CN105240711B - A kind of current heat radiating LED lamp - Google Patents

A kind of current heat radiating LED lamp Download PDF

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Publication number
CN105240711B
CN105240711B CN201510734095.4A CN201510734095A CN105240711B CN 105240711 B CN105240711 B CN 105240711B CN 201510734095 A CN201510734095 A CN 201510734095A CN 105240711 B CN105240711 B CN 105240711B
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fin
water inlet
led wafer
delivery port
heat
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CN105240711A (en
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严圣军
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JIANGSU TIWIN OPTO-ELECTRONICS TECHNOLOGY Co Ltd
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JIANGSU TIWIN OPTO-ELECTRONICS TECHNOLOGY Co Ltd
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Abstract

The present invention discloses a kind of current heat radiating LED lamp, including LED wafer (1), connecting line (2), lens (3), LED wafer substrate (5), system circuit board (6), fin (7), the heat abstractor (8) for radiating is provided with below fin (7), the water inlet (9) of heat abstractor (8) is located at immediately below heat abstractor (8), heat abstractor (8) is provided with more than two delivery ports (10), and delivery port (10) is uniformly distributed in heat abstractor (8) side.The beneficial effect of this patent is:Water inlet is located at underface, delivery port is located at side, current enter from below, surrounding flows out, so that the relatively low water of temperature forms flowing from the centre of fin to both sides, the heat on fin is taken away, realizes the uniform heat absorption of current, the heat absorption efficiency of current is improved, ensures that the holding of each regional temperature of fin is identical and stably.

Description

A kind of current heat radiating LED lamp
Technical field
The present invention relates to lighting field, more particularly to a kind of current heat radiating LED lamp.
Background technology
LED as a new generation lighting source, compared to conventional light source have make long lifespan, low in energy consumption, brightness is high, volume The advantage such as small, thus receive more and more attention.LED chip just develops towards small size and high-power both direction, still Its luminous efficiency only has 10%-20% at present, that is to say, that has up to 80%-90% electric energy to be converted into heat.Mesh Preceding great power LED (the power for being applied to illumination>1W) chip size exceedes in 1mm × more than 1mm, heat flow density mostly 100W/cm, as the heat of fruit chip can not distribute in time, the junction temperature of chip is too high to reduce its luminous efficiency and can By property, chip aging can be made or even failed, this is the important bottleneck for restricting the development of large power white light LED light source.In order to ensure LED In the normal work and use life-span of device, typically require that junction temperature is no more than 80 DEG C.Scale to realize great power LED Using must just solve its heat dissipation problem, the problem of for this respect, either from internal material or encapsulation or external auxiliary Instrument, many research is carried out with regard to this both at home and abroad.
Application for a patent for invention such as Publication No. CN102606896A discloses a kind of water circulation heat-dissipating LED lamp, including Lamp body, the LED for illumination is installed in the light-source chamber of lamp body, the light fixture also includes being used to dissipate to the water circulation of light fixture radiating Thermal, the water circulation heat radiation device are nested between lamp body and ambient atmosphere.A nested water circulation on lamp body on light fixture Heat abstractor, a part are arranged in light-source chamber, are close to LED, for heat exchange in light-source chamber, the exposed air of another part In, for carrying out heat exchange with the external world, circulated by water in water circulation heat radiation device, accelerate heat exchange, reduce light fixture Temperature in light-source chamber.The water circulation heat radiation device reclaimed water becomes steam after being heated, and the boiling point of water is set in circulating system For 79 DEG C, very high, operating difficulties is required to the sealing property of circulating system.
And for example Publication No. CN103162146A application for a patent for invention discloses a kind of heat storage type LED lamp, including LED Light source substrate, the non-metal shell one-time formed embedded aluminum hull with rear liquid storing barrel is set, nonmetallic outer after light source substrate Heat accumulation liquid is placed in the cavity that shell surrounds with embedded aluminum hull, set one in liquid storing barrel shell nearside controls with ambient light illumination The built-in drive of LED power.The inventive structure is reasonable, shell using nonmetallic materials make as carbon fiber, glass fibre, ABS etc., manufacturing cost can be effectively reduced, and improve light fixture resistance to corrosion, coastal area or high corrosion environment can be made to use LED Light fixture is carefree.But the light fixture can not be applicable in the environment of steady illumination effect, there is certain limitation.
The content of the invention
For overcome radiating effect present in prior art is poor, shed heat waste the problems such as, the invention provides one kind Current heat radiating LED lamp, including LED wafer, connecting line, lens, LED wafer substrate, system circuit board, fin, the connection Line connects the LED wafer and the LED wafer substrate, the LED wafer, LED wafer substrate, system circuit board and described dissipates Backing is sequentially connected from top to bottom, and the lens are fixed on the LED wafer substrate, the LED wafer is encapsulated in described The inner space that lens are formed with the LED wafer substrate, the fin lower section is provided with the heat abstractor for radiating, described The water inlet of heat abstractor is located at immediately below the heat abstractor, and the heat abstractor is provided with more than two delivery ports, described Delivery port is uniformly distributed in the heat abstractor side.
Current enter from below, surrounding outflow so that and the relatively low water of temperature forms flowing from the centre of fin to both sides, The heat on fin is taken away, realizes the uniform heat absorption of current, improves the heat absorption efficiency of current, ensures each regional temperature of fin Holding it is identical and stably.
Preferably, the fin is provided with more than two thermal columns, Mei Gesuo backwards to the side of the system circuit board State thermal column and be provided with more than one through hole.
Thermal column is set on a heat sink, can increase the contact area of fin and current, through hole is set on thermal column, can To realize among current to the smooth outflow on both sides, the flow velocity of stable water body, the uniformity that current absorb heat is improved.
Preferably, the through hole on the thermal column is in the same horizontal position, and the through hole midpoint is from the thermal column The distance of root is the 1/4-1/3 of the thermal column height.So cause current close to the position change side of thermal column root To pressure of the balanced current to fin.
Preferably, connected between the delivery port and the water inlet by main pipeline, connect the delivery port with it is described The main pipeline of water inlet is provided with water pump.The power controllable water inlet of water pump and the water velocity of delivery port are adjusted, is gone out here The mouth of a river can set 3 or 4, preferably 4, and the area of section of water inlet is 4-8 times of delivery port, preferably 5 times so that water outlet The speed of mouth is slightly greater than the speed of water inlet.
Preferably, the thermal column root is provided with the first temperature sensor, first temperature sensor and the water pump It is connected.When the temperature of thermal column root reaches setting value, at preferably 75 DEG C, water pump can accelerate water velocity, so that thermal column The temperature of root is reduced to less than 75 DEG C, preferably 70 DEG C or so.
Preferably, the main pipeline for connecting the delivery port and the water inlet is provided with cold water inlet road and hot water effluent Pipeline, the hot water effluent's pipeline are located at the delivery port opening position, the cold water inlet road and the water pump positioned at described The hot water effluent's pipeline and the main pipeline junction are provided with flowing water Valve at water inlet position, the cold water inlet road and The main pipeline junction is provided with inlet valve.
Preferably, the delivery port is provided with second temperature sensor, the second temperature sensor and the outlet valve Door, inlet valve connection.When second temperature sensor detects that outlet temperature reaches setting value, at preferably 70 DEG C, beat Output penstock and inlet valve, continue to flow out from hot water effluent's pipeline, cold water from when waterpipe enter, preferred cold water here Water temperature is 20-30 DEG C, when delivery port coolant-temperature gage is less than 65 DEG C, closes flowing water Valve and inlet valve.
Preferably, between the LED wafer and the LED wafer substrate, the LED wafer substrate and the circuit system Between plate, pass through the heat conduction gemel connection of one layer of solidification between the system circuit board and the fin.Can be with by heat-conducting glue The compactness connected between increase chip and substrate, substrate and circuit board, circuit board and fin, heat-conducting area is improved, realized High-efficiency heat conduction.
Preferably, the heat-conducting glue by weight percentage, including following components:20-30% terminal methyl vinyl Siloxanes, 20-30% hyperbranched epoxy resins, 3-8% nano aluminium oxides, 3-8% copper powders, 3-8% silver powder, 2-7% aluminium powders, 1- The solvent of 2% crosslinking agent, 30-50%.Pass through the conjunction of hyperbranched epoxy resin, terminal methyl vinylsiloxane and nano aluminium oxide Reason collocation, can effectively improve the binding ability between heat-conducting glue and substrate, chip, circuit board and fin, improve it and lead It is hot, a certain amount of copper powder, silver are added, effect of the nano aluminium oxide in heat-conducting glue is further expanded, improves solidification Overall heat-conducting effect afterwards.
Preferably, the fin is copper alloy, by weight percentage, including following composition:97-99% copper, 0- 0.5% silver medal, 0-0.5% aluminium titanium boron and 0-3% metal impurities.Selecting rational copper alloy proportioning, and by with a small amount of silver With aluminium titanium boron, the thinning effect and heat-conducting effect of copper alloy are improved, metal impurities therein are aluminium, iron, tin etc..
Preferably, the section of the water inlet and the delivery port is ellipse.
Preferably, the water inlet is provided with one section of changeover portion in smoothing junction with the heat abstractor, the changeover portion Area gradually increases from top to bottom.
Compared with prior art, the beneficial effects of the invention are as follows:
(1) water inlet is located at underface, delivery port is located at side, and current enter from below, surrounding outflow so that temperature Relatively low water forms flowing from the centre of fin to both sides, takes away the heat on fin, realizes the uniform heat absorption of current, carries The heat absorption efficiency of high current, each regional temperature of fin is set to keep identical and stably;
(2) thermal column is set on a heat sink, can increase the contact area of fin and current, is set on thermal column logical Hole, it is possible to achieve to the smooth outflow on both sides among current, the flow velocity of stable water body, improve the uniformity that current absorb heat;
(3) it can increase what is connected between chip and substrate, substrate and circuit board, circuit board and fin by heat-conducting glue Compactness, heat-conducting area is improved, realizes high-efficiency heat conduction;Pass through hyperbranched epoxy resin, terminal methyl vinylsiloxane and nanometer Aluminum oxide it is reasonably combined, the associativity between heat-conducting glue and substrate, chip, circuit board and fin can be effectively improved Can, its thermal conductivity is improved, adds a certain amount of copper powder, silver, further expands effect of the nano aluminium oxide in heat-conducting glue, Improve heat-conducting effect overall after solidifying;
(4) fin is by selecting rational copper alloy to match, and with a small amount of silver and aluminium titanium boron, improve copper alloy Thinning effect and heat-conducting effect;
(5) it is 75 DEG C or so from the hot water temperature of hot water effluent's pipeline outflow, just available for daily bathing etc., plays The effect of using electricity wisely;The water temperature entered from cold water inlet is ordinary temperature, and source is sufficient, easy to operate.
Brief description of the drawings
Fig. 1 is the present invention preferably front section view;
Fig. 2 is the present invention preferably upward view;
Fig. 3 is the present invention preferably current schematic diagram.
Embodiment
With reference to embodiments, the present invention will be described in further detail.It is it should be appreciated that described herein specific real Example is applied only to explain the present invention, is not intended to limit the present invention.
Be respectively the present invention preferably front section view and upward view as shown in Figure 1-2, including LED wafer 1, connecting line 2, Lens 3, LED wafer substrate 5, system circuit board 6, fin 7, connecting line 2 connect LED wafer 1 and LED wafer substrate 5, LED Chip 1, LED wafer substrate 5, system circuit board 6 and fin 7 are sequentially connected from top to bottom, and lens 3 are fixed on LED wafer base On plate 5, LED wafer 1 is encapsulated in the inner space that lens 3 and LED wafer substrate 5 formed, the lower section of fin 7 is provided with radiating Heat abstractor 8, the water inlet 9 of heat abstractor 8 are located at immediately below heat abstractor 8, and heat abstractor 8 is provided with more than two delivery ports 10, delivery port 10 is uniformly distributed in the side of heat abstractor 8, and water inlet 9 and water outlet mouth-shaped are ellipse.
Current enter from below, surrounding outflow so that and the relatively low water of temperature forms flowing from the centre of fin to both sides, The heat on fin is taken away, realizes the uniform heat absorption of current, improves the heat absorption efficiency of current, ensures each regional temperature of fin Holding it is identical and stably.
Fin 7 is provided with more than two thermal columns 71 backwards to the side of system circuit board 6, and each thermal column 71 is provided with More than one through hole 12.Thermal column is set on a heat sink, can increase the contact area of fin and current, on thermal column If through hole, it is possible to achieve to the smooth outflow on both sides among current, the flow velocity of stable water body, improve the uniformity that current absorb heat.
Through hole 12 on thermal column 71 is in the same horizontal position, and the distance of the discrete root of plume 71 in the midpoint of through hole 12 is The 0.3 of the height of thermal column 71.Through hole can also set two row or multi-row, and the distance that adjacent two row passes through is equal.As shown in Figure 3 For preferably current schematic diagram of the invention, connected between delivery port 10 and the water inlet 9 by main pipeline 13, connect delivery port 10 are provided with water pump 14 with the main pipeline of water inlet 9.
The root of thermal column 71 is provided with the first temperature sensor 15, and the first temperature sensor 15 is connected with water pump 14.
The main pipeline 13 of connection delivery port 10 and water inlet 9 is provided with cold water inlet road 16 and hot water effluent's pipeline 17, Hot water effluent's pipeline 17 is located at the opening position of delivery port 10, and cold water inlet road 16 and the water pump 14 are located at the water inlet 9 opening positions, hot water effluent's pipeline 17 are provided with flowing water Valve 18, cold water inlet road 16 and main pipeline 13 with the junction of main pipeline 13 Junction is provided with inlet valve 19.
Delivery port 10 is provided with second temperature sensor 20, second temperature sensor 20 and flowing water Valve 18, inlet valve 19 connections.Between LED wafer 1 and LED wafer substrate 5, between LED wafer substrate 5 and system circuit board 6, system circuit board 6 with Connected between fin 7 by the heat-conducting glue 4 of one layer of solidification.
The section of water inlet 9 and the delivery port 10 is ellipse;It is smooth with heat abstractor 8 provided with one section at water inlet 9 The changeover portion of connection, area gradually increases changeover portion from top to bottom.
Heat-conducting glue 4 by weight percentage, including following components:25% terminal methyl vinylsiloxane, 20% surpass Branch epoxy resins, 5% nano aluminium oxide, 5% copper powder, 5% silver powder, 5% aluminium powder, 1% crosslinking agent, 34% solvent.
Heat-conducting glue 4 by weight percentage, can be with composed of the following components:20% terminal methyl vinyl silica Alkane, 25% hyperbranched epoxy resin, 4% nano aluminium oxide, 6% copper powder, 4% silver powder, 5% aluminium powder, 1% crosslinking agent, 35% Solvent.
Fin 7 is copper alloy, by weight percentage, including following composition:99% bronze medal, 0.3% silver medal, 0.3% aluminium titanium Boron and 0.4% metal impurities.
Fin 7 is copper alloy, by weight percentage, can also be made up of following composition:98% bronze medal, 0.5% silver medal, 0.5% aluminium titanium boron and 1% metal impurities.
The preferred embodiments of the present invention have shown and described in described above, as previously described, it should be understood that the present invention is not office Be limited to form disclosed herein, be not to be taken as the exclusion to other embodiment, and available for various other combinations, modification and Environment, and can be changed in the scope of the invention is set forth herein by the technology or knowledge of above-mentioned teaching or association area It is dynamic., then all should be appended by the present invention and the change and change that those skilled in the art are carried out do not depart from the spirit and scope of the present invention In scope of the claims.

Claims (7)

1. a kind of current heat radiating LED lamp, including LED wafer (1), connecting line (2), lens (3), LED wafer substrate (5), system Circuit board (6), fin (7), the connecting line (2) connects the LED wafer (1) and the LED wafer substrate (5), described LED wafer (1), LED wafer substrate (5), system circuit board (6) and the fin (7) are sequentially connected from top to bottom, described Mirror (3) is fixed on the LED wafer substrate (5), and it is brilliant with the LED that the LED wafer (1) is encapsulated in into the lens (3) The inner space that plate base (5) is formed, it is characterised in that the heat abstractor for radiating is provided with below the fin (7) (8), the water inlet (9) of the heat abstractor (8) is located at immediately below the heat abstractor (8), and the heat abstractor (8) is provided with two Delivery port (10) more than individual, the delivery port (10) are uniformly distributed in the heat abstractor (8) side;The fin (7) More than two thermal columns (71) are provided with backwards to the side of the system circuit board (6), each thermal column (71) is provided with More than one through hole (12);Through hole (12) on the thermal column (71) is in the same horizontal position, the through hole (12) Midpoint is from the 1/4-1/3 for a distance from the thermal column (71) root being the thermal column (71) height;The LED wafer (1) with Between the LED wafer substrate (5), between the LED wafer substrate (5) and the system circuit board (6), the circuit system It is connected between plate (6) and the fin (7) by the heat-conducting glue (4) of one layer of solidification.
2. a kind of current heat radiating LED lamp as claimed in claim 1, it is characterised in that the delivery port (10) and the water inlet Connected between mouth (9) by main pipeline (13), the main pipeline for connecting the delivery port (10) and the water inlet (9) is provided with water Pump (14).
3. a kind of current heat radiating LED lamp as claimed in claim 2, it is characterised in that thermal column (71) root is provided with the One temperature sensor (15), first temperature sensor (15) are connected with the water pump (14).
A kind of 4. current heat radiating LED lamp as claimed in claim 3, it is characterised in that connect the delivery port (10) with it is described The main pipeline (13) of water inlet (9) is provided with cold water inlet road (16) and hot water effluent's pipeline (17), the hot water outlet pipe Road (17) is located at the delivery port (10) opening position, and the cold water inlet road (16) and the water pump (14) are located at the water inlet Mouth (9) opening position, the hot water effluent's pipeline (17) is provided with flowing water Valve (18) with the main pipeline (13) junction, described cold Water inlet channel (16) is provided with inlet valve (19) with the main pipeline (13) junction.
5. a kind of current heat radiating LED lamp as claimed in claim 4, it is characterised in that the delivery port (10) is provided with second Temperature sensor (20), the second temperature sensor (20) are connected with the flowing water Valve (18), the inlet valve (19).
6. a kind of current heat radiating LED lamp as claimed in claim 1, it is characterised in that the water inlet (9) and the delivery port (10) section is ellipse.
A kind of 7. current heat radiating LED lamp as claimed in claim 6, it is characterised in that water inlet (9) place be provided with one section with The heat abstractor (8) changeover portion in smoothing junction, area gradually increases the changeover portion from top to bottom.
CN201510734095.4A 2015-10-30 2015-10-30 A kind of current heat radiating LED lamp Active CN105240711B (en)

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CN105240711B true CN105240711B (en) 2018-01-16

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Publication number Priority date Publication date Assignee Title
CN110505735A (en) * 2018-05-16 2019-11-26 送飞实业集团有限公司 A kind of aviation obstruction beacon of changeable changes in temperature mode

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CN201897166U (en) * 2010-11-01 2011-07-13 安徽众和达光电有限公司 LED streetlamp with radiating system device
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CN205350865U (en) * 2015-10-30 2016-06-29 江苏天楹之光光电科技有限公司 Rivers heat dissipation LED lamp

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Publication number Priority date Publication date Assignee Title
CN101294678A (en) * 2008-05-19 2008-10-29 无锡爱迪信光电科技有限公司 Wind-electricity complementary LED road lamp heat radiating device
CN201897166U (en) * 2010-11-01 2011-07-13 安徽众和达光电有限公司 LED streetlamp with radiating system device
CN202403244U (en) * 2011-12-29 2012-08-29 桂林电子科技大学 Water cooling device of large LED (Light-Emitting Diode) lamp system
CN103438385A (en) * 2013-03-25 2013-12-11 郑运婷 LED (light-emitting diode) streetlamp
CN203323073U (en) * 2013-07-26 2013-12-04 江海帆 Led liquid cooling type radiator
CN205350865U (en) * 2015-10-30 2016-06-29 江苏天楹之光光电科技有限公司 Rivers heat dissipation LED lamp

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