllable water inlet of water pump and the water velocity of delivery port, delivery port can arrange 3 or 4 here, preferably 4, and the area of section of water inlet is 4-8 times of delivery port, preferably 5 times, makes the speed of delivery port slightly be greater than the speed of water inlet.
Preferably, described thermal column root is provided with the first temperature sensor, and described first temperature sensor is connected with described water pump.When the temperature of thermal column root reaches setting value, preferably 75 DEG C time, water pump can accelerate water velocity, thus makes the temperature of thermal column root be reduced to less than 75 DEG C, preferably about 70 DEG C.
Preferably, the main pipeline connecting described delivery port and described water inlet is provided with cold water inlet road and hot water effluent's pipeline, described hot water effluent's pipeline is positioned at described delivery port position, described cold water inlet road and described water pump are positioned at hot water effluent's pipeline described in described water inlet position place and described main pipeline junction is provided with flowing water Valve, and described cold water inlet road and described main pipeline junction are provided with inlet valve.
Preferably, described delivery port is provided with the second temperature sensor, and described second temperature sensor is connected with described flowing water Valve, described inlet valve.When the second temperature sensor detects that outlet temperature reaches setting value, preferably 70 DEG C time, open flowing water Valve and inlet valve, continue to flow out from hot water effluent's pipeline, cold water from time waterpipe enter, here preferably the water temperature of cold water is 20-30 DEG C, when delivery port coolant-temperature gage is less than 65 DEG C, closes flowing water Valve and inlet valve.
Preferably, between described LED wafer with described LED wafer substrate, described LED wafer substrate with between described system circuit board, the heat-conducting glue that solidified by one deck between described system circuit board with described fin is connected.Wafer and substrate, substrate and circuit board, the compactness that is connected between circuit board with fin can be increased by heat-conducting glue, improve heat-conducting area, realize high-efficiency heat conduction.
Preferably, described heat-conducting glue by weight percentage, comprises following component: the solvent of the terminal methyl vinylsiloxane of 20-30%, 20-30% hyperbranched epoxy resin, 3-8% nano aluminium oxide, 3-8% copper powder, 3-8% silver powder, 2-7% aluminium powder, 1-2% crosslinking agent, 30-50%.Reasonably combined by hyperbranched epoxy resin, terminal methyl vinylsiloxane and nano aluminium oxide, effectively can improve heat-conducting glue and substrate, wafer, binding ability between circuit board and fin, improve its thermal conductivity, add a certain amount of copper powder, silver again, expand the effect of nano aluminium oxide in heat-conducting glue further, heat-conducting effect overall after improve solidification.
Preferably, described fin is copper alloy, by weight percentage, comprises following composition: 97-99% copper, 0-0.5% silver, 0-0.5% aluminium titanium boron and 0-3% metal impurities.In the rational copper alloy proportioning of selection, and by with a small amount of silver and aluminium titanium boron, improve the thinning effect of copper alloy and heat-conducting effect, metal impurities are wherein aluminium, iron, tin etc.
Preferably, the cross section of described water inlet and described delivery port is oval.
Preferably, described water inlet be provided with one section with the changeover portion of described heat abstractor smooth connection, described changeover portion from top to bottom area increases gradually.
Preferably, described water inlet is provided with the three-temperature sensor for detecting water temperature, and described three-temperature sensor is connected with described water pump.
Compared with prior art, the beneficial effects of the utility model are:
(1) immediately below water inlet is located at, delivery port is located at side, current enter from below, surrounding flows out, the water making temperature lower forms flowing from the centre of fin to both sides, takes away the heat on fin, realizes the even heat absorption of current, improve the heat absorption efficiency of current, ensure that the maintenance of each regional temperature of fin is identical and stable;
(2) establish thermal column on a heat sink, the contact area of fin and current can be increased, thermal column establishes through hole, the smooth outflow to both sides in the middle of current can be realized, stablize the flow velocity of water body, improve the uniformity of current heat absorption;
(3) wafer and substrate, substrate and circuit board, the compactness that is connected between circuit board with fin can be increased by heat-conducting glue, improve heat-conducting area, realize high-efficiency heat conduction; Reasonably combined by hyperbranched epoxy resin, terminal methyl vinylsiloxane and nano aluminium oxide, effectively can improve heat-conducting glue and substrate, wafer, binding ability between circuit board and fin, improve its thermal conductivity, add a certain amount of copper powder, silver again, expand the effect of nano aluminium oxide in heat-conducting glue further, heat-conducting effect overall after improve solidification;
(4) fin by select rational copper alloy proportioning, and with a small amount of silver and aluminium titanium boron, improve thinning effect and the heat-conducting effect of copper alloy;
(5) hot water temperature of flowing out from hot water effluent's pipeline is 75 DEG C, just can be used for daily having a bath, plays the effect of using electricity wisely; The water temperature entered from cold water inlet is ordinary temperature, and source is sufficient, easy to operate.
Accompanying drawing explanation
Fig. 1 is the utility model preferably front section view;
Fig. 2 is the utility model preferably upward view;
Fig. 3 is the utility model preferably current schematic diagram.
Detailed description of the invention
Below in conjunction with embodiment, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Be respectively the utility model preferably front section view and upward view as shown in Figure 1-2, comprise LED wafer 1, connecting line 2, lens 3, LED wafer substrate 5, system circuit board 6, fin 7, connecting line 2 connects LED wafer 1 and LED wafer substrate 5, LED wafer 1, LED wafer substrate 5, system circuit board 6 is connected from top to bottom successively with fin 7, lens 3 are fixed on LED wafer substrate 5, LED wafer 1 is encapsulated in the inner space that lens 3 are formed with LED wafer substrate 5, the heat abstractor 8 of heat radiation is provided with below fin 7, the water inlet 9 of heat abstractor 8 is positioned at immediately below heat abstractor 8, heat abstractor 8 is provided with plural delivery port 10, delivery port 10 is uniformly distributed in described heat abstractor 8 side, water inlet 9 and delivery port shape are ellipse.
Current enter from below, and surrounding flows out, and the water making temperature lower forms flowing from the centre of fin to both sides, take away the heat on fin, realize the even heat absorption of current, improve the heat absorption efficiency of current, ensure that the maintenance of each regional temperature of fin is identical and stable.
The side of fin 7 system circuit board 6 is dorsad provided with plural thermal column 71, and each thermal column 71 is provided with more than one through hole 12.Establish thermal column on a heat sink, the contact area of fin and current can be increased, thermal column establishes through hole, the smooth outflow to both sides in the middle of current can be realized, stablize the flow velocity of water body, improve the uniformity of current heat absorption.
Through hole 12 on thermal column 71 is all in same level position, and the distance of through hole 12 mid point discrete plume 71 root is 0.3 of described thermal column 71 height.Through hole also can establish two row or multi-row, and adjacent two to arrange the distance passed through equal.Be illustrated in figure 3 the utility model preferably current schematic diagram, be communicated with by main pipeline 13 between delivery port 10 with described water inlet 9, connect delivery port 10 and be provided with water pump 14 with the main pipeline of water inlet 9.
Thermal column 71 root is provided with the first temperature sensor 15, first temperature sensor 15 and is connected with water pump 14.
Connect delivery port 10 and be provided with cold water inlet road 16 and hot water effluent's pipeline 17 with the main pipeline 13 of water inlet 9, hot water effluent's pipeline 17 is positioned at described delivery port 10 position, cold water inlet road 16 and described water pump 14 are positioned at described water inlet 9 position, hot water effluent's pipeline 17 and main pipeline 13 junction are provided with flowing water Valve 18, and cold water inlet road 16 and main pipeline 13 junction are provided with inlet valve 19.
Delivery port 10 is provided with the second temperature sensor 20, second temperature sensor 20 and is connected with flowing water Valve 18, inlet valve 19.The heat-conducting glue 4 solidified by one deck between LED wafer 1 with LED wafer substrate 5, between LED wafer substrate 5 with system circuit board 6, between system circuit board 6 with fin 7 is connected.
The cross section of water inlet 9 and described delivery port 10 is oval; Water inlet 9 place be provided with one section with the changeover portion of heat abstractor 8 smooth connection, changeover portion from top to bottom area increases gradually.Water inlet 9 place is provided with the three-temperature sensor for detecting water temperature, and three-temperature sensor is connected with described water pump 14.
Heat-conducting glue 4 by weight percentage, comprises following component: the terminal methyl vinylsiloxane of 25%, 20% hyperbranched epoxy resin, 5% nano aluminium oxide, 5% copper powder, 5% silver powder, 5% aluminium powder, 1% crosslinking agent, 34% solvent.
Heat-conducting glue 4 by weight percentage, can also be composed of the following components: the terminal methyl vinylsiloxane of 20%, 25% hyperbranched epoxy resin, 4% nano aluminium oxide, 6% copper powder, 4% silver powder, 5% aluminium powder, 1% crosslinking agent, 35% solvent.
Fin 7 is copper alloy, by weight percentage, comprises following composition: 99% bronze medal, 0.3% silver medal, 0.3% aluminium titanium boron and 0.4% metal impurities.
Fin 7 is copper alloy, by weight percentage, can also be made up of following composition: 98% bronze medal, 0.5% silver medal, 0.5% aluminium titanium boron and 1% metal impurities.
Above-mentioned explanation illustrate and describes preferred embodiment of the present utility model, as previously mentioned, be to be understood that the utility model is not limited to the form disclosed by this paper, should not regard the eliminating to other embodiments as, and can be used for other combinations various, amendment and environment, and can in utility model contemplated scope described herein, changed by the technology of above-mentioned instruction or association area or knowledge.And the change that those skilled in the art carry out and change do not depart from spirit and scope of the present utility model, then all should in the protection domain of the utility model claims.
Claims (10)
1. a water circulation heat radiating LED lamp, comprise LED wafer (1), connecting line (2), lens (3), LED wafer substrate (5), system circuit board (6), fin (7), described connecting line (2) connects described LED wafer (1) and described LED wafer substrate (5), described LED wafer (1), LED wafer substrate (5), system circuit board (6) is connected from top to bottom successively with described fin (7), described lens (3) are fixed on described LED wafer substrate (5), described LED wafer (1) is encapsulated in the inner space that described lens (3) are formed with described LED wafer substrate (5), it is characterized in that, described fin (7) below is provided with the heat abstractor (8) of heat radiation, the water inlet (9) of described heat abstractor (8) is positioned at immediately below described heat abstractor (8), described heat abstractor (8) is provided with plural delivery port (10), described delivery port (10) is uniformly distributed in described heat abstractor (8) side, described water inlet (9) place is provided with one section of changeover portion in smoothing junction with described heat abstractor (8), and described changeover portion from top to bottom area increases gradually.
2. a kind of water circulation heat radiating LED lamp as claimed in claim 1, it is characterized in that, the side of described fin (7) described system circuit board (6) is dorsad provided with plural thermal column (71), and each described thermal column (71) is provided with more than one through hole (12).
3. a kind of water circulation heat radiating LED lamp as claimed in claim 2, it is characterized in that, through hole (12) on described thermal column (71) is all in same level position, and described through hole (12) mid point is described thermal column (71) 1/4-1/3 highly from the distance of described thermal column (71) root.
4. a kind of water circulation heat radiating LED lamp as claimed in claim 3, it is characterized in that, be communicated with by main pipeline (13) between described delivery port (10) with described water inlet (9), connect described delivery port (10) and be provided with water pump (14) with the main pipeline of described water inlet (9).
5. a kind of water circulation heat radiating LED lamp as claimed in claim 4, it is characterized in that, described thermal column (71) root is provided with the first temperature sensor (15), and described first temperature sensor (15) is connected with described water pump (14).
6. a kind of water circulation heat radiating LED lamp as claimed in claim 5, it is characterized in that, connect described delivery port (10) and be provided with cold water inlet road (16) and hot water effluent's pipeline (17) with the main pipeline (13) of described water inlet (9), described hot water effluent's pipeline (17) is positioned at described delivery port (10) position, described cold water inlet road (16) and described water pump (14) are positioned at described water inlet (9) position, described hot water effluent's pipeline (17) and described main pipeline (13) junction are provided with flowing water Valve (18), described cold water inlet road (16) and described main pipeline (13) junction are provided with inlet valve (19).
7. a kind of water circulation heat radiating LED lamp as claimed in claim 6, it is characterized in that, described delivery port (10) is provided with the second temperature sensor (20), and described second temperature sensor (20) is connected with described flowing water Valve (18), described inlet valve (19).
8. a kind of water circulation heat radiating LED lamp as claimed in claim 1, it is characterized in that, the heat-conducting glue (4) solidified by one deck between described LED wafer (1) with described LED wafer substrate (5), between described LED wafer substrate (5) with described system circuit board (6), between described system circuit board (6) with described fin (7) is connected.
9. a kind of water circulation heat radiating LED lamp as claimed in claim 4, is characterized in that, the cross section of described water inlet (9) and described delivery port (10) is oval.
10. a kind of water circulation heat radiating LED lamp as claimed in claim 9, is characterized in that, described water inlet (9) place is provided with the three-temperature sensor for detecting water temperature, and described three-temperature sensor is connected with described water pump (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520859112.2U CN205137096U (en) | 2015-10-30 | 2015-10-30 | Hydrologic cycle heat dissipation LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520859112.2U CN205137096U (en) | 2015-10-30 | 2015-10-30 | Hydrologic cycle heat dissipation LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205137096U true CN205137096U (en) | 2016-04-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520859112.2U Expired - Fee Related CN205137096U (en) | 2015-10-30 | 2015-10-30 | Hydrologic cycle heat dissipation LED lamp |
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| Country | Link |
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| CN (1) | CN205137096U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105221970A (en) * | 2015-10-30 | 2016-01-06 | 江苏天楹之光光电科技有限公司 | A kind of water circulation heat radiating LED lamp |
-
2015
- 2015-10-30 CN CN201520859112.2U patent/CN205137096U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105221970A (en) * | 2015-10-30 | 2016-01-06 | 江苏天楹之光光电科技有限公司 | A kind of water circulation heat radiating LED lamp |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160406 Termination date: 20161030 |
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| CF01 | Termination of patent right due to non-payment of annual fee |