CN103363361A - Light source light emitting module - Google Patents
Light source light emitting module Download PDFInfo
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- CN103363361A CN103363361A CN2013103408094A CN201310340809A CN103363361A CN 103363361 A CN103363361 A CN 103363361A CN 2013103408094 A CN2013103408094 A CN 2013103408094A CN 201310340809 A CN201310340809 A CN 201310340809A CN 103363361 A CN103363361 A CN 103363361A
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- light source
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- plastic stent
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Abstract
The invention provides a light source light emitting module which comprises a wafer, a support and a printed circuit board, wherein the wafer is connected to the support, the wafer comprises a red light wafer, a green light wafer, a blue light wafer and an infrared light wafer, and the support is connected with the printed circuit board. Due to the fact that the infrared light wafer is additionally arranged based on the arrangement of the red light wafer, the green light wafer and the blue light wafer, the application range of the light source light emitting module is wider. The light source light emitting module can be used on scanning equipment made of materials sensitive to infrared light such as a currency detector.
Description
Technical field
The invention belongs to the light source module, more specifically relate to a kind of light source module that comprises infrared light supply.
Background technology
Only have ruddiness, green glow and blue light in the light source luminescent module of prior art, do not have infrared light, and the material of the light source luminescent module of prior art all is metal material, a kind of light source just needs to increase a pin, and also needing simultaneously increases whole width, and cost is higher.
Summary of the invention
The invention provides a kind of light source luminescent module, comprise wafer, support and printed circuit board (PCB), be connected with wafer on the support, wafer comprises ruddiness wafer, green glow wafer, blue light wafer and infrared light wafer, support is connected with printed circuit board (PCB), and ruddiness wafer, green glow wafer, blue light wafer and infrared light wafer are positioned at straight line.
Its beneficial effect is: the basis at ruddiness wafer, green glow wafer, blue light wafer increases the infrared light wafer, so that application of the present invention is broader, can be applied on some scanning devices to the infrared light sensitive material, such as cash inspecting machine.Arrangement mode in one line is so that the reverberation of ruddiness wafer, blue light wafer, green glow wafer and infrared light wafer is higher.Because after the later stage operation was installed in the light source luminescent module on the LGP, the white ink on the LGP was straight line, only reflect by printing ink and wafer sends, arranged in a straight linely just can guarantee not lose the wherein reverberation of any wafer.
In some embodiments, ruddiness wafer and infrared light wafer are positioned at the both sides of blue light wafer and green glow wafer.
Its beneficial effect is: because the optical source wavelength of ruddiness wafer and infrared light wafer is longer, brightness is higher, come both sides and can lose a little some brightness, green glow wafer and blue light wafer come middle because brightness is slightly low, so just in time can the balance high brightness and the drop of low-light level, reach the basically identical property of four wafer light sources, guarantee the quality of scanning after the light source luminescent module is applied on the scanning means.
In some embodiments, wafer encapsulates with transparent glue.
Its beneficial effect is: transparent glue plays the effect of protection wafer.
In some embodiments, support is plastic stent.
Its beneficial effect is: the employing plastic stent can reduce cost and reduce volume.The light source luminescent module of prior art is one, support is metallic support, and the pin on the metallic support all is in one line, has increased an infrared light wafer, just need to increase a pin at metallic support, must increase the width of whole illuminating source module; The present invention adopts plastic stent, and plastic stent can directly be welded on the printed circuit board (PCB); And the both sides of printed circuit board (PCB) and the back side can printed circuits, in the practical application in the situation that limited space, the pin of controlling these wafers can also be separately positioned on two sides and the back side of printed circuit board (PCB), more saves the space than metallic support, provides possibility for making narrower light source.
In some embodiments, the material of plastic stent is Merlon or the styrene copolymerized compound of the third alkene nitrile – fourth two alkene –.
In some embodiments, the plastic stent side that do not connect wafer scribbles the silver lacquer.
Its beneficial effect is: increase the reflection of light on plastic stent that wafer sends, prevent the loss of the light of wafer.
In some embodiments, wafer is connected with plastic stent by elargol, and plastic stent is provided with the first pad, and wafer is provided with the second pad, and the second pad that the first pad of plastic stent is connected with wafer connects by wire.
Its beneficial effect is: elargol can also play the effect of conduction except the effect of playing fixing wafer, in addition, and elargol can also produce wafer in luminous heat fast spread; The back side of four wafers is connected on the negative pole by elargol.Four wires that connect wafer and plastic stent are connected on four positive poles by plastic stent respectively.
In some embodiments, the side that plastic stent is connected with wafer is provided with block, block be positioned at wafer around, the height of transparent glue is lower than the height of block.
Its beneficial effect is: transparent glue direct collision LGP when preventing from being installed to the light source luminescent module on the LGP, cause the distortion of transparent glue, and form the gap, thereby cause the generation of the phenomenons such as light leak.
In some embodiments, plastic stent is connected by melting down weldering with printed circuit board (PCB).
Description of drawings
Fig. 1 is ruddiness wafer, blue light wafer, the green glow wafer of light source luminescent module one embodiment of the present invention, the arrangement schematic diagram of infrared light wafer;
Fig. 2 is the structural representation of light source luminescent module one embodiment of the present invention.
The specific embodiment
Shown in Fig. 1-2, the light source luminescent module comprises wafer 3, support and printed circuit board (PCB) 6.Support is plastic stent 1.In the present embodiment, the poly-carbonic acid resin of the material selection of plastic stent 1.In actual applications, can also select the styrene copolymerized compound of the third alkene nitrile – fourth two alkene – etc.Plastic stent 1 is for being provided with the cube of oval-shaped groove 12.Scribble elargol 2 in the oval-shaped groove 12 of plastic stent 1, wafer 3 is attached on the elargol 2, and is by baking that wafer 3 is fixing again.Elargol 2 can also play the effect of conduction except the effect of playing fixing wafer 3, in addition, and elargol 2 can also produce wafer 3 in luminous heat fast spread.Wafer 3 comprises ruddiness wafer 31, green glow wafer 32, blue light wafer 33, infrared light wafer 34.The arrangement mode of four wafers 3 is that arrangement mode in one line, in one line is so that the reverberation of ruddiness wafer 31, blue light wafer 33, green glow wafer 32 and infrared light wafer 34 is higher.Because after the later stage operation was installed in the light source luminescent module on the LGP, the white ink on the LGP was straight line, only reflect by printing ink and wafer 3 sends, arranged in a straight linely just can guarantee not lose the wherein reverberation of any wafer.And ruddiness wafer 31 and infrared light wafer 34 come respectively the both sides of green glow wafer 32 and blue light wafer 33, because the optical source wavelength of ruddiness wafer 31 and infrared light wafer 34 is longer, brightness is higher, come both sides and can lose a little some brightness, green glow wafer 32 and blue light wafer 33 come middle because brightness is slightly low, so just in time can the balance high brightness and the drop of low-light level, reach the basically identical property of the light source of four wafers 3.The present invention has increased an infrared light wafer 34, so that application is broader, can be applied on some scanning devices to the infrared light sensitive material, such as currency examine etc.The side that plastic stent 1 does not connect wafer 3 scribbles the silver lacquer, can increase the reflection of light on plastic stent 1 that wafer 3 sends, and prevents the loss of the light of wafer 3.
The position of protruding around the plastic stent 1 is block 11.After four wafers 3 fix, encapsulate by 5 pairs of four wafers 3 of transparent glue, 5 pairs of four wafers 3 of transparent glue play the effect of protection.The height of block 11 is higher than the height of transparent glue 5, and transparent glue 5 direct collision LGPs cause the distortion of transparent glue 5 when preventing from being installed to the light source luminescent module on the LGP, forms the gap, thereby causes the generation of the phenomenons such as light leak.
Plastic stent 1 is provided with the first pad, be respectively equipped with the second pad on ruddiness wafer 31, green glow wafer 32, blue light wafer 33, the infrared light wafer 34, plastic stent 1 is provided with four the first pads, four the first pads are connected by wire 4 with four the second pads respectively, and ruddiness wafer 31, green glow wafer 32, blue light wafer 33, infrared light wafer 34 are connected with plastic stent 1 by wire 4 respectively.The back side of ruddiness wafer 31, green glow wafer 32, blue light wafer 33, infrared light wafer 34 is connected on the negative pole by elargol 2.Four wires 4 that ruddiness wafer 31, green glow wafer 32, blue light wafer 33, infrared light wafer 34 are connected with plastic stent 1 respectively out are connected respectively on four positive poles afterwards from plastic stent 1 lead-in wire.
Employing plastic stent 1 can reduce cost and reduce volume.The light source luminescent module of prior art is one, support is metallic support, and the pin that is used for the installation wafer on the metallic support needs in one line, has increased a wafer, just need to increase a pin at metallic support, must increase the width of whole illuminating source module.The present invention adopts plastic stent 1, and plastic stent 1 can directly be fixed on the printed circuit board (PCB) 6 by the mode of welding.In the pad of printed circuit board (PCB) 6, stamp tin cream, plastic stent 1 is attached on the tin cream, plastic stent 1 is connected with printed circuit board (PCB) connects and fixing by melting down weldering; And the back side of printed circuit board (PCB) 6 or two sides can be provided for installing the pin of wafer, in the practical application in the situation that limited space, the pin that is used for the connection wafer can also be separately positioned on the back side or the two sides of printed circuit board (PCB) 6, more save the space than metallic support, provide possibility for making narrower light source.
The above describes in detail some embodiments of the present invention by reference to the accompanying drawings, but the invention is not restricted to above-mentioned embodiment, in the ken that those of ordinary skills possess, can also under the prerequisite that does not break away from aim of the present invention, make various variations.
Claims (9)
1. light source luminescent module, it is characterized in that, comprise wafer (3), support and printed circuit board (PCB) (6), be connected with wafer (3) on the described support, described wafer (3) comprises ruddiness wafer (31), green glow wafer (32), blue light wafer (33) and infrared light wafer (34), described support is connected with described printed circuit board (PCB) (6), and described ruddiness wafer (31), green glow wafer (32), blue light wafer (33) and infrared light wafer (34) are positioned at straight line.
2. light source luminescent module according to claim 1 is characterized in that, described ruddiness wafer (31) and described infrared light wafer (34) are positioned at the both sides of described blue light wafer (32) and described green glow wafer (33).
3. light source luminescent module according to claim 2 is characterized in that, described wafer (3) encapsulates with transparent glue (5).
4. light source luminescent module according to claim 3 is characterized in that, described support is plastic stent (1).
5. light source luminescent module according to claim 4 is characterized in that, the material of described plastic stent (1) is Merlon or the styrene copolymerized compound of the third alkene nitrile – fourth two alkene –.
6. light source luminescent module according to claim 5 is characterized in that, the side that described plastic stent (1) does not connect described wafer (3) scribbles the silver lacquer.
7. light source luminescent module according to claim 6, it is characterized in that, described wafer (3) is connected with described plastic stent (1) by elargol (2), described plastic stent (1) is provided with the first pad, described wafer (3) is provided with the second pad, and the first pad of described plastic stent (1) connects by wire (4) with second pad of being connected on the wafer (3).
8. light source luminescent module according to claim 7, it is characterized in that, the side that described plastic stent (1) is connected with described wafer (3) is provided with block (11), described block (11) be positioned at described wafer (3) around, the height of described transparent glue (5) is lower than the height of described block (11).
9. light source luminescent module according to claim 8 is characterized in that, described plastic stent (1) is connected by melting down weldering with described printed circuit board (PCB) (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103408094A CN103363361A (en) | 2013-08-06 | 2013-08-06 | Light source light emitting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103408094A CN103363361A (en) | 2013-08-06 | 2013-08-06 | Light source light emitting module |
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| CN103363361A true CN103363361A (en) | 2013-10-23 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104269490A (en) * | 2014-10-09 | 2015-01-07 | 江苏新广联光电股份有限公司 | Light-emitting diode integrating infrared light and white light |
| CN108302387A (en) * | 2017-09-28 | 2018-07-20 | 敦南科技（无锡）有限公司 | A kind of ultraviolet source gain module |
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Application publication date: 20131023 |