CN102054918A - LED packaging method and LED device - Google Patents
LED packaging method and LED device Download PDFInfo
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- CN102054918A CN102054918A CN2009101100364A CN200910110036A CN102054918A CN 102054918 A CN102054918 A CN 102054918A CN 2009101100364 A CN2009101100364 A CN 2009101100364A CN 200910110036 A CN200910110036 A CN 200910110036A CN 102054918 A CN102054918 A CN 102054918A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The invention is suitable for interior and exterior illumination and provides an LED packaging method and an LED device. The LED packaging method comprises the following steps of: carrying out die bonding on a welding line: fixedly arranging an LED chip on a bracket and connecting the LED chip with a relative circuit by using a lead; coating fluorescent powder: coating fluorescent powder on the surface of the LED chip, or coating the fluorescent powder on the inner surface of an outer packaging shell; and tightly sealing and aerating: tightly sealing the LED chip by using the bracket and the outer packaging shell, vacuumizing, and then filling protective gas which is inert gas or nitrogen. In the invention, the protective gas is directly used for packaging the LED bare chip, which is beneficial to the simplification of the traditional LED packaging method and the solving of the problem of secondary design of the LED device. Meanwhile, the protective gas insulates extraneous impurities such as oxygen, sulphur, bromine, and the like, thus the LED chip is protected, and the reliability of the LED device is greatly improved.
Description
Technical field
The invention belongs to the semiconductor lighting technology, relate in particular to a kind of LED method for packing and LED matrix.
Background technology
Many weeks, LED is as the new generation of green lighting source, has numerous advantages such as light efficiency height, life-span are long, bright in luster, energy-saving and environmental protection, and application is more and more widely grown as indoor and outdoor lighting, backlight, medical treatment, traffic, plant etc.
The encapsulation of LED plays an important role to the application of LED, has only the application matched materials, suitable encapsulating structure, just can give full play to the effect of led chip, transfer electric energy to luminous energy effectively, could guarantee chip light-emitting light shape, the colour temperature of LED packaging, look district distribution etc., thus be applied to better in the various LED downstream product.At present, the LED encapsulation all is that application silica gel or other encapsulation glue add that fluorescent material directly is filled on the good naked brilliant chip of solid brilliant bonding wire, forms the LED packaging in conjunction with support basically.Since silica gel and other encapsulation glue all has inevitable gas permeability, water absorption, easily aging, cooperate problem such as difficulty with chip light-emitting, and the problem that combines with support of existence.Secondly, the heat-conducting effect of encapsulation glue is relatively poor, and temperature has great influence to parameters such as the light decay of led chip and LED packaging, light shape, life-spans.In addition, the price of high-performance glue is high always, how encapsulating than higher, avoids generation, colloid baking rear surface evenness, the encapsulating of bubble in the encapsulating process to cooperate problems such as bright dipping light shape to technological requirement, and the manpower that these problems are brought and other relevant costs are very high.One document number is that the application for a patent for invention of CN101298903A discloses a kind of use transparency liquid encapsulated LED light source, and just there are the problems referred to above in it.
Traditional LED bulb is actually a plurality of packaged LED packagings is incorporated into a lamp plate, and cover glass cover then and form bulb, complex process, cost is higher.Equally, also there is identical problem in traditional LED module, all is directly packaged LED packaging to be combined once more, has the problem of Secondary Design.
Summary of the invention
The purpose of the embodiment of the invention is to provide a kind of LED method for packing and LED matrix, is intended to solve the problem that there is Secondary Design in the complicated and LED matrix of existing LED method for packing.
The embodiment of the invention is achieved in that a kind of LED method for packing, may further comprise the steps:
Gu brilliant bonding wire is fixedly arranged on support with led chip, connect described led chip and interlock circuit with lead;
Apply fluorescent material,, perhaps fluorescent material is coated in the inner surface of envelope at described led chip surface-coated fluorescent material;
Airtight inflation with described support and the airtight described led chip of envelope, vacuumizes the back and fills protective gas.
Protective gas is inert gas or nitrogen described in this method invention.
Another order of the embodiment of the invention is to realize like this; a kind of LED matrix; comprise: support, envelope, at least one is fixedly arranged on the led chip of described support and is located at fluorescent material in the described envelope; be filled with encapsulating material in the closed chamber that described support and envelope form, described encapsulating material is a protective gas.
As a kind of execution mode wherein, described LED matrix is the LED bulb, and the envelope of described LED bulb is a bulb-shaped translucent cover, and described translucent cover outer surface has the uneven structure on the microcosmic, and described protective gas is filled in described translucent cover.
As a kind of execution mode wherein, described LED matrix is the LED Down lamp, and the carrier openings place of described LED Down lamp establishes an airtight cover plate, and described airtight cover plate outer surface has the uneven structure on the microcosmic.
As a kind of execution mode wherein, described LED matrix is the LED fluorescent tube, and the shell of described LED fluorescent tube is a cylindrical or half-cylindrical transparent tube, and described transparent tube outer surface has the uneven structure on the microcosmic, and described protective gas is filled in described transparent tube.
As a kind of execution mode wherein, described LED matrix is the LED module, and the substrate of described LED module is provided with encapsulated holes, and described protective gas is filled in described encapsulated holes.
Compared with prior art, the present invention directly uses the naked brilliant chip of protective gas packaged LED, has completely cut off exogenous impurities such as oxygen, sulphur, bromine, the protection led chip, and described in addition protective gas and led chip contact area are big, and heat-conducting effect is good; The method is significantly save the cost of encapsulation glue, avoid the integrity problem that causes because of glue, significantly reduce related process flow process and cost thereof, especially the cost that produces of encapsulating and solid adhesive process flow process and these flow processs, bright dipping light shape that can obtain in addition and high light efficiency, also can combine, enhance productivity with production technologies such as traditional bulb, existing SMD encapsulation and LED modules.Behind the packaged connection power supply of each LED matrix, described led chip will directly be lighted luminous, realize simply, encapsulate effectively.Technology encapsulates the seal of the LED matrix that forms and prevents that the aqueous vapor performance is good thus, can isolate oxygen and other impurity well, avoids them to influence led chip, and the reliability of LED matrix increases substantially like this.
Description of drawings
Fig. 1 is the flow chart of LED method for packing;
Fig. 2 is the LED bulb structure schematic diagram that is formed by the encapsulation of Fig. 1 method;
Fig. 3 is the LED cylinder lamp structure schematic diagram that is formed by the encapsulation of Fig. 1 method;
Fig. 4 is the LED lamp tube structure schematic diagram that is formed by the encapsulation of Fig. 1 method;
Fig. 5 is the LED modular structure schematic diagram that is formed by the encapsulation of Fig. 1 method.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Embodiment one
As shown in Figure 1, present embodiment is LED bulb and method for packing thereof.Described LED bulb envelope step is as follows: earlier led chip 1 is fixed on the upper surface of support 2, connects described led chip 1 and interlock circuit with gold thread 3 then; Then fluorescent material (fluorescent material is lamelliform, and is not shown) directly is coated in described led chip 1 surface, perhaps fluorescent material is coated in the inner surface of envelope; With described support 2 and the airtight described led chip 1 of envelope, vacuumize the back and fill protective gas 6; This LED bulb envelope back well connects power supply, and described led chip 1 will directly be lighted luminous, realizes simply, encapsulates effectively.Described envelope is a bulb-shaped translucent cover 5, and described translucent cover 5 is made by glass, silica gel or other material, characteristics such as have high stability, high transmission rate, insulation property are good, shock-resistant, gas permeability is low; Described translucent cover 5 outer surfaces have the uneven structure on the microcosmic, can reduce the total reflectivity of translucent cover, help improving the light extraction efficiency of LED bulb; For control bright dipping light shape, raising light-emitting uniformity, can carry out various optical designs in addition to translucent cover.According to the market demand, described translucent cover inner surface is coated with the fluorescent material that is complementary with led chip equably, and described fluorescent material firmly is bonded in the translucent cover inner surface, and fluorescent material helps improving the launching efficiency of fluorescent material away from the structure of chip.Described protective gas 6 is generally inert gas, as argon gas, also can be nitrogen; This protective gas can guarantee that led chip at high temperature stably works, exogenous impurities such as starvation, sulphur, bromine effectively, and the protection led chip, described protective gas 6 is big with led chip 1 contact area, and heat-conducting effect is good; Described in addition protective gas 6 also can for can with obtain the special gas that goes out light color, goes out light effect after led chip 1 combines.Method encapsulates the seal of the LED bulb that forms and prevents that the aqueous vapor performance is good thus, can isolate oxygen and other impurity well, avoids them to influence led chip.Obviously, different with glue encapsulation, the problem that this encapsulating structure does not exist glue to cooperate with chip also do not have the problem that combines of glue and support, and the area of dissipation of packaging system is big, and the reliability of LED bulb increases substantially like this.
Embodiment two
As shown in Figure 2, present embodiment is LED Down lamp and method for packing thereof.Described LED Down lamp encapsulation step is as follows: earlier led chip 1 is fixed on the bottom 9 of support 8, connects described led chip 1 and interlock circuit with gold thread 3 then; Then fluorescent material directly is coated in described led chip 1 surface, perhaps fluorescent material is coated in the inner surface of cover plate 7, the described cover plate 7 of present embodiment is the part of envelope; With described cover plate 7 airtight described supports 8, vacuumize the back and fill protective gas 6; Behind the packaged connection power supply of this LED Down lamp, described led chip 1 will directly be lighted luminous, realize simply, encapsulate effectively.Described cover plate 7 is a circular or square transparent panel, and described transparent panel is made by glass, silica gel or other material, characteristics such as have high stability, high transmission rate, insulation property are good, shock-resistant, gas permeability is low; Described transparent panel outer surface has the uneven structure on the microcosmic, can reduce the total reflectivity of transparent panel, the light extraction efficiency of favourable raising LED Down lamp; For control bright dipping light shape, raising light-emitting uniformity, can carry out various optical designs in addition to transparent panel.According to the market demand, described transparent panel inner surface is coated with the fluorescent material that is complementary with led chip equably, and described fluorescent material firmly is bonded in the transparent panel inner surface, and fluorescent material helps improving the launching efficiency of fluorescent material away from the structure of chip.Described protective gas 6 is generally inert gas, as argon gas, also can be nitrogen; This protective gas 6 can guarantee that led chip at high temperature stably works, exogenous impurities such as starvation, sulphur, bromine effectively, and the protection led chip, described protective gas 6 is big with led chip 1 contact area, and heat-conducting effect is good; Described in addition protective gas 6 also can for can with obtain the special gas that goes out light color, goes out light effect after led chip 1 combines.Method encapsulates the seal of the LED Down lamp that forms and prevents that the aqueous vapor performance is good thus, can isolate oxygen and other impurity well, avoids them to influence led chip.Obviously, different with glue encapsulation, the problem that this encapsulating structure does not exist glue to cooperate with chip also do not have the problem that combines of glue and support, and the area of dissipation of packaging system is big, and the reliability of LED Down lamp increases substantially like this.
Embodiment three
As shown in Figure 3, present embodiment is LED fluorescent tube and method for packing thereof.Described LED fluorescent tube encapsulation step is as follows: earlier some led chips 1 are fixed on the fluorescent tube internal stent 10, then with gold thread 3 serial or parallel connections good each led chip 1 and interlock circuit; Then fluorescent material directly is coated in described led chip 1 surface, perhaps fluorescent material is coated in the inner surface of fluorescent tube shell 11; With fluorescent tube shell 11 airtight described supports 10, vacuumize the back and fill protective gas 6; Behind the packaged connection power supply of this LED fluorescent tube, described led chip 1 will directly be lighted luminous, realize simply, encapsulate effectively.Described fluorescent tube shell 11 is a cylindrical or half-cylindrical transparent tube, and described transparent tube is made by glass, silica gel or other material, characteristics such as have high stability, high transmission rate, insulation property are good, shock-resistant, gas permeability is low; Described transparent tube outer surface has the uneven structure on the microcosmic, can reduce the total reflectivity of transparent tube, the light extraction efficiency of favourable raising LED fluorescent tube; For control bright dipping light shape, raising light-emitting uniformity, can carry out various optical designs in addition to transparent tube.According to the market demand, described transparent tube inner surface is coated with the fluorescent material that is complementary with led chip equably, and described fluorescent material firmly is bonded in the transparent tube inner surface, and fluorescent material helps improving the launching efficiency of fluorescent material away from the structure of chip.Described protective gas 6 is generally inert gas, as argon gas, also can be nitrogen; This protective gas 6 can guarantee that led chip at high temperature stably works, exogenous impurities such as starvation, sulphur, bromine effectively, and the protection led chip, described protective gas 6 is big with the led chip contact area, and heat-conducting effect is good; Described in addition protective gas 6 also can for can with obtain the special gas that goes out light color, goes out light effect after led chip combines.It is good that method encapsulates the LED fluorescent tube seal and the anti-aqueous vapor performance that form thus, isolates oxygen and other impurity, avoids them to influence led chip.Obviously, different with glue encapsulation, the problem that this encapsulating structure does not exist glue to cooperate with chip also do not have the problem that combines of glue and support, and the area of dissipation of packaging system is big, and the reliability of LED fluorescent tube increases substantially like this.
Embodiment four
As shown in Figure 4, present embodiment is LED module and method for packing thereof.Described LED module encapsulation step is as follows: earlier some led chips 1 are separately fixed at the encapsulated holes 13 of substrate 12, then with gold thread serial or parallel connection good each led chip 1 and interlock circuit; Then fluorescent material directly is coated in described led chip 1 surface, perhaps fluorescent material is coated in the inner surface of cover plate; With the airtight described encapsulated holes 13 of cover plate, vacuumize the back and fill protective gas 6; Behind the packaged connection power supply of this LED module, described led chip 1 will directly be lighted luminous, realize simply, encapsulate effectively.Described cover plate is a circular or petal transparent panel, and described transparent panel is made by glass, silica gel or other material, characteristics such as have high stability, high transmission rate, insulation property are good, shock-resistant, gas permeability is low; Described transparent panel outer surface has the uneven structure on the microcosmic, can reduce the total reflectivity of transparent panel, the light extraction efficiency of favourable raising LED module; For control bright dipping light shape, raising light-emitting uniformity, can carry out various optical designs in addition to transparent panel.According to the market demand, described transparent panel inner surface is coated with the fluorescent material that is complementary with led chip equably, and described fluorescent material firmly is bonded in the transparent panel inner surface, and fluorescent material helps improving the launching efficiency of fluorescent material away from the structure of chip.Described protective gas 6 is generally inert gas, as argon gas, also can be nitrogen; This protective gas 6 can guarantee that led chip at high temperature stably works, exogenous impurities such as starvation, sulphur, bromine effectively, and the protection led chip, described protective gas 6 is big with the led chip contact area, and heat-conducting effect is good; Described in addition protective gas 6 also can for can with obtain the special gas that goes out light color, goes out light effect after led chip combines.The seal of described LED module and anti-aqueous vapor performance are good, isolate oxygen and other impurity, avoid them to influence led chip.Obviously, different with glue encapsulation, the problem that this encapsulating structure does not exist glue to cooperate with chip also do not have the problem that combines of glue and support, and the area of dissipation of packaging system is big, and the reliability of LED module increases substantially like this.
Compared with prior art, the present invention significantly saves the cost of encapsulation glue, avoid the integrity problem that causes because of glue, significantly reduce related process flow process and cost thereof, especially the cost that produces of encapsulating and solid adhesive process flow process and these flow processs, bright dipping light shape that can obtain in addition and high light efficiency also can combine with production technologies such as traditional bulb, existing SMD encapsulation and LED modules, enhance productivity.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a LED method for packing is characterized in that, may further comprise the steps:
Gu brilliant bonding wire is fixedly arranged on support with led chip, connect described led chip and interlock circuit with lead;
Apply fluorescent material,, perhaps fluorescent material is coated in the inner surface of envelope at described led chip surface-coated fluorescent material;
Airtight inflation with described support and the airtight described led chip of envelope, vacuumizes the back and fills protective gas.
2. LED method for packing as claimed in claim 1 is characterized in that, described protective gas is inert gas or nitrogen.
3. LED matrix; comprise: support, envelope, at least one is fixedly arranged on the led chip of described support and is located at fluorescent material in the described envelope; it is characterized in that be filled with encapsulating material in the closed chamber that described support and envelope form, described encapsulating material is a protective gas.
4. LED matrix as claimed in claim 3; it is characterized in that described LED matrix is the LED bulb, the envelope of described LED bulb is a bulb-shaped translucent cover; described translucent cover outer surface has the uneven structure on the microcosmic, and described protective gas is filled in described translucent cover.
5. LED matrix as claimed in claim 3 is characterized in that, described LED matrix is the LED Down lamp, and the carrier openings place of described LED Down lamp establishes an airtight cover plate, and described airtight cover plate outer surface has the uneven structure on the microcosmic.
6. LED matrix as claimed in claim 3; it is characterized in that described LED matrix is the LED fluorescent tube, the shell of described LED fluorescent tube is a cylindrical or half-cylindrical transparent tube; described transparent tube outer surface has the uneven structure on the microcosmic, and described protective gas is filled in described transparent tube.
7. LED matrix as claimed in claim 3 is characterized in that, described LED matrix is the LED module, and the substrate of described LED module is provided with encapsulated holes, and described protective gas is filled in described encapsulated holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101100364A CN102054918A (en) | 2009-11-09 | 2009-11-09 | LED packaging method and LED device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009101100364A CN102054918A (en) | 2009-11-09 | 2009-11-09 | LED packaging method and LED device |
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| CN102054918A true CN102054918A (en) | 2011-05-11 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306689A (en) * | 2011-05-24 | 2012-01-04 | 江苏永兴多媒体有限公司 | Method for producing light-emitting diode (LED) bracket based on thermally conductive plastics |
| CN102368530A (en) * | 2011-10-09 | 2012-03-07 | 常熟市华海电子有限公司 | LED (light-emitting diode) chip packaging structure |
| CN102881228A (en) * | 2012-10-15 | 2013-01-16 | 广东欧珀移动通信有限公司 | Water-proofing method for display screen module |
| CN103050489A (en) * | 2012-12-24 | 2013-04-17 | 余姚市泰联照明电器有限公司 | LED (Light Emitting Diode) illuminating device |
| WO2013135153A1 (en) * | 2012-03-12 | 2013-09-19 | 浙江锐迪生光电有限公司 | Led lighting column and led lamp using same |
| CN103545424A (en) * | 2013-10-29 | 2014-01-29 | 路旺培 | LED encapsulation method |
| CN103836409A (en) * | 2013-11-18 | 2014-06-04 | 上海亚浦耳照明电器有限公司 | LED light source and manufacturing method thereof |
| CN105240771A (en) * | 2015-11-10 | 2016-01-13 | 苏州汉克山姆照明科技有限公司 | LED automobile tail lamp |
| CN105257991A (en) * | 2015-10-09 | 2016-01-20 | 东莞市北科电子科技有限公司 | Ultraviolet light-emitting diode (UV LED) system |
| CN111197701A (en) * | 2020-02-03 | 2020-05-26 | 蒋伟成 | Lighting lamp |
| CN113659057A (en) * | 2021-08-10 | 2021-11-16 | 深圳莱特光学科技有限公司 | Semiconductor packaging method and semiconductor structure thereof |
-
2009
- 2009-11-09 CN CN2009101100364A patent/CN102054918A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306689B (en) * | 2011-05-24 | 2013-01-02 | 江苏永兴多媒体有限公司 | Method for producing light-emitting diode (LED) bracket based on thermally conductive plastics |
| CN102306689A (en) * | 2011-05-24 | 2012-01-04 | 江苏永兴多媒体有限公司 | Method for producing light-emitting diode (LED) bracket based on thermally conductive plastics |
| CN102368530A (en) * | 2011-10-09 | 2012-03-07 | 常熟市华海电子有限公司 | LED (light-emitting diode) chip packaging structure |
| WO2013135153A1 (en) * | 2012-03-12 | 2013-09-19 | 浙江锐迪生光电有限公司 | Led lighting column and led lamp using same |
| CN102881228A (en) * | 2012-10-15 | 2013-01-16 | 广东欧珀移动通信有限公司 | Water-proofing method for display screen module |
| CN103050489B (en) * | 2012-12-24 | 2015-07-08 | 余姚市泰联照明电器有限公司 | LED (Light Emitting Diode) illuminating device |
| CN103050489A (en) * | 2012-12-24 | 2013-04-17 | 余姚市泰联照明电器有限公司 | LED (Light Emitting Diode) illuminating device |
| CN103545424A (en) * | 2013-10-29 | 2014-01-29 | 路旺培 | LED encapsulation method |
| CN103836409A (en) * | 2013-11-18 | 2014-06-04 | 上海亚浦耳照明电器有限公司 | LED light source and manufacturing method thereof |
| CN105257991A (en) * | 2015-10-09 | 2016-01-20 | 东莞市北科电子科技有限公司 | Ultraviolet light-emitting diode (UV LED) system |
| CN105240771A (en) * | 2015-11-10 | 2016-01-13 | 苏州汉克山姆照明科技有限公司 | LED automobile tail lamp |
| CN111197701A (en) * | 2020-02-03 | 2020-05-26 | 蒋伟成 | Lighting lamp |
| CN113659057A (en) * | 2021-08-10 | 2021-11-16 | 深圳莱特光学科技有限公司 | Semiconductor packaging method and semiconductor structure thereof |
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Application publication date: 20110511 |