CN205911308U - Compact design type rectifier bridge structure - Google Patents
Compact design type rectifier bridge structure Download PDFInfo
- Publication number
- CN205911308U CN205911308U CN201620841794.9U CN201620841794U CN205911308U CN 205911308 U CN205911308 U CN 205911308U CN 201620841794 U CN201620841794 U CN 201620841794U CN 205911308 U CN205911308 U CN 205911308U
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- China
- Prior art keywords
- input terminal
- packages body
- epoxy packages
- input
- packaging body
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Rectifiers (AREA)
Abstract
The utility model relates to a compact design type rectifier bridge structure, include: by wrap -around first, the second of epoxy packaging body, third, fourth diode chip and exposed AC input, the 2nd AC input, positive input terminal and cathode output that goes out the epoxy packaging body, AC input, the 2nd AC input lie in the front end department of the bottom of epoxy packaging body, the bottom of epoxy packaging body is used for contacting with PCB circuit board, positive input terminal, cathode output lie in the rear end department of the bottom of epoxy packaging body, and an insulating protruding strip lies in epoxy packaging body bottom to lie in that AC input, positive input terminal are young with the 2nd AC input, cathode output is between young. The utility model discloses compact design type rectifier bridge structure realizes in the compact product, do not reduce the basis of fin area on, the effectual pin creepage distance that has increased product body heat radiating area, has improved the reliability and the security of device.
Description
Technical field
The utility model is related to a kind of rectified semiconductor device, more particularly, to a kind of compact design type rectification bridge construction.
Background technology
The bridge architecture that rectifier bridge device is made up of four commutation diodes, it utilizes the unilateal conduction of diode
Characteristic carries out rectification to alternating current, because bridge rectifier doubles than ripple rectification to the utilization ratio inputting positive sine wave, is
One kind of diode halfwave rectifier is significantly improved, therefore is widely used in alternating current and is converted in galvanic circuit.
Existing rectifier bridge device structure rectifying device, simple production process, easy to operate.But every diode crystal particle place
Support chip flatness interacts and causes interiors of products stress state in procedure for producing to be not sufficiently stable, and crystal grain is impaired or contacts not
Good situation happens occasionally.For compact products, heat sink sizes are difficult to take into account with pin creep age distance, draw when fin is big
Pin creep age distance will reduce accordingly, when needing larger pin creep age distance, can only reduce fin area or increase product
Appearance and size.
Content of the invention
The utility model purpose be provide a kind of compact design type rectification bridge construction, this compact design type rectification bridge construction its
Realize, in compact products, on the basis of not reducing fin area, being effectively increased pin creep age distance, increased product
Product body area of dissipation, improves reliability and the security of device.
For reaching above-mentioned purpose, the technical solution adopted in the utility model is: a kind of compact design type rectification bridge construction, bag
Include: first, second, third, fourth diode chip for backlight unit being coated by epoxy packages body and the first friendship exposing epoxy packages body
Stream input terminal, the second AC input terminal, positive input terminal and negative output terminals, described first AC input terminal,
Second AC input terminal is located at the front end of bottom of epoxy packages body, and the bottom of described epoxy packages body is used for and pcb electricity
Road plate contact, described positive input terminal, negative output terminals are located at the rear end of the bottom of epoxy packages body, and an insulation is raised
Bar is located at epoxy packages body bottom, and is located at the first AC input terminal, positive input terminal and the second AC input terminal, bears
Between the lead-out terminal of pole.
In technique scheme, further improved scheme is as follows:
In such scheme, described positive input terminal near the outer face at epoxy packages body edge have 2 spaced apart
Positive pole extended leg, described negative output terminals have 2 negative poles spaced apart near the outer face at epoxy packages body edge
Extended leg.
Because technique scheme is used, the utility model compared with prior art has following advantages and an effect:
1. the utility model compact design type rectification bridge construction, in fact now in compact products, does not reduce radiating unilateral
On the basis of long-pending, it is effectively increased pin creep age distance, increased product ontology area of dissipation, improve the reliability of device
And security.
2. the utility model compact design type rectification bridge construction, its positive input terminal is near epoxy packages body edge
Outer face has 2 positive pole extended legs spaced apart, and described negative output terminals are near the outer face at epoxy packages body edge
There are 2 negative pole extended legs spaced apart, when producing, during cutting input terminal, reduce the internal influence to device.
Brief description
Accompanying drawing 1 is existing rectifier bridge device structural representation one；
Accompanying drawing 2 is existing rectifier bridge device structural representation two；
Accompanying drawing 3 is the utility model compact design type rectifier bridge structural representation；
Accompanying drawing 4 is the cross-sectional view of accompanying drawing 3.
In the figures above: 1, epoxy packages body；2nd, the first diode chip for backlight unit；3rd, the second diode chip for backlight unit；4th, the three or two pole
Die；5th, the 4th diode chip for backlight unit；6th, the first AC input terminal；7th, the second AC input terminal；8th, positive input terminal；
81st, positive pole extended leg；9th, negative output terminals；91st, negative pole extended leg；10th, pcb circuit board；11st, insulate raised item.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment is further described to the utility model:
A kind of embodiment 1: compact design type rectification bridge construction, comprising: first, second, being coated by epoxy packages body 1
3rd, the 4th diode chip for backlight unit 2,3,4,5 and expose the first AC input terminal 6 of epoxy packages body 1, the second ac input end
Son 7, positive input terminal 8 and negative output terminals 9, described first AC input terminal 6, the second AC input terminal 7 are located at
At the front end of the bottom of epoxy packages body 1, the bottom of described epoxy packages body 1 is used for contacting with pcb circuit board 10, described positive pole
Input terminal 8, negative output terminals 9 are located at the rear end of the bottom of epoxy packages body 1, and an insulation raised item 11 is located at epoxy and seals
Dress body 1 bottom, and it is located at the first AC input terminal 6, positive input terminal 8 and the second AC input terminal 7, cathode output end
Between son 9.
Above-mentioned positive input terminal 8 has 2 positive poles spaced apart near the outer face at epoxy packages body 1 edge and extends
Pin 81, described negative output terminals 9 have 2 negative pole extended legs spaced apart near the outer face at epoxy packages body 1 edge
91.
A kind of embodiment 2: compact design type rectification bridge construction, comprising: first, second, being coated by epoxy packages body 1
3rd, the 4th diode chip for backlight unit 2,3,4,5 and expose the first AC input terminal 6 of epoxy packages body 1, the second ac input end
Son 7, positive input terminal 8 and negative output terminals 9, described first AC input terminal 6, the second AC input terminal 7 are located at
At the front end of the bottom of epoxy packages body 1, the bottom of described epoxy packages body 1 is used for contacting with pcb circuit board 10, described positive pole
Input terminal 8, negative output terminals 9 are located at the rear end of the bottom of epoxy packages body 1, and an insulation raised item 11 is located at epoxy and seals
Dress body 1 bottom, and it is located at the first AC input terminal 6, positive input terminal 8 and the second AC input terminal 7, cathode output end
Between son 9.
During using above-mentioned compact design type rectification bridge construction, in fact now in compact products, do not reduce fin area
On the basis of, be effectively increased pin creep age distance, increased product ontology area of dissipation, improve device reliability and
Security；Secondly, its positive input terminal has 2 positive poles spaced apart near the outer face at epoxy packages body edge and extends
Pin, described negative output terminals have 2 negative pole extended legs spaced apart near the outer face at epoxy packages body edge, are giving birth to
During product, during cutting input terminal, reduce the internal influence to device.
Above-described embodiment is only that technology design of the present utility model and feature are described, its object is to allow and is familiar with technique
Personage will appreciate that content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.
All equivalence changes made according to the utility model Spirit Essence or modification, all should cover protection domain of the present utility model it
Interior.
Claims (2)
1. a kind of compact design type rectification bridge construction it is characterised in that: include: first, the being coated by epoxy packages body (1)
2nd, the 3rd, the 4th diode chip for backlight unit (2,3,4,5) and expose first AC input terminal (6) of epoxy packages body (1),
Two AC input terminals (7), positive input terminal (8) and negative output terminals (9), described first AC input terminal (6),
Two AC input terminals (7) are located at the front end of bottom of epoxy packages body (1), and the bottom of described epoxy packages body (1) is used for
Contact with pcb circuit board (10), described positive input terminal (8), negative output terminals (9) are located at the bottom of epoxy packages body (1)
The rear end in portion, insulation raised item (11) is located at epoxy packages body (1) bottom, and is located at the first AC input terminal (6), just
Between pole input terminal (8) and the second AC input terminal (7), negative output terminals (9).
2. compact design type rectification bridge construction according to claim 1 it is characterised in that: described positive input terminal (8)
Outer face near epoxy packages body (1) edge has 2 positive pole extended legs (81) spaced apart, described negative output terminals
(9) near the outer face at epoxy packages body (1) edge, there are 2 negative pole extended legs (91) spaced apart.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620841794.9U CN205911308U (en) | 2016-08-05 | 2016-08-05 | Compact design type rectifier bridge structure |
| PCT/CN2017/089464 WO2018024044A1 (en) | 2016-08-05 | 2017-06-22 | Bridge rectifier structure having compact design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620841794.9U CN205911308U (en) | 2016-08-05 | 2016-08-05 | Compact design type rectifier bridge structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205911308U true CN205911308U (en) | 2017-01-25 |
Family
ID=57803423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620841794.9U Active CN205911308U (en) | 2016-08-05 | 2016-08-05 | Compact design type rectifier bridge structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205911308U (en) |
| WO (1) | WO2018024044A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018024044A1 (en) * | 2016-08-05 | 2018-02-08 | 苏州固锝电子股份有限公司 | Bridge rectifier structure having compact design |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4724474A (en) * | 1986-12-05 | 1988-02-09 | Zenith Electronics Corporation | Power bridge rectifier assembly |
| CN201393177Y (en) * | 2009-04-24 | 2010-01-27 | 常州银河世纪微电子有限公司 | Rectification voltage stabilizer device |
| CN102856307A (en) * | 2011-06-28 | 2013-01-02 | 上海金克半导体设备有限公司 | Small-sized jumper dual bridge rectifier |
| CN106449539B (en) * | 2013-02-01 | 2019-08-02 | 苏州固锝电子股份有限公司 | Preventing offsetting labeling type semiconductor device architecture |
| CN103401438B (en) * | 2013-08-13 | 2015-11-11 | 苏州工业园区凯众通微电子技术有限公司 | Surface-mount bridge rectifier and manufacture method thereof |
| CN105185757B (en) * | 2015-10-08 | 2018-06-29 | 苏州固锝电子股份有限公司 | Heat radiating fin structure surface mount rectifier bridge device |
| CN205911308U (en) * | 2016-08-05 | 2017-01-25 | 苏州固锝电子股份有限公司 | Compact design type rectifier bridge structure |
-
2016
- 2016-08-05 CN CN201620841794.9U patent/CN205911308U/en active Active
-
2017
- 2017-06-22 WO PCT/CN2017/089464 patent/WO2018024044A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018024044A1 (en) * | 2016-08-05 | 2018-02-08 | 苏州固锝电子股份有限公司 | Bridge rectifier structure having compact design |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018024044A1 (en) | 2018-02-08 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |