CN203118989U - Junction temperature controllable efficient light emitting diode (LED) package - Google Patents
Junction temperature controllable efficient light emitting diode (LED) package Download PDFInfo
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- CN203118989U CN203118989U CN 201320101067 CN201320101067U CN203118989U CN 203118989 U CN203118989 U CN 203118989U CN 201320101067 CN201320101067 CN 201320101067 CN 201320101067 U CN201320101067 U CN 201320101067U CN 203118989 U CN203118989 U CN 203118989U
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- led
- junction temperature
- package
- light emitting
- emitting diode
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Abstract
The utility model discloses a junction temperature controllable efficient light emitting diode (LED) package, and relates to the technical field of LED lighting technical field. The junction temperature controllable efficient LED package comprises an LED support, an LED chip, a temperature sensor, a fluorescent powder layer and a rubber layer. The temperature sensor is additionally arranged in the LED support so that temperature inside a lens of an LED can be fed back in real time, at last adjustment of working current can be achieved to enable the working current of a blue-ray LED chip always not to exceed a limit safe value, and the service life of the LED can be guaranteed.
Description
Technical field
The utility model relates to White-light LED package structure.
Background technology
The fluorescent material that white light LEDs encapsulation is at present both at home and abroad used is the YAG bloom, and the method that generally adopts in the encapsulation process of high-power LED light source is directly fluorescent material to be coated on the chip by mixing professional glue spraying or putting down after finishing the encapsulation of chip.But since a fatal shortcoming of YAG fluorescent material be exactly when chip temperature is too high when its luminous efficiency decay can appear, spend as surpassing 65 degree or 70, decaying significantly can appear in the luminous efficiency of fluorescent material; The 2nd, because the easy moisture absorption of YAG fluorescent material, if be directly exposed in the air, can make fluorescent material absorb airborne moisture and deliquescence can make luminous efficiency decay significantly equally, have a strong impact on the life-span of LED.For this reason, in order to overcome the problems referred to above, it is very significant proposing new improvement project.
Summary of the invention
In order to solve the ubiquitous problem of present LED, a kind of encapsulating structure of LED efficiently is provided, can improve white light LEDs luminous efficiency, reduce the wastage.
The technical scheme that the utility model is taked is: a kind of efficient LED encapsulation of test by method of controllable junction temperature, this encapsulating structure comprise led support, led chip, temperature sensor, phosphor powder layer, silica gel protected layer; Led chip and temperature sensor are in led support bowl cup; The phosphor powder layer of this encapsulating structure is on led chip, and outermost layer is silica gel protected layer.In LED bowl cup, increase temperature sensor, the lens temperature inside of LED can be fed back in real time, finally its operating current is realized adjusting, make the blue-light LED chip operating current be no more than limit safety value all the time, make the blue-light LED chip can operate as normal and can not reduce its useful life.
Description of drawings
Below in conjunction with accompanying drawing the utility model is further specified.
Accompanying drawing 1 is structural representation of the present utility model.
Embodiment
As shown in Figure 1: the utility model is by increasing temperature sensor in LED bowl cup, the lens temperature inside of LED can be fed back in real time, finally its operating current is realized adjusting, all the time make the blue-light LED chip operating current be no more than limit safety value, make the blue-light LED chip can operate as normal and can not reduce its useful life.
As shown in Figure 1: the 1.LED support; 2 temperature sensors.; 3. led chip; 4. phosphor powder layer; 5. silica gel protected layer.
Claims (2)
1. the efficient LED of test by method of controllable junction temperature encapsulation is characterized in that: this encapsulating structure comprises led support, led chip, temperature sensor, phosphor powder layer, silica gel protected layer.
2. the efficient LED of a kind of test by method of controllable junction temperature according to claim 1 encapsulation is characterized in that, led chip (3) and temperature sensor (2) are in led support (1) bowl cup.
3. the efficient LED of a kind of test by method of controllable junction temperature according to claim 1 encapsulation is characterized in that: the phosphor powder layer of this encapsulating structure (4) is on led chip (3), and outermost layer is silica gel protected layer (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320101067 CN203118989U (en) | 2013-03-06 | 2013-03-06 | Junction temperature controllable efficient light emitting diode (LED) package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320101067 CN203118989U (en) | 2013-03-06 | 2013-03-06 | Junction temperature controllable efficient light emitting diode (LED) package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203118989U true CN203118989U (en) | 2013-08-07 |
Family
ID=48899308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320101067 Expired - Lifetime CN203118989U (en) | 2013-03-06 | 2013-03-06 | Junction temperature controllable efficient light emitting diode (LED) package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203118989U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107819057A (en) * | 2017-11-01 | 2018-03-20 | 江苏稳润光电科技有限公司 | A kind of controllable led encapsulating structures of junction temperature |
-
2013
- 2013-03-06 CN CN 201320101067 patent/CN203118989U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107819057A (en) * | 2017-11-01 | 2018-03-20 | 江苏稳润光电科技有限公司 | A kind of controllable led encapsulating structures of junction temperature |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHENGZHOU SENYUAN NEW ENERGY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HENAN SENYUAN ELECTRIC CO., LTD. Effective date: 20131119 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 461500 XUCHANG, HENAN PROVINCE TO: 450000 ZHENGZHOU, HENAN PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20131119 Address after: 450000, Zhengzhou economic and Technological Development Zone, Henan Province, Third Avenue, north of longitude six South Patentee after: ZHENGZHOU SENYUAN NEW ENERGY TECHNOLOGY Co.,Ltd. Address before: Changge City, Xuchang City, Henan province 461500 Weiwu Road, South West Patentee before: HENAN SENYUAN ELECTRIC Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130807 |