CN201964166U

CN201964166U - LED lamp adopting fluorescent powder isolation and encapsulation technology

Info

Publication number: CN201964166U
Application number: CN2010206265200U
Authority: CN
Inventors: 熊海燕; 梁小东; 刘峰
Original assignee: BEIJING ZHENGSHIJI ENERGY TECHNOLOGY Co Ltd
Current assignee: BEIJING ZHENGSHIJI ENERGY TECHNOLOGY Co Ltd
Priority date: 2010-11-26
Filing date: 2010-11-26
Publication date: 2011-09-07
Anticipated expiration: 2020-11-26

Abstract

The utility model relates to an LED lamp adopting the fluorescent powder isolation and encapsulation technology. An LED chip is encapsulated according to the original technology, but the fluorescent powder is not added, and an isolation shield with the inner side coated with the fluorescent powder is used for covering the surface of the encapsulated LED, therefore, the isolation of the fluorescent powder and the LED is completed, the service life of the isolated and encapsulated LED using the fluorescent powder is prolonged, and the light-emitting efficiency of the LED is also greatly improved.

Description

A kind of LED lamp that uses the fluorescent material isolation technology

1. technical field

The utility model relates to the new packaging technology that a kind of LED lamp fluorescent material is isolated, and belongs to field of photoelectric technology.

2. background technology

Employed on the market at present LED lamp encapsulation technology situation is:

1. all at present method for packing all are that yellow fluorescent powder (YAG) and epoxy resin are mixed by different proportion, directly put on the led chip of blue light-emitting, are heating and curing again.This common way advantage is an economical with materials, and shortcoming is to be unfavorable for that heat radiation, fluorescent material also can wear out.Because epoxy resin and fluorescent material are not the good materials of heat conduction, and the parcel entire chip will influence heat radiation.Adopting this method for manufacturing LED lighting obviously is not best scheme.

2, the fluorescence pulvis is coated on the led chip of blue light-emitting, the thickness of freely controlling the fluorescence pulvis increases the toning temperature, the encapsulation of recycle silicon glue.

3, adopt blue-light LED chip and yellow fluorescent powder, obtain white light by blue light and the complementation of gold-tinted dichromatism, or cooperate redness and green emitting phosphor with blue-light LED chip, the blue light that is sent by chip, the ruddiness and green glow three mixture of colours that fluorescent material sends obtain white light.

After the drawback of existing encapsulation technology is the LED heating, the fluorescent material temperature increases, produce on the color and drift about, fluorescent material parcel entire chip will influence heat radiation simultaneously, fluorescent material high temperature ageing led chip reacts, cause the light transmittance of reduction of led chip luminous efficiency and fluorescent material to reduce, also shortened the service life of led chip.

3. summary of the invention

The purpose of this utility model is the service life that prolongs the LED lamp, avoids fluorescent material generation color drift and improves the photochromic uniformity, reduces hot spot and dazzle.

The utility model relates to a kind of LED lamp that adopts fluorescent material insulation package technology, and led chip by original technology encapsulation, is not coated with fluorescent material but do not add, and the cage that the inboard scribbles fluorescent material is added a cover on the LED surface after encapsulation, to finish the isolation of fluorescent material and LED.

Further, described LED lamp is the LED fluorescent lamp, and led chip is fixed on the metal of growing on the glass tube.

Further, described LED lamp is the LED bulb, and led chip is fixed on the metal of growing on the glass heat conduction wick.

By adopting the method for fluorescent material separate package, just can avoid problems such as above-mentioned color drift and the reduction of LED luminous efficiency.

4. description of drawings

Figure one is the structural representation of the LED fluorescent lamp of the utility model embodiment

Figure two is the structural representation of the LED bulb of the utility model embodiment

5. the specific embodiment

For making the purpose of this utility model, technical scheme and advantage are clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the utility model is further described.

1: the method that adopts the fluorescent material insulation package

1, led chip is encapsulated by original technology, be not coated with fluorescent material but do not add, the cage that the inboard scribbles fluorescent material is added a cover on LED surface after encapsulation, so just finished the isolation of fluorescent material and LED, adopted to prolong the luminous efficiency that has also improved it greatly the service life of the LED of fluorescent material separate package.

2, led chip is encapsulated by original technology, be not coated with fluorescent material but do not add, LED interior surface after encapsulation is coated with fluorescent material, has so just finished the isolation of fluorescent material and LED, adopts to prolong the luminous efficiency that has also improved it greatly the service life of the LED of fluorescent material separate package.

2: the scheme of insulation package

1, be packaged together LED is integrated, and then above add a cover the cloche that the inboard scribbles fluorescent material and just can realize.

2, with the integrated size that needs with fluorescent tube that is encapsulated in of LED, be installed in the inboard then and scribble in the fluorescent material glass tube.Just can obtain the LED fluorescent tube of the illuminating effect the same with traditional fluorescent lamp.Adopt integrated packaged LED on glass so just to use glass as heat conduction and radiator, LED fluorescent lamp utilization inboard scribbles the fluorescent material glass tube and dispels the heat, as shown in Figure 1.

3, on the integrated wick that is encapsulated in glass, be installed in the inboard then and scribble fluorescent material Glass lamp bubble-cap LED.Just can realize the LED lamp of LED lamp and the traditional the same profile of incandescent lamp, as shown in Figure 2.

Adopt integrated packaged LED on glass so just to use glass as heat conduction and radiator, lamp utilization inboard scribbles fluorescent material Glass lamp bubble-cap and dispels the heat.

Device described in the utility model not only can be used for LED; also can be used to the place that other can be suitable for; should be understood that; the above only is a preferred implementation method of the present utility model; for the person of ordinary skill of the art; under the prerequisite that does not break away from the utility model principle, can also make some improvement and variation, these improvement and variation also should be considered as protection domain of the present utility model.

Claims

1. LED lamp that adopts fluorescent material insulation package technology is characterized in that: led chip by original technology encapsulation, is not coated with fluorescent material but do not add, and the cage that the inboard scribbles fluorescent material is added a cover on the LED surface after encapsulation, to finish the isolation of fluorescent material and LED.

2. LED lamp as claimed in claim 1 is characterized in that: described LED lamp is the LED fluorescent lamp, and led chip is fixed on the metal of growing on the glass tube.

3. LED lamp as claimed in claim 1 is characterized in that: described LED lamp is the LED bulb, and led chip is fixed on the metal of growing on the glass heat conduction wick.