CN206090900U - Novel ultralow heat recombination board of leading - Google Patents
Novel ultralow heat recombination board of leading Download PDFInfo
- Publication number
- CN206090900U CN206090900U CN201621108432.5U CN201621108432U CN206090900U CN 206090900 U CN206090900 U CN 206090900U CN 201621108432 U CN201621108432 U CN 201621108432U CN 206090900 U CN206090900 U CN 206090900U
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- CN
- China
- Prior art keywords
- heat
- layer
- polyurethane
- heat conduction
- composite plate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/24—Structural elements or technologies for improving thermal insulation
- Y02A30/242—Slab shaped vacuum insulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
- Y02B80/10—Insulation, e.g. vacuum or aerogel insulation
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- Thermal Insulation (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model provides a material if: that novel ultralow heat recombination board of leading itself possesses ultralow coefficient of heat conductivity and possess superstrong heat preservation function because the coefficient of heat conductivity ( thermal insulation performance is good) much lower than the air of the used foamer of polyurethane, so the heat -proof quality that polyurethane hard bubbled be superior to those including the air mineral wool, glass fiber and polystyrene. Does and this have superior long -term insulating properties its distinctive obturator nature and highly resistance diffusion of gases nature messenger, its thermal -insulated thermal insulation performance sustainable 20 50 year or more of a specified duration. Superior evacuation protective layer has also strengthened the competitiveness of heated board on market for the coefficient of heat conductivity of greatly reduced heated board.
Description
Technical field
This product is a kind of a kind of novel super-low heat conduction composite plate that heat conductivity is reduced by various complex methods, it
It is relevant external wall exterior insulation work sheet material.
Background technology
A kind of novel super-low heat conduction composite plate possesses in itself ultralow heat conductivity and possesses superpower heat insulation function, due to poly-
The thermal conductivity ratio air much lower (good heat insulating) of foaming agent used by urethane, so the heat-proof quality of hard polyurethane foam is better than
Only aeriferous material is such as those:Mineral wool, glass fibre and polystyrene.And, its distinctive closed pore and high anti-gas expand
Scattered property makes this have superior long-term insulating properties, its heat preservation and insulation sustainable 20-50 or more long.Excellent anti-corruption
The hole-closing structure of corrosion hard polyurethane foam and the facestock for using so as to more superior resistance to air and resistance to aqueous vapor performance, and
It just can be made in molding inlays attachment structure, it is easy to assemble afterwards.It does not need extra insulating barrier moistureproof, eliminates many
The trouble of laying insulating barrier.These performances are all that other insulant to be provided simultaneously with.Wide cut, lightweight, thin wall due to
Hard polyurethane foam functions simultaneously as structural material so that overall structure has the advantages that lightweight, span is big, load is high.With
Other insulant are compared, and hard polyurethane foam has best thermal insulation properties.Therefore, relatively thin polyurethane sandwich can
To meet the pertinent regulations about the building energy consumption limit, so allow for, when building using relatively thin sheet material, saving building empty
Between.Steady quality, productivity effect are high nowadays, in the case where demand is risen sharply, a kind of novel super-low heat conduction composite plate
Industrial production line is produced, and except convenient quality is controlled, and more it brings good economy and competitiveness.
Utility model content
The technical problems to be solved in the utility model is：1. warming plate heat insulation effect is poor, and heat conductivity is exterior-wall heat insulation greatly
DeGrain.This product can increase heat insulation effect using polyurethane heat-insulation jacket layer and vacuum pumpin layer reduces heat conductivity
Purpose.The hole-closing structure of 2. excellent corrosion resistance hard polyurethane foam and the facestock for using so as to more superior resistance to air
With resistance to aqueous vapor performance, and it just can be made in molding and inlays attachment structure, it is easy to assemble afterwards.It does not need extra insulation
Layer is moistureproof, eliminates the trouble of many laying insulating barriers.These performances are all that other insulant to be provided simultaneously with.
The technical scheme that the technical problem that this utility model is solved is adopted：A kind of novel super-low heat conduction composite plate is adopted and taken out
Vacuum layer, polyurethane heat-insulation jacket layer come wrap up graphite polystyrene board increase heat insulation effect reduce heat conductivity, using polyurethane heat-insulation
The hole-closing structure of the excellent corrosion resistance hard polyurethane foam of jacket layer and the facestock for using so as to more superior resistance to air and resistance to
Aqueous vapor performance, and it just can be made in molding and inlays attachment structure, it is easy to assemble afterwards.
A kind of described novel super-low heat conduction composite plate, it is characterised in that：Warming plate is respectively from the inside to surface：Graphite polyphenyl
Flaggy, vacuum pumpin layer, polyurethane heat-insulation jacket layer.
A kind of described novel super-low heat conduction composite plate, it is characterised in that：Graphite polystyrene board thickness degree is 2-3cm；Density
For 18-22Kg/m3。
A kind of described novel super-low heat conduction composite plate, it is characterised in that：Vacuum pumpin layer be fiberglass plastic film, thickness
For 0.3-0.5mm, evacuated pressure is 0.1-0.3MPa, and the pumpdown time is 5-10min.
A kind of described novel super-low heat conduction composite plate, it is characterised in that：It is by above-mentioned graphite polystyrene board layer, vacuum pumpin layer
The warming plate peripheral injection polyurethane mould of one sends out molding, and polyurethane adventitia THICKNESS CONTROL is in 2-3cm.
A kind of novel super-low heat conduction composite plate of this utility model adopts vacuum pumpin layer, and polyurethane heat-insulation jacket layer is wrapping up graphite
Styrofoam increases heat insulation effect reduces heat conductivity, using closing for the excellent corrosion resistance hard polyurethane foam of polyurethane heat-insulation jacket layer
Pore structure and the facestock for using so as to more superior resistance to air and resistance to aqueous vapor performance, and it just can be made in molding
Inlay attachment structure, it is easy to assemble afterwards.
Description of the drawings
A kind of novel super-low heat conduction composite plate side structure schematic diagrams of Fig. 1
Wherein 1-graphite polystyrene board layer 2-vacuum pumpin layer, 3-polyurethane heat-insulation jacket layer
Specific embodiment
Embodiment 1 is as shown in figure 1, a kind of described novel super-low heat conduction composite plate is respectively from the inside to surface：Graphite polyphenyl
Flaggy, vacuum pumpin layer, polyurethane heat-insulation jacket layer.Wherein graphite polystyrene board thickness degree is 3cm；Density is 18Kg/m3.Vacuum pumpin layer
For fiberglass plastic film, thickness is 0.5mm, and evacuated pressure is 0.1MPa, and the pumpdown time is 5min.By graphite polystyrene board
Layer, the warming plate peripheral injection polyurethane mould that vacuum pumpin layer is integrated sends out molding, and polyurethane adventitia THICKNESS CONTROL is in 3cm.
Embodiment 2 is as shown in figure 1, a kind of described novel super-low heat conduction composite plate is respectively from the inside to surface：Graphite polyphenyl
Flaggy, vacuum pumpin layer, polyurethane heat-insulation jacket layer.Wherein graphite polystyrene board thickness degree is 2cm；Density is 20Kg/m3.Vacuum pumpin layer
For fiberglass plastic film, thickness is 0.5mm, and evacuated pressure is 0.3MPa, and the pumpdown time is 5min.By graphite polystyrene board
Layer, the warming plate peripheral injection polyurethane mould that vacuum pumpin layer is integrated sends out molding, and polyurethane adventitia THICKNESS CONTROL is in 2cm.
Embodiment of the present utility model is the foregoing is only, the scope of this utility model patent is not thereby limited, is passed through
This utility model patent extend expand and directly or indirectly apply to technical field, belong to patent protection model of the present invention
Enclose.
Claims (4)
1. a kind of novel super-low heat conduction composite plate, it is characterised in that：Warming plate is respectively from the inside to surface：Graphite polystyrene board layer, takes out
Vacuum layer, polyurethane heat-insulation jacket layer.
2. by a kind of novel super-low heat conduction composite plate described in claim 1, it is characterised in that：Graphite polystyrene board thickness degree is 2-
3cm；Density is 18-22Kg/m3。
3. by a kind of novel super-low heat conduction composite plate described in claim 1, it is characterised in that：Vacuum pumpin layer is fiberglass plastic
Film, thickness is 0.3-0.5mm, and evacuated pressure is 0.1-0.3MPa, and the pumpdown time is 5-10min.
4. by a kind of novel super-low heat conduction composite plate described in claim 1, it is characterised in that：By above-mentioned graphite polystyrene board layer, take out
The warming plate peripheral injection polyurethane mould that vacuum layer is integrated sends out molding, and polyurethane adventitia THICKNESS CONTROL is in 2-3cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621108432.5U CN206090900U (en) | 2016-10-10 | 2016-10-10 | Novel ultralow heat recombination board of leading |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621108432.5U CN206090900U (en) | 2016-10-10 | 2016-10-10 | Novel ultralow heat recombination board of leading |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206090900U true CN206090900U (en) | 2017-04-12 |
Family
ID=58483065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621108432.5U Active CN206090900U (en) | 2016-10-10 | 2016-10-10 | Novel ultralow heat recombination board of leading |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206090900U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108521750A (en) * | 2018-04-25 | 2018-09-11 | 沪如科技南京有限公司 | A kind of heat conductive silica gel gasket |
-
2016
- 2016-10-10 CN CN201621108432.5U patent/CN206090900U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108521750A (en) * | 2018-04-25 | 2018-09-11 | 沪如科技南京有限公司 | A kind of heat conductive silica gel gasket |
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| GR01 | Patent grant |