CN203453819U

CN203453819U - Light source luminous module

Info

Publication number: CN203453819U
Application number: CN201320478229.7U
Authority: CN
Inventors: 席文杰; 张景超; 谢炎忠; 廖国富
Original assignee: Lite On Semiconductor Wuxi Co Ltd
Current assignee: Lite On Semiconductor Wuxi Co Ltd
Priority date: 2013-08-06
Filing date: 2013-08-06
Publication date: 2014-02-26
Anticipated expiration: 2023-08-06

Abstract

The utility mode provides a light source luminous module which comprises wafers, a support and a printed circuit board. The wafers are connected to the support, the wafers comprise a red light wafer, a green light wafer, a blue light wafer and an infrared light wafer, and the support is connected with the printed circuit board. Due to the fact that infrared light wafer is added on the basis of the red light wafer, the green light wafer and the blue light wafer, the application range of the light source luminous module is broadened, and the light source luminous module can be applied to scanning equipment for materials sensitive to infrared light, such as currency detectors.

Description

Light source luminescent module

Technical field

The utility model belongs to light source module, more specifically relates to a kind of light source module that comprises infrared light supply.

Background technology

In the light source luminescent module of prior art, only have ruddiness, green glow and blue light, there is no infrared light, and the material of the light source luminescent module of prior art is all metal material, a kind of light source just need to increase a pin, and also need increases whole width simultaneously, and cost is higher.

Utility model content

The utility model provides a kind of light source luminescent module, comprise wafer, support and printed circuit board (PCB), on support, be connected with wafer, wafer comprises ruddiness wafer, green glow wafer, blue light wafer and infrared light wafer, support is connected with printed circuit board (PCB), and ruddiness wafer, green glow wafer, blue light wafer and infrared light wafer are positioned at straight line.

Its beneficial effect is: on the basis of ruddiness wafer, green glow wafer, blue light wafer, increase infrared light wafer, make application of the present utility model broader, can be applied to some on the scanning device of infrared light sensitive material, such as cash inspecting machine.Arrangement mode in one line makes the reverberation of ruddiness wafer, blue light wafer, green glow wafer and infrared light wafer higher.Because after later stage operation is arranged on LGP by light source luminescent module, the white ink on LGP is straight line, and wafer sends, only by ink, reflect, arranged in a straight linely just can guarantee not lose the wherein reverberation of any wafer.

In some embodiments, ruddiness wafer and infrared light wafer are positioned at the both sides of green glow wafer and blue light wafer.

Its beneficial effect is: because the optical source wavelength of ruddiness wafer and infrared light wafer is longer, brightness is higher, come both sides and can lose a little some brightness, in the middle of green glow wafer and blue light wafer come because brightness is slightly low, so just in time can balance high brightness and the drop of low-light level, reach the basically identical property of four wafer light sources, guarantee the quality of scanning after light source luminescent module is applied on scanning means.

In some embodiments, wafer encapsulates with transparent glue.

Its beneficial effect is: transparent glue plays the effect of protection wafer.

In some embodiments, support is plastic stent.

Its beneficial effect is: adopt plastic stent can reduce costs and reduce volume.The light source luminescent module of prior art is one, support is metallic support, and the pin on metallic support is all in one line, has increased an infrared light wafer, just a pin need to be on metallic support, increased, the width of whole illuminating source module must be increased; The utility model adopts plastic stent, and plastic stent can directly be welded on printed circuit board (PCB); And the both sides of printed circuit board (PCB) and the back side can printed circuits, in practical application in the situation that of limited space, the pin of controlling these wafers can also be separately positioned on two sides and the back side of printed circuit board (PCB), than metallic support, more saves space, for manufacturing narrower light source, provides possibility.

In some embodiments, the material of plastic stent is Merlon or the styrene copolymerized compound of the third alkene nitrile – fourth two alkene –.

In some embodiments, the side that plastic stent does not connect wafer scribbles silver paint.

Its beneficial effect is: the reflection of the light that increase wafer sends on plastic stent, prevents the loss of the light of wafer.

In some embodiments, wafer is connected with plastic stent by elargol, and plastic stent is provided with the first pad, and wafer is provided with the second pad, and the first pad of plastic stent is connected by wire with the second pad on wafer.

Its beneficial effect is: elargol, except playing the effect of fixing wafer, can also play the effect of conduction, in addition, and the heat fast spread that elargol can also produce wafer in luminous; The back side of four wafers is connected on a negative pole by elargol.Four wires that connect wafer and plastic stent are connected on four positive poles by plastic stent respectively.

In some embodiments, the side that plastic stent is connected with wafer is provided with block, and block is positioned at the surrounding of wafer, and the height of transparent glue is lower than the height of block.

Its beneficial effect is: transparent glue direct collision LGP while preventing light source luminescent module to be installed on LGP, cause the distortion of transparent glue, and form gap, thereby cause the generation of the phenomenons such as light leak.

In some embodiments, plastic stent and printed circuit board (PCB) are by melting down soldered connecing.

Accompanying drawing explanation

Fig. 1 is ruddiness wafer, blue light wafer, the green glow wafer of the utility model light source luminescent module one embodiment, the arrangement schematic diagram of infrared light wafer;

Fig. 2 is the structural representation of the utility model light source luminescent module one embodiment.

The specific embodiment

As shown in Figure 1-2, light source luminescent module comprises wafer 3, support and printed circuit board (PCB) 6.Support is plastic stent 1.In the present embodiment, the poly-carbonic acid resin of the material selection of plastic stent 1.In actual applications, can also select the styrene copolymerized compound of the third alkene nitrile – fourth two alkene – etc.Plastic stent 1 is for being provided with the cube of oval-shaped groove 12.In the oval-shaped groove 12 of plastic stent 1, scribble elargol 2, wafer 3 is attached on elargol 2, then by baking, wafer 3 is fixing.Elargol 2 can also play the effect of conduction except playing the effect of fixing wafer 3, in addition, and the heat fast spread that elargol 2 can also produce wafer 3 in luminous.Wafer 3 comprises ruddiness wafer 31, green glow wafer 32, blue light wafer 33, infrared light wafer 34.The arrangement mode of four wafers 3 is that arrangement mode in one line, in one line makes the reverberation of ruddiness wafer 31, blue light wafer 33, green glow wafer 32 and infrared light wafer 34 higher.Because after later stage operation is arranged on LGP by light source luminescent module, the white ink on LGP is straight line, and wafer 3 sends, only by ink, reflect, arranged in a straight linely just can guarantee not lose the wherein reverberation of any wafer.And ruddiness wafer 31 and infrared light wafer 34 come respectively the both sides of green glow wafer 32 and blue light wafer 33, because the optical source wavelength of ruddiness wafer 31 and infrared light wafer 34 is longer, brightness is higher, come both sides and can lose a little some brightness, in the middle of green glow wafer 32 and blue light wafer 33 come because brightness is slightly low, so just in time can balance high brightness and the drop of low-light level, reach the basically identical property of the light source of four wafers 3.The utility model has increased an infrared light wafer 34, makes application broader, can be applied to some on the scanning device of infrared light sensitive material, such as currency examine etc.The side that plastic stent 1 does not connect wafer 3 scribbles silver paint, can increase the reflection on plastic stent 1 of light that wafer 3 sends, prevents the loss of the light of wafer 3.

The position that the surrounding of plastic stent 1 is protruded is block 11.After four wafers 3 fix, by 5 pairs of four wafers 3 of transparent glue, encapsulate, 5 pairs of four wafers 3 of transparent glue play the effect of protection.The height of block 11 is higher than the height of transparent glue 5, and while preventing light source luminescent module to be installed on LGP, transparent glue 5 direct collision LGPs, cause the distortion of transparent glue 5, forms gap, thereby causes the generation of the phenomenons such as light leak.

Plastic stent 1 is provided with the first pad, on ruddiness wafer 31, green glow wafer 32, blue light wafer 33, infrared light wafer 34, be respectively equipped with the second pad, plastic stent 1 is provided with four the first pads, four the first pads are connected by wire 4 with four the second pads respectively, and ruddiness wafer 31, green glow wafer 32, blue light wafer 33, infrared light wafer 34 are connected with plastic stent 1 by wire 4 respectively.The back side of ruddiness wafer 31, green glow wafer 32, blue light wafer 33, infrared light wafer 34 is connected on a negative pole by elargol 2.Four wires 4 that ruddiness wafer 31, green glow wafer 32, blue light wafer 33, infrared light wafer 34 are connected with plastic stent 1 are respectively connected respectively on four positive poles from plastic stent 1 goes between out.

Adopt plastic stent 1 can reduce costs and reduce volume.The light source luminescent module of prior art is one, support is metallic support, on metallic support, for the pin of wafer is installed, needs in one linely, has increased a wafer, just a pin need to be on metallic support, increased, the width of whole illuminating source module must be increased.The utility model adopts plastic stent 1, and plastic stent 1 can directly be fixed on printed circuit board (PCB) 6 by the mode of welding.In the pad of printed circuit board (PCB) 6, stamp tin cream, plastic stent 1 is attached on tin cream, by melting down weldering, plastic stent 1 is connected and is fixed with printed circuit board (PCB) 6; And the back side of printed circuit board (PCB) 6 or two sides can be provided for installing the pin of wafer, in practical application in the situation that of limited space, for connecting the pin of wafer, can also be separately positioned on the back side or the two sides of printed circuit board (PCB) 6, than metallic support, more save space, for manufacturing narrower light source, provide possibility.

By reference to the accompanying drawings embodiments more of the present utility model are described in detail above, but the utility model is not limited to above-mentioned embodiment, in the ken possessing those of ordinary skills, can also under the prerequisite that does not depart from the utility model aim, make various variations.

Claims

1. light source luminescent module, it is characterized in that, comprise wafer (3), support and printed circuit board (PCB) (6), on described support, be connected with wafer (3), described wafer (3) comprises ruddiness wafer (31), green glow wafer (32), blue light wafer (33) and infrared light wafer (34), described support is connected with described printed circuit board (PCB) (6), and described ruddiness wafer (31), green glow wafer (32), blue light wafer (33) and infrared light wafer (34) are positioned at straight line.

2. light source luminescent module according to claim 1, is characterized in that, described ruddiness wafer (31) and described infrared light wafer (34) are positioned at the both sides of described green glow wafer (32) and described blue light wafer (33).

3. light source luminescent module according to claim 2, is characterized in that, transparent glue (5) encapsulation for described wafer (3).

4. light source luminescent module according to claim 3, is characterized in that, described support is plastic stent (1).

5. light source luminescent module according to claim 4, is characterized in that, the material of described plastic stent (1) is Merlon or the styrene copolymerized compound of the third alkene nitrile – fourth two alkene –.

6. light source luminescent module according to claim 5, is characterized in that, the side that described plastic stent (1) does not connect described wafer (3) scribbles silver paint.

7. light source luminescent module according to claim 6, it is characterized in that, described wafer (3) is connected with described plastic stent (1) by elargol (2), described plastic stent (1) is provided with the first pad, described wafer (3) is provided with the second pad, and the first pad of described plastic stent (1) is connected by wire (4) with the second pad on described wafer (3).

8. light source luminescent module according to claim 7, it is characterized in that, the side that described plastic stent (1) is connected with described wafer (3) is provided with block (11), described block (11) is positioned at the surrounding of described wafer (3), and the height of described transparent glue (5) is lower than the height of described block (11).

9. light source luminescent module according to claim 8, is characterized in that, described plastic stent (1) and described printed circuit board (PCB) (6) are by melting down soldered connecing.