CN208247649U - A kind of insulation copper-clad plate - Google Patents
A kind of insulation copper-clad plate Download PDFInfo
- Publication number
- CN208247649U CN208247649U CN201820745012.0U CN201820745012U CN208247649U CN 208247649 U CN208247649 U CN 208247649U CN 201820745012 U CN201820745012 U CN 201820745012U CN 208247649 U CN208247649 U CN 208247649U
- Authority
- CN
- China
- Prior art keywords
- insulating layer
- layer
- clad plate
- copper foil
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 17
- 239000010410 layer Substances 0.000 claims abstract description 76
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000011889 copper foil Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 20
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 14
- 239000004519 grease Substances 0.000 claims abstract description 13
- 239000011241 protective layer Substances 0.000 claims abstract description 8
- 239000010432 diamond Substances 0.000 claims description 12
- 229910003460 diamond Inorganic materials 0.000 claims description 12
- 239000000428 dust Substances 0.000 claims description 9
- 229920006267 polyester film Polymers 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of insulation copper-clad plate, including copper foil layer, aluminum substrate and cooling fin, it is characterized in that: the upper surface of the copper foil layer is provided with depression area, matcoveredn is arranged in the upside of the copper foil layer, the protective layer is internally provided with several heat-conducting silicone grease blocks, the heat-conducting silicone grease block is located in depression area, the upper surface of several heat-conducting silicone grease blocks is plane, and its lower surface is the arc surface to match with depression area, prepreg is provided on the downside of the copper foil layer, insulating layer one is provided on the downside of the prepreg, the aluminum substrate it is upper, lower surface is provided with semicircle recessed, the aluminum substrate it is upper, lower surface is connect with insulating layer one and insulating layer two respectively, the shape of the insulating layer one and insulating layer two is film-form, the downside of the insulating layer two is connected with cooling fin.The utility model thermal conductivity is high, and thermal diffusivity is good, and insulating properties is strong.
Description
Technical field
The utility model discloses a kind of insulation copper-clad plate, belongs to technical field of copper clad laminate.
Background technique
Copper-clad plate --- -- also known as substrate.Supporting material is soaked with resin, one or both sides are formed coated with copper foil through hot pressing
A kind of board-like material, referred to as copper-clad laminate.It is the basic material for being PCB, is often substrate.When it is raw for multi-layer board
When production, core plate is also.Copper-clad plate is also usually used as heat dissipation technology, and copper-clad plate thermal diffusivity on the market is bad, is easy to cause machine
Overheat, influences performance, and insulation degree is poor, and structure is single.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide for a kind of insulation copper-clad plate, with solution
Certainly the problems mentioned above in the background art.
To achieve the above object, the utility model provides following technical solution to realize:
A kind of insulation copper-clad plate, including copper foil layer, aluminum substrate and cooling fin, it is characterized in that: the upper surface of the copper foil layer
It is provided with depression area, matcoveredn is arranged in the upside of the copper foil layer, and the protective layer is internally provided with several thermal conductive silicons
Rouge block, the heat-conducting silicone grease block are located in depression area, and the upper surface of several heat-conducting silicone grease blocks is plane, and its following table
Face is the arc surface to match with depression area, is provided with prepreg, the downside of the prepreg on the downside of the copper foil layer
It is provided with insulating layer one, the upper and lower surfaces of the aluminum substrate are provided with semicircle recessed, the upper and lower surfaces of the aluminum substrate
It is connect respectively with insulating layer one and insulating layer two, the shape of the insulating layer one and insulating layer two is film-form, the insulation
The downside of layer two is connected with cooling fin, several triangular hills is provided on the downside of the cooling fin, several described triangles
The height of shape protrusion is all the same.
As preferred: the insulating layer one, insulating layer two are internally provided with diamond dust.
As preferred: the average grain diameter of the diamond dust is 10um.
As preferred: the protective layer is made of polyester film.
As preferred: the insulating layer one, insulating layer two with a thickness of 0.5mm, and it is made of epoxy resin.
As preferred: the thickness of the cooling fin is greater than the thickness of aluminum substrate.
The utility model has the beneficial effects that
When heat dissipation, heat-conducting silicone grease block absorbs heat, passes to copper foil layer, and copper foil layer absorbs heat, then heat
By prepreg, aluminum substrate is transmitted to by insulating layer one, aluminum substrate is transmitted on cooling fin by insulating layer two, semi-solid preparation
Piece can improve the anti-breakdown voltage of copper-clad plate, and insulating layer one, insulating layer two are internally provided with diamond dust, and diamond is mesh
Preceding best heat-conducting substance, diamond dust contact with each other, and form thermally conductive network chain, through insulating layer one and insulating layer two
In, thermal conductivity, the semicircle recessed bond area that can increase with insulating layer one, insulating layer two are improved, thus increase stripper-resistance,
It is provided with several triangular hills on the downside of cooling fin, increases the area contacted with air, air can be circulated in each
Between groove, heat is taken away by the flowing of air, improves the efficiency of heat dissipation, diamond is electrically non-conductive material, guarantees insulating properties
Can, polyester film rigidity, hardness and toughness are high, and puncture-resistant, rub resistance, oil resistivity is all splendid, and protective effect is fairly obvious.
Detailed description of the invention
Fig. 1 is a kind of cross-sectional view for copper-clad plate of insulating of the utility model.
Appended drawing reference: 1, protective layer；2, heat-conducting silicone grease block；3, copper foil layer；4, prepreg；5, insulating layer one；6, semicircle
Shape is recessed；7, cooling fin；8, triangular hill；9, depression area；10, aluminum substrate；11, insulating layer two.
Specific embodiment
Insulation copper-clad plate a kind of to the utility model is described further referring to Fig.1.
A kind of insulation copper-clad plate, including copper foil layer 3, aluminum substrate 10 and cooling fin 7, it is characterized in that: the copper foil layer 3 is upper
Surface is provided with depression area 9, and matcoveredn 1 is arranged in the upside of the copper foil layer 3, and being internally provided with for the protective layer 1 is several
A heat-conducting silicone grease block 2, the heat-conducting silicone grease block 2 are located in depression area 9, and the upper surface of several heat-conducting silicone grease blocks 2 is
Plane, and its lower surface is the arc surface to match with depression area 9, the downside of the copper foil layer 3 is provided with prepreg 4, institute
The downside for stating prepreg 4 is provided with insulating layer 1, and the upper and lower surfaces of the aluminum substrate 10 are provided with semicircle recessed 6,
The upper and lower surfaces of the aluminum substrate 10 are connect with insulating layer 1 and insulating layer 2 11 respectively, the insulating layer 1 and insulating layer
2 11 shape is film-form, and the downside of the insulating layer 2 11 is connected with cooling fin 7, the downside setting of the cooling fin 7
There are several triangular hills 8, the height of several triangular hills 8 is all the same；The insulating layer 1, insulating layer two
11 are internally provided with diamond dust, and the average grain diameter of the diamond dust is 10um, and the protective layer 1 is by polyester film
Be made, the insulating layer 1, insulating layer 2 11 with a thickness of 0.5mm, and it is made of epoxy resin, the thickness of the cooling fin 7
Degree is greater than the thickness of aluminum substrate 10.
When heat dissipation, heat-conducting silicone grease block 2 absorbs heat, passes to copper foil layer 3, and copper foil layer 3 absorbs heat, then hot
Amount passes through prepreg 4, is transmitted to aluminum substrate 10 by insulating layer 1, aluminum substrate 10 is transmitted to heat dissipation by insulating layer 2 11
On piece 7, prepreg 4 can improve the anti-breakdown voltage of copper-clad plate, and insulating layer 1, insulating layer 2 11 are internally provided with Buddha's warrior attendant
Stone powder, diamond are that best heat-conducting substance, diamond dust contact with each other at present, form thermally conductive network chain, through exhausted
In edge layer 1 and insulating layer 2 11, improve thermal conductivity, semicircle recessed 6 can increase with insulating layer 1, insulating layer 2 11 it is viscous
Junction product, to increase stripper-resistance, the downside of cooling fin 7 is provided with several triangular hills 8, increases and contacts with air
Area, air can be circulated between each groove, heat is taken away by the flowing of air, improves the efficiency of heat dissipation, Buddha's warrior attendant
Stone is electrically non-conductive material, guarantees insulation performance, polyester film rigidity, hardness and toughness are high, and puncture-resistant, rub resistance, oil resistivity is all
Splendid, protective effect is fairly obvious.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (6)
1. a kind of insulation copper-clad plate, including copper foil layer, aluminum substrate and cooling fin, it is characterized in that: the upper surface of the copper foil layer is set
It is equipped with depression area, matcoveredn is arranged in the upside of the copper foil layer, and the protective layer is internally provided with several heat-conducting silicone greases
Block, the heat-conducting silicone grease block are located in depression area, and the upper surface of several heat-conducting silicone grease blocks is plane, and its lower surface
For the arc surface to match with depression area, it is provided with prepreg on the downside of the copper foil layer, is set on the downside of the prepreg
It is equipped with insulating layer one, the upper and lower surfaces of the aluminum substrate are provided with semicircle recessed, the upper and lower surfaces point of the aluminum substrate
It is not connect with insulating layer one and insulating layer two, the shape of the insulating layer one and insulating layer two is film-form, the insulating layer
Two downside is connected with cooling fin, several triangular hills are provided on the downside of the cooling fin, several described triangles
The height of protrusion is all the same.
2. a kind of insulation copper-clad plate according to claim 1, it is characterized in that: the inside of the insulating layer one, insulating layer two
It is provided with diamond dust.
3. a kind of insulation copper-clad plate according to claim 2, it is characterized in that: the average grain diameter of the diamond dust is
10um。
4. a kind of insulation copper-clad plate according to claim 1, it is characterized in that: the protective layer is made of polyester film.
5. a kind of insulation copper-clad plate according to claim 1, it is characterized in that: the thickness of the insulating layer one, insulating layer two
For 0.5mm.
6. a kind of insulation copper-clad plate according to claim 1, it is characterized in that: the thickness of the cooling fin is greater than aluminum substrate
Thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820745012.0U CN208247649U (en) | 2018-05-18 | 2018-05-18 | A kind of insulation copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820745012.0U CN208247649U (en) | 2018-05-18 | 2018-05-18 | A kind of insulation copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208247649U true CN208247649U (en) | 2018-12-18 |
Family
ID=66481749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820745012.0U Expired - Fee Related CN208247649U (en) | 2018-05-18 | 2018-05-18 | A kind of insulation copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208247649U (en) |
-
2018
- 2018-05-18 CN CN201820745012.0U patent/CN208247649U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181218 |