CN207014900U - A kind of aluminium nitride substrate - Google Patents
A kind of aluminium nitride substrate Download PDFInfo
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- CN207014900U CN207014900U CN201720822535.6U CN201720822535U CN207014900U CN 207014900 U CN207014900 U CN 207014900U CN 201720822535 U CN201720822535 U CN 201720822535U CN 207014900 U CN207014900 U CN 207014900U
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- flaggy
- aluminum
- nitride
- copper foil
- glass fiber
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Abstract
It the utility model is related to a kind of aluminium nitride substrate, including copper foil layer, first heat conduction silicone, epoxy glass fiber flaggy, second heat conduction silicone and aluminum-nitride-based flaggy, the copper foil layer lower surface is spaced apart and is provided with plural bar copper foil thermal trough, the epoxy glass fiber flaggy upper surface is spaced apart and is provided with plural bar fiberboard thermal trough, the copper foil layer lower surface is bonded by the first heat conduction silicone and epoxy glass fiber flaggy upper surface, the epoxy glass fiber flaggy lower surface is bonded by the second heat conduction silicone and aluminum-nitride-based flaggy, the aluminum-nitride-based flaggy interior edge horizontal direction is spaced apart and is provided with plurality of through holes, graphite heat-conducting fin is filled with each through hole.Solves existing aluminum-based copper-clad plate due to pressing using hot pressing mode by the utility model, not easy to remove, disassembly cost is high, the problem of being unfavorable for resource recycling.
Description
Technical field
It the utility model is related to substrate fabrication techniques field, more particularly to a kind of aluminium nitride substrate.
Background technology
It is also increasing for the demand of substrate with the development of electronics and information industry.Generally, substrate is exactly
Copper-clad laminate, much copper-clad laminates use aluminum-based copper-clad plate at present, and its production technology is using aluminium base flaggy as support
And radiating bottom plate, composite multi-layer heat-conducting plate, insulating barrier through hot pressing successively on aluminium base flaggy, copper foil is finally covered on the insulating layer
Layer, its manufacturing process are simple.
A kind of aluminum-based copper-clad plate as disclosed on October 03rd, 2012 Chinese patent mandate publication number CN202463041U,
Including aluminium base flaggy, thermally conductive insulating layer, copper foil layer and release transparent film layer, wherein, the aluminium base flaggy has the first stitching surface
And second stitching surface, the bottom surface of the thermally conductive insulating layer are fitted on first stitching surface of the aluminium base flaggy, copper foil layer patch
Close on second stitching surface of the aluminium base flaggy, the release transparent film layer is fitted on the top surface of the thermally conductive insulating layer.It is above-mentioned
Aluminum-based copper-clad plate manufacturing process is simple, speed of production is fast, the heat of copper foil can be made to be rapidly reached aluminium base plays heat conduction and radiating
Effect.
It is contemplated that the aluminum-based copper-clad plate disassembly ＆ recycling problem after electronic product damage, above-mentioned aluminum-based copper-clad plate is due to aluminium
Substrate layer, thermally conductive insulating layer, copper foil layer are pressed using hot pressing mode, not easy to remove, and disassembly cost is high, is unfavorable for aluminium base
Layer, thermally conductive insulating layer, the disassembly ＆ recycling of copper foil layer.
Utility model content
Therefore, for it is above-mentioned the problem of, the utility model proposes a kind of aluminium nitride substrate, solves existing aluminium base and covers copper
Plate is not easy to remove due to being pressed using hot pressing mode, and disassembly cost is high, the problem of being unfavorable for resource recycling.
To achieve the above object, the utility model employs following technical scheme：A kind of aluminium nitride substrate, including copper foil
Layer, the first heat conduction silicone, epoxy glass fiber flaggy, the second heat conduction silicone and aluminum-nitride-based flaggy, under the copper foil layer
Surface, which is spaced apart, is provided with plural bar copper foil thermal trough, and the epoxy glass fiber flaggy upper surface is spaced apart and is provided with plural bar fiber
Plate thermal trough, the copper foil layer lower surface is bonded by the first heat conduction silicone and epoxy glass fiber flaggy upper surface, described
Epoxy glass fiber flaggy lower surface is bonded by the second heat conduction silicone and aluminum-nitride-based flaggy, in the aluminum-nitride-based flaggy
It is horizontally spaced to offer plurality of through holes, it is filled with graphite heat-conducting fin in each through hole.
Further, the aluminum-nitride-based flaggy upper surface is arranged at intervals with a plurality of clamping joints, and the expoxy glass is fine
Dimension flaggy lower surface offers the buckling groove that plural bar is connected with each clamping joint.
Further, the aluminum-nitride-based flaggy lower surface offers a plurality of semicircle radiating grooves.
By using preceding solution, the beneficial effects of the utility model are：The copper of the utility model aluminum-based copper-clad plate
Layers of foil is bonded by the first heat conduction silicone and epoxy glass fiber flaggy upper surface, epoxy glass fiber flaggy lower surface and nitrogen
Change being bonded by the second heat conduction silicone for aluminium base flaggy, make epoxy glass fiber flaggy and aluminum-nitride-based flaggy directly seamless
Connection, heat transfer efficiency is high, its structure, simple production process；Copper foil layer lower surface is spaced apart and is provided with plural bar copper foil heat conduction
Groove, epoxy glass fiber flaggy upper surface are spaced apart and are provided with plural bar fiberboard thermal trough, and being advantageous to the first heat conduction silicone will
Copper foil layer and the bonding of epoxy glass fiber flaggy are firm；Plural number is provided with by being spaced apart in aluminum-nitride-based flaggy interior edge horizontal direction
Individual through hole, and filling graphite heat-conducting fin in through hole, accelerate the heat transfer speed in aluminum-nitride-based flaggy；Further, nitrogenize
Aluminium base flaggy upper surface is arranged at intervals with a plurality of clamping joints, and epoxy glass fiber flaggy lower surface offers plural bar and each institute
The buckling groove of clamping joint mating connection is stated, aluminum-nitride-based flaggy connects more firm with epoxy glass fiber flaggy；Further, lead to
A plurality of semicircle radiating grooves of aluminum-nitride-based flaggy lower surface are crossed, increase the area of dissipation of aluminum-nitride-based flaggy, accelerate nitridation
Aluminium base flaggy radiates.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the utility model embodiment；
Fig. 2 is the structural representation of the utility model embodiment copper foil layer；
Fig. 3 is the structural representation of the utility model embodiment epoxy glass fiber plate；
Fig. 4 is the structural representation of the utility model embodiment aluminium base.
Embodiment
The utility model is further illustrated in conjunction with the drawings and specific embodiments.
With reference to figure 1, Fig. 2, Fig. 3 and Fig. 4, the present embodiment provides a kind of aluminium nitride substrate, including copper foil layer 1, heat conductive silica gel
Layer 2, epoxy glass fiber flaggy 3, heat conduction silicone 4, aluminum-nitride-based flaggy 5 and a plurality of graphite heat-conducting fins 6.The copper foil layer
1 lower surface, which is spaced apart, is provided with plural bar copper foil thermal trough 11, and the upper surface of epoxy glass fiber flaggy 3, which is spaced apart, is provided with plural number
Bar fiberboard thermal trough 31, the lower surface of epoxy glass fiber flaggy 3 offer plural bar buckling groove 32, the copper foil layer 1
Bonded by heat conduction silicone 2 and epoxy glass fiber flaggy 3, each the copper foil thermal trough 11 and fiberboard thermal trough 31 are favourable
Copper foil layer 1 and epoxy glass fiber flaggy 3 are bonded firmly in heat conduction silicone 2.
The upper surface of aluminum-nitride-based flaggy 5 is arranged at intervals with a plurality of clamping joints 51, the quantity of clamping joint 51 and card
The quantity of access slot 32 is identical, and each clamping joint 51 is respectively engaged with each buckling groove 32；The interior edge of aluminum-nitride-based flaggy 5
Horizontal direction is spaced apart and is provided with plurality of through holes 52, and the quantity of through hole 52 is identical with the quantity of graphite heat-conducting fin 6, each graphite
Thermally conductive sheet 6 is correspondingly arranged in each through hole 52 respectively；The lower surface of aluminum-nitride-based flaggy 5 offers a plurality of semicircles
Radiating groove 53, increase the area of dissipation of aluminum-nitride-based flaggy 5, accelerate aluminum-nitride-based flaggy 5 and radiate.The epoxy glass fiber plate
The contact surface surface of layer 3 and aluminum-nitride-based flaggy 5 is bonded by heat conduction silicone 4.
When reclaiming aluminum-based copper-clad plate, first soften heat conduction silicone 2 and heat conduction silicone 4 by high temperature, then again by copper foil
Layer 1 and aluminum-nitride-based flaggy 5 are dismantled from epoxy glass fiber flaggy 3, and unloading process simply, conveniently, is advantageous to resource reclaim
Utilize.
Although specifically showing and describing the utility model with reference to preferred embodiment, those skilled in the art should
This is understood, is not departing from the spirit and scope of the present utility model that appended claims are limited, in form and details
On the utility model can be made a variety of changes, be the scope of protection of the utility model.
Claims (3)
- A kind of 1. aluminium nitride substrate, it is characterised in that：Including copper foil layer, the first heat conduction silicone, epoxy glass fiber flaggy, Two heat conduction silicones and aluminum-nitride-based flaggy, the copper foil layer lower surface are spaced apart and are provided with plural bar copper foil thermal trough, the ring Oxygen glass fiberboard upper surface is spaced apart and is provided with plural bar fiberboard thermal trough, and the copper foil layer lower surface passes through the first heat conduction Layer of silica gel bonds with epoxy glass fiber flaggy upper surface, and the epoxy glass fiber flaggy lower surface passes through the second heat conductive silica gel Layer bonds with aluminum-nitride-based flaggy, and the aluminum-nitride-based flaggy interior edge horizontal direction, which is spaced apart, is provided with plurality of through holes, each described Graphite heat-conducting fin is filled with through hole.
- A kind of 2. aluminium nitride substrate according to claim 1, it is characterised in that：The aluminum-nitride-based flaggy upper surface interval A plurality of clamping joints are provided with, the epoxy glass fiber flaggy lower surface offers plural bar and coordinates company with each clamping joint The buckling groove connect.
- A kind of 3. aluminium nitride substrate according to claim 1 or 2, it is characterised in that：The aluminum-nitride-based flaggy lower surface Offer a plurality of semicircle radiating grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720822535.6U CN207014900U (en) | 2017-07-07 | 2017-07-07 | A kind of aluminium nitride substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720822535.6U CN207014900U (en) | 2017-07-07 | 2017-07-07 | A kind of aluminium nitride substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207014900U true CN207014900U (en) | 2018-02-16 |
Family
ID=61483694
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720822535.6U Active CN207014900U (en) | 2017-07-07 | 2017-07-07 | A kind of aluminium nitride substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN207014900U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108521750A (en) * | 2018-04-25 | 2018-09-11 | 沪如科技南京有限公司 | A kind of heat conductive silica gel gasket |
-
2017
- 2017-07-07 CN CN201720822535.6U patent/CN207014900U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108521750A (en) * | 2018-04-25 | 2018-09-11 | 沪如科技南京有限公司 | A kind of heat conductive silica gel gasket |
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