CN207353246U - A kind of COB packaged light sources - Google Patents
A kind of COB packaged light sources Download PDFInfo
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- CN207353246U CN207353246U CN201721410346.4U CN201721410346U CN207353246U CN 207353246 U CN207353246 U CN 207353246U CN 201721410346 U CN201721410346 U CN 201721410346U CN 207353246 U CN207353246 U CN 207353246U
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- die bond
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- glue
- light sources
- bond glue
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Abstract
LED light source technical field is the utility model is related to, discloses a kind of COB packaged light sources, solves the problems, such as that current COB packaged light sources light efficiency is low.The utility model includes LED wafer array, die bond glue-line and aluminum substrate, and LED wafer array is arranged on the upper surface of aluminum substrate, and die bond glue-line glue is covered in the surface of LED wafer array；Die bond glue-line includes optical cement and fluorescent powder, and optical cement is evenly distributed in die bond glue-line, and fluorescent powder is deposited in the bottom of die bond glue-line.The utility model is suitable for the illuminators such as square, ocean, road, searchlighting.
Description
Technical field
LED light source technical field is the utility model is related to, more particularly to a kind of COB packaged light sources.
Background technology
For COB packaged light sources in existing LED light source technology because simple in structure, the scale of construction is small, and light source is concentrated, and downstream group shipment is used
Family used device is few, is found broad application using simple, but existing COB light source presence " heat collection compared with existing SMD lamp beads
In, reliability is not high, light efficiency is low " etc. drawback and problem, how to improve COB high-power and light efficiency requirement show COB capture
Main way.
It is substantially both at home and abroad at present and then die bond bonding wire glue dispensing and packaging completion is directly attached on base plate carrying body using chip,
This is simple in structure, but heat of light source is concentrated, and light efficiency is not high, causes heat not dissipate not go out, and reliability is not high.What wattage was also done
It is not high, it can only generally accomplish below 35W, require occasion to there is limitation, such as square, ocean, road, spy in existing high power device
According to field etc..
Utility model content
The technical problems to be solved in the utility model is：A kind of COB packaged light sources are provided, solve current COB packaged light sources
The problem of light efficiency is low.
To solve the above problems, the technical solution adopted in the utility model is：A kind of COB packaged light sources, including LED wafer
Array, die bond glue-line and aluminum substrate, LED wafer array are arranged on the upper surface of aluminum substrate, and die bond glue-line glue is covered in LED wafer
The surface of array；Die bond glue-line includes optical cement and fluorescent powder, and optical cement is evenly distributed in die bond glue-line, and fluorescent powder is deposited in
The bottom of die bond glue-line.
Further, the upper surface of above-mentioned aluminum substrate is minute surface.
Further, the spacing of each chip is 1mm in above-mentioned LED wafer array.
The beneficial effects of the utility model are：The utility model is made glimmering in die bond glue-line by centrifugation and free settling
Light powder is fully deposited in the bottom of die bond glue-line, due to fluorescent powder be gathered in bottom can preferably with LED wafer array contact, because
This improves the launching efficiency of chip and fluorescent powder so that the light efficiency of COB packaged light sources gets a promotion.
Brief description of the drawings
Fig. 1 is the structure diagram of COB packaged light sources in embodiment.
Numbered in figure：1 is LED wafer array, and 2 be die bond glue-line, and 201 be fluorescent powder, and 3 be aluminum substrate.
Embodiment
The utility model is further described with embodiment below in conjunction with the accompanying drawings.
Referring to Fig. 1, embodiment provides a kind of COB packaged light sources, including LED wafer array 1, die bond glue-line 2 and aluminum substrate
3, LED wafer array 1 sets the upper surface of aluminum substrate 3, and die bond glue-line glue 2 is covered in the surface of LED wafer array 1, crystal-bonding adhesive
Layer 2 includes optical cement and fluorescent powder 201, and optical cement is evenly distributed in die bond glue-line 2, and fluorescent powder 201 is deposited in die bond glue-line 2
Bottom.
In embodiment, aluminum substrate 3 employs a kind of high density, reflective, efficient, more than the heat conduction 200W/ (mK) of height
Minute surface substrate as crystal chip bearing body, die bond glue-line 2 employ a kind of high heat conduction high reflection crystal-bonding adhesive heat conduction 15W/ (mK) with
Upper carry out die bond, this improves heat dissipation channel, reduces 201 surface of fluorescent powder and colloid surface temperature, improves light source
Service life and reliability.Meanwhile embodiment employs a kind of alternative fluorescent powder and directly applies technique sealing, passes through centrifugation
Fluorescent powder 201 in die bond glue-line 2 is set fully to be deposited in the bottom of die bond glue-line 2 with free settling, since fluorescent powder 201 is gathered in
Bottom can preferably be contacted with LED wafer array 1, therefore improve the launching efficiency of chip and fluorescent powder 201 so that COB is sealed
The light efficiency of dress light source gets a promotion.
Also, embodiment can be imitated according to the FMEA failure modes reliability of test, the collection of SPSS creation datas and optics
True software analysis designs packaging, analyzes the radiation flux of chip, reasonably selects current density, brightness and the optimization of chip
Chip connection in series-parallel be laid out, by COB-Package techniques by N number of LED particle string and interconnect binding on this substrate, become one
A new LED light source module；We can use more and go here and there more, the interval of 1mm be maintained the wafers in, since the interval of 1mm can
Allow between chip and the interference of light and to absorb the relatively low level that be in, therefore embodiment is not done chip interval with respect to other and limited
Fixed COB light source, can reduce the interference and absorption of light, fully improve chip light extraction efficiency.
The COB light source of embodiment can reach effect in detail below：
1st, the technology can be allowed to be pushed on the high-power packaging of more than 200W, in can be widely used in, high-power
Light source device field, such as outdoor intelligent road lamp, Tunnel Lamp, Projecting Lamp, high shed light, is realized applied to road, square, lamp
The high brightness low energy consumption such as tower, building, airport, parking lot, place.
2nd, performance indicator reaches the state that COB-LED luminous efficiency of source when realizing high-power single mode group 75W reaches more than 190LM/W
Interior top standard.
The basic principle of the utility model and main feature are the foregoing described, the description of specification simply illustrates this practicality
New principle, on the premise of not departing from the spirit and scope of the utility model, the utility model also have various change and change
Into these various changes and improvements fall within the scope of the claimed invention.
Claims (3)
1. a kind of COB packaged light sources, including LED wafer array, die bond glue-line and aluminum substrate, LED wafer array are arranged on aluminium base
The upper surface of plate, die bond glue-line glue are covered in the surface of LED wafer array, it is characterised in that the die bond glue-line includes optics
Glue and fluorescent powder, optical cement are evenly distributed in die bond glue-line, and fluorescent powder is deposited in the bottom of die bond glue-line.
2. a kind of COB packaged light sources according to claim 1, it is characterised in that the upper surface of the aluminum substrate is minute surface.
A kind of 3. COB packaged light sources according to claim 1, it is characterised in that each chip in the LED wafer array
Spacing is 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721410346.4U CN207353246U (en) | 2017-10-27 | 2017-10-27 | A kind of COB packaged light sources |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721410346.4U CN207353246U (en) | 2017-10-27 | 2017-10-27 | A kind of COB packaged light sources |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207353246U true CN207353246U (en) | 2018-05-11 |
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ID=62353284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721410346.4U Active CN207353246U (en) | 2017-10-27 | 2017-10-27 | A kind of COB packaged light sources |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207353246U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828345A (en) * | 2019-11-14 | 2020-02-21 | 广州市晶鑫光电科技有限公司 | COB light source color uniformity control process |
-
2017
- 2017-10-27 CN CN201721410346.4U patent/CN207353246U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828345A (en) * | 2019-11-14 | 2020-02-21 | 广州市晶鑫光电科技有限公司 | COB light source color uniformity control process |
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