CN102856307A - Small-sized jumper dual bridge rectifier - Google Patents

Small-sized jumper dual bridge rectifier Download PDF

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Publication number
CN102856307A
CN102856307A CN2011101764714A CN201110176471A CN102856307A CN 102856307 A CN102856307 A CN 102856307A CN 2011101764714 A CN2011101764714 A CN 2011101764714A CN 201110176471 A CN201110176471 A CN 201110176471A CN 102856307 A CN102856307 A CN 102856307A
Authority
CN
China
Prior art keywords
crystal grain
pin
pins
jumper
positive pole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011101764714A
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Chinese (zh)
Inventor
林茂昌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Jinke Semiconductor & Equipment Co ltd
Original Assignee
Shanghai Jinke Semiconductor & Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Jinke Semiconductor & Equipment Co ltd filed Critical Shanghai Jinke Semiconductor & Equipment Co ltd
Priority to CN2011101764714A priority Critical patent/CN102856307A/en
Publication of CN102856307A publication Critical patent/CN102856307A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

The invention discloses a small-sized jumper dual bridge rectifier which comprises a package, four grains and four pins. The four dices and the four pins are disposed in the package. The four pins are led out of two sides of the package and are arranged in two rows. Two pins led out of one side form alternating current input ends of the bridge rectifier, and the other two pins led out of the other side form a positive-negative output end of the bridge rectifier. The four dices are fixed on the two pins serving as the alternating current input ends and one pin serving as the positive-negative output end, two dices are fixed on the two pins serving as the alternating input ends, and two dices are fixed on one pin serving as the positive-negative output end. Polarities of the four dices are in the same direction. The four pins and the four dices are connected to form the bridge rectifier through four jumpers. The polarities of the four dices are in the same direction, the difficulty in dice sorting in the packaging process is reduced, and packaging efficiency is improved.

Description

A kind of small-scale jumper-type double-row bridge rectifier
Technical field
The present invention relates to rectistack, relate in particular to a kind of small-scale jumper-type double-row bridge rectifier of AC-DC.
Background technology
The bridge architecture that bridge rectifier is comprised of four rectifier diodes, it utilizes the unilateal conduction characteristic of diode that alternating current is carried out rectification, because bridge rectifier must utilize efficient to double than halfwave rectifier to input sine wave, be a kind of remarkable improvement to the diode halfwave rectifier, convert in the galvanic circuit so be widely used in alternating current.
Along with electronic product develops to miniaturization, what require that the profile of semi-conductor electronic device does is again little and thin.Present minimize bridge heap mainly is divided into two classes, and a class is direct insertion bridge heap, and another kind is SMD bridge heap.
For SMD bridge heap, more typical structure has following several at present: 1, the disclosed a kind of miniature semiconductor rectifier bridge of Chinese invention patent publication number CN1197989A, it comprises the two diode crystal grain that have N-type altogether and the two diode crystal grain that have the P type altogether, wherein altogether a p type island region of N-type crystal grain together a corresponding N-type fauna of P type crystal grain be connected to a terminal electrode of first group of lead frame, altogether another p type island region of N-type crystal grain then together another N-type district of P type crystal grain be connected to the another terminal electrode of first group of lead frame, and altogether the N-type district of N-type crystal grain together the p type island region of P type crystal grain then be connected to respectively the two-terminal electrode of second group of lead frame, thereby consist of a bridge rectifier, although this miniature rectifier structurally is conducive to microminiaturization, but need to adopt the double diode chip of two kinds in the manufacturing, namely have N-type double diode chip altogether and have P type double diode chip altogether, cause easily following problem: 1) acp chip is wide in variety, and complex process shape increases; 2) chip yield is relatively low; 3) owing to there are two chip kinds, uniformity is relatively poor; 4) chip of P type substrate relatively difficulty do.2, the disclosed sheet type miniature bridge stack of Chinese invention patent Granted publication CN2545706Y, it is in a packaging body, form bridge rectifier by four rectifier diodes, four rectifier diodes are made of identical PN junction chip, spatially two and be listed in of four PN junction chips, two and be listed in down in addition, the p type island region of each PN junction chip and N-type district arrange up and down, wherein the p type island region of diagonal position PN junction chip is identical with orientation, N-type district, adopt respectively a connecting piece to connect between two PN junction chips repeatedly putting up and down, and be listed in and be connected two PN junction chips under being listed in and adopt respectively another brace to connect, two braces on the intermediate layer are as one group of electrode terminal, two braces on the upper and lower are organized electrode terminal as another, and draw in packaging body respectively, consist of miniature five layers of rectifier bridge stack structure with this.Because this patent adopts five-layer structure, the thickness of its product is generally about 2.5~2.7mm, the inner many accommodation spaces of electronic product have not only been taken, and because the processing step that is arranged so that the production and processing of bridge heap of sandwich construction increases, the location is installed for simultaneously each layer parts and has proposed higher requirement.
Four crystal grain both positive and negative polarities of existing SMD bridge heap are not to be positioned at same direction in addition, and when causing like this encapsulation, the crystal grain difficulty of arranging confounds easily, therefore need to take a long time crystal grain is sorted, so that production efficiency reduces.
Summary of the invention
Technical problem to be solved by this invention is to provide for the existing problem of above-mentioned rectifier bridge stack a kind of easy to assembly, good heat dissipation effect, small-scale jumper-type double-row bridge rectifier that volume is little.
Technical problem to be solved by this invention can be achieved through the following technical solutions:
A kind of small-scale jumper-type double-row bridge rectifier comprises a packaging body and is arranged on packaging body interior four crystal grain and four pins that it is characterized in that described four pins are drawn by the two opposite sides of described packaging body, the exit of four pins becomes biserial to arrange; Described two pins of being drawn by an opposite side consist of the ac input end of bridge heap, and described two other pin of being drawn by another opposite side consists of the both positive and negative polarity output of bridge heap; Described four crystal grain are fixed on as on two pins of ac input end and on one of them pin as the both positive and negative polarity output, wherein each fixes a crystal grain respectively on as two pins of ac input end, is fixed with two crystal grain at one of them pin as the both positive and negative polarity output; The polarity of four crystal grain towards identical; Described four pins and four intergranules connect and compose a rectifier bridge stack by four wire jumpers.
In a preferred embodiment of the invention, the positive pole of described four crystal grain down, wherein the positive pole of first and second crystal grain is separately fixed on described first, second pin as ac input end, and the positive pole of the 3rd, the 4th crystal grain is fixed on described the 3rd pin as cathode output end; The negative pole of first, second crystal grain is respectively by on first, second wire jumper and described the 4th pin as cathode output end, the negative pole of the 3rd crystal grain is electrically connected by the 3rd wire jumper and described the first pin, and the negative pole of the 4th crystal grain is electrically connected by the forth jump line and described the second pin.
In a preferred embodiment of the invention, the negative positive pole of described four crystal grain down, wherein the negative positive pole of first and second crystal grain is separately fixed on described first, second pin as ac input end, and the negative pole of the 3rd, the 4th crystal grain is fixed on described the 4th pin as cathode output end; The positive pole of first, second crystal grain is respectively by on first, second wire jumper and described the 3rd pin as cathode output end, the positive pole of the 3rd crystal grain is electrically connected by the 3rd wire jumper and described the first pin, and the positive pole of the 4th crystal grain is electrically connected by the four or three wire jumper and described the second pin.
In a preferred embodiment of the invention, described four pins part of extending described packaging body is in the same plane.
Owing to adopted technical scheme as above, the present invention compared with prior art has following advantages:
1, the polarity with four crystal grain is identical towards being arranged to, and has reduced the difficulty in the ordering of encapsulation process crystal grain, has improved the encapsulation work efficiency.
2, crystal grain kind of the present invention only need be a kind of, the purchase cost of having saved crystal grain; The qualification rate of crystal grain is very high simultaneously, once the quality qualification rate after the encapsulation 〉=99.9%.
3, crystal grain and pin adopt the layering tiling, can realize automated production, have reduced simultaneously the thickness of bridge heap, have saved sizing material, so that the volume of bridge heap is less, weight is lighter.
4, pin can adopt tower structure, has saved the waste of material, and the waste rate that makes copper material drops to 5% by original 25%.
Description of drawings
Fig. 1 is the internal structure schematic diagram of small-scale jumper-type double-row bridge rectifier embodiment 1 of the present invention.
Fig. 2 is the internal structure schematic diagram of small-scale jumper-type double-row bridge rectifier embodiment 2 of the present invention.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect is easy to understand, below in conjunction with concrete drawings and Examples, further set forth the present invention.
Embodiment 1
Referring to Fig. 1, the small-scale jumper-type double-row bridge rectifier shown in the figure comprises a packaging body 100 and is arranged on four crystal grain 210 in the packaging body 100,220,230,240 and four pins 310,320,330,340.Pin 310,320 is drawn by an opposite side of packaging body 100, and pin 330,340 is drawn by another opposite side of packaging body 100, and pin 310 is arranged as row with pin 330, and pin 320 is arranged as other row with pin 340; Pin 310,320 consists of the ac input end of bridge heap, and pin 330 consists of the cathode output end of bridge heap, and pin 340 consists of the cathode output end of bridge heap.Crystal grain 210,220,230,240 positive pole all down, negative pole up, wherein the positive pole of crystal grain 210 and pin 310 are welded to connect, the positive pole of crystal grain 220 and pin 320 are welded to connect, crystal grain 230,240 positive pole and pin 330 are welded to connect, the negative pole of crystal grain 210 is electrically connected by wire jumper 410 and pin 340, the negative pole of crystal grain 220 is electrically connected by wire jumper 420 and pin 340, the negative pole of crystal grain 230 is electrically connected by wire jumper 430 and pin 310, the negative pole of crystal grain 240 is electrically connected by wire jumper 440 and pin 320, and pin 310 like this, 320,330,340 and crystal grain 210,220,230, pass through wire jumper 410 between 240,420,430,440 connect and compose a rectifier bridge stack.
Embodiment 2
Referring to Fig. 2, the small-scale jumper-type double-row bridge rectifier shown in the figure comprises a packaging body 100 and is arranged on four crystal grain 210 in the packaging body 100,220,230,240 and four pins 310,320,330,340.Pin 310,320 is drawn by an opposite side of packaging body 100, and pin 330,340 is drawn by another opposite side of packaging body 100, and pin 310 is arranged as row with pin 330, and pin 320 is arranged as other row with pin 340; Pin 310,320 consists of the ac input end of bridge heap, and pin 330 consists of the cathode output end of bridge heap, and pin 340 consists of the cathode output end of bridge heap.Crystal grain 210,220,230,240 negative pole all down, positive pole up, wherein the negative pole of crystal grain 210 and pin 310 are welded to connect, the negative pole of crystal grain 220 and pin 320 are welded to connect, crystal grain 230,240 negative pole and pin 330 are welded to connect, the positive pole of crystal grain 210 is electrically connected by wire jumper 410 and pin 340, the positive pole of crystal grain 220 is electrically connected by wire jumper 420 and pin 340, the positive pole of crystal grain 230 is electrically connected by wire jumper 430 and pin 310, the positive pole of crystal grain 240 is electrically connected by wire jumper 440 and pin 320, and pin 310 like this, 320,330,340 and crystal grain 210,220,230, pass through wire jumper 410 between 240,420,430,440 connect and compose a rectifier bridge stack.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that describes in above-described embodiment and the specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.

Claims (4)

1. a small-scale jumper-type double-row bridge rectifier comprises a packaging body and is arranged on packaging body interior four crystal grain and four pins, and it is characterized in that described four pins are drawn by the two opposite sides of described packaging body, the exit of four pins becomes biserial to arrange; Described two pins of being drawn by an opposite side consist of the ac input end of bridge heap, and described two other pin of being drawn by another opposite side consists of the both positive and negative polarity output of bridge heap; Described four crystal grain are fixed on as on two pins of ac input end and on one of them pin as the both positive and negative polarity output, wherein each fixes a crystal grain respectively on as two pins of ac input end, is fixed with two crystal grain at one of them pin as the both positive and negative polarity output; The polarity of four crystal grain towards identical; Described four pins and four intergranules connect and compose a rectifier bridge stack by four wire jumpers.
2. small-scale jumper-type double-row bridge rectifier as claimed in claim 1, it is characterized in that, the positive pole of described four crystal grain down, wherein the positive pole of first and second crystal grain is separately fixed on described first, second pin as ac input end, and the positive pole of the 3rd, the 4th crystal grain is fixed on described the 3rd pin as cathode output end; The negative pole of first, second crystal grain is respectively by on first, second wire jumper and described the 4th pin as cathode output end, the negative pole of the 3rd crystal grain is electrically connected by the 3rd wire jumper and described the first pin, and the negative pole of the 4th crystal grain is electrically connected by the forth jump line and described the second pin.
3. small-scale jumper-type double-row bridge rectifier as claimed in claim 1, it is characterized in that, the negative positive pole of described four crystal grain down, wherein the negative positive pole of first and second crystal grain is separately fixed on described first, second pin as ac input end, and the negative pole of the 3rd, the 4th crystal grain is fixed on described the 4th pin as cathode output end; The positive pole of first, second crystal grain is respectively by on first, second wire jumper and described the 3rd pin as cathode output end, the positive pole of the 3rd crystal grain is electrically connected by the 3rd wire jumper and described the first pin, and the positive pole of the 4th crystal grain is electrically connected by the four or three wire jumper and described the second pin.
4. such as the described small-scale jumper-type double-row bridge rectifier of each claim of claims 1 to 3, it is characterized in that the part that described four pins extend described packaging body is in the same plane.
CN2011101764714A 2011-06-28 2011-06-28 Small-sized jumper dual bridge rectifier Pending CN102856307A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011101764714A CN102856307A (en) 2011-06-28 2011-06-28 Small-sized jumper dual bridge rectifier

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105957853A (en) * 2016-06-21 2016-09-21 九江浩峰电子科技有限公司 Rectifier bridge welding structure and manufacturing technology thereof
WO2018024044A1 (en) * 2016-08-05 2018-02-08 苏州固锝电子股份有限公司 Bridge rectifier structure having compact design
CN108736743A (en) * 2018-07-09 2018-11-02 山东晶导微电子股份有限公司 A kind of direct insertion rectifier bridge device with output protection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2901580Y (en) * 2006-02-24 2007-05-16 梁锦荣 Single row direct insert full wave rectifier bridge stack
CN201393177Y (en) * 2009-04-24 2010-01-27 常州银河世纪微电子有限公司 Rectification voltage stabilizer device
CN202111086U (en) * 2011-06-28 2012-01-11 上海金克半导体设备有限公司 Small-scale jumper-type double-row bridge rectifier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2901580Y (en) * 2006-02-24 2007-05-16 梁锦荣 Single row direct insert full wave rectifier bridge stack
CN201393177Y (en) * 2009-04-24 2010-01-27 常州银河世纪微电子有限公司 Rectification voltage stabilizer device
CN202111086U (en) * 2011-06-28 2012-01-11 上海金克半导体设备有限公司 Small-scale jumper-type double-row bridge rectifier

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105957853A (en) * 2016-06-21 2016-09-21 九江浩峰电子科技有限公司 Rectifier bridge welding structure and manufacturing technology thereof
WO2018024044A1 (en) * 2016-08-05 2018-02-08 苏州固锝电子股份有限公司 Bridge rectifier structure having compact design
CN108736743A (en) * 2018-07-09 2018-11-02 山东晶导微电子股份有限公司 A kind of direct insertion rectifier bridge device with output protection
CN108736743B (en) * 2018-07-09 2024-05-24 山东晶导微电子股份有限公司 Direct-insert rectifier bridge device with output protection

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Application publication date: 20130102