CN204857773U - Vertical packaging body of full -color nitride -based LED chip - Google Patents
Vertical packaging body of full -color nitride -based LED chip Download PDFInfo
- Publication number
- CN204857773U CN204857773U CN201520489338.8U CN201520489338U CN204857773U CN 204857773 U CN204857773 U CN 204857773U CN 201520489338 U CN201520489338 U CN 201520489338U CN 204857773 U CN204857773 U CN 204857773U
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- flexible substrate
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- led chip
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- base led
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 150000004767 nitrides Chemical class 0.000 title abstract 7
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910002601 GaN Inorganic materials 0.000 claims description 57
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 57
- 238000005538 encapsulation Methods 0.000 abstract description 6
- 238000009826 distribution Methods 0.000 abstract description 4
- 238000000605 extraction Methods 0.000 abstract description 4
- 238000012536 packaging technology Methods 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 238000012856 packing Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model provides a vertical packaging body of full -color nitride -based LED chip, including flexible substrate, one or many nitride -based LED chips, many strip electrodes circuit and encapsulation part, one or the flip -chip of many nitride -based LED chips fixed to the flexible substrate on and many strip electrodes circuit fixed to the flexible substrate on, wherein every nitride -based LED chip all is connected to two strip electrode circuit, many strip electrodes circuit is all perpendicular with flexible substrate base, encapsulation part covers on one or many nitride -based LED chips and many strip electrodes circuit and solidification to the flexible substrate completely, flexible substrate is vertical cylindric. The utility model discloses with the help of any auxiliary stay object, the vertical encapsulation of nitride -based LED chip has not been realized for the packaging efficiency improves greatly, and packaging technology simplifies, the light energy that makes LED chip active area send in addition enough follow the chip just, back outgoing, send full -color light source moreover, improved the extraction efficiency of LED device greatly, also improved its far -field distribution simultaneously greatly.
Description
Technical field
The utility model belongs to technical field of semiconductors, refers to the vertical packaging body of a kind of full-color galliumnitride base LED chip especially.
Background technology
Because LED has the advantage such as energy-saving and environmental protection, life-span length, after the coming years, LED likely replaces the traditional lighting such as incandescent lamp, fluorescent lamp light fixture and enters huge numbers of families.The method for packing of current LED is mainly paster type encapsulation, and namely LED chip level is attached on support.The light that this method for packing makes active area send can only from front outgoing, which increases the probability that light is absorbed by metal electrode, and being limited in light in LED chip can at the interface roundtrip of gallium nitride material and outside air, thus absorbed by gallium nitride material, greatly have impact on the extraction efficiency of device, also can have influence on the reliability of device simultaneously.Simultaneously this method for packing also can affect the far-field distribution of LED light source greatly, thus the application of restriction LED in backlight etc.
Utility model content
The vertical packaging body of a kind of full-color galliumnitride base LED chip is provided in order to overcome the problems referred to above the utility model, comprise flexible substrate, one or many galliumnitride base LED chips, many strip electrodes circuit and packed part, one or many galliumnitride base LED chip upside-down mountings are fixed in flexible substrate and many strip electrodes circuit is fixed in flexible substrate, wherein every galliumnitride base LED chip is all connected to two strip electrode circuit, many strip electrodes circuit all with flexible substrate base vertical, packed part covers one or many galliumnitride base LED chips and many strip electrodes circuit completely and is cured in described flexible substrate, flexible substrate is vertical cylinder shape.
In the embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip disclosed in the utility model, one or many galliumnitride base LED chips comprise red light chips and/or green glow chip and/or blue chip.
In the embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip disclosed in the utility model, the wavelength of red light chips is 600-800nm, and the wavelength of green glow chip is 500-600nm, and the wavelength of blue chip is 400-500nm.
In the embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip disclosed in the utility model, flexible substrate is flexible and transparent silica gel, polyimides or flexiplast.
In the embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip disclosed in the utility model, many strip electrodes circuit can evaporation or printing or spray printing in flexible substrate.
In an embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip disclosed in the utility model, flexible substrate is provided with 3 galliumnitride base LED chips, is respectively red light chips, green glow chip and blue chip.
In an embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip disclosed in the utility model, flexible substrate is vertical triangulation shape, and each side of vertical triangulation shape is provided with a galliumnitride base LED chip and two strip electrode circuit.
Beneficial effect
The purpose of this utility model is to provide a kind of full-color galliumnitride base LED chip vertical packaging body, not by any supplemental support object, achieves the vertical encapsulation of galliumnitride base LED chip.Packaging efficiency is improved greatly, and packaging technology simplifies, and is conducive to the universal of semiconductor lighting and development.
The light enabling LED chip active area send in addition from the front and back outgoing of chip, and sends full-color light source, substantially increases the extraction efficiency of LED component, also substantially improves its far-field distribution simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of an embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip.
Fig. 2 is the packed front structural representation of the vertical packaging body of a kind of full-color galliumnitride base LED chip.
Fig. 3 is the structural representation of another embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, but not as to restriction of the present utility model.
Fig. 1 is the structural representation of an embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip.As shown in Figure 1, the utility model provides the vertical packaging body of a kind of full-color galliumnitride base LED chip, comprise flexible substrate (01), one or many galliumnitride base LED chips (02), many strip electrodes circuit (03) and packed part (04), one or the upside-down mounting of many galliumnitride base LED chips (02) are fixed to the upper and many strip electrodes circuit (03) of flexible substrate (01) and are fixed in flexible substrate (01), wherein every galliumnitride base LED chip (02) is all connected to two strip electrode circuit (03), many strip electrodes circuit (03) is all vertical with flexible substrate (01) limit, packed part (04) covers one or many galliumnitride base LED chips (02) and many strip electrodes circuit (03) completely and is cured in described flexible substrate (01), flexible substrate (01) is vertical cylinder shape.
The manufacture method of the vertical packaging body of above-mentioned a kind of full-color galliumnitride base LED chip is as follows:
First, in flexible substrate (01) upper making many strip electrodes circuit (03), many strip electrodes circuit (03) and flexible substrate (01) base vertical, secondly, upside-down mounting one or many galliumnitride base LED chips (02) are fixed on in flexible substrate (01), and connect respectively at two strip electrode circuit (03), Fig. 2 is the packed front structural representation of the vertical packaging body of a kind of full-color galliumnitride base LED chip, as shown in Figure 2.After chip die bond, with transparent adhesive tape, one or many galliumnitride base LED chips (02) are covered completely, and form packed part (04) after solidification in baking oven; Finally, flexible substrate (01) is rolled into tubular together with one or many galliumnitride base LED chips (02), and stick with glue in junction and connect, complete vertical encapsulation, light one or many galliumnitride base LED chips (02) by many strip electrodes circuit (03).
In the embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip disclosed in the utility model, one or many galliumnitride base LED chips (02) comprise red light chips and/or green glow chip and/or blue chip, wherein, the wavelength of red light chips is 600-800nm, the wavelength of green glow chip is 500-600nm, the wavelength of blue chip is 400-500nm, regulates one or many galliumnitride base LED chips (02) to regulate so respectively to send full-color.
In the embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip disclosed in the utility model, flexible substrate (01) is flexible and transparent silica gel, polyimides or flexiplast, packed part (04) is transparent adhesive tape in addition, the light enabling galliumnitride base LED chip (02) active area send like this is from its front and back outgoing, substantially increase the extraction efficiency of LED component, also substantially improve its far-field distribution simultaneously.
In the embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip disclosed in the utility model, many strip electrodes circuit (03) can evaporation or printing or spray printing in flexible substrate (01).
Fig. 3 is the structural representation of another embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip.As shown in Figure 3, in an embodiment of the vertical packaging body of a kind of full-color galliumnitride base LED chip disclosed in the utility model, flexible substrate (01) is provided with 3 galliumnitride base LED chips (02), is respectively red light chips, green glow chip and blue chip.Wherein, flexible substrate (01) is vertical triangulation shape, and each side of vertical triangulation shape is provided with a galliumnitride base LED chip (02) and two strip electrode circuit (03).
The above is only the utility model preferably execution mode, not does any pro forma restriction to the technical solution of the utility model.Everyly according to technical spirit of the present utility model, any simple modification is done to above embodiment, variation and modification, all fall into protection range of the present utility model.
Claims (5)
1. the vertical packaging body of full-color galliumnitride base LED chip, comprise flexible substrate, one or many galliumnitride base LED chips, many strip electrodes circuit and packed part, described one or many galliumnitride base LED chip upside-down mountings are fixed in described flexible substrate and described many strip electrodes circuit is fixed in described flexible substrate, wherein every galliumnitride base LED chip is all connected to two strip electrode circuit, described many strip electrodes circuit all with described flexible substrate base vertical, described packed part covers described one or many galliumnitride base LED chips and described many strip electrodes circuit completely and is cured in described flexible substrate, described flexible substrate is vertical cylinder shape.
2. the vertical packaging body of the full-color galliumnitride base LED chip of one according to claim 1, is characterized in that: described one or many galliumnitride base LED chips comprise red light chips and/or green glow chip and/or blue chip.
3. the vertical packaging body of the full-color galliumnitride base LED chip of one according to claim 2, is characterized in that: the wavelength of described red light chips is 600-800nm, and the wavelength of described green glow chip is 500-600nm, and the wavelength of described blue chip is 400-500nm.
4. the vertical packaging body of the full-color galliumnitride base LED chip of one according to claim 1, is characterized in that: described flexible substrate is provided with 3 galliumnitride base LED chips, is respectively red light chips, green glow chip and blue chip.
5. the vertical packaging body of the full-color galliumnitride base LED chip of one according to claim 4, is characterized in that: described flexible substrate is vertical triangulation shape, and each side of described vertical triangulation shape is provided with a galliumnitride base LED chip and two strip electrode circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520489338.8U CN204857773U (en) | 2015-07-09 | 2015-07-09 | Vertical packaging body of full -color nitride -based LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520489338.8U CN204857773U (en) | 2015-07-09 | 2015-07-09 | Vertical packaging body of full -color nitride -based LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204857773U true CN204857773U (en) | 2015-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520489338.8U Expired - Fee Related CN204857773U (en) | 2015-07-09 | 2015-07-09 | Vertical packaging body of full -color nitride -based LED chip |
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| CN (1) | CN204857773U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133808A (en) * | 2020-08-05 | 2020-12-25 | 清华大学无锡应用技术研究院 | Vertical packaging structure of full-color gallium nitride-based chip |
| CN112133809A (en) * | 2020-09-06 | 2020-12-25 | 杭州金知科技有限公司 | Vertical packaging structure of full-color gallium nitride-based chip |
-
2015
- 2015-07-09 CN CN201520489338.8U patent/CN204857773U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133808A (en) * | 2020-08-05 | 2020-12-25 | 清华大学无锡应用技术研究院 | Vertical packaging structure of full-color gallium nitride-based chip |
| CN112133808B (en) * | 2020-08-05 | 2022-03-11 | 清华大学无锡应用技术研究院 | Vertical packaging structure of full-color gallium nitride-based chip |
| CN112133809A (en) * | 2020-09-06 | 2020-12-25 | 杭州金知科技有限公司 | Vertical packaging structure of full-color gallium nitride-based chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151209 Termination date: 20210709 |
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| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Patent of Mingde Star (Beijing) Technology Co., Ltd. The person in charge Document name: Patent termination notice |