CN206401362U - A kind of high heat conductive insulating aluminium base - Google Patents
A kind of high heat conductive insulating aluminium base Download PDFInfo
- Publication number
- CN206401362U CN206401362U CN201720121704.3U CN201720121704U CN206401362U CN 206401362 U CN206401362 U CN 206401362U CN 201720121704 U CN201720121704 U CN 201720121704U CN 206401362 U CN206401362 U CN 206401362U
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- China
- Prior art keywords
- insulating barrier
- aluminium base
- chip
- hole
- base body
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of high heat conductive insulating aluminium base, including copper foil, insulating barrier and aluminium base body, copper foil is arranged on the upper surface of insulating barrier, insulating barrier is internally provided with several insulating barrier through holes, chip carrier is fixed with inside insulating barrier through hole, the upper surface of chip carrier is provided with chip, the two ends of chip are respectively arranged with input pin and output pin, input pin and output pin are welded by solder and the copper foil at chip two ends respectively, copper foil, the upper end of input pin and output pin is provided with one layer of packaging plastic, the lower surface of insulating barrier is provided with one layer of silica gel piece, the lower surface of chip carrier is connected by heat-conducting glue with silica gel piece.The utility model chip is embedded in the inside of insulating barrier, enhance the distance between chip and aluminium sheet, it ensure that good heat radiating efficiency, radiating fin can be for chip bottom radiating, solve the problem of aluminium base body integral heat sink is uneven, it ensure that good radiating effect, it is possible to increase the service life of product.
Description
Technical field
The utility model is related to aluminium base technical field, specially a kind of high heat conductive insulating aluminium base.
Background technology
Aluminium base is a kind of metal-based copper-clad plate with good heat radiating function, and general single sided board is by three-decker institute group
Into being circuit layer, insulating barrier and metal-based layer respectively.For it is high-end use be also designed as dual platen, structure be circuit layer,
Insulating barrier, aluminium base, insulating barrier, circuit layer.It is multi-layer sheet that only a few, which is applied, can be by common multi-layer sheet and insulating barrier, aluminium base
Laminating is formed.Radiator aluminium base plate mainly uses its heat-radiating substrate material to have preferably heat conductivity in itself, by thermal source from LED
Crystal grain is exported.Two kinds of different heat-radiating substrates carry produced when LED grain lights LED grain with LED wafer respectively
Heat energy, via LED grain heat-radiating substrate to system circuit board, is then absorbed by atmospheric environment, to reach hot scattered effect.
Aluminium base of the prior art, because structure is single, radiating and insulation are using the structure sheaf of flush system, high-power
The problem of there is poor heat radiation unavoidably when using in the specific occasion such as environment, insulating properties is not high, it is difficult to ensure that the normal of product makes
With, and most aluminium base does not possess certain autoprotection structure, so as to reduce product service life.
Utility model content
The purpose of this utility model is to provide a kind of high heat conductive insulating aluminium base, to solve to propose in above-mentioned background technology
The problem of.
To achieve the above object, the utility model provides following technical scheme：A kind of high heat conductive insulating aluminium base, including copper
Paper tinsel, insulating barrier and aluminium base body, the copper foil are arranged on the upper surface of insulating barrier, and insulating barrier is internally provided with several insulation
Chip carrier is fixed with inside layer through hole, insulating barrier through hole, the upper surface of chip carrier is provided with chip, the two ends difference of chip
Input pin and output pin are provided with, input pin and output pin are welded by solder and the copper foil at chip two ends respectively,
The upper end of copper foil, input pin and output pin is provided with one layer of packaging plastic, and the lower surface of insulating barrier is provided with one layer of silica gel
Piece, the lower surface of chip carrier is connected by heat-conducting glue with silica gel piece, and the lower surface of silica gel piece is provided with aluminium base body, aluminium base
The vertical corresponding position of the lower surface of plate body and insulating barrier through hole is provided with radiating fin, and aluminium base body is internally provided with
Heat emission hole, and heat emission hole sequentially passes through silica gel piece and insulating barrier, the upper surface of packaging plastic is provided with radiating groove, aluminium base body
Middle part is provided with positioning hole, and aluminium base body is internally provided with several screwed holes, and positioning hole and screwed hole are sequentially passed through
Silica gel piece, insulating barrier and packaging plastic.
Further, the insulating barrier through hole is in round table-like, and chip carrier is embedded in inside insulating barrier.
Further, the horizontal area of the radiating fin is more than the horizontal area of chip carrier.
Further, the radiating groove is provided with two and in annular shape, and two radiating grooves are located at the both sides of chip respectively.
Further, the screwed hole is separately positioned on the Internal and external cycle of radiating groove.
Compared with prior art, the beneficial effects of the utility model are：Chip is embedded in the inside of insulating barrier, promotes significantly
The distance between chip and aluminium sheet, it is ensured that good heat radiating efficiency, insulating barrier through hole can while ensureing chip normal work
To play a part of protecting chip, packaging plastic plays a part of effective protection pin and copper foil, and heat emission hole and radiating groove can rise
To further thermolysis, radiating fin can solve the problem of aluminium base body integral heat sink is uneven for chip bottom radiating,
Good radiating effect is ensure that, the service life of product can be greatly improved.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the overall top view of the utility model.
In reference：1- packaging plastics；2- input pins；3- chip carriers；4- chips；5- output pins；6- solders；7-
Copper foil；8- insulating barriers；9- silica gel pieces；10- aluminium base bodies；11- radiating fins；12- heat emission holes；13- heat-conducting glues；14- insulate
Layer through hole；15- radiating grooves；16- screwed holes；17- positioning holes.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Fig. 1-2 is referred to, the utility model provides a kind of high heat conductive insulating aluminium base, including copper foil 7, insulating barrier 8 and aluminium
Substrate body 10, the copper foil 7 is arranged on the upper surface of insulating barrier 8, and insulating barrier 8 is internally provided with several insulating barrier through holes
14, chip carrier 3 is fixed with inside insulating barrier through hole 14, the upper surface of chip carrier 3 is provided with chip 4, the two ends point of chip 4
Input pin 2 and output pin 5 are not provided with, and input pin 2 and output pin 5 pass through solder 6 and the copper at the two ends of chip 4 respectively
Paper tinsel 7 is welded, and the upper end of copper foil 7, input pin 2 and output pin 5 is provided with one layer of packaging plastic 1, and the lower surface of insulating barrier 8 is set
One layer of silica gel piece 9 is equipped with, the lower surface of chip carrier 3 is connected by heat-conducting glue 13 with silica gel piece 9, and the lower surface of silica gel piece 9 is set
Aluminium base body 10 is equipped with, the lower surface of aluminium base body 10 is provided with heat radiating fin with the vertical corresponding position of insulating barrier through hole 14
Piece 11, aluminium base body 10 is internally provided with heat emission hole 12, and heat emission hole 12 sequentially passes through silica gel piece 9 and insulating barrier 8, encapsulation
The upper surface of glue 1 is provided with radiating groove 15, and the middle part of aluminium base body 10 is provided with positioning hole 17, the inside of aluminium base body 10
Several screwed holes 16 are provided with, and positioning hole 17 and screwed hole 16 sequentially pass through silica gel piece 9, insulating barrier 8 and packaging plastic 1.
Further, the insulating barrier through hole 14 is in round table-like, and chip carrier 3 is embedded in inside insulating barrier 8, enhances core
The radiating effect of piece.
Further, the horizontal area of the radiating fin 11 is more than the horizontal area of chip carrier 3, it is ensured that chip bottom
Effectively radiating.
Further, the radiating groove 15 is provided with two and in annular shape, and two radiating grooves 15 are respectively positioned at chip 4
Both sides, it is ensured that the radiating effect at the top of aluminium base body 10.
Further, the screwed hole 16 is separately positioned on the Internal and external cycle of radiating groove 15, improves aluminium base body 10 and pacifies
Fill stability.
The insulating barrier 8 that the utility model is mentioned is a kind of polymerization by high heat conduction, the ceramic powder filled of high insulation
The component that thing is made.
Operation principle：Chip carrier 3 and chip 4 are embedded in the inside of insulating barrier 8, and there is one layer of packaging plastic 1 outer surface of copper foil 7
Protection, it is ensured that the good insulating properties of product, the aluminium base body 10 of the lower end of chip 4 is provided with radiating fin 11, can be with
Accomplish targetedly to radiate, while the heat transfer that produces chip of heat-conducting glue 13 is to silica gel piece 9 and aluminium base body 10, big portion
Point heat is discharged from radiating fin 11, solve aluminium base body 10 radiate inequality the problem of, it is ensured that the radiating effect of product, dissipate
The setting of hot hole 12 and radiating groove 15, serves the effect of auxiliary heat dissipation, and screwed hole 16 and locating slot 17 ensure that aluminium base sheet
The stable installation of body 10.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out in the case where not departing from principle of the present utility model and spirit a variety of changes, repaiies
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of high heat conductive insulating aluminium base, including copper foil (7), insulating barrier (8) and aluminium base body (10), it is characterised in that：
The copper foil (7) is arranged on the upper surface of insulating barrier (8), and insulating barrier (8) is internally provided with several insulating barrier through holes (14), absolutely
Chip carrier (3) is fixed with inside edge layer through hole (14), the upper surface of chip carrier (3) is provided with chip (4), chip (4)
Two ends are respectively arranged with input pin (2) and output pin (5), and input pin (2) and output pin (5) pass through solder respectively
(6) copper foil (7) with chip (4) two ends is welded, and the upper end of copper foil (7), input pin (2) and output pin (5) is provided with
One layer of packaging plastic (1), the lower surface of insulating barrier (8) is provided with one layer of silica gel piece (9), and the lower surface of chip carrier (3) is by leading
Hot glue (13) is connected with silica gel piece (9), and the lower surface of silica gel piece (9) is provided with aluminium base body (10), aluminium base body (10)
The vertical corresponding position of lower surface and insulating barrier through hole (14) be provided with radiating fin (11), the inside of aluminium base body (10)
Heat emission hole (12) is provided with, and heat emission hole (12) sequentially passes through silica gel piece (9) and insulating barrier (8), the upper surface of packaging plastic (1) is set
It is equipped with the middle part of radiating groove (15), aluminium base body (10) and is provided with positioning hole (17), the inside of aluminium base body (10) is set
There are several screwed holes (16), and positioning hole (17) and screwed hole (16) sequentially pass through silica gel piece (9), insulating barrier (8) and encapsulation
Glue (1).
2. a kind of high heat conductive insulating aluminium base according to claim 1, it is characterised in that：The insulating barrier through hole (14) is in
Round table-like, it is internal that chip carrier (3) is embedded in insulating barrier (8).
3. a kind of high heat conductive insulating aluminium base according to claim 1, it is characterised in that：The water of the radiating fin (11)
Horizontal area of the plane product more than chip carrier (3).
4. a kind of high heat conductive insulating aluminium base according to claim 1, it is characterised in that：The radiating groove (15) is provided with
Two and in annular shape, two radiating grooves (15) respectively be located at chip (4) both sides.
5. a kind of high heat conductive insulating aluminium base according to claim 1, it is characterised in that：The screwed hole (16) sets respectively
Put the Internal and external cycle in radiating groove (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720121704.3U CN206401362U (en) | 2017-02-10 | 2017-02-10 | A kind of high heat conductive insulating aluminium base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720121704.3U CN206401362U (en) | 2017-02-10 | 2017-02-10 | A kind of high heat conductive insulating aluminium base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206401362U true CN206401362U (en) | 2017-08-11 |
Family
ID=59517948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720121704.3U Expired - Fee Related CN206401362U (en) | 2017-02-10 | 2017-02-10 | A kind of high heat conductive insulating aluminium base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206401362U (en) |
-
2017
- 2017-02-10 CN CN201720121704.3U patent/CN206401362U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170811 Termination date: 20190210 |