CN202339916U - Novel TOP light emitting diode (LED) bracket and LED device manufactured by using novel TOP LED bracket - Google Patents
Novel TOP light emitting diode (LED) bracket and LED device manufactured by using novel TOP LED bracket Download PDFInfo
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- CN202339916U CN202339916U CN2011203943536U CN201120394353U CN202339916U CN 202339916 U CN202339916 U CN 202339916U CN 2011203943536 U CN2011203943536 U CN 2011203943536U CN 201120394353 U CN201120394353 U CN 201120394353U CN 202339916 U CN202339916 U CN 202339916U
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- reflector
- organic
- led
- novel top
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The utility model provides a novel TOP light emitting diode (LED) bracket, which comprises an organic substrate, a reflection cup, at least one small reflection cups and electrodes, wherein the reflection cup is arranged on the organic substrate, and is at least encapsulated to part of lateral surface of the organic substrate; the small reflection cups are positioned in the reflection cup, and form an integral structure with the reflection cup; and the electrodes are positioned in the reflection cup. The reflection cup in a semi-encapsulated structure is fixedly molded on the organic substrate, so that the novel TOP LED bracket has high humidity resistance and high reliability. According to an LED device manufactured by using the novel TOP LED bracket, chips are arranged in different small reflection cups, so that light absorption between the chips is avoided, and high luminous efficiency is ensured; in addition, the small reflection cups are filled with fluorescent glue, and the reflection cup is filled with transparent silica gel, so that the device is highly consistent; and more favorably, the small reflection cups are arranged to form an array, so that red, green and blue devices can be conveniently and collinearly arranged, and the large-viewing angle color fidelity of a multicolor display device is improved.
Description
Technical field
The utility model relates to the LED encapsulation field, and relate in particular to a kind of multicore sheet encapsulation and use the TOPLED support, and the LED device that utilizes this support to make.
Background technology
In the lighting source of new development, (Light emitting diode LED) owing to have the advantage of low energy consumption, high brightness, becomes the new lamp source of tool potentiality to light-emitting diode already.In the development of LED, good directionality, brightness is high, and the TOP LED that barrier propterty is good (top light extracting LED) device is a main direction of studying always.
For light direction and the rising angle of controlling the LED device better, need around led chip, reflector be set usually, the light that makes led chip send can only be that the reflector opening direction penetrates towards top device.This LED device with reflector structure, top bright dipping is the alleged TOP LED device of industry.TOP LED belongs to surface attaching type LED, is widely used in fields such as decorative lamp, indoor display screen and backlight at present.
Common TOP led support structure such as PLCC type referring to shown in Figure 1, comprising: lead frame 01, reflector 02 and led chip 03.Because PLCC type support has reflection cavity and compact conformation, is particularly suitable for being applied to the light distribution requirements height, mounts the high field of density.At present, PLCC type support all is widely used on low-power LED and the power LED.Produce the problem of high heat energy when there is work in power LED, need to adopt technological means that the heat energy that is produced is well distributed, otherwise can influence its life-span and go out light effect.Therefore the typical package structure of the PLCC type support used of power LED is: the plastic casing with reflection cavity structure; Except the coated metal lead frame; Also parcel places led chip bottom and is exposed to heat sink outside the support; The material that this is heat sink is generally selected radiating effect good metal material for use, and for example copper is beneficial to distribute the high heat energy that produces when LED works.Because radiating effect is good, PLCC type great power LED is one of at present the most frequently used power LED encapsulating structure.
Yet the lead frame 01 of PLCC type supporting structure is used for serving as positive and negative electrode and carries led chip, and its material is generally metallic copper; The material that uses of reflector is plastics.As everyone knows, the thermal expansion coefficient difference of plastics and metal is bigger, and both cohesive forces are not strong, thereby has also caused the air-tightness of this TOP LED device to be difficult to guarantee that the outer water air-capacitor is prone to enter into device inside along lead frame, causes integrity problem.
In recent years, along with the power requirement of application product to LED improves, LED encapsulation manufacturer hankers after in a device, a plurality of led chips being set.Yet a problem is the mutual absorption that often exists light between a plurality of led chips, and this absorption has seriously restricted the light extraction efficiency of LED device.Therefore, people propose little reflector is set between a plurality of led chips, and the light of avoiding chip to send shines directly on the adjacent chips and is absorbed.The Chinese patent that is CN201780995 like one piece of patent No. discloses a kind of multichip packaging structure; Referring to shown in Figure 2, comprising: substrate 04 is arranged on a plurality of reflectors 02 on the substrate 04; Be arranged on the baffle plate 05 on the reflector 02, and be arranged on the light-emitting diode chip for backlight unit 03 in the reflector.The disclosed this multichip packaging structure of this patent has avoided the light between multicore sheet encapsulation chips to absorb the light loss that brings each other well, yet it must make two-layer reflex reflector on the substrate continuously, complex structure, and the manufacturing cost is big; In addition, between substrate and the reflector, all have contact interface between reflector and the baffle plate, the difficult control of the barrier propterty of entire device device is difficult to adapt to open air etc. barrier propterty is required than higher workplace.
Therefore, very be necessary to develop a kind of simple in structure, light extraction efficiency is high, barrier propterty is good novel TOP led support and multicore chip package.
Summary of the invention
A purpose of the utility model is, provides that a kind of barrier propterty is good, the novel TOP led support of the mutual absorption of avoiding chip chamber light.
Another purpose of the utility model is to provide a kind of barrier propterty good, the multicore sheet TOP LED device that light extraction efficiency is high.
The novel also purpose of this enforcement is that provide a kind of barrier propterty good, brightness is high, the big display device in color fidelity visual angle.
For solving the problems of the technologies described above, the technical scheme of the utility model is:
A kind of novel TOP led support; It is characterized in that, comprising: organic substrate is arranged on organic reflector of sealing at least on organic substrate to organic group plate portion side surface; At least one is positioned at little organic reflector of organic reflector, and is positioned at the electrode of organic reflector.
Preferably, said organic reflector and little organic reflector are into a single integrated structure.
Preferably, between said organic reflector and the little organic reflector dowel is arranged.
Preferably, the upper surface of said dowel is the pitted skin of horizontal plane, inclined-plane, arc surface or alligatoring.
Preferably, said little organic reflector is arranged in array.
Preferably, the upper surface of said dowel is the plane, and far below the top of little organic reflector, and form little organic reflector outer wall; The inside and outside wall of little organic reflector is the inclined-plane.
Preferably, said organic substrate is a pcb board.
Preferably, on said organic substrate louvre is arranged, be filled with highly heat-conductive material in the louvre.
A kind of novel TOP LED device that the utility model provides; Comprise: novel TOP led support; Be positioned at the led chip of the little organic reflector of support, the gold thread of electrical ties led chip to positive and negative electrode is filled in the packing colloid that covers said led chip in organic reflector.
Preferably, said packing colloid comprises fluorescent colloid that is filled in little organic reflector and the transparent silica gel that is filled in organic reflector.
Compared with prior art, a kind of novel TOP led support that the utility model provides, organic reflector is fixed on organic substrate with half encapsulating structure moulding, has good humidity resistance and high reliability; Little organic reflector with organic reflector one is set further, and chip mount is partly left one by one, and processing and fabricating simple in structure is convenient.
Compared with prior art, a kind of LED device of making based on novel TOP led support that the utility model provides has been avoided the light absorption of chip chamber, and light extraction efficiency is high; Simultaneously, fill fluorescent glue in little organic reflector, the structural design of filling transparent silica gel in organic reflector makes that the consistency of device is better; More advantageously, through the array setting of little organic reflector, the convenient red, green, blue three-color LED chip of realizing is arranged on the same straight line, has improved the color fidelity with great visual angle of colorful display device.
Description of drawings
Fig. 1 is existing PLCC type TOP led support structural representation;
Fig. 2 is existing TOP multichip LED encapsulation structure sketch map;
The vertical view of a kind of novel TOP led support embodiment one that Fig. 3 provides for the utility model;
The cutaway view of a kind of novel TOP led support embodiment one that Fig. 4 provides for the utility model;
The cutaway view of a kind of device embodiment one based on novel TOP led support that Fig. 5 provides for the utility model;
The vertical view of a kind of device embodiment one based on novel TOP led support that Fig. 6 provides for the utility model;
The cutaway view of a kind of device embodiment two based on novel TOP led support that Fig. 7 provides for the utility model;
The vertical view of a kind of device embodiment three based on novel TOP led support that Fig. 8 provides for the utility model;
The cutaway view of a kind of device embodiment three based on novel TOP led support that Fig. 9 provides for the utility model.
Embodiment
For setting forth a kind of novel TOP led support that the utility model provides and the LED device of making based on this support better, to the utility model explanation as follows below in conjunction with accompanying drawing.
Support embodiment one
Like Fig. 3, shown in Figure 4; A kind of novel TOP led support that present embodiment provides; Comprise: organic substrate 1, be arranged on organic reflector 2 of also sealing organic substrate 1 part side surface on organic substrate 1 at least, be positioned at least one little organic reflector 3 of organic reflector 2; The inner bottom surface of little organic reflector 3 serves as chip mount portion 4, and the outer setting of little organic reflector 3 has positive and negative electrode 6.
Wherein, organic reflector 2 is integrative-structures with little organic reflector 3, that is, organic reflector 2 is integrated with little organic reflector 3, and the organic reflector after the moulding 2 connects together through dowel 5 with little organic reflector 3.In the present embodiment, little organic reflector 3 is six, is 2 * 3 array and arranges.
Said organic substrate 1 is a pcb board; The material of organic base main body can be FR-4 (flame resistant laminates Grade-4), bismaleimide-triazine resin (bismaleimide-triazine resin BT material) etc., and preferred panels is the epoxy glass cloth laminated board of FR-4.Said organic reflector 2 is meant that with little organic reflector 3 material of reflector is an organic material; Can adopt polyphtalamide resin (PPA), polymethyl methacrylate (PMMA), polyamide (PA), Merlon (PC); Polyformaldehyde (POM); In polybutylene terephthalate (PBT) (PBT) and polyphenylene oxide (PPO), silica gel, the epoxy resin any one, preferably polyphtalamide resin (PPA).
The upper surface of said dowel 5 is horizontal plane, inclined plane, arc surface or pitted skin with alligatoring structure.The upper surface of preferred dowel is the inclined plane in the present embodiment.
A kind of novel TOP led support structure that present embodiment provides mainly has following advantage:
The one, improve barrier propterty.Utilize organic material as the reflector moulding material; And reflector is fixed on organic substrate with half encapsulating structure moulding; Overcome on the one hand degradation deficiency under the humidity resistance that conventional P LCC type TOPLED causes greatly because of reflector plastic packaging material and metallic support material thermal expansion coefficient difference; Need not to adopt adhesive glue on the other hand, avoid condition such as adhesive glue Yin Wendu to change and cause degradation problem generation under bond properties and the air-tightness, have good humidity resistance and high reliability.
The 2nd, improve light extraction efficiency.Through little reflector is set in reflector, chip mount is partly isolated one by one, avoids being placed in the light that each chip of chip mount portion sends and absorbs each other; The pitted skin of inclined-plane or alligatoring is arranged on the dowel surface simultaneously, reduces the total reflection of light, improves the utilance of the light on outgoing to dowel surface.
The 3rd, simple in structure, practice thrift cost.One-shot forming is convenient in integrative-structure design between reflector and the little reflector, and is simple in structure, easy to process, practices thrift cost.
Device embodiment one
Like Fig. 5, shown in Figure 6; A kind of multichip device that utilizes aforementioned TOP led support to make; Comprise: organic substrate 1; Be arranged on organic reflector 2 of sealing organic substrate 1 part side surface on organic substrate 1 at least, be arranged on organic reflector 2 inner and with the little organic reflector 3 of organic reflector 2 all-in-one-pieces, be arranged on the led chip 7 in each little organic reflector 3; Gold thread 8 is electrically connected on led chip to the electrode 6, and a packing colloid 9 is filled in organic reflector 2 and the little organic reflector 3 and covers led chip 7 and gold thread 8.
Wherein, the number of little organic reflector 3 is six, is 2 * 3 array arrangements; 3 led chips of every row are connected in series, and are connected in parallel between two row.Organic reflector 2 connects through dowel 5 with little organic reflector 3, and the upper surface of dowel 5 is a cambered surface.
Said chip 7 is one or more in ultraviolet light chip, blue chip, green glow chip or the red light chips, is preferably the gallium nitride base blue light chip.Said packing colloid is epoxy resin, silica gel or fluorescent colloid.
A kind of novel TOP LED device that present embodiment provides, its organic reflector are partly sealed to organic base plate bottom and are only spilt the electrode part, and good sealing effect can effectively prevent the invasion of steam, is fit to be applied in the operational environment of having relatively high expectations to barrier propterty in open air etc.The arc of dowel 5 upper surfaces design simultaneously can reduce the light loss that total reflection brings, and make bright dipping become more even, does not produce dazzle.
Device embodiment two
As shown in Figure 7; A kind of multichip device that utilizes aforementioned TOP led support to make; Comprise: organic substrate 1, be arranged on organic reflector 2 of sealing organic substrate portion side surface on organic substrate 1 at least, be arranged on organic reflector 2 inner and with the little organic reflector 3 of organic reflector 2 all-in-one-pieces; Be arranged on the led chip 7 in each little organic reflector 3, cover the encapsulating material 9 of led chip.
A kind of multicore sheet TOP LED device that this enforcement provides, with device embodiment one basically identical, difference is:
One, also is provided with at least one louvre (not indicating) on said organic substrate 1, and is arranged at heat sink 11 in the louvre.In the present embodiment, said heat sink 11 be six little heat sink, respectively corresponding each led chip.In other embodiments, can adopt 6 of a big heat sink replacement little heat sink, be not limited to present embodiment.In other embodiments, louvre can also be filled other highly heat-conductive material, like copper powder, is not limited to present embodiment.
Two, said encapsulating material is formed by being filled in little organic reflector 3 fluorescent glue 91 and being filled in organic reflector 2 transparent silica gel 92.
Three, the upper surface of said dowel 5 has concavo-convex alligatoring structure.
Device embodiment three
Like Fig. 8, shown in Figure 9; A kind of colorful device that utilizes aforementioned TOP led support to make; Comprise: organic substrate 1, be arranged on organic reflector 2 of sealing organic substrate 1 part side surface on organic substrate 1 at least, be arranged on organic reflector 2 inner and with the little organic reflector 3 of organic reflector 2 all-in-one-pieces; The dowel 5 that connects organic reflector 2 and little organic reflector 3; Be arranged on the led chip 7 in each little organic reflector, the gold thread 8 of electrical ties led chip 7 to positive and negative electrode 6, and the encapsulating material 9 of covering led chip 7.
Wherein, the quantity of said little organic reflector 3 is three, is wire and arranges; The upper surface of said dowel 5 is the plane, and far below the top of little organic reflector 3, and form little organic reflector outer wall; The inside and outside wall of little organic reflector is the inclined-plane.(as shown in Figure 9)
Said led chip 7 comprises red, green, blue three color chips, is separately positioned in different little organic reflectors 3; Said electrode 6 is formed by being arranged on three pairs of positive and negative electrodes that occupy little organic reflector 3 both sides in organic reflector 2.
Said packing colloid 9 is for having the silica gel of scattering property.
A kind of colorful LED device that utilizes aforementioned TOP led support to make that present embodiment provides; Red, green, blue three-color LED chip is arranged on the same straight line; This structural design helps improving the scope of watching of color fidelity, has guaranteed the interior color fidelity of viewing angle on a large scale.Simultaneously, the inside and outside wall of little organic reflector is that ramp structure can more help the light that chip sends is reflected away, and improves the brightness of device.
More than the utility model has been carried out detailed introduction, use concrete example in the literary composition principle and the execution mode of the utility model set forth, the explanation of above embodiment just is used to help to understand the method and the core concept thereof of the utility model.Should be understood that; For those skilled in the art; Under the prerequisite that does not break away from the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection range of the utility model claim.
Claims (10)
1. novel TOP led support; It is characterized in that, comprising: organic substrate is arranged on organic reflector of sealing at least on organic substrate to organic group plate portion side surface; At least one is positioned at little organic reflector of organic reflector, and is positioned at the electrode of organic reflector.
2. novel TOP led support as claimed in claim 1 is characterized in that, said organic reflector and little organic reflector are into a single integrated structure.
3. novel TOP led support as claimed in claim 2 is characterized in that, between said organic reflector and the little organic reflector dowel is arranged.
4. novel TOP led support as claimed in claim 3 is characterized in that the upper surface of said dowel is the pitted skin of horizontal plane, inclined-plane, arc surface or alligatoring.
5. novel TOP led support as claimed in claim 1 is characterized in that, said little organic reflector is arranged in array.
6. novel TOP led support as claimed in claim 3 is characterized in that the upper surface of said dowel is the plane, and far below the top of little organic reflector, and form little organic reflector outer wall; The inside and outside wall of little organic reflector is the inclined-plane.
7. novel TOP led support as claimed in claim 1 is characterized in that said organic substrate is a pcb board.
8. novel TOP led support as claimed in claim 1 is characterized in that, on said organic substrate louvre is arranged, and is filled with highly heat-conductive material in the louvre.
9. one kind based on the LED device of novel TOP led support according to claim 1; It is characterized in that; Comprise: said novel TOP led support; Be positioned at the led chip of the little organic reflector of support, the gold thread of electrical ties led chip to positive and negative electrode is filled in the packing colloid that covers said led chip in organic reflector.
10. LED device as claimed in claim 9 is characterized in that, said packing colloid comprises fluorescent colloid that is filled in little organic reflector and the transparent silica gel that is filled in organic reflector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203943536U CN202339916U (en) | 2011-05-13 | 2011-09-27 | Novel TOP light emitting diode (LED) bracket and LED device manufactured by using novel TOP LED bracket |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110124360.9 | 2011-05-13 | ||
| CN201110124360 | 2011-05-13 | ||
| CN2011203943536U CN202339916U (en) | 2011-05-13 | 2011-09-27 | Novel TOP light emitting diode (LED) bracket and LED device manufactured by using novel TOP LED bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202339916U true CN202339916U (en) | 2012-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011203943536U Expired - Lifetime CN202339916U (en) | 2011-05-13 | 2011-09-27 | Novel TOP light emitting diode (LED) bracket and LED device manufactured by using novel TOP LED bracket |
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| CN (1) | CN202339916U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363361A (en) * | 2013-08-06 | 2013-10-23 | 敦南科技（无锡）有限公司 | Light source light emitting module |
| CN104409604A (en) * | 2014-12-01 | 2015-03-11 | 深圳市晶台股份有限公司 | Manufacturing method and packaging application of novel LED bracket |
| CN107134522A (en) * | 2016-02-26 | 2017-09-05 | 晶元光电股份有限公司 | Light-emitting device |
| CN109473533A (en) * | 2018-11-30 | 2019-03-15 | 江苏欧密格光电科技股份有限公司 | A kind of LED support structure and LED packaging technology |
| US10825970B2 (en) | 2016-02-26 | 2020-11-03 | Epistar Corporation | Light-emitting device with wavelength conversion structure |
| CN111933781A (en) * | 2020-07-28 | 2020-11-13 | 佛山市国星光电股份有限公司 | LED device and LED lamp |
| CN114334930A (en) * | 2021-12-30 | 2022-04-12 | 惠州市艾斯谱光电有限公司 | Lighting lamp and lamp panel thereof |
-
2011
- 2011-09-27 CN CN2011203943536U patent/CN202339916U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363361A (en) * | 2013-08-06 | 2013-10-23 | 敦南科技（无锡）有限公司 | Light source light emitting module |
| CN104409604A (en) * | 2014-12-01 | 2015-03-11 | 深圳市晶台股份有限公司 | Manufacturing method and packaging application of novel LED bracket |
| CN104409604B (en) * | 2014-12-01 | 2017-04-12 | 深圳市晶台股份有限公司 | Manufacturing method and packaging application of LED bracket |
| CN107134522A (en) * | 2016-02-26 | 2017-09-05 | 晶元光电股份有限公司 | Light-emitting device |
| US10825970B2 (en) | 2016-02-26 | 2020-11-03 | Epistar Corporation | Light-emitting device with wavelength conversion structure |
| CN109473533A (en) * | 2018-11-30 | 2019-03-15 | 江苏欧密格光电科技股份有限公司 | A kind of LED support structure and LED packaging technology |
| CN111933781A (en) * | 2020-07-28 | 2020-11-13 | 佛山市国星光电股份有限公司 | LED device and LED lamp |
| CN114334930A (en) * | 2021-12-30 | 2022-04-12 | 惠州市艾斯谱光电有限公司 | Lighting lamp and lamp panel thereof |
| CN114334930B (en) * | 2021-12-30 | 2022-09-27 | 惠州市艾斯谱光电有限公司 | Lighting lamp and lamp panel thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120718 |
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