CN107270140A - A kind of samming and integrated heat dissipation formula LED lamp module - Google Patents
A kind of samming and integrated heat dissipation formula LED lamp module Download PDFInfo
- Publication number
- CN107270140A CN107270140A CN201710450016.6A CN201710450016A CN107270140A CN 107270140 A CN107270140 A CN 107270140A CN 201710450016 A CN201710450016 A CN 201710450016A CN 107270140 A CN107270140 A CN 107270140A
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- CN
- China
- Prior art keywords
- led lamp
- radiator structure
- heat dissipation
- lamp module
- integrated heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 16
- 238000004020 luminiscence type Methods 0.000 claims abstract description 12
- 241000218202 Coptis Species 0.000 claims description 12
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 9
- 239000000084 colloidal system Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 210000004209 hair Anatomy 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 238000013461 design Methods 0.000 abstract description 7
- 239000012530 fluid Substances 0.000 abstract description 5
- 238000012546 transfer Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract description 2
- 238000000605 extraction Methods 0.000 abstract description 2
- 229910002804 graphite Inorganic materials 0.000 abstract description 2
- 239000010439 graphite Substances 0.000 abstract description 2
- 239000006071 cream Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention relates to a kind of LED lamp, more particularly to a kind of samming and integrated heat dissipation formula LED lamp module.The device includes LED luminescence units, upper lid and radiator structure, and it is structurally characterized in that：Upper lid is integrated with radiator structure.Compared with prior art, upper lid is integrated with radiator structure, eliminates lower cover body and graphite flake, simple in construction, reduces the part of transmission heat, reduces thermal resistance, optimizes heat-transfer effect, accelerates the efficiency of transmission heat by the present invention；The junction temperature of LED chip is reduced, light extraction efficiency is improved, life of product is improved, it is ensured that the stability of product；The radiating fin of radiator structure, convection holes, the design of vaccum case inner supporting body and the working fluid in capillary structure and supporter, add area of dissipation, improve radiating efficiency.
Description
Technical field
The present invention relates to a kind of LED lamp, more particularly to a kind of samming and integrated heat dissipation formula LED lamp module.
Background technology
LED lamp is increasingly becoming main force's production of illumination market with the technical characterstic such as its efficient, energy-conservation, long-lived, compact
Product, pull the high speed development of environmental protection and energy-conservation industry.
The luminous efficiency of LED lamp and the influence factor of service life, except LED chip, encapsulation procedure, light fixture light
The design such as, motor-driven, driving power supply is outer, radiates also very crucial.Existing LED lamp is mostly radiated using temperature-uniforming plate, but
Be because avoiding air from remaining, need to be in the gap between each radiating interface with heat-conducting cream fills up interface, the thermal conductivity factor of heat-conducting cream
Between 1-6, as a new thermal resistance, and heat-conducting cream easily solidifies after a long time use, influences heat-conducting effect.Therefore design
New radiator structure, finding more excellent thermal component turns into the pass for improving LED luminous efficiency and extension LED service life
Key.
The content of the invention
The present invention provides a kind of reasonable in design, the samming of good heat dissipation effect and integrated heat dissipation formula LED lamp module, its
The technical problem of solution is：
1st, during existing LED encapsulation, need the heat-conducting cream dosed because its thermal conductivity factor is low between radiator structure and temperature-uniforming plate and
Thermal resistance is become, radiating effect is influenceed；
2nd, the radiator structure in existing LED lamp can not meet the requirement of LED radiatings.
The present invention solves the technical scheme that is used of above-mentioned technical problem：
A kind of samming and integrated heat dissipation formula LED lamp module, including LED luminescence units, upper lid and radiator structure, it is described
LED luminescence units are fixedly installed on the top of lid, and radiator structure is arranged on the lower section of lid, and is fixed with the elongation end of upper lid
Connection, described upper lid is integrated with radiator structure.The structure of integration saves unnecessary part, reduces because of part itself
The heat for generating heat and producing；It is upper to cover the equal heat structure that belongs in the device, soaking and radiating are set integral so that upper lid with
There is no other heat transfer influences between radiator structure, heat transfer, radiating effect can be greatly promoted.Set simultaneously using the modularization of the present invention
Meter, facilitates follow-up maintenance and upgrading replacement.
Further, described LED luminescence units include circuit substrate, circuit layer, insulating barrier, LED chip, box dam glue and
Gold thread；Described insulating barrier is arranged on lid, and described circuit layer is set on the insulating layer；LED chip is arranged on lid,
The LED chip often arranged connects into series circuit by gold thread and circuit layer, and the LED chip of each column is connected in parallel on two electricity by gold thread
Between the floor of road.The series-parallel design of LED chip, can effectively ensure when part LED chip fails, other LED cores in parallel
Piece is unaffected, and then does not interfere with LED luminescence unit normal luminous.
Further, in addition to anti-hydraulic pressure plate, anti-hydraulic pressure plate is arranged on radiator structure.This design can effectively ensure this
The light fixture mould of invention has good waterproof and dust reduction capability.
Further, lens are additionally provided with above described LED luminescence units, the elongation end of lens is fixedly arranged above the 3rd
Rubber ring, lower section is fixed with the first rubber ring, and is fixed on lens pressing plate and waterproof by the first rubber ring and the 3rd rubber ring
Between pressing plate.Lens while lighting requirement is met, can rationally control light by carrying out secondary light-distribution to integrated optical source
Spot, reduces light loss, improves the utilization rate of light, it is to avoid produce glare and light pollution.
Further, combine and set inside one vaccum case of formation, vaccum case between described upper lid and radiator structure
Supporter is equipped with, vaccum case surrounding inwall is provided with capillary structure.Supporter and capillary structure increase area of dissipation, improve this hair
Bright lamp has the radiating efficiency of mould.
Further, in addition to water filling port, water filling port passes through upper cover body, is connected with vaccum case.Injected from water filling port
Working fluid, working fluid flow at high speed can be conducted heat in supporter, and heat is directly delivered on radiator structure, optimization heat transfer
Effect.
Further, described radiator structure is made up of multiple radiating fins, and convection holes are provided with radiator structure.Radiating
Fin adds area of dissipation, and radiating fin and convection holes can effectively improve radiating efficiency.
Further, described upper lid surface scribbles colloid.Colloid is mixed by fluorescent material and glue.Colloid can be adjusted
Colour temperature is saved, light is made into white light, can be dust-proof, chip can be protected again.
The present invention compared with the existing technology has advantages below and effect：
1st, compared with prior art, upper lid is integrated with radiator structure, eliminates lower cover body and graphite flake by the present invention,
It is simple in construction, the part of transmission heat is reduced, thermal resistance is reduced, optimizes heat-transfer effect, accelerates the efficiency of transmission heat；Reduction
The junction temperature of LED chip, improves light extraction efficiency, improves life of product, it is ensured that the stability of product.
2nd, the radiating fin of radiator structure, convection holes, vaccum case inner supporting body and capillary structure and branch in the present invention
The design of working fluid in support body, adds area of dissipation, improves radiating efficiency.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is structural representation of the invention.
Label declaration：
1st, upper lid；11st, supporter copper post；12nd, capillary structure；13rd, inlet；2nd, radiator structure；
21st, convection holes；3rd, circuit substrate；31st, circuit layer；32nd, insulating barrier；33rd, electric wire；
34th, cable；341st, water joint；342nd, waterproof end plug；4th, chip；41st, colloid；
42；Box dam glue；43rd, gold thread；5th, anti-hydraulic pressure plate；51st, the first rubber ring；52nd, the second rubber ring；
6th, lens；61st, the 3rd rubber ring；62nd, screw；63rd, lens pressing plate.
Embodiment
With reference to embodiment, the present invention is described in further detail, following examples be explanation of the invention and
The invention is not limited in following examples.
Embodiment 1：
As shown in figure 1, a kind of samming and integrated heat dissipation formula LED lamp module, including LED luminescence units, upper lid 1 and radiating
Structure 2, LED luminescence units are fixedly installed on the top of lid 1, and radiator structure 2 is arranged on the lower section of lid 1, and with upper lid 1
Elongation end is fixedly connected, and upper lid 1 is integrated with radiator structure 2.Upper lid is copper material, inverse u shape, and is prolonged two ends are parallel
Stretch.Radiator structure 2 is made up of multiple radiating fins, and convection holes 21 are provided with radiator structure.LED luminescence units include circuit base
Plate 3, circuit layer 31, insulating barrier 32, LED chip 4, box dam glue 42 and gold thread 43；The upper upper surface of lid 1 scribbles the exhausted of a floor height heat conduction
Edge medium, forms an insulating barrier 32；Circuit layer 31 is arranged on insulating barrier 32；LED chip 4 is arranged on lid 1, is often arranged
LED chip 4 connects into series circuit by gold thread 43 and circuit layer 31, and the LED chip 4 of each column is connected in parallel on two by gold thread 43
Between circuit layer 31.
One vaccum case of formation is combined between upper lid 1 and radiator structure 2, vaccum case is internally provided with supporter 11,
Supporter 11 is honeycomb；Vaccum case surrounding inwall is provided with capillary structure 12.Water filling port 13 passes through upper lid 1, with vacuum shell
Body is connected.Working fluid is added by water filling port 13, it is 7.5*10- that vacuum is carried out to vaccum case by water filling port 13
3torr's vacuumizes (equivalent to 9.87*10-6Individual standard atmospheric pressure), and water filling port 13 is sealed.
Lens 6 are additionally provided with above LED luminescence units, the elongation end of lens 6 is fixedly arranged above the 3rd rubber ring 61, lower section
The first rubber ring 51 is fixed with, and lens pressing plate 63 and anti-hydraulic pressure plate are fixed on by the first rubber ring 51 and the 3rd rubber ring 61
Between 5.
Anti- hydraulic pressure plate 5 is arranged on radiator structure 2.First rubber ring 51 and the 3rd rubber ring 61 are separately positioned on lens pressure
In two independent grooves of the bottom of plate 63, the second rubber ring 52 is arranged in the groove of the anti-bottom of hydraulic pressure plate 5；First rubber ring 51
The space between anti-hydraulic pressure plate 5 and lens pressing plate 63 is sealed, the second rubber ring 52 is sealed between anti-hydraulic pressure plate 5 and radiator structure 2
Space, the 3rd rubber ring 61 sealing lens 6 and lens pressing plate 63 between space.Screw 62 passes through lens pressing plate 63, and embedding
Enter inside anti-hydraulic pressure plate 5, lens pressing plate 63 and anti-hydraulic pressure plate 5 are fixed together.It is provided with below the nut of screw 62 trapezoidal
Rubber washer, can play sealing function.
Embodiment 2：
As described in Example 1, it is differed only in and colloid 41 is also coated with lid 1, and colloid 41 is mixed by fluorescent material and glue
Conjunction is formed, to make white light source.
Furthermore, it is necessary to explanation, the LED chip being arranged on lid can also use circle type arrangement mode, it is identical
The LED chip of the number of turns connects into series circuit by gold thread and circuit layer, and the LED chip of the different number of turns is connected in parallel on two by gold thread
Between individual circuit layer.Other arrangement modes enlightened by the present invention belong to the protection content of the present invention.Retouched in this specification
The specific embodiment stated, shape, the named title of its parts and components etc. can be different.All structures according to described in inventional idea of the present invention
Make, the equivalent or simple change that feature and principle are done, in the protection domain for being included in patent of the present invention.Skill belonging to of the invention
The technical staff in art field can make various modifications or supplement to described specific embodiment or use similar side
Formula substitute, without departing from the present invention structure or surmount scope defined in the claims, all should belong to the present invention
Protection domain.
Claims (8)
1. a kind of samming and integrated heat dissipation formula LED lamp module, including LED luminescence units, upper lid (1) and radiator structure (2), institute
The LED luminescence units stated are fixedly installed on the top of lid (1), and radiator structure (2) is arranged on the lower section of lid (1), and with it is upper
The elongation end of lid (1) is fixedly connected, it is characterised in that：Described upper lid (1) is integrated with radiator structure (2).
2. a kind of samming according to claim 1 and integrated heat dissipation formula LED lamp module, it is characterized in that：Described LED hairs
Light unit includes circuit substrate (3), circuit layer (31), insulating barrier (32), LED chip (4), box dam glue (42) and gold thread (43)；
Described insulating barrier (32) is arranged on lid (1), and described circuit layer (31) is arranged on insulating barrier (32)；LED chip (4)
It is arranged on lid (1), the LED chip (4) often arranged connects into series circuit by gold thread (43) and circuit layer (31), each column
LED chip (4) is connected in parallel between two circuit layers (31) by gold thread (43).
3. a kind of samming according to claim 1 and integrated heat dissipation formula LED lamp module, it is characterized in that：Also include waterproof
Pressing plate (5), anti-hydraulic pressure plate (5) is arranged on radiator structure (2).
4. a kind of samming according to claim 1 and integrated heat dissipation formula LED lamp module, it is characterized in that：Described LED hairs
Lens (6) are additionally provided with above light unit, the elongation end of lens (6) is fixedly arranged above the 3rd rubber ring (61), and lower section is fixed with
First rubber ring (51), and lens pressing plate (63) and anti-hydraulic pressure are fixed on by the first rubber ring (51) and the 3rd rubber ring (61)
Between plate (5).
5. a kind of samming according to claim 1 and integrated heat dissipation formula LED lamp module, it is characterized in that：Described upper lid
(1) one vaccum case of formation is combined between radiator structure (2), vaccum case is internally provided with supporter (11), vacuum shell
Body surrounding inwall is provided with capillary structure (12).
6. a kind of samming according to claim 5 and integrated heat dissipation formula LED lamp module, it is characterized in that：Also include water filling
Mouth (13), water filling port (13) is connected through upper lid (1) with vaccum case.
7. a kind of samming according to claim 1 and integrated heat dissipation formula LED lamp module, it is characterized in that：Described radiating
Structure (2) is made up of multiple radiating fins, and convection holes (21) are provided with radiator structure (2).
8. a kind of samming according to claim 1 and integrated heat dissipation formula LED lamp module, it is characterized in that：Described upper lid
(1) surface scribbles colloid (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710450016.6A CN107270140A (en) | 2017-06-15 | 2017-06-15 | A kind of samming and integrated heat dissipation formula LED lamp module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710450016.6A CN107270140A (en) | 2017-06-15 | 2017-06-15 | A kind of samming and integrated heat dissipation formula LED lamp module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107270140A true CN107270140A (en) | 2017-10-20 |
Family
ID=60067130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710450016.6A Pending CN107270140A (en) | 2017-06-15 | 2017-06-15 | A kind of samming and integrated heat dissipation formula LED lamp module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107270140A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108204578A (en) * | 2017-12-14 | 2018-06-26 | 天长市天新电子实业有限公司 | A kind of circular mounting seat LED lamps cooling component |
| CN108253398A (en) * | 2017-12-14 | 2018-07-06 | 天长市天新电子实业有限公司 | A kind of LED light group radiating subassembly |
| CN108534101A (en) * | 2017-12-14 | 2018-09-14 | 天长市天新电子实业有限公司 | A kind of safe cooling LED structure |
| CN108534102A (en) * | 2017-12-14 | 2018-09-14 | 天长市天新电子实业有限公司 | A kind of air-draft-type LED radiating subassemblies |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202405323U (en) * | 2012-01-04 | 2012-08-29 | 四川鋈新能源科技有限公司 | Structure for directly packaging LED chips on vapor chamber and lamp employing same |
| CN202633383U (en) * | 2012-07-13 | 2012-12-26 | 石家庄市京华电子实业有限公司 | Integrally-packaged light-emitting diode (LED) illumination lamp |
| CN102878456A (en) * | 2012-09-07 | 2013-01-16 | 浙江中博光电科技有限公司 | High-power LED (light-emitting diode) lamp module of chip-on-board |
| CN102927484A (en) * | 2012-11-26 | 2013-02-13 | 殷逢宝 | High-power LED lamp |
| CN207349811U (en) * | 2017-06-15 | 2018-05-11 | 浙江中博光电科技有限公司 | Samming and integrated heat dissipation formula LED lamp module |
-
2017
- 2017-06-15 CN CN201710450016.6A patent/CN107270140A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202405323U (en) * | 2012-01-04 | 2012-08-29 | 四川鋈新能源科技有限公司 | Structure for directly packaging LED chips on vapor chamber and lamp employing same |
| CN202633383U (en) * | 2012-07-13 | 2012-12-26 | 石家庄市京华电子实业有限公司 | Integrally-packaged light-emitting diode (LED) illumination lamp |
| CN102878456A (en) * | 2012-09-07 | 2013-01-16 | 浙江中博光电科技有限公司 | High-power LED (light-emitting diode) lamp module of chip-on-board |
| CN102927484A (en) * | 2012-11-26 | 2013-02-13 | 殷逢宝 | High-power LED lamp |
| CN207349811U (en) * | 2017-06-15 | 2018-05-11 | 浙江中博光电科技有限公司 | Samming and integrated heat dissipation formula LED lamp module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108204578A (en) * | 2017-12-14 | 2018-06-26 | 天长市天新电子实业有限公司 | A kind of circular mounting seat LED lamps cooling component |
| CN108253398A (en) * | 2017-12-14 | 2018-07-06 | 天长市天新电子实业有限公司 | A kind of LED light group radiating subassembly |
| CN108534101A (en) * | 2017-12-14 | 2018-09-14 | 天长市天新电子实业有限公司 | A kind of safe cooling LED structure |
| CN108534102A (en) * | 2017-12-14 | 2018-09-14 | 天长市天新电子实业有限公司 | A kind of air-draft-type LED radiating subassemblies |
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Application publication date: 20171020 |