CN208247650U - A kind of high stability copper-clad plate - Google Patents
A kind of high stability copper-clad plate Download PDFInfo
- Publication number
- CN208247650U CN208247650U CN201820746607.8U CN201820746607U CN208247650U CN 208247650 U CN208247650 U CN 208247650U CN 201820746607 U CN201820746607 U CN 201820746607U CN 208247650 U CN208247650 U CN 208247650U
- Authority
- CN
- China
- Prior art keywords
- insulating layer
- layer
- copper
- heat
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010410 layer Substances 0.000 claims abstract description 103
- 239000002245 particle Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011889 copper foil Substances 0.000 claims abstract description 20
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 10
- 239000011256 inorganic filler Substances 0.000 claims abstract description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 238000007731 hot pressing Methods 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000005439 thermosphere Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of high stability copper-clad plate, including bottom plate, it is characterized in that: being provided with the first insulating layer above the bottom plate, is provided with second insulating layer above first insulating layer；Heat-conducting layer is provided with above the second insulating layer, copper foil layer is provided with above the heat-conducting layer, first insulating layer is made of several inorganic filler layers and several resin particles, the resin particle is distributed in the inside of inorganic filler layer, several filler particles are provided on the inside of the second insulating layer, the heat-conducting layer includes heat conducting base material layer and two high thermal conductivity adhesive layers, two high thermal conductivity adhesive layers are located at the two sides up and down of heat conducting base material layer, the thickness of first insulating layer and being of uniform thickness for second insulating layer, the thickness of the bottom plate is greater than the thickness of the first insulating layer.The thermally conductive stability of copper-clad plate can be improved in the utility model.
Description
Technical field
The utility model discloses a kind of high stability copper-clad plate, belongs to technical field of copper clad laminate.
Background technique
Copper-clad plate also known as substrate are to soak supporting material with resin, and one or both sides are coated with copper foil, through made of hot pressing one
Kind board-like material, referred to as copper-clad laminate, existing copper-clad plate are not sufficiently stable in thermally conductive and insulation, are now badly in need of solving this
A series of problems.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide for a kind of high stability copper-clad plate,
To solve the problems mentioned in the above background technology.
To achieve the above object, the utility model provides following technical solution to realize:
A kind of high stability copper-clad plate, including bottom plate, it is characterized in that: the first insulating layer is provided with above the bottom plate,
Second insulating layer is provided with above first insulating layer；Heat-conducting layer is provided with above the second insulating layer, it is described to lead
Copper foil layer is provided with above thermosphere, first insulating layer is made of several inorganic filler layers and several resin particles, institute
The inside that resin particle is distributed in inorganic filler layer is stated, several filler particles are provided on the inside of the second insulating layer, it is described
Heat-conducting layer includes heat conducting base material layer and two high thermal conductivity adhesive layers, and two high thermal conductivity adhesive layers are located at the upper of heat conducting base material layer
Lower two sides, the thickness of first insulating layer and being of uniform thickness for second insulating layer, the thickness of the bottom plate are greater than the first insulation
The thickness of layer, the bottom plate, the first insulating layer, second insulating layer, heat-conducting layer and copper foil layer are integrally formed by hot pressing.
As preferred: the filler particles are the small particle aluminium oxide heat filling particle of high heat conductance.
As preferred: the copper foil layer is made of electrolytic copper foil.
As preferred: the high thermal conductivity adhesive layer is made of several high thermal conductivity bonding sheets.
As preferred: the bottom surface of the bottom plate and the upper surface of copper foil layer are provided with release protective film.
As preferred: being provided with several heat sink strips below the bottom plate.
The utility model has the beneficial effects that
By being provided with the first insulating layer, second insulating layer, resin particle and filler particles, so that the copper-clad plate has well
Thermal stability, excellent capacity of heat transmission and electrical property mention by being provided with heat conducting base material layer and two high thermal conductivity adhesive layers
The thermal conductivity of the high copper-clad plate prevents the surface of copper-clad plate from phenomena such as oxidation, corrosion occur by being provided with release protective film,
It is integrally formed by setting bottom plate, the first insulating layer, second insulating layer, heat-conducting layer and copper foil layer by hot pressing, improves this and cover copper
The stability of plate when in use；By being provided with heat sink strip, the thermal diffusivity of copper-clad plate is improved.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of high stability copper-clad plate of the utility model.
Appended drawing reference: 1, bottom plate；2, the first insulating layer；21, inorganic filler layer；22, resin particle；3, second insulating layer；4,
Heat-conducting layer；41, heat conducting base material layer；42, high thermal conductivity adhesive layer；5, copper foil layer；6, release protective film；7, filler particles；8, it radiates
Item.
Specific embodiment
A kind of high stability copper-clad plate of the utility model is described further referring to Fig.1.
A kind of high stability copper-clad plate, including bottom plate 1, it is characterized in that: the top of the bottom plate 1 is provided with the first insulating layer
2, the top of first insulating layer 2 is provided with second insulating layer 3；The top of the second insulating layer 3 is provided with heat-conducting layer 4,
The top of the heat-conducting layer 4 is provided with copper foil layer 5, and first insulating layer 2 is by several inorganic filler layers 21 and several trees
Fat granule 22 forms, and the resin particle 22 is distributed in the inside of inorganic filler layer 21, if the inside of the second insulating layer 3 is provided with
Dry filler particles 7, the heat-conducting layer 4 include heat conducting base material layer 41 and two high thermal conductivity adhesive layers 42, two high thermal conductivities
Adhesive layer 42 is located at the two sides up and down of heat conducting base material layer 41, the thickness of first insulating layer 2 and the thickness one of second insulating layer 3
Sample, the thickness of the bottom plate 1 are greater than the thickness of the first insulating layer 2, and the bottom plate 1, second insulating layer 3, is led at first insulating layer 2
Thermosphere 4 and copper foil layer 5 are integrally formed by hot pressing, and the filler particles 7 are the small particle aluminium oxide heat filling of high heat conductance
Particle, the copper foil layer 5 are made of electrolytic copper foil, and the high thermal conductivity adhesive layer 42 is made of several high thermal conductivity bonding sheets, institute
The upper surface of the bottom surface and copper foil layer 5 of stating bottom plate 1 is provided with release protective film 6, and the lower section of the bottom plate 1 is provided with several
Heat sink strip 8.
By being provided with the first insulating layer 2, second insulating layer 3, resin particle 22 and filler particles 7, so that the copper-clad plate has
There are good thermal stability, excellent capacity of heat transmission and electrical property, by being provided with heat conducting base material layer 41 and two high thermal conductivities
Adhesive layer 42 improves the thermal conductivity of the copper-clad plate, by being provided with release protective film 6, prevent the surface of copper-clad plate occur oxidation,
Phenomena such as corrosion, passes through hot pressing one by setting bottom plate 1, the first insulating layer 2, second insulating layer 3, heat-conducting layer 4 and copper foil layer 5
Molding, improves the stability of the copper-clad plate when in use, by being provided with heat sink strip 8, improves the thermal diffusivity of copper-clad plate.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (6)
1. a kind of high stability copper-clad plate, including bottom plate, it is characterized in that: the first insulating layer is provided with above the bottom plate, institute
It states and is provided with second insulating layer above the first insulating layer；Heat-conducting layer is provided with above the second insulating layer, it is described thermally conductive
The top of layer is provided with copper foil layer, and first insulating layer is made of several inorganic filler layers and several resin particles, described
Resin particle is distributed in the inside of inorganic filler layer, several filler particles are provided on the inside of the second insulating layer, described to lead
Thermosphere includes heat conducting base material layer and two high thermal conductivity adhesive layers, and two high thermal conductivity adhesive layers are located at the upper and lower of heat conducting base material layer
The thickness of two sides, the thickness of first insulating layer and being of uniform thickness for second insulating layer, the bottom plate is greater than the first insulating layer
Thickness, the bottom plate, the first insulating layer, second insulating layer, heat-conducting layer and copper foil layer pass through hot pressing be integrally formed.
2. a kind of high stability copper-clad plate according to claim 1, it is characterized in that: the filler particles are high heat conductance
Small particle aluminium oxide heat filling particle.
3. a kind of high stability copper-clad plate according to claim 1, it is characterized in that: the copper foil layer is by electrolytic copper foil system
At.
4. a kind of high stability copper-clad plate according to claim 1, it is characterized in that: the high thermal conductivity adhesive layer is by several
High thermal conductivity bonding sheet composition.
5. a kind of high stability copper-clad plate according to claim 1, it is characterized in that: the bottom surface of the bottom plate and copper foil layer
Upper surface is provided with release protective film.
6. a kind of high stability copper-clad plate according to claim 1, it is characterized in that: being provided with below the bottom plate several
A heat sink strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820746607.8U CN208247650U (en) | 2018-05-18 | 2018-05-18 | A kind of high stability copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820746607.8U CN208247650U (en) | 2018-05-18 | 2018-05-18 | A kind of high stability copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208247650U true CN208247650U (en) | 2018-12-18 |
Family
ID=66480786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820746607.8U Expired - Fee Related CN208247650U (en) | 2018-05-18 | 2018-05-18 | A kind of high stability copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208247650U (en) |
-
2018
- 2018-05-18 CN CN201820746607.8U patent/CN208247650U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181218 |