CN104269490A - Light-emitting diode integrating infrared light and white light - Google Patents
Light-emitting diode integrating infrared light and white light Download PDFInfo
- Publication number
- CN104269490A CN104269490A CN201410529851.5A CN201410529851A CN104269490A CN 104269490 A CN104269490 A CN 104269490A CN 201410529851 A CN201410529851 A CN 201410529851A CN 104269490 A CN104269490 A CN 104269490A
- Authority
- CN
- China
- Prior art keywords
- light
- infrared
- led chip
- blue
- led chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims description 3
- 210000004907 gland Anatomy 0.000 claims description 3
- 238000005286 illumination Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract description 2
- 239000003292 glue Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 238000004020 luminiscence type Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- -1 and certainly Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a light-emitting diode integrating infrared light and white light, and belongs to the technical field of LED packaging. According to the technical scheme, the light-emitting diode integrating infrared light and white light comprises a packaging substrate, blue LED chips and infrared LED chips are arranged on the packaging substrate, the blue LED chips and the infrared LED chips are packaged and pressed on and cover the packaging substrate through packaging glue, and fluorescent film which can make the blue LED chips to emit white light is arranged on the blue LED chips. The blue LED chips and the infrared LED chip are arranged on the packaging substrate, only the blue LED chips are covered with the fluorescent film so that the blue LED chips can be used in cooperation with the fluorescent film for emitting white light, the infrared LED chips are not influenced by fluorescent powder when working and generating infrared light, the light emitting distance of the infrared light emitted by the infrared LED chips is ensured, the illumination requirement is met, and the light-emitting diode is simple in structure, safe and reliable.
Description
Technical field
The present invention relates to a kind of encapsulating structure of diode, especially a kind of light-emitting diode of integrated infrared and white light, belongs to the technical field of LED.
Background technology
In existing LED illumination, only have white light LEDs or infrared LED, the technical difficult points for white light LEDs and infrared LED assembled package is white light LEDs is add fluorescent material by blue chip to excite generation white light.And the wavelength of infrared LED can be absorbed by fluorescent material, thus cause the luminescence of infrared LED distance greatly to reduce, especially in the light filling field of monitoring at night, infrared LED is luminous apart from time too short, cannot reach the effect of illumination light filling.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of light-emitting diode of integrated infrared and white light, its encapsulating structure is simple, can emit white light separately and infrared, improves infraluminescence distance, safe and reliable.
According to technical scheme provided by the invention, the light-emitting diode of described integrated infrared and white light, comprises base plate for packaging; Described base plate for packaging is provided with blue-light LED chip and infrared LED chip, described blue-light LED chip and infrared LED chip encapsulate gland on base plate for packaging by packaging plastic, blue-light LED chip are arranged so that blue-light LED chip can send the fluorescent film of white light.
Described base plate for packaging comprises ceramic substrate.
The outside of described blue-light LED chip and infrared LED chip all arranges symmetrical pad, and blue-light LED chip, infrared LED chip are electrically connected with corresponding pad by connecting line
Advantage of the present invention: base plate for packaging is arranged blue-light LED chip and infrared LED chip, only cover on blue-light LED chip and fluorescent film is set, to coordinate with fluorescent film to make blue-light LED chip and send white light, when infrared LED chip operation produces infrared light, not by the impact of fluorescent material, guarantee the luminescence distance of the infrared light that infrared LED chip sends, meet lighting requirement, structure is simple, safe and reliable.
Accompanying drawing explanation
Fig. 1 is encapsulating structure schematic diagram of the present invention.
Fig. 2 is blue-light LED chip of the present invention, the schematic diagram of infrared LED chip on base plate for packaging.
Description of reference numerals: 1-base plate for packaging, 2-packaging plastic, 3-infrared LED chip, 4-fluorescent film, 5-blue-light LED chip and 6-pad.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
As depicted in figs. 1 and 2: in order to infrared and white light effectively being encapsulated, improve infrared luminescence distance, meet instructions for use, the present invention includes base plate for packaging 1; Described base plate for packaging 1 is provided with blue-light LED chip 5 and infrared LED chip 3, described blue-light LED chip 5 encapsulates gland with infrared LED chip 3 on base plate for packaging 1 by packaging plastic 2, blue-light LED chip 5 is arranged so that blue-light LED chip 5 can send the fluorescent film 4 of white light.
Particularly, described base plate for packaging 1 comprises ceramic substrate, and certainly, base plate for packaging 1 also can adopt other version.Described blue-light LED chip 5 all arranges symmetrical pad 6 with the outside of infrared LED chip 3, and blue-light LED chip 5, infrared LED chip 3 are electrically connected with corresponding pad 6 by connecting line.Described pad 6 is fixed on base plate for packaging 1, and two pads 6 outside blue-light LED chip 5 are respectively as the positive terminal of blue-light LED chip 5 and negative pole end, and two pads 6 outside infrared LED chip 3 are the positive terminal of infrared LED chips 3 and negative pole end respectively.In the embodiment of the present invention, infrared LED chip 3 and blue-light LED chip 5 all adopt existing conventional version, and concrete structure, known by the art personnel, repeats no more herein.
In the embodiment of the present invention, fluorescent film 4 can adopt the mixture of fluorescent material and silica gel, and fluorescent material and silica gel are sprayed according to after the mass ratio mixing of 1:10, thickness is 0.1-1MM.Certainly, fluorescent film 4 also can pass through to apply silica gel on blue-light LED chip 5, and then the mode be arranged on silica gel is formed by fluorescent material.Blue-light LED chip 5, when live line work, produces white light by exciting yellow fluorescent powder.Packaging plastic 2 is also for encapsulating conventional silica gel.
Blue-light LED chip 5 of the present invention is connected with external power source respectively by two pads 6 of outside correspondence, and infrared LED chip 3 is also connected with external power source respectively by two pads 6 of outside correspondence.When blue-light LED chip 5 switches on power work, the blue light that blue-light LED chip 5 sends can produce white light after fluorescent film 4.When infrared LED chip 3 is when switching on power work, the infrared light that infrared LED chip 3 sends directly penetrates through packaging plastic 2.Owing to only arranging fluorescent film 4 on blue-light LED chip 5, the infrared ray that infrared LED chip 3 is operationally produced by the impact of fluorescent material, can meet send white light time, also can obtain required infrared light.When lighting separately infrared LED chip 3, the infraluminescence scope of light-emitting diode can be made can to arrive the distance of 20m, effectively meeting the requirement of monitoring at night.
Claims (3)
1. a light-emitting diode for integrated infrared and white light, comprises base plate for packaging (1); It is characterized in that: described base plate for packaging (1) is provided with blue-light LED chip (5) and infrared LED chip (3), described blue-light LED chip (5) and infrared LED chip (3) encapsulate gland on base plate for packaging (1) by packaging plastic (2), blue-light LED chip (5) are arranged so that blue-light LED chip (5) can send the fluorescent film (4) of white light.
2. the light-emitting diode of integrated infrared and white light according to claim 1, is characterized in that: described base plate for packaging (1) comprises ceramic substrate.
3. the light-emitting diode of integrated infrared and white light according to claim 1, it is characterized in that: described blue-light LED chip (5) all arranges symmetrical pad (6) with the outside of infrared LED chip (3), and blue-light LED chip (5), infrared LED chip (3) are electrically connected with corresponding pad (6) by connecting line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410529851.5A CN104269490A (en) | 2014-10-09 | 2014-10-09 | Light-emitting diode integrating infrared light and white light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410529851.5A CN104269490A (en) | 2014-10-09 | 2014-10-09 | Light-emitting diode integrating infrared light and white light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104269490A true CN104269490A (en) | 2015-01-07 |
Family
ID=52160996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410529851.5A Pending CN104269490A (en) | 2014-10-09 | 2014-10-09 | Light-emitting diode integrating infrared light and white light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104269490A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346591A (en) * | 2018-09-29 | 2019-02-15 | 国红（深圳）光电科技有限公司 | Optical devices |
| CN110970541A (en) * | 2018-09-29 | 2020-04-07 | 有研稀土新材料股份有限公司 | Semiconductor light source and optical device prepared by same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6806981B1 (en) * | 1999-10-12 | 2004-10-19 | Fuji Photo Film Co., Ltd. | Image reading apparatus |
| CN201741723U (en) * | 2010-06-29 | 2011-02-09 | 李军 | White-infrared double-color super flux LED (light-emitting diode) support structure and LED lamp |
| CN103210490A (en) * | 2010-08-27 | 2013-07-17 | 夸克星有限责任公司 | Solid state light sheet or strip for general illumination |
| CN103363361A (en) * | 2013-08-06 | 2013-10-23 | 敦南科技（无锡）有限公司 | Light source light emitting module |
| CN203823597U (en) * | 2014-05-22 | 2014-09-10 | 厦门多彩光电子科技有限公司 | Circular COB (chip on board) encapsulated LED lamp for plant growth |
-
2014
- 2014-10-09 CN CN201410529851.5A patent/CN104269490A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6806981B1 (en) * | 1999-10-12 | 2004-10-19 | Fuji Photo Film Co., Ltd. | Image reading apparatus |
| CN201741723U (en) * | 2010-06-29 | 2011-02-09 | 李军 | White-infrared double-color super flux LED (light-emitting diode) support structure and LED lamp |
| CN103210490A (en) * | 2010-08-27 | 2013-07-17 | 夸克星有限责任公司 | Solid state light sheet or strip for general illumination |
| CN103363361A (en) * | 2013-08-06 | 2013-10-23 | 敦南科技（无锡）有限公司 | Light source light emitting module |
| CN203823597U (en) * | 2014-05-22 | 2014-09-10 | 厦门多彩光电子科技有限公司 | Circular COB (chip on board) encapsulated LED lamp for plant growth |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346591A (en) * | 2018-09-29 | 2019-02-15 | 国红（深圳）光电科技有限公司 | Optical devices |
| CN110970541A (en) * | 2018-09-29 | 2020-04-07 | 有研稀土新材料股份有限公司 | Semiconductor light source and optical device prepared by same |
| CN110970541B (en) * | 2018-09-29 | 2023-04-21 | 有研稀土新材料股份有限公司 | Semiconductor light source and optical device prepared by same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150107 |
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| RJ01 | Rejection of invention patent application after publication |