CN108521750A - A kind of heat conductive silica gel gasket - Google Patents
A kind of heat conductive silica gel gasket Download PDFInfo
- Publication number
- CN108521750A CN108521750A CN201810376187.3A CN201810376187A CN108521750A CN 108521750 A CN108521750 A CN 108521750A CN 201810376187 A CN201810376187 A CN 201810376187A CN 108521750 A CN108521750 A CN 108521750A
- Authority
- CN
- China
- Prior art keywords
- heat conductive
- heat
- insulating rubber
- silica gel
- rubber layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 239000000741 silica gel Substances 0.000 title claims abstract description 27
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 27
- 229920001971 elastomer Polymers 0.000 claims abstract description 34
- 239000011521 glass Substances 0.000 claims abstract description 30
- 239000000945 filler Substances 0.000 claims abstract description 9
- 238000005728 strengthening Methods 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 54
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 11
- 239000011241 protective layer Substances 0.000 claims description 10
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- 125000006850 spacer group Chemical group 0.000 claims description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- 229910052810 boron oxide Inorganic materials 0.000 claims description 6
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 3
- 239000000292 calcium oxide Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 3
- 229910001948 sodium oxide Inorganic materials 0.000 claims description 3
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 230000035939 shock Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Securing Of Glass Panes Or The Like (AREA)
Abstract
The invention discloses a kind of heat conductive silica gel gaskets, including heat-conducting plate, the heat-conducting plate is internally provided with multiple T-slots, strengthening mechanism is equipped in the T-slot, the both sides of the heat-conducting plate have been fixedly connected with glass layer, the both sides of two glass layers are equipped with heat conductive insulating rubber layer, the opposing sidewalls of the heat conductive insulating rubber layer have been fixedly connected with multiple strips, and two glass layers are equipped with multiple strip-shaped clamp grooves corresponding with strip position close to the side of strip, the heat conductive insulating rubber layer is internally provided with multiple filled cavities, filler is filled in the filled cavity, two sides of the heat conductive insulating rubber layer far from glass layer are all provided with flexible heat conductive pad.The configuration of the present invention is simple, reasonable design can improve the mechanical strength and heat-transfer effect of heat conductive silica gel gasket, using effect is good to a certain extent by the way that multiple glass layers and heat conductive insulating rubber layer is arranged.
Description
Technical field
The present invention relates to heat conductive silica gel technical field more particularly to a kind of heat conductive silica gel gaskets.
Background technology
With the development of the assembling densification of integrated technology and microelectronics, heat caused by electronic equipment accumulates rapidly,
Increase.And as the raising of electronic component self-temperature can directly result in the performance and reliability decrease of itself, therefore energy
No timely heat dissipation becomes an important factor for influencing its service life.To ensure that electronic component remains to protect at a temperature of use environment
Normal operating conditions is held, one layer of heat conductive insulating film would generally be set on the heat exchange interface of related component and be used as heat conduction
Boundary material, rapidly by heater element heat transfer to heat dissipation equipment, to ensure electronic equipment normal operation.Present heat conductive silica gel
Gasket is widely used as sealant and is used in electronic product, therefore to heat conductive silica gel gasket other than heat transfer requires, it is also necessary to
Heat conductive silica gel gasket has good mechanical strength.And the heat-conducting insulation material provided currently on the market mainly uses a kind of knot
The simple single layer silicon rubber heat-conduction insulation spacer of structure, the mechanical strength of most of silica gel pads is poor, in terms of shock resistance
There is also deficiencies, while heat-transfer effect is not fine.
Invention content
The purpose of the present invention is to solve disadvantages existing in the prior art, and a kind of heat conductive silica gel gasket proposed.
To achieve the goals above, present invention employs following technical solutions：A kind of heat conductive silica gel gasket of the present invention, packet
Including heat-conducting plate, the heat-conducting plate is internally provided with multiple T-slots, is equipped with strengthening mechanism in the T-slot, and the two of the heat-conducting plate
Side has been fixedly connected with glass layer, and the both sides of two glass layers are equipped with heat conductive insulating rubber layer, described to lead
The opposing sidewalls of thermal insulation rubber layer have been fixedly connected with multiple strips, and two glass layers are equipped with close to the side of strip
Multiple strip-shaped clamp grooves corresponding with strip position, the heat conductive insulating rubber layer are internally provided with multiple filled cavities, the filling
Intracavitary is filled with filler, and two sides of the heat conductive insulating rubber layer far from glass layer are all provided with flexible heat conductive pad,
Two sides of the flexible heat conductive pad far from heat conductive insulating rubber layer are all provided with matcoveredn, and protective layer is transparent protective film.
Preferably, the strengthening mechanism is T-type reinforcing rib, and multiple T-type reinforcing ribs are symmetricly set on the inside of heat-conducting plate
Both sides.
Preferably, the strip is integrally formed with heat conductive insulating rubber layer, and strip is far from heat conductive insulating rubber layer
Side is connected by the filling glue of heat conductive insulating and the interior sealed bottom of strip-shaped clamp groove.
Preferably, the filler is the ceramics particles such as boron oxide or aluminium oxide.
Preferably, side of two protective layers far from flexible heat conductive pad is equipped with multiple attachment spacers, the connection
The surface of gasket is equipped with heat-conducting glue band.
Preferably, the glass layer is silica, aluminium oxide, calcium oxide, boron oxide, magnesia, sodium oxide molybdena etc.
Material is made.
In the present invention, T-type reinforcing rib is added in heat-conducting plate, can enhance the toughness of heat-conducting plate, by heat-conducting plate two
Glass layer is arranged in side, and glass layer good insulating, heat resistance are strong, corrosion resistance is good, high mechanical strength, glass layer
In conjunction with heat conductive insulating rubber layer, under the action of playing good heat radiating, also improve thermal conductive silicon rubber cushion to a certain extent
The mechanical strength of piece, improves shock resistance and tensile property, and the side wall of two protective layers is equipped with attachment spacers, connection
Heat-conducting glue band on gasket facilitates heat conductive silica gel gasket and the surface of device and radiator to be bonded.The configuration of the present invention is simple, design
Rationally, by the way that multiple glass layers and heat conductive insulating rubber layer is arranged, heat conductive silica gel gasket can be improved to a certain extent
Mechanical strength and heat-transfer effect, using effect it is good.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of heat conductive silica gel gasket proposed by the present invention；
Fig. 2 is a kind of vertical view of the heat conductive insulating rubber layer of heat conductive silica gel gasket proposed by the present invention；
Fig. 3 is glass layer and the heat conductive insulating rubber layer junction of a kind of heat conductive silica gel gasket proposed by the present invention
Side view.
In figure：1 heat-conducting plate, 2 glass layers, 3 heat conductive insulating rubber layers, 4 flexible heat conductive pads, 5 protective layers, 6 connection gaskets
Piece, 7T types reinforcing rib, 8 strips, 9 fillers, 10 strip-shaped clamp grooves, 11 heat-conducting glue bands, 12 filled cavities.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
As shown in Figs. 1-3, a kind of heat conductive silica gel gasket of the invention, including heat-conducting plate 1, being internally provided with for heat-conducting plate 1 are more
A T-slot, T-slot is interior to be equipped with strengthening mechanism, and strengthening mechanism helps to improve the mechanical strength of heat-conducting plate 1, the both sides of heat-conducting plate 1
It is fixedly connected with glass layer 2, the both sides of two glass layers 2 are equipped with heat conductive insulating rubber layer 3, heat conductive insulating rubber
The opposing sidewalls of glue-line 3 have been fixedly connected with multiple strips 8, and two glass layers 2 be equipped with close to the side of strip 8 it is multiple
Strip-shaped clamp groove 10 corresponding with 8 position of strip, strip 8 are fitted and connected with strip-shaped clamp groove 10, help to improve glass layer 2
With the adaptation between heat conductive insulating rubber layer 3, heat conductive insulating rubber layer 3 is internally provided with multiple filled cavities 12, filled cavity 12
Interior to be filled with filler 9, filler 9 helps to improve the heat conductivility of heat conductive insulating rubber layer 3, two heat conductive insulating rubber layers
3 sides far from glass layer 2 are all provided with flexible heat conductive pad 4, and two flexible heat conductive pads 4 are far from heat conductive insulating rubber layer 3
Side is all provided with matcoveredn 5, and protective layer 5 is transparent protective film.
In the present invention, strengthening mechanism is T-type reinforcing rib 7, and multiple T-type reinforcing ribs 7 are symmetricly set on the inside of heat-conducting plate 1
Both sides, T-type structure further improve the reinforcement performance of heat-conducting plate 1.Strip 8 is integrally formed with heat conductive insulating rubber layer 3,
And side of the strip 8 far from heat conductive insulating rubber layer 3 is connected by the filling glue of heat conductive insulating and the interior sealed bottom of strip-shaped clamp groove 10
It connects, the filling glue of heat conductive insulating has certain thermal conductivity, and has leakproofness and adhesiveness simultaneously.Filler 9 be boron oxide or
The ceramics particle such as aluminium oxide.Side of two protective layers 5 far from flexible heat conductive pad 4 is equipped with multiple attachment spacers 6, connects
The surface of gasket 6 is equipped with heat-conducting glue band 11, and heat-conducting glue band 11 facilitates heat conductive silica gel gasket and the surface of device and radiator to be bonded.
Glass layer 2 is made of materials such as silica, aluminium oxide, calcium oxide, boron oxide, magnesia, sodium oxide molybdenas.
In the present invention, addition T-type reinforcing rib 7, can enhance the toughness of heat-conducting plate 1, by heat-conducting plate in heat-conducting plate 1
Glass layer 2 is arranged in 1 both sides, and 2 good insulating of glass layer, heat resistance are strong, corrosion resistance is good, high mechanical strength, glass
Fibrous layer 2 combines heat conductive insulating rubber layer 3, under the action of playing good heat radiating, also improve and lead to a certain extent
The mechanical strength of hot silica gel pad, improves shock resistance and tensile property, and the side wall of two protective layers 5 is equipped with connection
Gasket 6, the heat-conducting glue band 11 in attachment spacers 6 facilitate heat conductive silica gel gasket and the surface of device and radiator to be bonded.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of heat conductive silica gel gasket, including heat-conducting plate (1), which is characterized in that the heat-conducting plate (1) is internally provided with multiple T
Type groove, is equipped with strengthening mechanism in the T-slot, and the both sides of the heat-conducting plate (1) have been fixedly connected with glass layer (2), and two
The both sides of a glass layer (2) are equipped with heat conductive insulating rubber layer (3), the heat conductive insulating rubber layer (3) it is opposite
Side wall has been fixedly connected with multiple strips (8), and two glass layers (2) are equipped with multiple and card close to the side of strip (8)
The corresponding strip-shaped clamp groove (10) in item (8) position, the heat conductive insulating rubber layer (3) are internally provided with multiple filled cavities (12), institute
It states and is filled with filler (9) in filled cavity (12), the one of the separate glass layer (2) of two heat conductive insulating rubber layers (3)
Side is all provided with flexible heat conductive pad (4), and the two flexible sides of the heat conductive pad (4) far from heat conductive insulating rubber layer (3) are equipped with
Protective layer (5), protective layer (5) are transparent protective film.
2. heat conductive silica gel gasket according to claim 1, which is characterized in that the strengthening mechanism is T-type reinforcing rib (7),
And multiple T-type reinforcing ribs (7) are symmetricly set on the inside both sides of heat-conducting plate (1).
3. heat conductive silica gel gasket according to claim 1, which is characterized in that the strip (8) and heat conductive insulating rubber layer
(3) it is integrally formed, and side of the strip (8) far from heat conductive insulating rubber layer (3) passes through the filling glue of heat conductive insulating and bar shaped card
The interior sealed bottom of slot (10) connects.
4. heat conductive silica gel gasket according to claim 1, which is characterized in that the filler (9) is boron oxide or oxidation
The ceramics particle such as aluminium.
5. heat conductive silica gel gasket according to claim 1, which is characterized in that two protective layers (5) are led far from flexibility
The side of heat pad (4) is equipped with multiple attachment spacers (6), and the surface of the attachment spacers (6) is equipped with heat-conducting glue band (11).
6. heat conductive silica gel gasket according to claim 1, which is characterized in that the glass layer (2) be silica,
The materials such as aluminium oxide, calcium oxide, boron oxide, magnesia, sodium oxide molybdena are made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810376187.3A CN108521750A (en) | 2018-04-25 | 2018-04-25 | A kind of heat conductive silica gel gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810376187.3A CN108521750A (en) | 2018-04-25 | 2018-04-25 | A kind of heat conductive silica gel gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108521750A true CN108521750A (en) | 2018-09-11 |
Family
ID=63430053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810376187.3A Pending CN108521750A (en) | 2018-04-25 | 2018-04-25 | A kind of heat conductive silica gel gasket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108521750A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111732931A (en) * | 2020-06-29 | 2020-10-02 | 王朝鹏 | Heat-conducting adhesive silica gel |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204560109U (en) * | 2015-04-28 | 2015-08-12 | 东莞市零度导热材料有限公司 | A kind of heat-conducting pad of packaged chip |
| CN204586013U (en) * | 2015-01-27 | 2015-08-26 | 衡山县佳诚新材料有限公司 | Heat conductive silica gel pad |
| CN204585979U (en) * | 2015-01-27 | 2015-08-26 | 衡山县佳诚新材料有限公司 | Heat conduction soft silica gel insulation spacer |
| CN206090900U (en) * | 2016-10-10 | 2017-04-12 | 天津奇才科技发展有限公司 | Novel ultralow heat recombination board of leading |
| CN206758425U (en) * | 2017-03-07 | 2017-12-15 | 昆山裕凌电子科技有限公司 | A kind of novel heat-conducting clay |
| CN207014900U (en) * | 2017-07-07 | 2018-02-16 | 福建华清电子材料科技有限公司 | A kind of aluminium nitride substrate |
| CN208095032U (en) * | 2018-04-25 | 2018-11-13 | 沪如科技南京有限公司 | A kind of heat conductive silica gel gasket |
-
2018
- 2018-04-25 CN CN201810376187.3A patent/CN108521750A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204586013U (en) * | 2015-01-27 | 2015-08-26 | 衡山县佳诚新材料有限公司 | Heat conductive silica gel pad |
| CN204585979U (en) * | 2015-01-27 | 2015-08-26 | 衡山县佳诚新材料有限公司 | Heat conduction soft silica gel insulation spacer |
| CN204560109U (en) * | 2015-04-28 | 2015-08-12 | 东莞市零度导热材料有限公司 | A kind of heat-conducting pad of packaged chip |
| CN206090900U (en) * | 2016-10-10 | 2017-04-12 | 天津奇才科技发展有限公司 | Novel ultralow heat recombination board of leading |
| CN206758425U (en) * | 2017-03-07 | 2017-12-15 | 昆山裕凌电子科技有限公司 | A kind of novel heat-conducting clay |
| CN207014900U (en) * | 2017-07-07 | 2018-02-16 | 福建华清电子材料科技有限公司 | A kind of aluminium nitride substrate |
| CN208095032U (en) * | 2018-04-25 | 2018-11-13 | 沪如科技南京有限公司 | A kind of heat conductive silica gel gasket |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111732931A (en) * | 2020-06-29 | 2020-10-02 | 王朝鹏 | Heat-conducting adhesive silica gel |
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