CN210065631U - Conductive copper foil - Google Patents
Conductive copper foil Download PDFInfo
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- CN210065631U CN210065631U CN201920621640.2U CN201920621640U CN210065631U CN 210065631 U CN210065631 U CN 210065631U CN 201920621640 U CN201920621640 U CN 201920621640U CN 210065631 U CN210065631 U CN 210065631U
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Abstract
The utility model discloses a conductive copper foil, it is a plurality of first extension and a plurality of first depressed part is crisscross the setting in proper order, every have a plurality of archs, every in the first extension have a plurality of through-holes on the bellied lateral wall, it is a plurality of second extension and a plurality of the second depressed part is crisscross the setting in proper order, every second depressed part and every first depressed part sets up relatively and forms spherical cavity, every have a plurality of recesses in the second extension, every recess and every the arch agrees with each other, the heat conduction silica gel layer is filled to every recess, every the inside and every of through-hole in the spherical cavity of second depressed part, first conductive adhesive layer with the copper basic unit bonds. The purpose of improving the toughness and the heat dissipation of the copper foil is achieved.
Description
Technical Field
The utility model relates to a copper foil technical field especially relates to a conductive copper foil.
Background
With the continuous progress of science and technology, the packaging density of electronic components in products such as computers, mobile phones and the like is continuously increased, the heat productivity is rapidly increased while strong use functions are provided, high temperature can have harmful effects on the stability, reliability and service life of the electronic components, and the internal packaging space of the electronic components is limited, so that the heat dissipation is generally assisted by applying copper foil on the electronic components.
However, since the internal assembly space of the electronic component is limited, when the copper foil is applied to the electronic component, the copper foil is easily broken due to poor toughness, and the heat dissipation performance of the single copper foil heat dissipation structure is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a conductive copper foil, it is relatively poor to aim at solving the copper foil toughness among the prior art, easy rupture, the relatively poor technical problem of thermal diffusivity.
In order to achieve the above object, the present invention provides a conductive copper foil, which comprises an ultra-thin copper layer, a copper base layer, a heat conductive silica gel layer and a first conductive adhesive layer, wherein the ultra-thin copper layer has a first extending portion and a first recessed portion, the first extending portion and the first recessed portion are provided in a plurality of numbers, the first extending portion and the first recessed portion are sequentially arranged in a staggered manner, each first recessed portion is in a cambered surface configuration, each first extending portion has a plurality of protrusions, each protrusion has a plurality of through holes on the outer side wall, the copper base layer has a second extending portion and a second recessed portion, the second extending portion and the second recessed portion are provided in a plurality of numbers, the second extending portion and the second recessed portion are sequentially arranged in a staggered manner, and each second recessed portion is in a cambered surface configuration, and each second depressed part and each first depressed part are oppositely arranged to form a spherical cavity, each second extending part is provided with a plurality of grooves, each groove is matched with each protrusion, the heat-conducting silica gel layer is filled in each groove, the inside of each through hole and the spherical cavity of each first depressed part and each second depressed part, and the first electric-conducting adhesive layer is bonded with the copper base layer and is positioned at one end of the copper base layer, which is far away from the extremely thin copper layer.
Wherein, the first extension portion, the first recess portion and the protrusion are integrally formed.
Wherein, the second extension portion, the second recess portion and the groove are integrally formed.
Wherein the thickness of the extremely thin copper layer is 9 to 13 μm.
Wherein the thickness of the copper base layer is 16-20 μm.
Wherein the depth of the groove is 8-11 μm, and the length of the protrusion is 4-7 μm.
The conductive copper foil further comprises a graphene layer, wherein the graphene layer is fixedly connected with the ultrathin copper layer and is positioned at one end, far away from the copper base layer, of the ultrathin copper layer.
The conductive copper foil further comprises a second conductive adhesive layer, the second conductive adhesive layer is bonded with the graphene layer and is positioned at one end, away from the ultrathin copper layer, of the graphene layer, and the bonding force of the second conductive adhesive layer is different from that of the first conductive adhesive layer.
Wherein, conductive copper foil still includes that first from type layer and second from the type layer, first from the type layer with first conductive adhesive layer bonds, and is located first conductive adhesive layer is kept away from the one end of copper basic unit, second conductive adhesive layer with second conductive adhesive layer fixed connection, and is located second conductive adhesive layer is kept away from the one end of graphite alkene layer.
The first release layer and the second release layer are both PET films.
The utility model discloses a conductive copper foil, through have first extension and first depressed part on the extremely thin copper layer, it is a plurality of first extension and a plurality of first depressed part is crisscross the setting in proper order, every first depressed part is the ARC structure setting, every have a plurality of archs in the first extension, every have a plurality of through-holes on the bellied lateral wall, second extension and second depressed part have in the copper base layer, it is a plurality of second extension and a plurality of second depressed part is crisscross the setting in proper order, every the second depressed part is the ARC structure setting, and every second depressed part and every first depressed part sets up relatively and forms spherical cavity, every have a plurality of recesses in the second extension, every recess and every the arch agrees with each other, heat conduction silica gel layer is filled to every recess, And in the interior of each through hole and the spherical cavity of each first sunken part and each second sunken part, the first conductive adhesive layer is bonded with the copper base layer. Wherein through extremely thin copper layer with copper basic unit is with electronic components's heat transfer to every the second depressed part with every the inside of the spherical cavity that first depressed part set up formation relatively, because the inner space of spherical cavity is great relatively, filled heat conduction silica gel layer is more, the heat that heat conduction silica gel layer absorbed is more, consequently better to electronic components's radiating effect, simultaneously extremely thin copper layer with between the copper basic unit through protruding with the recess agrees with each other, and heat conduction silica gel layer fills to every spherical cavity, and recess and a plurality of the inside of through-hole has increased extremely thin copper layer with improved structural strength when the toughness between the copper basic unit, has obtained the effect that improves the toughness and the thermal diffusivity of copper foil.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of the conductive copper foil of the present invention.
Fig. 2 is a schematic view of a partial structure of the conductive copper foil of the present invention.
Fig. 3 is a schematic structural view of an extremely thin copper layer according to the present invention.
Fig. 4 is a schematic structural diagram of the copper-based layer of the present invention.
100-conductive copper foil, 10-ultrathin copper layer, 20-copper base layer, 30-heat conduction silica gel layer, 40-first conductive adhesive layer, 50-graphene layer, 60-second conductive adhesive layer, 70-first release layer, 80-second release layer, 11-first extending part, 12-first sunken part, 13-protrusion, 131-through hole, 21-second extending part, 22-second sunken part and 23-groove.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 4, the present invention provides a conductive copper foil 100, including an ultra-thin copper layer 10, a copper base layer 20, a thermal conductive silica gel layer 30 and a first conductive gel layer 40, wherein the ultra-thin copper layer 10 has a first extending portion 11 and a first recessed portion 12, the number of the first extending portion 11 and the first recessed portion 12 is plural, the plural first extending portions 11 and the plural first recessed portions 12 are sequentially arranged in a staggered manner, each first recessed portion 12 is arranged in an arc structure, the first extending portion 11 has plural protrusions 13, the outer side wall of each protrusion 13 has plural through holes 131, the copper base layer 20 has a second extending portion 21 and a second recessed portion 22, the number of the second extending portion 21 and the second recessed portion 22 is plural, the plural second extending portions 21 and the plural second recessed portions 22 are sequentially arranged in a staggered manner, each second concave portion 22 is arranged in an arc-shaped structure, each second concave portion 22 and each first concave portion 12 are oppositely arranged to form a spherical cavity, each second extending portion 21 is provided with a plurality of grooves 23, each groove 23 is matched with each protrusion 13, the heat-conducting silica gel layer 30 is filled in each groove 23, the inside of each through hole 131 and the spherical cavity of each first concave portion 12 and each second concave portion 22, and the first conductive adhesive layer 40 is bonded with the copper base layer 20 and is located at one end, away from the ultra-thin copper layer 10, of the copper base layer 20.
In this embodiment, the ultra-thin copper layer 10, the copper base layer 20 and the first conductive adhesive layer 40 are sequentially disposed, the conductive copper foil 100 is bonded to an electronic component through the first conductive adhesive layer 40, the thermal conductive adhesive layer 30 is filled between the ultra-thin copper layer 10 and the copper base layer 20, the thermal conductive adhesive layer 30 mainly employs a thermal conductive silica gel, which is a high-end thermal conductive compound and is cross-linked and cured by releasing low molecules through condensation reaction of moisture in the air, and vulcanized into a high-performance elastomer having excellent cold and hot alternation resistance, the first extending portions 11 and the first recessed portions 12 are sequentially disposed on the ultra-thin copper layer 10 in an alternating manner, each of the first extending portions 11 is provided with a plurality of the protrusions 13 uniformly distributed, and the copper base layer 20 is provided with the second extending portions 21 and the second recessed portions 22 sequentially disposed in an alternating manner, each of the second extending portions 21 has a plurality of the grooves 23, the ultra-thin copper layer 10 and the copper base layer 20 are connected by the engagement of a plurality of the protrusions 13 and a plurality of the corresponding grooves 23, because the first recessed portions 12 and the second recessed portions 22 are both arranged in an arc structure, when the ultra-thin copper layer 10 and the copper base layer 20 are connected together, a plurality of spherical cavities are formed by the plurality of the first recessed portions 12 on the ultra-thin copper layer 10 and the plurality of the second recessed portions 22 on the copper base layer 20, the thermal conductive silicone adhesive layer 30 is filled in each spherical cavity, and the thermal conductive silicone adhesive layer 30 is filled in the plurality of spherical cavities formed by filling the ultra-thin copper layer 10 and the copper base layer 20, the thermal conductive silicone adhesive layer 30 is filled in the copper foil 100, which has a thermal conductivity greatly improved compared with a conventional single copper foil, meanwhile, because the volume of the spherical cavity is relatively large, the filling amount of the heat-conducting silicon adhesive layer 30 is relatively large, the heat conductivity of the conductive copper foil 100 can be further improved, and then the heat dissipation effect of the electronic component is improved. The thermal conductive silica gel layer 30 is filled between the ultra-thin copper layer 10 and the copper base layer 20, so as to increase the toughness and ductility of the conductive copper foil 100, the protrusions 13 and the grooves 23 are engaged with each other, so that the connection between the ultra-thin copper layer 10 and the copper base layer 20 is more stable, the thermal conductive silica gel layer 30 is filled in the connection between each protrusion 13 and the groove 23 and the inside of the plurality of through holes 131, and the thermal conductive silica gel layer makes the connection between each protrusion 13 and each groove 23 more stable, so as to form the function of reinforcing ribs, increase the structural strength of the conductive copper foil 100, and ensure that the conductive copper foil 100 is not broken due to limited internal assembly space when being attached to an electronic component.
Further, the first extending portion 11, the first recess 12 and the protrusion 13 are integrally formed.
In the present embodiment, the first extended portion 11, the first recessed portion 12, and the projection 13 are all integrally formed, and the structural strength of the extremely thin copper layer 10 can be increased.
Further, the second extending portion 21, the second recess 22 and the groove 23 are integrally formed.
In this embodiment, the second extending portion 21, the second recessed portion 22 and the concave groove 23 are all integrally formed, so that the structural strength of the copper base layer 20 can be increased.
Further, the thickness of the extremely thin copper layer 10 is 9 to 13 μm. The thickness of the copper base layer 20 is 16-20 μm.
In the present embodiment, the thickness of the copper base layer 20 is 20 μm when the thickness of the extra thin copper layer 10 is 9 μm, and the thickness of the copper base layer 20 is 16 μm when the thickness of the extra thin copper layer 10 is 13 μm, thereby ensuring that the thicknesses of the extra thin copper layer 10 and the copper base layer 20 are at predetermined values after that, and ensuring the structural strength and the compressive resistance of the conductive copper foil 100.
Further, the depth of the groove 23 is 8-11 μm, and the length of the protrusion 13 is 4-7 μm.
In the present embodiment, when the depth of the groove 23 is 8 μm, the length of the protrusion 13 is 4 μm, and when the depth of the groove 23 is 11 μm, the length of the protrusion 13 is 7 μm, when the protrusion 13 is inserted into the groove 23, a gap is ensured between the bottom of the protrusion 13 and the bottom of the groove 23, and the height of the gap is kept at 4 μm, which facilitates the heat-conducting silica gel layer 30 to flow into the gap, and increases the connectivity between the protrusion 13 and the groove 23.
Further, the conductive copper foil 100 further includes a graphene layer 50, and the graphene layer 50 is fixedly connected to the extra thin copper layer 10 and is located at one end of the extra thin copper layer 10 away from the copper base layer 20.
In this embodiment, the graphene layer 50 is made of graphene, the graphene has a high thermal conductivity and a radiation heat effect, the graphene layer 50 is in contact with an electrical component which generates heat, the graphene layer 50 can absorb heat energy on an electronic component and transmit the heat energy to the ultra-thin copper layer 10, and then the heat energy on the ultra-thin copper layer 10 is absorbed by the thermal conductive silicone adhesive layer 30, and the graphene layer 50 can improve the heat exchange efficiency between the conductive copper foil 100 and the electronic component.
Further, the conductive copper foil 100 further includes a second conductive adhesive layer 60, the second conductive adhesive layer 60 is bonded to the graphene layer 50 and is located at one end of the graphene layer 50 away from the ultra-thin copper layer 10, and the bonding force of the second conductive adhesive layer 60 and the first conductive adhesive layer 40 is different.
In this embodiment, the cohesive force of first conductive adhesive layer 40 is less than the cohesive force of second conductive adhesive layer 60, conductive copper foil 100 has the one side of first conductive adhesive layer 40 is connected with the inside fixed plate of electronic equipment, conductive copper foil 100 has the one side of second conductive adhesive layer 60 is connected with electronic components on the PCB board, through first conductive adhesive layer 40 with the setting of the different cohesive forces of second conductive adhesive layer 60 can improve conductive copper foil 100's radiating effect.
Further, the conductive copper foil 100 further comprises a first release layer 70 and a second release layer 80, wherein the first release layer 70 is bonded to the first conductive adhesive layer 40 and is located at a position where the first conductive adhesive layer 40 is far away from one end of the copper base layer 20, the second conductive adhesive layer 60 is fixedly connected to the second conductive adhesive layer 60 and is located at a position where the second conductive adhesive layer 60 is far away from one end of the graphene layer 50.
In this embodiment, the first layer 70 that leaves bonds on the first conductive adhesive layer 40, the second leaves the layer 80 and bonds on the second conductive adhesive layer 60, works as when conductive copper foil 100 needs to use, tears first leave the layer 70 with the second leaves the layer 80, will conductive copper foil 100 bonds to predetermineeing the position, first leave the layer 70 with the second can prevent from the layer 80 first conductive adhesive layer 40 with second conductive adhesive layer 60 receives the pollution, influences viscidity.
Further, the first release layer 70 and the second release layer 80 both adopt PET films.
In this embodiment, the first release film and the second release film are both PET films, and have good adsorptivity and conformability.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A conductive copper foil, characterized in that,
the heat-conducting silicone rubber heat-conducting paint comprises an extremely thin copper layer, a copper base layer, a heat-conducting silicone rubber layer and a first electric-conducting adhesive layer, wherein a first extending part and a first depressed part are arranged on the extremely thin copper layer, the number of the first extending part and the first depressed part is multiple, the first extending part and the first depressed part are sequentially arranged in a staggered manner, each first depressed part is of an arc surface structure, a plurality of bulges are arranged on each first extending part, a plurality of through holes are arranged on each convex outer side wall, a second extending part and a second depressed part are arranged on the copper base layer, the number of the second extending part and the number of the second depressed part are multiple, the second extending part and the second depressed part are sequentially arranged in a staggered manner, each second depressed part is of an arc surface structure, and each second depressed part and each first depressed part are oppositely arranged to form a spherical cavity, each second extension portion is provided with a plurality of grooves, each groove is matched with each protrusion, the heat-conducting silica gel layer is filled in each groove, each through hole and each spherical cavity of the first sunken portion and each second sunken portion, the first electric-conducting silica gel layer is bonded with the copper base layer and is positioned at one end, far away from the extremely thin copper layer, of the copper base layer.
2. The conductive copper foil of claim 1,
the first extending portion, the first recess portion and the protrusion are integrally formed.
3. The conductive copper foil of claim 2,
the second extending portion, the second recess portion and the groove are integrally formed.
4. The conductive copper foil of claim 3,
the thickness of the extremely thin copper layer is 9-13 μm.
5. The conductive copper foil of claim 4,
the thickness of the copper base layer is 16-20 mu m.
6. The conductive copper foil of claim 5,
the depth of the groove is 8-11 mu m, and the length of the protrusion is 4-7 mu m.
7. The conductive copper foil of claim 1,
the conductive copper foil further comprises a graphene layer, wherein the graphene layer is fixedly connected with the ultrathin copper layer and is positioned at one end, far away from the copper base layer, of the ultrathin copper layer.
8. The conductive copper foil of claim 7,
the conductive copper foil further comprises a second conductive adhesive layer, the second conductive adhesive layer is bonded with the graphene layer and is positioned at one end, away from the ultrathin copper layer, of the graphene layer, and the bonding force of the second conductive adhesive layer is different from that of the first conductive adhesive layer.
9. The conductive copper foil of claim 8,
the conductive copper foil further comprises a first release layer and a second release layer, wherein the first release layer is adhered to the first conductive adhesive layer and is located at one end of the copper base layer, the second conductive adhesive layer is fixedly connected with the second conductive adhesive layer and is located at one end of the graphene layer, and the first conductive adhesive layer is far away from the one end of the copper base layer.
10. The conductive copper foil of claim 9,
the first release layer and the second release layer both adopt PET films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920621640.2U CN210065631U (en) | 2019-04-30 | 2019-04-30 | Conductive copper foil |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920621640.2U CN210065631U (en) | 2019-04-30 | 2019-04-30 | Conductive copper foil |
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| CN210065631U true CN210065631U (en) | 2020-02-14 |
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| CN201920621640.2U Active CN210065631U (en) | 2019-04-30 | 2019-04-30 | Conductive copper foil |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114106726A (en) * | 2021-11-29 | 2022-03-01 | 京东方科技集团股份有限公司 | Heat dissipation film and electronic device with same |
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- 2019-04-30 CN CN201920621640.2U patent/CN210065631U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114106726A (en) * | 2021-11-29 | 2022-03-01 | 京东方科技集团股份有限公司 | Heat dissipation film and electronic device with same |
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