CN208336201U - A kind of radiator structure and the power module with it - Google Patents
A kind of radiator structure and the power module with it Download PDFInfo
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- CN208336201U CN208336201U CN201820729341.6U CN201820729341U CN208336201U CN 208336201 U CN208336201 U CN 208336201U CN 201820729341 U CN201820729341 U CN 201820729341U CN 208336201 U CN208336201 U CN 208336201U
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- radiator structure
- lead frame
- power module
- cooling fin
- tin cream
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Abstract
The utility model provides a kind of radiator structure (1) and the power module with it.Radiator structure (1), it is followed successively by cooling fin (11) and welding layer (12) from the bottom to top, the welding layer (12) is made of tin cream and printing gauze, and the printing gauze offers several windows, and the paste solder printing is in the window.Power module with the radiator structure (1), including lead frame (2) and the radiator structure (1), need the position of heat dissipation corresponding with the position of the window on the lead frame (2), and the tin cream is melted by welding, the lead frame (2) and the radiator structure (1) are connected as one.The utility model can improve heat dissipation effect, improve production efficiency, keep product whole height consistent, it is ensured that product reliability, and reduce manufacturing cost.
Description
Technical field
The utility model relates to Cooling Technology of Electronic Device fields, and in particular to a kind of radiator structure, the power with it
Module.
Background technique
The power electronic devices such as intelligent power module are during the work time, certain by generating due to the power loss of itself
Heat and cause the raising of power electronic devices running temperature.In order to enable power electronic devices normally and reliably to transport
Row, needs reasonable power electronics radiator to distribute the heat of generation.
The heat dissipation connection type that existing intelligent power module uses is covered between lead frame bottom and Copper base material cooling fin
Two layers of lid pressing there is high insulation, high thermal conductivity ability and the resin-bonded layer with certain adhesive capacity, there are the problem of
In: the difficulty of matching between the curing degree of 1. cooling fins and resin layer, viscosity, softness and insulating heat-conductive rate characteristic is big, therefore, right
Cooling fin characteristic requirements are high, thus at high cost；2. Copper base material cooling fin is softer, poor flatness, there are the discreteness of size with
The deviation of equipment pressing, to easily cause excessive glue during the plastic packaging of product；3. segment difference arranged at lead frame bottom, but resin
The problem of thickness is certain, therefore when cooling fin and lead frame press, and fitting is be easy to cause to remove；4. resin layer and frame
Thermal expansion coefficient between frame is different, so that reliability of Power Modules is low；5. the bonding of cooling fin and resin layer need by
Preheating, heating, pressing, production effect are low.
In addition, Chinese patent literature CN107808858A discloses a kind of power device and its (PCC) power, from down toward
On successively include cooling fin, insulating radiation layer and lead frame, wherein cooling fin be metal fin, and insulating radiation layer be pottery
Tile between insulating radiation layer and cooling fin, is all attached by tin cream between insulating radiation layer and lead frame.The patent
Radiator structure in document the problem is that: 1, sandwiched ceramic layer between lead frame and cooling fin, heat dissipation effect are bad；2,
Ceramic layer two sides requires to be welded using tin cream, and manufacturing process is complicated, and production efficiency is low；3, using the manufacture of ceramic layer at
This height.
Summary of the invention
Therefore, the technical problem to be solved by the present invention is to: improve the heat dissipation effect of power device, simplify its heat dissipation
The production procedure of structure reduces whole manufacturing cost.
Radiator structure provided by the utility model is followed successively by cooling fin and welding layer from the bottom to top, and the welding layer is by tin cream
With printing gauze composition, the printing gauze offers several windows, and the paste solder printing is in the window.
Further, the cooling fin is made of the heat-conducting insulated film of aluminum substrate and the aluminum substrate upper surface.
Further, the heat-conducting insulated film is PP film.
Further, the PP film is combined as a whole by hot pressing and the aluminum substrate.
Further, the printing gauze is steel mesh.
Further, the steel mesh is coated with tin layers away from the surface of the cooling fin.
Power module provided by the utility model, including lead frame and radiator structure described in any of the above embodiments, it is described
It needs the position of heat dissipation corresponding with the position of the window on lead frame, and melts the tin cream by welding, draw described
Wire frame is connected as one with the radiator structure.
Further, it needs to sink to being formed sinking portion at the position of heat dissipation on the lead frame.
Further, the sinking portion has several sinking sub-portions, and the tin cream thickness in the radiator structure can make up respectively
The segment difference that a sinking sub-portion generates in pressing process.
Further, the bottom surface in the sinking portion is coated with nickel layer.
Technical solutions of the utility model have the advantages that
1. the radiator structure of the utility model guarantees insulation characterisitic while improving heat dissipation effect, and reduces production
The packaging cost of product.
2. the matching problem and excessive glue problem of cooling fin and resin layer, letter is not present in the radiator structure of the utility model
Change manufacturing process, improves production efficiency.
3. the thickness of tin cream can make up the segment difference of lead frame bottom in the radiator structure of the utility model, so as to accurate
Control lead frame is bonded flatness and tightness with cooling fin.
4. the radiator structure tin cream of the utility model and lead frame, the expansion coefficient similar for printing gauze, improve production
The reliability of product entirety.
5. power module provided by the utility model has above-mentioned any one due to using above-mentioned radiator structure
Advantage.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic perspective view of the power module provided by the utility model with radiator structure；
Fig. 2 is the top view of power module in Fig. 1；
Fig. 3 be the utility model radiator structure in conjunction with lead frame after cross-sectional view；
Fig. 4 is the process flow chart of the manufacture power module of the utility model.
Description of symbols:
1- radiator structure, 11- cooling fin, 111- aluminum substrate, 112- heat-conducting insulated film, 12- welding layer,
2- lead frame, 21- sinking portion, 211/212- sinking sub-portion, 3-PCB plate.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is a part of embodiment of the utility model, rather than whole embodiments.Based on the reality in the utility model
Apply mode, every other embodiment obtained by those of ordinary skill in the art without making creative efforts,
It fall within the protection scope of the utility model.
It is in the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
In addition, as long as technical characteristic involved in the utility model different embodiments disclosed below is each other
Not constituting conflict can be combined with each other.
Fig. 1 and Fig. 2 shows the power module in the utility model from different visual angles.It is practical new that this is shown in Fig. 1
The schematic perspective view of power module in type with radiator structure, Fig. 2 is the top view of power module in Fig. 1.It should manage
It solves, the radiator structure in the utility model can be used for the various power electronic devices occasions for needing to radiate, but in this reality
It applies in mode, is introduced for for power module.The reason of power module is as its fever of device for power switching is main
There are two, conduction loss caused by a conduction voltage drop for power electronic devices, two make for the switching process of power electronic devices
At switching loss.In order to guarantee that power module normally and is reliably run, it is necessary to be radiated in time by radiator structure.Function
Rate module includes lead frame 2, and PCB plate 3 is carried among lead frame 2.Radiator structure 1 and lead in the utility model
The bottom of frame 2 closely connects.
Fig. 3 be the utility model in radiator structure 1 combined with lead frame 2 after cross-sectional view.As shown, radiator structure
1 successively includes cooling fin 11 and welding layer 12 from the bottom to top.Welding layer 12 for the side of being connected thereto lead frame 2 bottom and
Cooling fin 11 below.Welding layer 12 is made of tin cream and printing gauze, wherein printing gauze offers several windows, tin cream
It is printed in several windows.Tin cream plays the role of connection, closely connect by welding with the bottom surface of lead frame 2.
It can be seen that there is no intermediate ceramic layer in the radiator structure 1 of the utility model, cooling fin 11 directly by tin cream with
Lead frame 2 connects, thus excellent in heat dissipation effect；It replaces copper base to carry out heat dissipation using aluminum substrate and improves the smooth of product entirety
It spends, improve the scattered property of size of product, reduce costs；The resin layer of cementation has been not present in radiator structure 1, has been not necessarily to
The matching problem for considering resin layer, will not lead to product failure because of excessive glue, at the same the coefficient of expansion of tin cream and cooling fin 11 with
And lead frame 2 is all close, improves the reliability of product entirety, when keeping from heat or being cooled, because the coefficient of expansion mismatches
The low problem of caused product reliability.
Further, cooling fin 11 is made of aluminum substrate 111 and the heat-conducting insulated film on surface disposed thereon 112.Aluminum substrate
111 for heat dissipation and and support power module.112 very thin thickness of heat-conducting insulated film, main function are to improve heat dissipation performance
While guarantee product electrical insulating property.Cooling fin 11 is connected as an independent finished product by welding layer 12 and lead frame 2
It connects, that is to say, that aluminum substrate 111 and heat-conducting insulated film 112 are integral.
Preferably, the heat-conducting insulated film 112 in cooling fin 11 is PP film, and PP film is combined into one through hot pressing and aluminum substrate 111
Body.PP film in conjunction with after is in hardening state, the matching problem there is no PP film curing degree, viscosity etc. with other component.PP film has
Help keep high insulating properties while heat dissipation, to further improve the electrical security of product entirety.
Particularly, the track net in welding layer 12 is preferably steel mesh, and steel mesh has several windows, the shape of window and
Size and lead frame 2 need to reinforce the location matches of heat dissipation, and paste solder printing is in these windows, to need with lead frame 2
The position to be radiated is corresponding.Printing gauze can be used as partial electric conducting wire, but not as the electrical pathways of high current.For the later period
It preferably be combined with each other with tin cream and convenient for welding, track wire side, i.e., can away from the surface of cooling fin 11 to lead frame 2
One layer of tin layers are electroplated.
Cooling fin 11 can closely be connect by the structure of above-mentioned welding layer 12 with 2 bottom of lead frame, and bottom line is reduced
Thermal resistance between lead frame 2 and cooling fin 11, greatly improves heat dissipation effect.
Fig. 1 is combined to describe the structure of the lead frame 2 of power module in the utility model, usual pcb board 3 further below
It is carried in lead frame 2, lead frame 2 can be used as partial electric conducting wire, while also function to structural support effect, and be used as
Radiate carrier.The bottom of lead frame 2 is combined with radiator structure 1, thus the heat that power module radiates by radiator structure 1
Amount is transmitted to outside.Heat dissipation effect is increased dramatically the power module of the utility model compared to the prior art.
As shown, the bottom of lead frame 2 needs the position for reinforcing heat dissipation to be designed as under sinking relative to PCB plate
Heavy portion 21, i.e., it is not a plane that the bottom of lead frame 2 is whole, and sinking portion 21 is in different planes from pcb board 3, is sunk
The bottom surface in portion 21 is combined with radiator structure 1.Heat dissipation position and PCB be staggered a height be in order to avoid heat dissipation position to PCB
Have an adverse effect.Sinking portion 21 can be divided into multiple sinking sub-portions 211,212 etc. side by side again it can be seen from Fig. 1,
Since pressed lead frame 2 usually there will be subtle segment difference, i.e., there may be thin for the bottom surface of each sinking sub-portion 211,212
Micro- difference of height, the utility model can make up the segment difference by controlling the thickness of tin cream.Specifically, i.e. sink it is more,
Slightly thin tin cream is brushed at the corresponding printing gauze window of the slightly lower sinking sub-portion in bottom surface, in the sinking sunk less, bottom surface is slightly higher
Slightly thick tin cream is brushed at the corresponding printing gauze window of sub-portion.Therefore, the power module of the utility model can accurately control and draw
Wire frame 2 is bonded flatness and tightness with cooling fin 11, keeps whole high consistency.
In addition, surface that can be to be welded in 2 bottom of lead frame plates one layer of nickel layer, the nickel layer in order not to oxidizable
Thermal conductivity can further be improved.
The manufacturing process of power module in the utility model is described in detail below in conjunction with the flow chart of Fig. 4.
Step 1 S1: in 11 upper surface print solder paste of cooling fin；
Step 2 S2: in a manner of needing the position of heat dissipation and the aligned in position of the tin cream on lead frame 2, draw described
Wire frame 2 is bonded with the cooling fin 11 for printing tin cream；
Step 3 S3: the tin cream is melted by welding, the lead frame 2 of fitting and the cooling fin 11 are welded
Connect fixation.
Specifically, step 1 includes, cooling fin 11 is placed on carrier, as described above, cooling fin 11 is in aluminium
The finished product that 111 upper surface hot pressing heat-conducting insulated film 112 of substrate is integrally formed；The printing gauze of several windows will be offered, it is such as excellent
It is selected as steel mesh covering and is fixed on cooling fin 11；And automatic printing tin cream equipment is used, at the window of printing gauze
Print the tin cream of a layer specific amount.
It is further preferred that the heat-conducting insulated film 112 in step 1 is PP film.In addition, steel mesh deviates from the table of cooling fin 11
Face can be coated with tin layers, in favor of welding.
Further, in step 2, lead frame 2 forms sinking portion 21 at heat dissipation position, is bonded process, i.e. sinking portion 21
It is fitted closely with the corresponding position of cooling fin 11.As described above, sinking portion 21 also has several sinking sub-portions 211,212, sink
Sub-portion 211,212 generates certain segment difference in pressing process, and the segment difference can be come by the tin cream printed on cooling fin 11
It makes up, that is, brush slightly thin tin cream at the corresponding printing gauze window of slightly lower sinking sub-portion in bottom surface, it is on the contrary then brush thicker
Tin cream.
Particularly, the welding manner in step 3 is vacuum back-flow weldering, melts tin cream by cooling fin 11 and lead
Frame 2 is welded on one piece.
Further, further include step 4 S4 after step 3: the bubble generated at solder bond is taken away.Guaranteed with this
The compactness of welding completes the welding of lead frame 2 and cooling fin 11.
The manufacturing process of the manufacture power module of the utility model is brush tin cream and use reflux directly on cooling fin 11
Weldering is attached, and is not needed processes, the production efficiencys such as preheating, heating, pressing and is substantially improved compared with traditional handicraft, such as passes
The Copper base material of system completes the connection for achievable 10 products of time the utility model that 4 products are connect with resin Joining Technology.
Obviously, above embodiment is only intended to clearly illustrate example, and does not limit the embodiments.
For those of ordinary skill in the art, other various forms of variations can also be made on the basis of the above description
Or it changes.There is no necessity and possibility to exhaust all the enbodiments.And obvious variation extended from this
Or it changes still within the protection scope of the invention.
Claims (10)
1. a kind of radiator structure, which is characterized in that be followed successively by cooling fin (11) and welding layer (12), the welding layer from the bottom to top
(12) it is made of tin cream and printing gauze, the printing gauze offers several windows, and the paste solder printing is in the window.
2. radiator structure according to claim 1, which is characterized in that the cooling fin (11) is by aluminum substrate (111) and institute
State heat-conducting insulated film (112) composition of aluminum substrate (111) upper surface.
3. radiator structure according to claim 2, which is characterized in that the heat-conducting insulated film (112) is PP film.
4. radiator structure according to claim 3, which is characterized in that the PP film passes through hot pressing and the aluminum substrate
(111) it is combined as a whole.
5. radiator structure according to any one of claims 1 to 4, which is characterized in that the printing gauze is steel mesh.
6. radiator structure according to claim 5, which is characterized in that the steel mesh deviates from the surface of the cooling fin (11)
It is coated with tin layers.
7. a kind of power module, which is characterized in that including lead frame (2) and it is according to any one of claims 1 to 6 dissipate
Heat structure (1) needs on the lead frame (2) position of heat dissipation corresponding with the position of the window, and by described in welding and making
Tin cream fusing, the lead frame (2) and the radiator structure (1) are connected as one.
8. power module according to claim 7, which is characterized in that at the position for needing heat dissipation on the lead frame (2)
Sinking forms sinking portion (21).
9. power module according to claim 8, which is characterized in that the sinking portion (21) has several sinking sub-portions
(211,212), the tin cream thickness in the radiator structure (1) can make up each sinking sub-portion (211,212) and suppress
The segment difference generated in journey.
10. power module according to claim 8 or claim 9, which is characterized in that the bottom surface of the sinking portion (21) is coated with nickel
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820729341.6U CN208336201U (en) | 2018-05-16 | 2018-05-16 | A kind of radiator structure and the power module with it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820729341.6U CN208336201U (en) | 2018-05-16 | 2018-05-16 | A kind of radiator structure and the power module with it |
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| Publication Number | Publication Date |
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| CN208336201U true CN208336201U (en) | 2019-01-04 |
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| CN201820729341.6U Active CN208336201U (en) | 2018-05-16 | 2018-05-16 | A kind of radiator structure and the power module with it |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511413A (en) * | 2018-05-16 | 2018-09-07 | 珠海格力新元电子有限公司 | A kind of radiator structure, power module and its manufacturing process with it |
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2018
- 2018-05-16 CN CN201820729341.6U patent/CN208336201U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511413A (en) * | 2018-05-16 | 2018-09-07 | 珠海格力新元电子有限公司 | A kind of radiator structure, power module and its manufacturing process with it |
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