CN210182410U - High temperature resistant LED packaging structure based on ceramic substrate - Google Patents
High temperature resistant LED packaging structure based on ceramic substrate Download PDFInfo
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- CN210182410U CN210182410U CN201921642887.9U CN201921642887U CN210182410U CN 210182410 U CN210182410 U CN 210182410U CN 201921642887 U CN201921642887 U CN 201921642887U CN 210182410 U CN210182410 U CN 210182410U
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Abstract
The utility model provides a high temperature resistant LED packaging structure based on ceramic substrate. High temperature resistant LED packaging structure based on ceramic substrate includes: an alumina ceramic substrate; the outer frame is arranged on the outer side of the alumina ceramic substrate; the mounting groove is formed in the outer frame, and the alumina ceramic substrate is fixedly mounted in the mounting groove; the upper LED packaging light source is arranged at the top of the aluminum oxide ceramic substrate; and the lower LED packaging light source is arranged at the bottom of the aluminum oxide ceramic substrate. The utility model provides a high temperature resistant LED packaging structure based on ceramic substrate has ceramic substrate and frame and is connected closely, and whole radiating effect is good, have the advantage based on ceramic substrate of apolegamy function.
Description
Technical Field
The utility model relates to a LED technical field especially relates to a high temperature resistant LED packaging structure based on ceramic substrate.
Background
The ceramic substrate is a special process plate in which copper foil is directly bonded to the surface (single side or double sides) of an aluminum oxide or aluminum nitride ceramic substrate at high temperature, the manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft weldability and high adhesion strength, various patterns can be etched like a PCB (printed circuit board), and the ultrathin composite substrate has high current carrying capacity.
The prior art discloses an LED packaging light source based on a ceramic substrate, and the utility model relates to the technical field of LED packaging; a group of welding pads are arranged on the lower surface of the ceramic substrate; the upper surface of the ceramic substrate is provided with a group of welding lines; each group of the bonding pads and the welding circuits corresponding to the bonding pads up and down are provided with counter bores, and the counter bores are communicated with the bonding pads on the lower surface and the welding circuits on the upper surface; a bowl-cup-shaped plastic package base is arranged on the upper surface of the ceramic substrate; an LED chip is arranged in a non-welding circuit area at the bottom of a bowl cup of the bowl cup-shaped plastic package base, and a surface electrode of the LED chip is connected with a welding circuit through a key and a lead; and packaging glue is arranged inside the bowl cup of the bowl cup-shaped plastic packaging base. The LED chip can be directly fixed on the surface of the ceramic substrate in the middle of the bowl cup, so that the influence of vulcanization is avoided, and the quality of the LED is ensured; the region where the LED chip is fixed is not conductive, the thermoelectric separation effect is achieved, the heat dissipation is good, the advantage of high power can be exerted on the LED devices with the same size, and the practicability is higher.
Although the substrate of the high-temperature resistant LED packaging structure in the prior art is mostly a ceramic substrate and has strong heat conduction and heat dissipation performance, the heat dissipation effect of the used frame is poor, and the overall heat dissipation capacity is reduced.
Therefore, it is necessary to provide a high temperature resistant LED package structure based on a ceramic substrate to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide a ceramic substrate is connected closely with the frame, and whole radiating effect is good, have the high temperature resistant LED packaging structure based on ceramic substrate of apolegamy function.
In order to solve the technical problem, the utility model provides a high temperature resistant LED packaging structure based on ceramic substrate, include: an alumina ceramic substrate; the outer frame is arranged on the outer side of the alumina ceramic substrate; the mounting groove is formed in the outer frame, and the alumina ceramic substrate is fixedly mounted in the mounting groove; the upper LED packaging light source is arranged at the top of the aluminum oxide ceramic substrate; and the lower LED packaging light source is arranged at the bottom of the aluminum oxide ceramic substrate.
Preferably, the outer wall of the outer frame is provided with a plurality of mounting blocks which are distributed in a rectangular shape, and the mounting blocks and the outer frame are of an integral structure.
Preferably, a plurality of the mounting blocks are provided with mounting holes.
Preferably, a heat conduction silica gel layer is filled between the outer wall of the alumina ceramic substrate and the inner wall of the mounting groove.
Preferably, a fixed frame is fixedly mounted at the top of the outer frame, a plurality of radiating fins are arranged at the top of the fixed frame, and the plurality of radiating fins and the fixed frame are of an integral structure.
Preferably, the top of frame is seted up a plurality of thread grooves that are the rectangle and distribute, the top of fixed frame is seted up a plurality of fixed orificess that are the rectangle and distribute, and is a plurality of the fixed orifices respectively with a plurality of thread groove looks adaptation, it is a plurality of all be provided with the fixed screw in the fixed orifices, it is a plurality of the bottom of fixed screw all extends to corresponding in the thread groove, and is a plurality of the fixed screw all closes with corresponding the inner wall of thread groove is mutually screwed.
Preferably, the outer frame is made of aluminum, and the fixing frame and the radiating fins are made of copper materials.
Compared with the prior art, the utility model provides a high temperature resistant LED packaging structure based on ceramic substrate has following beneficial effect:
the utility model provides a high temperature resistant LED packaging structure based on ceramic substrate, the mounting groove is bonded with the alumina ceramic substrate through heat conduction silica gel, and the material of the frame is aluminum material, in the using or installation or transportation process, the frame can provide better protection for the alumina ceramic substrate, the alumina ceramic substrate can rapidly transmit partial heat to the frame, thereby the effect of increasing the heat dissipation area is achieved, thereby the heat dissipation efficiency can be improved, the fixing frame and the frame are installed together through a plurality of fixing screws which are evenly distributed, the laminating is tight, after the frame receives the heat from the alumina ceramic substrate, the heat can be rapidly transmitted to the fixing frame, the heat is transmitted to a plurality of heat dissipation discs by the fixing frame, the whole heat dissipation area is further increased, the heat dissipation efficiency is further improved, and the service life of the internal elements of the upper LED packaging light source and the lower LED packaging light source is further improved, the fixed frame can be selected and matched according to actual requirements.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of a high temperature resistant LED package structure based on a ceramic substrate according to the present invention;
fig. 2 is a top view of a first embodiment of a high temperature resistant LED package structure based on a ceramic substrate according to the present invention;
fig. 3 is a plan view of the outer frame shown in fig. 1.
Fig. 4 is a schematic view of a second embodiment of a high temperature resistant LED package structure based on a ceramic substrate according to the present invention;
FIG. 5 is an enlarged schematic view of portion A shown in FIG. 4;
fig. 6 is a top view of a second embodiment of a high temperature resistant LED package structure based on a ceramic substrate according to the present invention;
figure 7 is a top view of the fixing frame of figure 4.
Reference numbers in the figures: 1. alumina ceramics base plate, 2, frame, 3, mounting groove, 4, last LED encapsulation light source, 5, lower LED encapsulation light source, 6, installation piece, 7, mounting hole, 8, fixed frame, 9, fin, 10, thread groove, 11, fixed orifices, 12, fixed screw.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and embodiments.
First embodiment
Referring to fig. 1-3, in a first embodiment of the present invention, a high temperature resistant LED package structure based on a ceramic substrate includes: an alumina ceramic substrate 1; an outer frame 2, wherein the outer frame 2 is arranged outside the alumina ceramic substrate 1; the mounting groove 3 is formed in the outer frame 2, and the alumina ceramic substrate 1 is fixedly mounted in the mounting groove 3; an upper LED packaging light source 4, wherein the upper LED packaging light source 4 is arranged at the top of the alumina ceramic substrate 1; and the lower LED packaging light source 5 is arranged at the bottom of the aluminum oxide ceramic substrate 1.
The outer wall of the outer frame 2 is provided with a plurality of mounting blocks 6 which are distributed in a rectangular shape, and the mounting blocks 6 and the outer frame 2 are of an integral structure.
A plurality of mounting blocks 6 are provided with mounting holes 7.
And a heat conduction silica gel layer is filled between the outer wall of the alumina ceramic substrate 1 and the inner wall of the mounting groove 3.
The utility model provides a high temperature resistant LED packaging structure based on ceramic substrate's theory of operation as follows:
the first step is as follows: the upper LED packaging light source 4 and the lower LED packaging light source 5 are conventionally arranged in the prior art, the number of the mounting blocks 6 is 6-10, and the installation of the device can be completed by using screws to the plurality of mounting blocks 6.
The second step is that: all bond through heat conduction silica gel between the bottom of the inside and alumina ceramic substrate 1 of bottom of mounting groove 3 and between four side inner walls of mounting groove 3 and four sides of alumina ceramic substrate 1, the material of frame 2 is the aluminium material, it is better to belong to the heat conductivity, in using or installing or transportation, frame 2 can give the better protection of alumina ceramic substrate 1, alumina ceramic substrate 1 can be with the quick transmission of partial heat for frame 2, the effect that increases heat radiating area has been played, thereby can improve the radiating efficiency.
Compared with the prior art, the utility model provides a high temperature resistant LED packaging structure based on ceramic substrate has following beneficial effect:
bonding through heat conduction silica gel between mounting groove 3 and the alumina ceramic base plate 1, and the material of frame 2 is the aluminium material, using or installing or transportation in, frame 2 can give the better protection of alumina ceramic base plate 1, and alumina ceramic base plate 1 can be with the quick transmission of part heat for frame 2, has played the effect that increases heat radiating area to can improve the radiating efficiency.
Second embodiment:
based on the ceramic substrate-based high-temperature resistant LED package structure provided by the first embodiment of the application, the second embodiment of the application provides another ceramic substrate-based high-temperature resistant LED package structure. The second embodiment is merely a preferred way of the first embodiment, and the implementation of the second embodiment does not affect the implementation of the first embodiment alone.
The second embodiment of the present invention will be further explained with reference to the drawings and the embodiments.
Referring to fig. 4-7, the high temperature resistant LED package structure based on the ceramic substrate further includes a fixing frame 8, the fixing frame 8 is fixedly mounted on the top of the outer frame 2, a plurality of heat sinks 9 are disposed on the top of the fixing frame 8, and the plurality of heat sinks 9 and the fixing frame 8 are integrated.
A plurality of thread grooves 11 that are the rectangular distribution are seted up at the top of frame 2, a plurality of fixed orificess 12 that are the rectangular distribution are seted up at the top of fixed frame 8, and are a plurality of fixed orifices 12 respectively with a plurality of 11 looks adaptations of thread groove, it is a plurality of all be provided with fixed screw 12 in the fixed orifices 12, it is a plurality of the bottom of fixed screw 12 all extends to corresponding in the thread groove 11, and is a plurality of fixed screw 12 all with corresponding the inner wall of thread groove 11 closes mutually soon.
The outer frame 2 is made of aluminum, and the fixing frame 8 and the radiating fins 9 are made of copper.
Fixed frame 8 and frame 1 are in the same place through the even fixed screw 12 installation of a plurality of distributions, the laminating is inseparable, frame 1 receives after the heat from alumina ceramics base plate 1, can be quick with heat transmission to fixed frame 8 on, fixed frame 8 is again with heat transfer for on a plurality of heat dissipation dish 9, holistic heat radiating area further increases, further improve the radiating efficiency, then improve the life of last LED encapsulation light source 4 and lower LED encapsulation light source 5 internal element, fixed frame 8 can be as the apolegamy according to the actual demand.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a high temperature resistant LED packaging structure based on ceramic substrate which characterized in that includes:
an alumina ceramic substrate;
the outer frame is arranged on the outer side of the alumina ceramic substrate;
the mounting groove is formed in the outer frame, and the alumina ceramic substrate is fixedly mounted in the mounting groove;
the upper LED packaging light source is arranged at the top of the aluminum oxide ceramic substrate;
and the lower LED packaging light source is arranged at the bottom of the aluminum oxide ceramic substrate.
2. The ceramic substrate-based high-temperature-resistant LED package structure as claimed in claim 1, wherein a plurality of mounting blocks are disposed on an outer wall of the outer frame and are distributed in a rectangular shape, and the mounting blocks and the outer frame are integrated.
3. The ceramic substrate-based high-temperature-resistant LED package structure according to claim 2, wherein a plurality of the mounting blocks are provided with mounting holes.
4. The ceramic substrate-based high-temperature-resistant LED packaging structure according to claim 1, wherein a heat-conducting silica gel layer is filled between the outer wall of the alumina ceramic substrate and the inner wall of the mounting groove.
5. The high temperature resistant LED package structure based on ceramic substrate as claimed in claim 1, wherein a fixing frame is fixedly installed on the top of the outer frame, a plurality of heat dissipation fins are installed on the top of the fixing frame, and the plurality of heat dissipation fins and the fixing frame are integrated.
6. The high-temperature resistant LED package structure based on the ceramic substrate as claimed in claim 5, wherein a plurality of screw grooves are formed at the top of the outer frame, a plurality of fixing holes are formed at the top of the fixing frame, the fixing holes are respectively matched with the screw grooves, fixing screws are disposed in the fixing holes, the bottom ends of the fixing screws extend into the corresponding screw grooves, and the fixing screws are screwed with the inner walls of the corresponding screw grooves.
7. The high temperature resistant LED package structure based on ceramic substrate as claimed in claim 5, wherein the outer frame is made of aluminum, and the fixing frame and the heat sink are made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921642887.9U CN210182410U (en) | 2019-09-29 | 2019-09-29 | High temperature resistant LED packaging structure based on ceramic substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921642887.9U CN210182410U (en) | 2019-09-29 | 2019-09-29 | High temperature resistant LED packaging structure based on ceramic substrate |
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| Publication Number | Publication Date |
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| CN210182410U true CN210182410U (en) | 2020-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921642887.9U Active CN210182410U (en) | 2019-09-29 | 2019-09-29 | High temperature resistant LED packaging structure based on ceramic substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112838154A (en) * | 2021-02-16 | 2021-05-25 | 深圳市众芯诺科技有限公司 | Ultrathin ultraviolet LED chip with high-efficiency light emitting |
-
2019
- 2019-09-29 CN CN201921642887.9U patent/CN210182410U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112838154A (en) * | 2021-02-16 | 2021-05-25 | 深圳市众芯诺科技有限公司 | Ultrathin ultraviolet LED chip with high-efficiency light emitting |
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