CN204289518U - The glue sealing structure of luminescence chip - Google Patents
The glue sealing structure of luminescence chip Download PDFInfo
- Publication number
- CN204289518U CN204289518U CN201420779172.9U CN201420779172U CN204289518U CN 204289518 U CN204289518 U CN 204289518U CN 201420779172 U CN201420779172 U CN 201420779172U CN 204289518 U CN204289518 U CN 204289518U
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- CN
- China
- Prior art keywords
- luminescence chip
- sealing structure
- adhesive tape
- transparent adhesive
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a kind of glue sealing structure of luminescence chip, comprises substrate, and described substrate is provided with the luminescence chip of arrayed, described luminescence chip surface encapsulation transparent adhesive tape, between the luminescence chip described in adjacent every two, encapsulate black glue.After have employed said structure, be separated by by black glue, can ensure can not interfere between adjacent luminescence chip, increase illuminating effect, also greatly will increase illuminating effect by the interpolation of fluorescent grain.
Description
Technical field
The utility model relates to illumination chip sealing technical field, especially relates to a kind of glue sealing structure of luminescence chip.
Background technology
LED(Light Emitting Diode, light-emitting diodes) chip is a kind of solid-state semiconductor device, it directly can be converted into light electricity, the heart of LED is the wafer of a semiconductor, one end of wafer is attached on a support, one end is negative pole, and the other end connects the positive pole of power supply, makes whole wafer by epoxy encapsulation.The sealing technology of existing batch production, normally be encapsulated by the luminescence chip of arrayed, cut as required afterwards, this technology is not owing to stopping between luminescence chip, light between adjacent luminescence chip is easy to produce interferes, and greatly reduces illuminating effect.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of glue sealing structure of the luminescence chip do not interfered each other.
The technical scheme in the invention for solving the technical problem is: a kind of glue sealing structure of luminescence chip, comprise substrate, described substrate is provided with the luminescence chip of arrayed, described luminescence chip surface encapsulation transparent adhesive tape, encapsulates black glue between the luminescence chip described in adjacent every two.
Further, more remarkable in order to not interfere effect, the height of described black glue is higher than the height of transparent adhesive tape.
Further, in order to increase the illuminating effect of luminescence chip, described transparent adhesive tape inner homogeneous distribution fluorescent grain.
Concrete further, the surface of described transparent adhesive tape is curved.
Concrete further, described transparent adhesive tape in quadrangle, circle or triangle.
The beneficial effects of the utility model are: after have employed said structure, are separated by by black glue, can ensure can not interfere between adjacent luminescence chip, increase illuminating effect, also greatly will increase illuminating effect by the interpolation of fluorescent grain.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1, substrate; 2, black glue; 3, transparent adhesive tape; 4, luminescence chip.
Embodiment
Below in conjunction with accompanying drawing, the utility model is explained in detail.
A kind of glue sealing structure of luminescence chip as shown in Figure 1, comprise substrate 1, described substrate 1 is provided with the luminescence chip 4 of arrayed, described luminescence chip 4 surface encapsulation transparent adhesive tape 3, black glue 2 is encapsulated between the luminescence chip 4 described in adjacent every two, the Main Function of black glue 2 is separated by the light of adjacent luminescence chip 4, in order to avoid cause interference, the height of described black glue 2 is higher than the height of transparent adhesive tape 3, further can improve the effect preventing from interfering, described transparent adhesive tape 3 inner homogeneous distribution fluorescent grain, be radiated on fluorescent grain by the light of luminescence chip 4, promote illuminating effect, the surface of described transparent adhesive tape 3 is curved, when making, the various shapes such as quadrangle, circle or triangle can be made into as required by transparent adhesive tape 3.
Black glue 2, a little more than the height of transparent adhesive tape 3, can improve the effect preventing from interfering, improve illuminating effect.
It is emphasized that: be only preferred embodiment of the present utility model above, not any pro forma restriction is done to the utility model, every above embodiment is done according to technical spirit of the present utility model any simple modification, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (5)
1. the glue sealing structure of a luminescence chip, comprise substrate (1), described substrate (1) is provided with the luminescence chip (4) of arrayed, it is characterized in that, described luminescence chip (4) surface encapsulation transparent adhesive tape (3), encapsulates black glue (2) between the luminescence chip (4) described in adjacent every two.
2. the glue sealing structure of luminescence chip according to claim 1, is characterized in that, the height of described black glue (2) is higher than the height of transparent adhesive tape (3).
3. the glue sealing structure of luminescence chip according to claim 1, is characterized in that, described transparent adhesive tape (3) inner homogeneous distribution fluorescent grain.
4. the glue sealing structure of luminescence chip according to claim 1, is characterized in that, the surface of described transparent adhesive tape (3) is curved.
5. the glue sealing structure of luminescence chip according to claim 1, is characterized in that, described transparent adhesive tape (3) in quadrangle, circle or triangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420779172.9U CN204289518U (en) | 2014-12-12 | 2014-12-12 | The glue sealing structure of luminescence chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420779172.9U CN204289518U (en) | 2014-12-12 | 2014-12-12 | The glue sealing structure of luminescence chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204289518U true CN204289518U (en) | 2015-04-22 |
Family
ID=52872650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420779172.9U Expired - Fee Related CN204289518U (en) | 2014-12-12 | 2014-12-12 | The glue sealing structure of luminescence chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204289518U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107869663A (en) * | 2017-11-16 | 2018-04-03 | 广东豪泰照明科技有限公司 | A kind of LED lamp waterproof antifog structure |
| CN109449148A (en) * | 2018-09-25 | 2019-03-08 | 深圳市奥拓电子股份有限公司 | LED encapsulation structure and LED display system |
-
2014
- 2014-12-12 CN CN201420779172.9U patent/CN204289518U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107869663A (en) * | 2017-11-16 | 2018-04-03 | 广东豪泰照明科技有限公司 | A kind of LED lamp waterproof antifog structure |
| CN109449148A (en) * | 2018-09-25 | 2019-03-08 | 深圳市奥拓电子股份有限公司 | LED encapsulation structure and LED display system |
| CN109449148B (en) * | 2018-09-25 | 2020-10-16 | 深圳市奥拓电子股份有限公司 | LED packaging structure and LED display system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215000 room 8, Song Jia Gang Road, Zhou Shi Town, Kunshan, Suzhou, Jiangsu, 8 Patentee after: Suzhou Yi nite Electronics Industry Co., Ltd. Address before: 215316 Yushan Town, Kunshan City, Suzhou, Jiangsu, No. 58, Chengbei Huayuan Road Patentee before: KUNSHAN YINAITE PRECISION MOLD CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20201212 |