CN204560109U - A kind of heat-conducting pad of packaged chip - Google Patents
A kind of heat-conducting pad of packaged chip Download PDFInfo
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- CN204560109U CN204560109U CN201520261173.9U CN201520261173U CN204560109U CN 204560109 U CN204560109 U CN 204560109U CN 201520261173 U CN201520261173 U CN 201520261173U CN 204560109 U CN204560109 U CN 204560109U
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- heat
- conducting pad
- conducting
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Abstract
The utility model discloses a kind of heat-conducting pad of packaged chip, comprise heat-conducting pad body, heat-conducting pad body is provided with the groove (1) matched with the convex shape surface of euthermic chip, heat-conducting pad body comprises heat-conducting layer (2) and is arranged at the glass reinforced layer (3) of heat-conducting layer (2) side, groove (1) is arranged at the surface of heat-conducting layer (2), described heat-conducting layer (2) comprises silica gel matrix (4) and is filled in the wire (5) in silica gel matrix (4), one deck phase change thermal conductive material layer (6) is provided with in the groove bottom of groove (1) and on the surface of four groove sidewalls.The beneficial effects of the utility model are: groove can fit tightly median plane and the peripheral side of euthermic chip, and the phase change thermal conductive material layer in recess sidewall and groove bottom carries out phase transformation when being heated, semi liquid state is softened into by original solid layer, thus from the surface of microcosmic angle contact heating chip more closely, heat conductivility can be improve.
Description
Technical field
The utility model relates to euthermic chip technical field of heat dissipation, particularly a kind of heat-conducting pad of packaged chip.
Background technology
The profile of current euthermic chip mostly is higher, the highly lower type shape of center height around, and central authorities are about 1 ~ 2mm with the difference of height of surrounding.The housing contacted due to heat conductive pad during assembling has level altitude.If during for pasting heat-conducting pad above euthermic chip, the central authorities of euthermic chip or the around wherein thickness highly selecting heat-conducting pad only can be coordinated.This just causes significantly reducing the heat transfer area of heating new product or makes heat-conducting pad blocked up, produces assembling interference problem.
Summary of the invention
The purpose of this utility model is the shortcoming overcoming prior art, provides a kind of heat euthermic chip respectively being generated heat face to carry out conducting, the heat-conducting pad of packaged chip.
The purpose of this utility model is achieved through the following technical solutions: a kind of heat-conducting pad of packaged chip, be covered in the surface of the convex shape of euthermic chip, comprise heat-conducting pad body, heat-conducting pad body is provided with the groove matched with the convex shape surface of euthermic chip, described heat-conducting pad body comprises heat-conducting layer and is arranged at the glass reinforced layer of heat-conducting layer side, groove is arranged at the surface of heat-conducting layer, described heat-conducting layer comprises silica gel matrix and is filled in the wire in silica gel matrix, one deck phase change thermal conductive material layer is provided with in the groove bottom of groove and on the surface of four groove sidewalls.Phase change thermal conductive material layer adopts commercially available phase-transition material to make, and being heated, Temporal variation thermal conductive material layer carries out phase transformation, softens into semi liquid state by original solid layer.
Described wire is filamentary silver, copper wire or aluminium wire.
Described diameter wiry is 0.5mm ~ 1mm, and the volumetric filling ratio of wire in silica gel matrix is 20 ~ 60%.Inventor found through experiments diameter wiry and the volumetric filling ratio of wire in silica gel matrix is all the factor affecting heat-conducting pad heat conductivility, further, diameter wiry is larger, when then wire content does not reach very high values, obviously reducing appears in the elasticity of heat-conducting pad, and the minimizing of content wiry makes the thermal conductivity of heat-conducting pad reduce, suitable reduction diameter wiry effectively can reduce wire content and reduce the flexible impact of heat-conducting pad, but meticulous wire is difficult to form through heat conduction path, also the thermal conductivity of heat-conducting pad is affected.Inventor by scientific research, when finding that diameter wiry is 0.5mm ~ 1mm, can ensure to form through heat conduction path, and can remain on again when having higher metal silk content, heat-conducting pad entirety has preferably elasticity.
Described wire extends along perpendicular to the direction of heat-conducting pad in silica gel matrix, thus each wire forms a through heat conduction path.
The shape of described heat-conducting pad is square or circular.
Described groove is rectangular channel.
The utility model has the following advantages: groove of the present utility model can fit tightly median plane and the peripheral side of euthermic chip, and the phase change thermal conductive material layer in recess sidewall and groove bottom carries out phase transformation when being heated, semi liquid state is softened into by original solid layer, thus from the surface of microcosmic angle contact heating chip more closely, heat conductivility can be improve.In heat-conducting pad, fill wire, the wire of filling is continuous distribution in silica gel matrix, defines through heat transfer path, therefore improves the heat conductivility of heat-conducting layer body.Thus the heat in the face that respectively generated heat by euthermic chip conducts, and there is not assembling interference problem, compare existing heat-conducting pad, energy effective temperature-reducing more than 8 DEG C, solves the heat dissipation problem of high heating power euthermic chip well.
The utility model is compounded with layer of glass fiber reinforced layer on heat-conducting pad, the mechanical strength of heat-conducting pad is improve under the prerequisite not increasing heat-conducting pad thickness and thermal resistance, there is good tear-proof and anti-puncture performance, can not be stung by stitch, avoid the generation of electronic product short circuit problem.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure, 1-groove, 2-heat-conducting layer, 3-glass reinforced layer, 4-silica gel matrix, 5-wire, 6-phase change thermal conductive material layer.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described:
As shown in Figure 1, a kind of heat-conducting pad of packaged chip, be covered in the surface of the convex shape of euthermic chip, comprise heat-conducting pad body, heat-conducting pad body is provided with the groove 1 matched with the convex shape surface of euthermic chip, described heat-conducting pad body comprises heat-conducting layer 2 and is arranged at the glass reinforced layer 3 of heat-conducting layer 2 side, groove 1 is arranged at the surface of heat-conducting layer 2, the wire 5 that described heat-conducting layer 2 comprises silica gel matrix 4 and is filled in silica gel matrix 4, one deck phase change thermal conductive material layer 6 is provided with in the groove bottom of groove 1 and on the surface of four groove sidewalls.Phase change thermal conductive material layer 6 adopts commercially available phase-transition material to make, and being heated, Temporal variation thermal conductive material layer 6 carries out phase transformation, softens into semi liquid state by original solid layer.
Described wire 5 is filamentary silver, copper wire or aluminium wire.
The diameter of described wire 5 is 0.5mm ~ 1mm, and the volumetric filling ratio of wire 5 in silica gel matrix 4 is 20 ~ 60%.Inventor found through experiments the diameter of wire 5 and the volumetric filling ratio of wire 5 in silica gel matrix 4 is all the factor affecting heat-conducting pad heat conductivility, further, the diameter of wire 5 is larger, when then wire 5 content does not reach very high values, obviously reducing appears in the elasticity of heat-conducting pad, and the minimizing of the content of wire 5 makes the thermal conductivity of heat-conducting pad reduce, the diameter of suitable reduction wire 5 effectively can reduce wire 5 content and reduce the flexible impact of heat-conducting pad, but meticulous wire 5 is difficult to form through heat conduction path, also the thermal conductivity of heat-conducting pad is affected.Inventor by scientific research, when the diameter finding wire 5 is 0.5mm ~ 1mm, can ensure to form through heat conduction path, and can remain on again when having higher metal silk 5 content, heat-conducting pad entirety has preferably elasticity.
Described wire 5 extends along the direction perpendicular to heat-conducting pad in silica gel matrix 4, thus the heat conduction path that each wire 5 formation one is through.
The shape of described heat-conducting pad is square or circular.
Described groove 1 is rectangular channel.
Groove 1 can fit tightly median plane and the peripheral side of euthermic chip, and the phase change thermal conductive material layer 6 in groove 1 sidewall and groove bottom carries out phase transformation when being heated, semi liquid state is softened into by original solid layer, thus from the surface of microcosmic angle contact heating chip more closely, heat conductivility can be improve.In heat-conducting pad, fill wire 5, the wire 5 of filling is continuous distribution in silica gel matrix 4, defines through heat transfer path, therefore improves the heat conductivility of heat-conducting layer 2 body.Thus the heat in the face that respectively generated heat by euthermic chip conducts, and there is not assembling interference problem, compare existing heat-conducting pad, energy effective temperature-reducing more than 8 DEG C, solves the heat dissipation problem of high heating power euthermic chip well.
Heat-conducting pad is compounded with layer of glass fiber reinforced layer 3, the mechanical strength of heat-conducting pad is improve under the prerequisite not increasing heat-conducting pad thickness and thermal resistance, there is good tear-proof and anti-puncture performance, can not be stung by stitch, avoid the generation of electronic product short circuit problem.
Claims (6)
1. the heat-conducting pad of a packaged chip, it is characterized in that: comprise heat-conducting pad body, heat-conducting pad body is provided with the groove (1) matched with the convex shape surface of euthermic chip, described heat-conducting pad body comprises heat-conducting layer (2) and is arranged at the glass reinforced layer (3) of heat-conducting layer (2) side, groove (1) is arranged at the surface of heat-conducting layer (2), described heat-conducting layer (2) comprises silica gel matrix (4) and is filled in the wire (5) in silica gel matrix (4), one deck phase change thermal conductive material layer (6) is provided with in the groove bottom of groove (1) and on the surface of four groove sidewalls.
2. the heat-conducting pad of a kind of packaged chip according to claim 1, is characterized in that: described wire (5) is filamentary silver, copper wire or aluminium wire.
3. the heat-conducting pad of a kind of packaged chip according to claim 1, is characterized in that: the diameter of described wire (5) is 0.5mm ~ 1mm, and the volumetric filling ratio of wire (5) in silica gel matrix (4) is 20 ~ 60%.
4. the heat-conducting pad of a kind of packaged chip according to claim 1, is characterized in that: described wire (5) extends along the direction perpendicular to heat-conducting pad in silica gel matrix (4).
5. the heat-conducting pad of a kind of packaged chip according to claim 1, is characterized in that: the shape of described heat-conducting pad is square or circular.
6. the heat-conducting pad of a kind of packaged chip according to claim 1, is characterized in that: described groove (1) is rectangular channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520261173.9U CN204560109U (en) | 2015-04-28 | 2015-04-28 | A kind of heat-conducting pad of packaged chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520261173.9U CN204560109U (en) | 2015-04-28 | 2015-04-28 | A kind of heat-conducting pad of packaged chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204560109U true CN204560109U (en) | 2015-08-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520261173.9U Expired - Fee Related CN204560109U (en) | 2015-04-28 | 2015-04-28 | A kind of heat-conducting pad of packaged chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204560109U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108521750A (en) * | 2018-04-25 | 2018-09-11 | 沪如科技南京有限公司 | A kind of heat conductive silica gel gasket |
-
2015
- 2015-04-28 CN CN201520261173.9U patent/CN204560109U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108521750A (en) * | 2018-04-25 | 2018-09-11 | 沪如科技南京有限公司 | A kind of heat conductive silica gel gasket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150812 Termination date: 20180428 |