CN206697471U - A kind of encapsulating structure of semiconductor integrated circuit - Google Patents
A kind of encapsulating structure of semiconductor integrated circuit Download PDFInfo
- Publication number
- CN206697471U CN206697471U CN201720380774.0U CN201720380774U CN206697471U CN 206697471 U CN206697471 U CN 206697471U CN 201720380774 U CN201720380774 U CN 201720380774U CN 206697471 U CN206697471 U CN 206697471U
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- CN
- China
- Prior art keywords
- chip
- integrated circuit
- semiconductor integrated
- encapsulating structure
- packaging body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of encapsulating structure of semiconductor integrated circuit, including circuit substrate, the upper and lower part of the circuit substrate is respectively arranged with packaging body and lower package body, IC chip is installed between the upper packaging body and the circuit substrate, the first bond plies are provided between the upper surface of the IC chip and the lower surface of the upper packaging body, the both sides of the IC chip are connected with pin；The lower surface of the circuit substrate is provided with the second bond plies；The lower package body designs for cavity, and the section of the lower package body is U-shape structure.IC chip is fixed by upper packaging body and lower package body for the utility model, improves stability；By the first bond plies and the second bond plies are attached and heat conduction；By filling radiating filler and the coated with thermally conductive silicone grease in groove in cavity, accelerate thermal diffusivity, the utility model has the characteristics of good heat dissipation effect, simple in construction.
Description
Technical field
The utility model belongs to technical field of semiconductor encapsulation, is related to a kind of encapsulating structure of semiconductor integrated circuit.
Background technology
Integrated antenna package not only acts as bonding point in IC chip and the outside effect being electrically connected, also for
IC chip provides a reliable and stable working environment, and machinery or the work of environmental protection are played to IC chip
With, so that the function that IC chip can bring into normal play, and ensure that it has high stability and reliability.In a word, integrate
The quality of circuit package quality is very big to the overall performance quality relation of integrated circuit.Therefore, encapsulation should have stronger machinery
Performance, good electric property, heat dispersion and chemical stability.
Existing integrated circuit package structure, chip with elargol bonding with chip carrier on, and need by baking procedure come
Solidify elargol, chip is fixed on chip carrier, because higher using elargol cost, and production efficiency is relatively low, and radiating effect is bad,
Easily occur encapsulate bad or failure of chip the problems such as, while with use during cause collision the problems such as, easily cause encapsulation
Part loosens, and causes signal connection problem to be present, can not make the reliable and stable work of integrated circuit, now designs and a kind of new partly lead
The encapsulating structure of body integrated circuit.
Utility model content
The encapsulating structure of a kind of semiconductor integrated circuit provided by the utility model, by upper packaging body and lower package body
IC chip is fixed；Heat conduction is realized by using the first bond plies and the second bond plies；By
Filling radiating filler and the coated with thermally conductive silicone grease in groove in cavity, solves the packaged stability of semiconductor integrated circuit
The problem of difference and radiating effect difference.
The purpose of this utility model can be achieved through the following technical solutions：
A kind of encapsulating structure of semiconductor integrated circuit, including circuit substrate, the upper and lower part point of the circuit substrate
Packaging body and lower package body are not provided with, IC chip are installed between the upper packaging body and the circuit substrate, institute
State and the first bond plies, the integrated electricity are provided between the upper surface of IC chip and the lower surface of the upper packaging body
The both sides of road chip are connected with pin；The lower surface of the circuit substrate is provided with the second bond plies；The lower package body
Designed for cavity, the section of the lower package body is U-shape structure.
Further, the upper packaging body includes top plate, perpendicular side plate and hang plate, and the top plate is vertical with four pieces respectively
Side plate carries out vertical connection, wherein being respectively arranged with hang plate on the outside of two pieces of perpendicular side plates.
Further, the upper surface of the top plate is designed using step groove, and heat-conducting silicone grease is coated with groove.
Further, the angle between the perpendicular side plate and hang plate is 30 °, the length of the perpendicular side plate and hang plate
Degree extends to the upper surface of pin.
Further, filled with radiating filler in the cavity of the lower package body, the radiating filler is stone.
Further, the number at least two of the pin, one of them is positive pole pin, and another draws for negative pole
Pin.
The beneficial effects of the utility model：The utility model is entered by upper packaging body and lower package body to IC chip
Row is fixed, and ensures that the stability after ic chip package improves；It is double by using the first bond plies and the second heat conduction
Face glue realizes connection and heat conduction, can be quickly by heat transfer caused by the IC chip course of work to miscellaneous part；It is logical
Filling radiating filler and the coated with thermally conductive silicone grease in groove in the cavities are crossed, accelerates thermal diffusivity, the utility model, which has, to be dissipated
The characteristics of thermal effect is good, simple in construction.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme of the utility model embodiment, make required for being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the utility model,
For those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Other accompanying drawings.
Fig. 1 is a kind of diagrammatic cross-section of the encapsulating structure of semiconductor integrated circuit of the utility model；
Fig. 2 is a kind of encapsulating structure schematic top plan view of semiconductor integrated circuit of the utility model；
Fig. 3 is the structural representation of packaging body on the utility model；
In accompanying drawing, the list of parts representated by each label is as follows：
The upper packaging bodies of 1-, the bond plies of 2- first, 3- IC chips, 4- circuit substrates, the heat-conducting double-sideds of 5- second
Glue, 6- radiating fillers, 7- lower package bodies, 8- pins, 11- top plates, 12- perpendicular side plates, 13- hang plates.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The all other embodiment obtained, belong to the scope of the utility model protection.
Refer to Fig. 1, shown in 2, a kind of encapsulating structure of semiconductor integrated circuit, including circuit substrate 4, circuit substrate 4
Using the ceramic substrate with sandwich construction, substrate is internally provided with the conductor wire for forming circuit；The top of circuit substrate 4 is with
Portion is respectively arranged with packaging body 1 and lower package body 7；
IC chip 3 is installed between upper packaging body 1 and circuit substrate 4, the upper surface of IC chip 3 with it is upper
The first bond plies 2 are provided between the lower surface of packaging body 1, the first bond plies 2 are used for the surface of IC chip 3
Temperature radiated, the both sides of IC chip 3 are connected with pin 8, and wherein the number of pin 8 is according to IC chip
Depending on 3 function；The lower surface of circuit substrate 4 is provided with the second bond plies 5, and the second bond plies 5 are used for circuit
Heat on substrate 4 is radiated.
As shown in figure 3, upper packaging body 1 includes top plate 11, perpendicular side plate 12 and hang plate 13, the surrounding of top plate 11 respectively with
Four pieces of perpendicular side plates 12 carry out vertical connection, wherein two pieces of outsides of perpendicular side plate 12 are respectively arranged with hang plate 13, perpendicular side plate
12 and hang plate 13 extend respectively to the upper surface of pin 8；The upper surface of top plate 11 is designed using step groove, is applied in groove
Heat-conducting silicone grease is covered with, uniform fold increases area of dissipation in groove after heat-conducting silicone grease is heated；Perpendicular side plate 12 and hang plate 13
Between angle be 30 °, the stability encapsulated for improving upper packaging body 1 to IC chip 3.
Lower package body 7 is designed using cavity, the U-shaped structure in the section, filled with radiating filler 6, radiating in cavity
Filler 6 is silica flour or other have the material of thermolysis.
IC chip is fixed by upper packaging body and lower package body for the utility model, ensures ic core
Stability after piece encapsulation improves；Connection and heat conduction, energy are realized by using the first bond plies and the second bond plies
Enough quickly by heat transfer caused by the IC chip course of work to miscellaneous part；By filling radiating filling in the cavities
Agent and the coated with thermally conductive silicone grease in groove, accelerate thermal diffusivity, and the utility model has good heat dissipation effect, spy simple in construction
Point.
Above content is only to the utility model structure example and explanation, the technology people of affiliated the art
Member is made various modifications or supplement to described specific embodiment or substituted using similar mode, without departing from reality
With new structure or surmount scope defined in the claims, the scope of protection of the utility model all should be belonged to.
Claims (6)
1. a kind of encapsulating structure of semiconductor integrated circuit, including circuit substrate (4), the top of the circuit substrate (4) is with
Portion is respectively arranged with packaging body (1) and lower package body (7), it is characterised in that：The upper packaging body (1) and the circuit substrate
(4) IC chip (3), the upper surface of the IC chip (3) and the lower end of the upper packaging body (1) are installed between
The first bond plies (2) are provided between face, the both sides of the IC chip (3) are connected with pin (8)；The circuit base
The lower surface of plate (4) is provided with the second bond plies (5)；The lower package body (7) is designed for cavity, the lower package body
(7) section is U-shape structure.
A kind of 2. encapsulating structure of semiconductor integrated circuit according to claim 1, it is characterised in that：The upper packaging body
(1) top plate (11), perpendicular side plate (12) and hang plate (13) are included, the top plate (11) is entered with four pieces of perpendicular side plates (12) respectively
Row vertical connection, wherein being respectively arranged with hang plate (13) on the outside of two pieces of perpendicular side plates (12).
A kind of 3. encapsulating structure of semiconductor integrated circuit according to claim 2, it is characterised in that：The top plate (11)
Upper surface using step groove design, heat-conducting silicone grease is coated with groove.
A kind of 4. encapsulating structure of semiconductor integrated circuit according to claim 2, it is characterised in that：The perpendicular side plate
(12) angle between hang plate (13) is 30 °, and the length of the perpendicular side plate (12) and hang plate (13) extends to pin
(8) upper surface.
A kind of 5. encapsulating structure of semiconductor integrated circuit according to claim 1, it is characterised in that：The lower package body
(7) filled with radiating filler (6) in cavity, the radiating filler (6) is silica flour.
A kind of 6. encapsulating structure of semiconductor integrated circuit according to claim 1, it is characterised in that：The pin (8)
Number at least two, one of them is positive pole pin, and another is negative pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720380774.0U CN206697471U (en) | 2017-04-12 | 2017-04-12 | A kind of encapsulating structure of semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720380774.0U CN206697471U (en) | 2017-04-12 | 2017-04-12 | A kind of encapsulating structure of semiconductor integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206697471U true CN206697471U (en) | 2017-12-01 |
Family
ID=60440693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720380774.0U Active CN206697471U (en) | 2017-04-12 | 2017-04-12 | A kind of encapsulating structure of semiconductor integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206697471U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962830A (en) * | 2018-06-14 | 2018-12-07 | 中国电子科技集团公司第二十四研究所 | A kind of hydrolyzable plane routing shell for transient circuit |
| CN109860130A (en) * | 2019-01-18 | 2019-06-07 | 南京双电科技实业有限公司 | A kind of packaging body reducing laminated packaging structure for communication chip |
-
2017
- 2017-04-12 CN CN201720380774.0U patent/CN206697471U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962830A (en) * | 2018-06-14 | 2018-12-07 | 中国电子科技集团公司第二十四研究所 | A kind of hydrolyzable plane routing shell for transient circuit |
| CN109860130A (en) * | 2019-01-18 | 2019-06-07 | 南京双电科技实业有限公司 | A kind of packaging body reducing laminated packaging structure for communication chip |
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