CN210120751U - Circuit board module and heat dissipation plate structure thereof - Google Patents

Abstract

The utility model discloses a circuit board module and heat radiation plate structure thereof, wherein the heat radiation plate structure includes a first plate body, a second plate body, a heat transfer layer and a buffer liquid. The first plate body is provided with a first inner surface, and the first inner surface is provided with a plurality of first metal bumps. The second plate body is correspondingly jointed with the first plate body so as to form an accommodating cavity between the second plate body and the first plate body, wherein the second plate body is provided with a second inner surface, and a plurality of second metal lugs are arranged on the second inner surface. The heat transfer layer is arranged in the accommodating cavity and is positioned between the first metal bumps and the second metal bumps. The buffer liquid is filled in the residual space in the accommodating cavity. Therefore, the heat dissipation plate structure can meet the design requirements of light and thin electronic products and can effectively take away heat from a heat source.

Description

Circuit board module and heat dissipation plate structure thereof

Technical Field

The utility model relates to a heat radiation structure especially relates to a heating panel structure to and use its circuit board module.

Background

In response to the coming of the 5G era, the performance requirements of high-frequency and high-speed products (such as antennas) are continuously increased, and not only is the transmission speed of signals required to be increased, but also the signal integrity is prevented from being reduced due to the loss of the signals in the transmission process. In addition, as electronic products are developing towards the trend of light weight, small size and high efficiency, how to effectively dissipate heat of electronic components in a limited internal space, namely, the heat dissipation structure is used to take away heat generated in the operation process of the electronic components, which is one of the problems to be solved in the field; for example, not only focusing on the X-Y direction, but also considering the contribution of the heat conduction in the Z direction to the overall heat dissipation efficiency when planning the heat dissipation path.

In the heat dissipation process, the heat dissipation structure can be directly contacted with the electronic component or keep a gap with the electronic component. For example, graphite, metal or graphite/metal heat sinks may be attached directly to high power electronic components (e.g., processors) or to adjacent other parts (e.g., back covers) to carry heat away from the electronic components; in addition, a high-power electronic component (such as a light emitting diode) may be disposed on the heat pipe, so that heat is transferred from the electronic component to the heat dissipation structure (such as the heat dissipation fins) through the heat pipe and then dissipated from the heat dissipation structure to the outside.

Although the heat sink can timely cool the electronic component in operation, the heat dissipation capability of the heat sink still has room for improvement, and the heat sink is not favorable for light and thin design; in addition, the heat pipe has a high cost and needs to be matched with another heat dissipation structure for heat dissipation.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the present invention is to provide a heat dissipation plate structure, which has excellent heat transfer effect in the three directions of XYZ; in addition, a circuit board module using the heat radiation plate structure is provided.

In order to solve the above technical problem, the present invention provides a circuit board module, which includes a heat dissipation plate structure, a high-frequency high-speed circuit board, and a heat conduction member. The heat dissipation plate structure comprises a first plate body, a second plate body, a heat transfer layer and buffer liquid; the first plate body is provided with a first inner surface, and a plurality of first metal lugs are arranged on the first inner surface; the second plate body is correspondingly jointed with the first plate body so as to form an accommodating cavity between the second plate body and the first plate body, wherein the second plate body is provided with a second inner surface, and a plurality of second metal lugs are arranged on the second inner surface; the heat transfer layer is arranged in the accommodating cavity and is positioned between the first metal bumps and the second metal bumps; the buffer liquid is filled in the residual space in the accommodating cavity. The high-frequency high-speed circuit board is arranged on the first board body of the heat dissipation board structure, and comprises a dielectric substrate and at least one functional circuit layer formed on the dielectric substrate. The heat conducting piece is provided with a first end part and a second end part, the first end part is in heat conduction connection with the first plate body of the heat radiating plate structure, and the second end part is arranged near the functional circuit layer.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a heat dissipation plate structure, which includes a first plate, a second plate, a heat transfer layer and a buffer liquid; the first plate body is provided with a first inner surface, and a plurality of first metal lugs are arranged on the first inner surface; the second plate body is correspondingly jointed with the first plate body so as to form an accommodating cavity between the second plate body and the first plate body, wherein the second plate body is provided with a second inner surface, and a plurality of second metal lugs are arranged on the second inner surface; the heat transfer layer is arranged in the accommodating cavity and is positioned between the first metal bumps and the second metal bumps; the buffer liquid is filled in the residual space in the accommodating cavity.

Furthermore, the positions of the first metal bumps and the second metal bumps are staggered.

Further, the heat transfer layer is in the form of a porous layer or a continuous layer.

Furthermore, the first board body includes a first substrate layer and at least one first metal layer formed on the first substrate layer, and the plurality of first metal bumps are formed on the first metal layer.

Furthermore, the first plate body is provided with at least one first blind hole, the first blind hole penetrates through the first substrate layer, and a heat conduction material is filled in the first blind hole.

Further, the first board body has at least one first through hole, the first through hole penetrates through the first substrate layer and the first metal layer, and a heat conductive material is filled in the first through hole.

Furthermore, the second board body includes a second substrate layer and at least one second metal layer formed on the second substrate layer, and the plurality of second metal bumps are formed on the second metal layer.

Furthermore, the second plate body is provided with at least one second blind hole, the second blind hole penetrates through the second substrate layer, and a heat conduction material is filled in the second blind hole.

Further, the second board body has at least one second through hole, the second through hole penetrates through the second substrate layer and the second metal layer, and a heat conductive material is filled in the second through hole.

Furthermore, the first plate body has a first inner side portion and at least one first outer side portion located on one side of the first inner side portion, the second plate body has a second inner side portion and at least one second outer side portion located on one side of the second inner side portion, and the accommodating cavity is formed between the first inner side portion and the second inner side portion.

Further, the heat dissipation plate structure further includes at least one heat conduction column connected between the first outer side portion and the second outer side portion.

Further, the thickness of the heat dissipation plate structure is 0.2 mm to 0.5 mm, and the average height of the plurality of first metal bumps and the plurality of second metal bumps is 30 micrometers to 220 micrometers.

The utility model discloses an one of them beneficial effect lies in, the utility model discloses a heating panel structure, it can correspond the joint through "first plate body and second plate body to form a holding chamber during it, the heat transfer layer sets up in the holding intracavity, and is located between a plurality of first metal lug of first plate body internal surface and a plurality of second metal lug of second plate body internal surface, and the buffer liquid fills the technical scheme in the remaining space of holding intracavity", in order to compromise frivolousization, structural strength and heat-sinking capability, accord with frivolous electronic product's designing requirement.

For a further understanding of the nature and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are provided for reference and illustration purposes only and are not intended to limit the invention.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation plate structure according to a first embodiment of the present invention.

Fig. 2 is a schematic perspective view of a heat dissipation plate structure according to a first embodiment of the present invention.

Fig. 3 is another schematic structural diagram of a heat dissipation plate structure according to a first embodiment of the present invention.

Fig. 4 is an enlarged view of the portion IV of fig. 1.

Fig. 5 is an enlarged view of a portion V of fig. 1.

Fig. 6 is another enlarged view of the portion IV of fig. 1.

Fig. 7 is another enlarged view of the portion V of fig. 1.

Fig. 8 is another enlarged schematic view of the portion IV of fig. 1.

Fig. 9 is another enlarged view of the portion V of fig. 1.

Fig. 10 is a schematic structural view of a heat dissipation plate structure according to a second embodiment of the present invention.

Fig. 11 is a schematic structural diagram of the circuit board module according to the present invention.

Fig. 12 is another schematic structural diagram of the circuit board module according to the present invention.

Fig. 13 is another schematic structural diagram of the circuit board module according to the present invention.

Fig. 14 is another schematic structural diagram of the circuit board module according to the present invention.

Detailed Description

The following description is provided for the embodiments of the present invention relating to "circuit board module and heat dissipation plate structure thereof" by specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present invention. The present invention may be practiced or carried out in other different embodiments, and various modifications and changes may be made in the details of this description based on the different points of view and applications without departing from the spirit of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

First embodiment

Referring to fig. 1 to 3, a heat dissipating plate structure 1 according to a first embodiment of the present invention includes a first plate 11, a second plate 12, a heat transfer layer 13 and a buffer liquid 14. The surfaces of the first board body 11 and the second board body 12 are provided with three-dimensional heat conduction patterns, the first board body 11 and the second board body 12 are correspondingly connected and jointly enclose a sealed accommodating cavity C, the heat transfer layer 13 is arranged in the accommodating cavity C, and the buffer liquid 14 is filled in the residual space in the accommodating cavity C. The buffer liquid 14 may be pure water, but is not limited thereto.

When the heat-conducting plate is used, the first plate body 11 can rapidly conduct heat generated by a heat source outwards and transfer the heat to the accommodating cavity C, and the conducted heat can be transferred to the second plate body 12 in a large-area mode along the Z direction after being transferred along the XY direction under the synergistic effect of the three-dimensional heat-conducting patterns on the first plate body 11 and the second plate body 12, the buffer liquid 14 and the heat transfer layer 13, and then is dissipated to the outside from the second plate body 12.

Further, the first plate 11 can serve as a heat absorption side, the first plate 11 has a first outer surface 111 and a first inner surface 112 opposite to the first outer surface 111, wherein the first inner surface 112 has a plurality of first metal bumps 1121 thereon. The second board 12 can be used as a heat dissipation side, and the second board 12 has a second outer surface 121 and a second inner surface 122 opposite to the second outer surface 121, wherein the second inner surface 122 has a plurality of second metal bumps 1221 thereon. Further, the plurality of first metal bumps 1121 may be arranged in an array on the first inner surface 112 of the first plate 11, and the distribution area of the plurality of first metal bumps 1121 may occupy 5% to 30% of the area of the first inner surface 112. The plurality of second metal bumps 1221 may be arranged in an array on the second inner surface 122 of the second plate 12, and the distribution area of the plurality of second metal bumps 1221 may occupy 5% to 30% of the area of the second inner surface 122. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention. According to actual requirements, the first metal bumps 1121 and the second metal bumps 1221 may also be arranged in other regular manners.

In the present embodiment, each of the first board 11 and the second board 12 may be a flexible board, such as a flexible PCB. The first metal bump 1121 and the second metal bump 1221 can be formed by electroplating or screen printing, and the average height of the first metal bump 1121 and the second metal bump 1221 can be 30 micrometers to 220 micrometers. The first metal bump 1121 and the second metal bump 1221 may be made of copper or other high thermal conductivity metal, and the first metal bump 1121 and the second metal bump 1221 may be made of the same material or different materials. The first metal bump 1121 and the second metal bump 1221 may have a square column shape or a cylindrical shape, and the first metal bump 1121 and the second metal bump 1221 may have the same or different shapes. However, the present invention is not limited to the above examples.

Referring to fig. 1 and fig. 4 and 5, fig. 4 and 5 show an implementation manner of the first board 11 and the second board 12. The first plate body 11 may be formed of a single metal, such as copper or other high thermal conductivity metal; according to practical requirements, the first plate 11 may also be made of metal and polymer or polymer composite. Further, the first plate 11 may include a first substrate layer 11a and at least one first metal layer 11b formed on the first substrate layer 11a, and the plurality of first metal bumps 1121 are formed on the first metal layer 11 b. The second board 12 may include a second substrate layer 12a and at least one second metal layer 12b formed on the second substrate layer 12a, and a plurality of second metal bumps 1221 are formed on the second metal layer 12 b. It is noted that the first substrate layer 11a and the second substrate layer 12a can function as a support, and the first metal layer 11b and the second metal layer 12b can function as a heat sink.

Referring to fig. 6 and 7, another implementation of the first board 11 and the second board 12 is shown. As shown in fig. 6, under the structure that the first board body 11 includes a first substrate layer 11a and two first metal layers 11b respectively formed on two opposite surfaces of the first substrate layer 11a, one or more first blind holes 11c may be formed on the first board body 11, wherein the first blind holes 11c penetrate through the first substrate layer 11a, and the first blind holes 11c are filled with a heat conductive material to form a heat conductive connection between the two first metal layers 11 b. In the structure where the second board body 12 includes a second substrate layer 12a and two second metal layers 12b respectively formed on two opposite surfaces of the second substrate layer 12a, one or more second blind holes 12c may be formed in the second board body 11, wherein the second blind holes 12c penetrate through the second substrate layer 11a, and the second blind holes 12c are filled with a heat conductive material to form a heat conductive connection between the two second metal layers 12 b. Therefore, the overall heat dissipation efficiency can be improved.

Referring to fig. 8 and 9, a further implementation manner of the first board 11 and the second board 12 is shown. As shown in fig. 8, in order to form a thermal conductive connection between the two first metal layers 11b, one or more first through holes 11d may be formed in the first plate body 11, wherein the first through holes 11d penetrate through the first substrate layers 11a and the first metal layers 11b, and the first through holes 11d are filled with a thermal conductive material. As shown in fig. 9, in order to form a thermal conductive connection between the two second metal layers 12b, one or more second through holes 12d may also be formed in the second board body 12, wherein the second through holes 12d penetrate through the second substrate layer 12a and the second metal layers 12b, and the second through holes 12d are filled with a thermal conductive material.

In this embodiment, the materials of the first substrate layer 11a and the second substrate layer 12a may be unmodified or modified polyimide, unmodified or modified liquid crystal polymer, or glass fiber reinforced epoxy resin, wherein the molecular chain structure of the modified polyimide and the modified liquid crystal polymer may contain a functional monomer (aromatic monomer); the materials of the first substrate layer 11a and the second substrate layer 12a may be the same or different. The material of the first metal layer 11b and the second metal layer 12b may be copper or other high thermal conductivity metal, and the material of the first metal layer 11b and the second metal layer 12b may be the same or different. The thermally conductive material filled in the first and second blind holes 11c, 12c or the first and second through holes 11d, 12d may comprise a metal or metal-based material, a carbon-based or carbon-based material, or a combination thereof. However, the present invention is not limited to the above examples.

In the present embodiment, the first board 11 and the second board 12 may have regular shapes, such as square and rectangle. The first plate body 11 and the second plate body 12 may be joined together by diffusion bonding, but not limited thereto. In order to form the receiving cavity C, an annular retaining wall 15 is disposed between the first inner surface 112 of the first plate 11 and the second inner surface 122 of the second plate 12, and the annular retaining wall 15 surrounds the first metal protrusions 1121 and the second metal protrusions 1221. Further, the upper half of the annular wall 15 may be integrally formed with the first plate 11, and the lower half of the annular wall 15 may be integrally formed with the second plate 12, but is not limited thereto. In other embodiments, the annular retaining wall 15 may be integrally formed with the first plate 11 or the second plate 12. The thickness of the annular retaining wall 15 may be 3 to 6 microns to facilitate the joining of the first plate body 11 to the second plate body 12.

In the present embodiment, as shown in fig. 1 to 3, the heat transfer layer 13 may exist in the form of a porous layer or a continuous layer, and the material of the heat transfer layer 13 may be a highly heat conductive metal (such as copper), graphite, or carbon fiber; for example, the heat transfer layer 13 may be a metal mesh, a metal sheet, a graphite paper, or a carbon fiber mesh. In the structure where the heat transfer layer 13 is a porous layer, a plurality of holes (not numbered) of the heat transfer layer 13 may be arranged in a matrix, wherein each hole may have a circular, square or other polygonal shape, and a pore size of 25 microns to 200 microns. However, the present invention is not limited to the above examples. It should be noted that, in the structure in which the heat transfer layer 13 is a porous layer, the positions of the first metal bumps 1121 and the second metal bumps 1221 are staggered, so that a plurality of heat transfer channels can be provided in the accommodating cavity C, and the buffer liquid 14 can increase the heat transfer effect in the XY direction. Preferably, the heat transfer layer 13, the first metal bump 1121, and the second metal bump 1221 are not in contact with each other.

Second embodiment

Referring to fig. 10, a second embodiment of the present invention provides a heat dissipating plate structure 1, which includes a first plate 11, a second plate 12, a heat transfer layer 13 and a buffer liquid 14. The surfaces of the first board body 11 and the second board body 12 are provided with three-dimensional heat conduction patterns, the first board body 11 and the second board body 12 are correspondingly connected and jointly enclose a sealed accommodating cavity C, the heat transfer layer 13 is arranged in the accommodating cavity C, and the buffer liquid 14 is filled in the residual space in the accommodating cavity C. The main difference between this embodiment and the first embodiment is: the heat spreader structure 1 further comprises at least one heat-conducting post 16.

In the present embodiment, the first board 11 has a first inner side portion 11P1 and at least a first outer side portion 11P2 located at one side of the first inner side portion 11P1, and the second board 12 has a second inner side portion 12P1 and at least a second outer side portion 12P2 located at one side of the second inner side portion 12P 1. The accommodating cavity C, with the heat transfer layer 13 and the buffer liquid 14 inside, is disposed between the first inner side portion 11P1 and the second inner side portion 12P1, the heat-conducting pillar 16 is disposed between the first outer side portion 11P2 and the second outer side portion 12P2, and two ends of the heat-conducting pillar 16 are respectively connected to the first outer side portion 11P2 and the second outer side portion 12P 2. This improves the structural stability and flexibility of the heat sink structure 1.

Referring to fig. 11 to 14, the present invention further provides a circuit board module M, which includes a heat dissipation plate structure 1 having the above structure, a high-frequency high-speed circuit board 2 and a heat conducting member 3. The high-frequency high-speed circuit board 2 is disposed on the first board body 11 of the heat dissipation board structure 1, and the heat conducting member 3 is used for guiding heat generated by a heat source on the high-frequency high-speed circuit board 2 to the first board body 11, and then performing effective heat dissipation.

In the present embodiment, the high-frequency high-speed circuit board 2 includes a dielectric substrate 21 and at least one functional circuit layer 22 formed on the dielectric substrate 21; the functional circuit layer 22 may be an antenna structure, but is not limited thereto. The heat conducting member 3 has a first end portion 31, a second end portion 32 and a main body portion 33 connected to the first end portion 31 and the second end portion 32, wherein the first end portion 31 is thermally connected to the first board 11, and the second end portion 32 is disposed near the functional circuit layer 22.

Further, as shown in fig. 11, the dielectric substrate 21 of the high-frequency and high-speed circuit board 2 may be directly attached to the first plate 11 of the heat dissipation plate structure 1; preferably, the dielectric substrate 21 may be formed on the first board body 11 through a printed circuit board process or a flexible board process, but is not limited thereto. According to practical requirements, an appropriate heat-conductive connection interface (e.g., a heat-conductive adhesive) may be used to connect the dielectric substrate 21 and the first board 11. However, the present invention is not limited to the above examples. In this configuration, the heat-conducting member 3 may be in the form of a column, wherein the first end portion 31 and the main body portion 33 of the heat-conducting member 3 are both embedded in the dielectric substrate 21, and the first end portion 31 directly contacts the first plate 11; it should be noted that the second end portion 32 of the heat conducting member 3 protrudes from the dielectric substrate 21 from a position close to the functional circuit layer 22 to exchange heat with the functional circuit layer 22 by means of thermal convection.

In addition, as shown in fig. 12, the dielectric substrate 21 of the high-frequency high-speed circuit board 2 may be disposed above the first board body 11 of the heat dissipation plate structure 1 through a plurality of supporting pillars 4, i.e., a plurality of supporting pillars 4 may be disposed between the dielectric substrate 21 and the first board body 11. In this configuration, the heat conducting member 3 may be in the form of a cylinder, wherein the first end portion 31 and the main body portion 33 of the heat conducting member 3 are both embedded in the dielectric substrate 21, the first end portion 31 directly contacts the supporting pillar 4 and is thermally conductively connected to the first board 11 through the supporting pillar 4, and the second end portion 32 of the heat conducting member 3 protrudes from the dielectric substrate 21 from a position close to the functional circuit layer 22; the second end portion 32 of the heat-conducting member 3 may thus be disposed adjacent to the functional wiring layer 22 to exchange heat with the functional wiring layer 22 by means of thermal convection.

In addition, as shown in fig. 13 and 14, under the two aforementioned configurations, the heat conducting member 3 may be in the form of a belt, wherein the first end portion 31 of the heat conducting member 3 may be formed by extending from the first plate 11, and the main body portion 33 of the heat conducting member 3 extends toward the functional circuit layer 22 without contacting the dielectric substrate 21, so that the second end portion 32 is located near the functional circuit layer 22, and the normal operation of the internal circuit (not shown) in the dielectric substrate 21 is not affected.

Advantageous effects of the embodiments

The utility model discloses an one of them beneficial effect lies in, the utility model discloses a heating panel structure, it can correspond the joint through "first plate body and second plate body to form a holding chamber during it, the heat transfer layer sets up in the holding intracavity, and is located between a plurality of first metal lug of first plate body internal surface and a plurality of second metal lug of second plate body internal surface, and the buffer liquid fills the technical scheme in the remaining space of holding intracavity", in order to compromise frivolousization, structural strength and heat-sinking capability, accord with frivolous electronic product's designing requirement.

The above disclosure is only a preferred and practical embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention, so that all the modifications of the equivalent technology made by the contents of the specification and the drawings are included in the scope of the claims of the present invention.

Claims (24)

1. A heat dissipation plate structure, characterized in that the heat dissipation plate structure comprises:

the first plate body is provided with a first inner surface, and a plurality of first metal lugs are arranged on the first inner surface;

the second plate body is correspondingly jointed with the first plate body so as to form an accommodating cavity between the second plate body and the first plate body, wherein the second plate body is provided with a second inner surface, and a plurality of second metal lugs are arranged on the second inner surface;

the heat transfer layer is arranged in the accommodating cavity and is positioned between the first metal bumps and the second metal bumps; and

and the buffer liquid is filled in the residual space in the accommodating cavity.

2. The heat spreader structure of claim 1, wherein the first metal bumps and the second metal bumps are staggered.

3. Heat distribution plate structure as claimed in claim 1, characterized in that the heat transfer layer is present in the form of a porous layer or a continuous layer.

4. The heat dissipation plate structure as claimed in claim 1, wherein the first plate includes a first substrate layer and at least one first metal layer formed on the first substrate layer, and the plurality of first metal bumps are formed on the first metal layer.

5. The heat sink plate structure as claimed in claim 4, wherein the first plate body has at least one first blind hole, the first blind hole penetrates through the first substrate layer, and a thermally conductive material is filled in the first blind hole.

6. The heat sink plate structure as claimed in claim 4, wherein the first plate body has at least a first through hole, the first through hole penetrates through the first substrate layer and the first metal layer, and a thermally conductive material is filled in the first through hole.

7. The heat dissipation plate structure as claimed in claim 1, wherein the second plate includes a second substrate layer and at least one second metal layer formed on the second substrate layer, and the plurality of second metal bumps are formed on the second metal layer.

8. The heat sink plate structure of claim 7, wherein the second plate body has at least one second blind hole, the second blind hole penetrates through the second substrate layer, and a thermally conductive material is filled in the second blind hole.

9. The heat sink plate structure of claim 7, wherein the second plate body has at least a second through hole, the second through hole penetrates through the second substrate layer and the second metal layer, and a heat conductive material is filled in the second through hole.

10. The heat dissipating plate structure of claim 1, wherein the first plate has a first inner side portion and at least one first outer side portion on one side of the first inner side portion, the second plate has a second inner side portion and at least one second outer side portion on one side of the second inner side portion, and the receiving cavity is formed between the first inner side portion and the second inner side portion.

11. The heat spreader structure of claim 10, further comprising at least one heat conductive post, wherein the at least one heat conductive post is connected between the first outer side and the second outer side.

12. The heat spreader structure of claim 1, wherein the heat spreader structure has a thickness of 0.2 mm to 0.5 mm, and the average height of the first metal bumps and the second metal bumps is 30 micrometers to 220 micrometers.

13. A circuit board module, comprising:

a heat sink structure, comprising:

the first plate body is provided with a first inner surface, and a plurality of first metal lugs are arranged on the first inner surface;

the second plate body is correspondingly jointed with the first plate body so as to form an accommodating cavity between the second plate body and the first plate body, wherein the second plate body is provided with a second inner surface, and a plurality of second metal lugs are arranged on the second inner surface;

the heat transfer layer is arranged in the accommodating cavity and is positioned between the first metal bumps and the second metal bumps; and

the buffer liquid is filled in the residual space in the accommodating cavity;

the high-frequency high-speed circuit board is arranged on the first board body of the heat dissipation board structure and comprises a dielectric substrate and at least one functional circuit layer formed on the dielectric substrate; and

the heat conducting piece is provided with a first end part and a second end part, the first end part is in heat conduction connection with the first plate body of the heat radiating plate structure, and the second end part is arranged near the functional circuit layer.

14. The circuit board module according to claim 13, wherein the first metal bumps and the second metal bumps are staggered.

15. The wiring board module of claim 13, wherein said heat transfer layer is in the form of a porous layer or a continuous layer.

16. The circuit board module of claim 13, wherein the first board body comprises a first substrate layer and at least a first metal layer formed on the first substrate layer, and a plurality of the first metal bumps are formed on the first metal layer.

17. The circuit board module according to claim 16, wherein the first board body has at least one first blind hole, the first blind hole extends through the first substrate layer, and a thermally conductive material is filled in the first blind hole.

18. The circuit board module according to claim 16, wherein the first board body has at least a first via hole, the first via hole penetrates through the first substrate layer and the first metal layer, and a thermally conductive material is filled in the first via hole.

19. The circuit board module of claim 13, wherein the second board body comprises a second substrate layer and at least a second metal layer formed on the second substrate layer, and a plurality of the second metal bumps are formed on the second metal layer.

20. The circuit board module according to claim 19, wherein the second board body has at least one second blind hole, the second blind hole extends through the second substrate layer, and a thermally conductive material is filled in the second blind hole.

21. The circuit board module according to claim 19, wherein the second board body has at least a second via hole, the second via hole penetrates through the second substrate layer and the second metal layer, and a thermally conductive material is filled in the second via hole.

22. The circuit board module of claim 13, wherein the first board body has a first inner side portion and at least one first outer side portion located at one side of the first inner side portion, the second board body has a second inner side portion and at least one second outer side portion located at one side of the second inner side portion, and the receiving cavity is formed between the first inner side portion and the second inner side portion.

23. The circuit board module according to claim 22, wherein the heat spreader structure further comprises at least one thermal post, the at least one thermal post connected between the first and second outer sides.

24. The circuit board module according to claim 13, wherein the heat dissipation plate has a thickness of 0.2 mm to 0.5 mm, and an average height of the first metal bumps and the second metal bumps is 30 micrometers to 220 micrometers.

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