CN219203185U

CN219203185U - LED chip stacking structure and LED package

Info

Publication number: CN219203185U
Application number: CN202320145782.2U
Authority: CN
Inventors: 陈亚勇; 蔡江艺; 吴书麟; 杜涛; 魏亚河; 张会
Original assignee: Xiamen Xindeco Optoelectronics Co ltd
Current assignee: Xiamen Xindeco Optoelectronics Co ltd
Priority date: 2023-01-17
Filing date: 2023-01-17
Publication date: 2023-06-16
Anticipated expiration: 2033-01-17

Abstract

The utility model relates to the technical field of LEDs, in particular to an LED chip stacking structure and an LED package. The LED chip stacking structure at least comprises a first LED chip and a second LED chip; the first LED chip is of a horizontal structure, and the upper surface of the first LED chip comprises a light-emitting area with a light-emitting layer and a welding area without the light-emitting layer; the first electrode is arranged on the light-emitting area of the first LED chip, and the second LED chip is welded on the welding area of the first LED chip. The LED package includes the LED chip stack structure. The LED chip stacking structure provided by the utility model can further reduce the size of the LED packaging body, is beneficial to reducing the pixel spacing, improving the pixel density, and has smaller chip spacing and is beneficial to light mixing.

Description

LED chip stacking structure and LED package

Technical Field

The utility model relates to the technical field of LEDs, in particular to an LED chip stacking structure and an LED package.

Background

LEDs are a common light emitting device and have been used for over sixty years. The LED can efficiently convert electric energy into light energy, and has the characteristics of environmental protection and energy saving.

In recent years, as technology advances, LED packages are smaller and smaller, but still cannot meet the ever-evolving application requirements. Up to now, how to further reduce the size of the LED package is still a big research focus in the field.

Disclosure of Invention

In order to further reduce the size of the LED package, the utility model provides an LED chip stacking structure and an LED package.

Specifically, the technical scheme of the utility model is as follows:

an LED chip stacking structure at least comprises a first LED chip and a second LED chip; the first LED chip is of a horizontal structure, and the upper surface of the first LED chip comprises a light-emitting area with a light-emitting layer and a welding area without the light-emitting layer; the first electrode is arranged on the light-emitting area of the first LED chip, and the second LED chip is welded on the welding area of the first LED chip.

Preferably, the first LED chip includes a substrate, an N-type layer, a light emitting layer and a P-type layer that are sequentially stacked, the light emitting area of the first LED chip is a portion having the light emitting layer and the P-type layer, and the bonding area of the first LED chip is an exposed portion of the N-type layer; or, the first LED chip comprises a substrate, a P-type layer, a light-emitting layer and an N-type layer which are sequentially stacked, the light-emitting area of the first LED chip is a part with the light-emitting layer and the N-type layer, and the welding area of the first LED chip is a bare part of the P-type layer.

Preferably, the second LED chip has a vertical structure, and electrodes are respectively disposed on the upper surface and the lower surface of the second LED chip, and the second LED chip is welded on the welding area of the first LED chip through the electrodes disposed on the lower surface of the second LED chip and is electrically connected with the first LED chip.

Preferably, the second LED chip is arranged in series with the first LED chip; or, the second LED chip is arranged in parallel with the first LED chip, and the welding area of the first LED chip is also provided with a second electrode.

Preferably, the LED chip stack structure further includes a third LED chip, and the third LED chip is also soldered on the soldering region of the first LED chip.

Preferably, the third LED chip has a vertical structure, and electrodes are respectively disposed on the upper surface and the lower surface of the third LED chip, and the third LED chip is welded on the welding area of the first LED chip through the electrodes disposed on the lower surface of the third LED chip and is electrically connected with the first LED chip.

Preferably, the second LED chip and/or the third LED chip are arranged in series with the first LED chip; or, the second LED chip and the third LED chip are both arranged in parallel with the first LED chip, and the welding area of the first LED chip is also provided with a second electrode.

Preferably, the LED chip stack structure further includes a third LED chip soldered on the second LED chip.

Preferably, the LED chip stacking structure further includes a fourth LED chip, the fourth LED chip is a CSP white LED chip, and the fourth LED chip is soldered on the first, second or third LED chip.

An LED package comprising an LED chip stack structure as described above.

The beneficial technical effects of the utility model are as follows:

the LED chip stacking structure provided by the utility model can further reduce the size of the LED packaging body, is beneficial to reducing the pixel spacing, improving the pixel density, and has smaller chip spacing and is beneficial to light mixing.

Drawings

FIG. 1 is a schematic diagram of an LED chip stacking structure according to an embodiment;

FIG. 2 is a schematic diagram of a stacked structure of LED chips according to the second embodiment;

FIG. 3 is a schematic diagram of a three LED chip stacking structure according to an embodiment;

FIG. 4 is a schematic diagram of a stacked structure of LED chips according to the fourth embodiment;

FIG. 5 is a schematic diagram of a fifth embodiment of a stacked LED chip structure;

fig. 6 is a schematic diagram of a stacked structure of a sixth LED chip according to the embodiment;

fig. 7 is a structural diagram of a seventh LED package of the embodiment;

FIG. 8 is an exploded view of the LED package of FIG. 7;

fig. 9 is a top view of the portion a shown in fig. 8.

Detailed Description

The utility model will be described in further detail with reference to the accompanying drawings and specific examples.

Embodiment one:

as shown in fig. 1, the present embodiment provides an LED chip stacking structure including a first LED chip and a second LED chip; the first LED chip is of a horizontal structure, and the upper surface of the first LED chip comprises a light-emitting area with a light-emitting layer and a welding area without the light-emitting layer; the first electrode 15 is arranged on the light-emitting area of the first LED chip, and the second LED chip is welded on the welding area of the first LED chip.

In this embodiment, the first LED chip includes a substrate 11, an N-type layer 12, a light emitting layer (not shown), and a P-type layer 13, which are sequentially stacked, and the light emitting region of the first LED chip is a portion having the light emitting layer and the P-type layer 13, and the bonding region of the first LED chip is an exposed portion of the N-type layer 12. In other embodiments, the positions of the N-type layer and the P-type layer may also be reversed.

In this embodiment, the second LED chip has a vertical structure, and includes an electrode 21, an N-type layer 22, a light emitting layer (not shown), a P-type layer 23, and an electrode 24, which are sequentially stacked, the polarities of the electrode 21 and the electrode 24 being opposite, and the second LED chip is soldered on the soldering region of the first LED chip through the electrode 21 provided on the lower surface thereof and electrically connected to the first LED chip. In other embodiments, the bonding area of the first LED chip may be an exposed portion of the upper surface of the substrate 11, and the second LED chip is bonded to the substrate 11.

In this embodiment, the second LED chip is disposed in parallel with the first LED chip, and the second electrode 14 is further disposed on the bonding area of the first LED chip.

Embodiment two:

as shown in fig. 2, the present embodiment differs from the first embodiment in that the second LED chip includes an electrode 21, a P-type layer 22, a light emitting layer (not shown), an N-type layer 23, and an electrode 24, which are sequentially stacked, and the second LED chip is disposed in series with the first LED chip, which does not include the second electrode 14.

Embodiment III:

as shown in fig. 3, the present embodiment is different from the first embodiment in that a third LED chip is further stacked on the first LED chip, and the third LED chip is soldered on the soldering region of the first LED chip.

In this embodiment, the third LED chip is of a vertical structure, including an electrode 31, an N-type layer 32, a light emitting layer (not shown), a P-type layer 33, and an electrode 34, which are sequentially stacked, is soldered on the soldering region of the first LED chip through the electrode 31 provided on the lower surface thereof and is electrically connected to the first LED chip.

In this embodiment, the third LED chip is disposed in parallel with the first LED chip.

Embodiment four:

as shown in fig. 4, the difference between the present embodiment and the second embodiment is that a third LED chip is further stacked on the first LED chip, and the third LED chip is soldered on the soldering area of the first LED chip.

In this embodiment, the third LED chip is of a vertical structure, including an electrode 31, a P-type layer 32, a light emitting layer (not shown), an N-type layer 33, and an electrode 34, which are sequentially stacked, is soldered on the soldering region of the first LED chip through the electrode 31 provided on the lower surface thereof and is electrically connected to the first LED chip.

In this embodiment, the third LED chip is disposed in series with the first LED chip.

Fifth embodiment:

as shown in fig. 5, the present embodiment differs from the fourth embodiment in that the third LED chip includes an electrode 31, an N-type layer 32, a light emitting layer (not shown), a P-type layer 33, and an electrode 34, which are sequentially stacked, and is disposed in parallel with the first LED chip.

Example six:

as shown in fig. 6, the present embodiment is different from the second embodiment in that a third LED chip is further stacked on the second LED chip, and the third LED chip is soldered on the second LED chip.

In this embodiment, the third LED chip is of a vertical structure and is disposed in series with the second LED chip.

Embodiment seven:

the present embodiment provides an LED package including the LED chip stack structure of the third embodiment, which includes the first LED chip 1 of the horizontal structure, the second LED chip 2 of the vertical structure, and the third LED chip 3 of the vertical structure, as shown in fig. 7 to 8, the second LED chip 2, the third LED chip 3 being stacked on the first LED chip 1, respectively, and being disposed in parallel with the first LED chip 1, respectively.

In the present embodiment, the second LED chip 2 and the third LED chip 3 are soldered to the electrodes 14 of the first LED chip 1, respectively. In other embodiments, it may be soldered to the N-type layer 12 of the first LED chip 1.

The core of the utility model is that the stacked chips are located outside the light emitting area of the first LED chip while the package size is reduced by chip stacking. As to why the number of the upper chips, why the structure is connected in series and parallel with the first LED chip, it is possible to adjust the number of the upper chips as needed.

In this embodiment, as shown in fig. 9, the second LED chip 2 and the third LED chip 3 are respectively arranged with the first LED chip 1 in a common cathode, the number of wires is small, and the connection between each chip electrode and the package electrode can be completed only by four wires 4. Similarly, if the first, second and third LED chips are changed from the N-type layer to the P-type layer, the second and

third LED chips

2 and 3 are respectively arranged in common with the first LED chip 1, and only four wires are needed.

In other embodiments, if the second LED chip 2 and/or the third LED chip 3 is changed from a vertical structure to a horizontal structure, the number of wires required may be increased.

In this embodiment, the first, second, and third LED chips are blue, green, and red LED chips, respectively, and in other embodiments, the stacking order may be adjusted as needed. The blue light, green light and red light LED chips are stacked to realize RGB full-color display, the light mixing effect is good, and the size of the package body is small.

In other embodiments, a fourth LED chip may be stacked on the first, second, third, or third LED chips, which are blue, green, red, CSP white LED chips, respectively, and in other embodiments, the stacking order may be adjusted as desired. The blue light, green light, red light and white light LED chips are stacked to realize RGBW full-color display, the light mixing effect is good, and the size of the package body is small.

The above description is only of the preferred embodiments of the present utility model, and is not intended to limit the present utility model. It should be noted that any modifications, equivalent substitutions, improvements, etc. made by those skilled in the art without departing from the spirit and principles of the present utility model are intended to be included in the scope of the present utility model.

Claims

1. An LED chip stacking structure, characterized in that: at least comprising a first LED chip and a second LED chip; the first LED chip is of a horizontal structure, and the upper surface of the first LED chip comprises a light-emitting area with a light-emitting layer and a welding area without the light-emitting layer; the first electrode is arranged on the light-emitting area of the first LED chip, and the second LED chip is welded on the welding area of the first LED chip.

2. The LED chip stack structure of claim 1, wherein: the first LED chip comprises a substrate, an N-type layer, a light-emitting layer and a P-type layer which are sequentially stacked, wherein a light-emitting area of the first LED chip is a part with the light-emitting layer and the P-type layer, and a welding area of the first LED chip is an exposed part of the N-type layer; or, the first LED chip comprises a substrate, a P-type layer, a light-emitting layer and an N-type layer which are sequentially stacked, the light-emitting area of the first LED chip is a part with the light-emitting layer and the N-type layer, and the welding area of the first LED chip is a bare part of the P-type layer.

3. The LED chip stack structure of claim 2, wherein: the second LED chip is of a vertical structure, electrodes are respectively arranged on the upper surface and the lower surface of the second LED chip, and the second LED chip is welded on a welding area of the first LED chip through the electrodes arranged on the lower surface of the second LED chip and is electrically connected with the first LED chip.

4. The LED chip stack structure of claim 3, wherein: the second LED chip is connected with the first LED chip in series; or, the second LED chip is arranged in parallel with the first LED chip, and the welding area of the first LED chip is also provided with a second electrode.

5. The LED chip stack structure of claim 2, wherein: the LED chip also comprises a third LED chip which is welded on the welding area of the first LED chip.

6. The LED chip stack structure of claim 5, wherein: the third LED chip is of a vertical structure, electrodes are respectively arranged on the upper surface and the lower surface of the third LED chip, and the third LED chip is welded on a welding area of the first LED chip through the electrodes arranged on the lower surface of the third LED chip and is electrically connected with the first LED chip.

7. The LED chip stack structure of claim 6, wherein: the second LED chip and/or the third LED chip are/is arranged in series with the first LED chip; or, the second LED chip and the third LED chip are both arranged in parallel with the first LED chip, and the welding area of the first LED chip is also provided with a second electrode.

8. The LED chip stack structure of claim 3, wherein: the LED lamp further comprises a third LED chip, and the third LED chip is welded on the second LED chip.

9. The LED chip stack structure according to claim 5 or 8, characterized in that: the LED lamp also comprises a fourth LED chip, wherein the fourth LED chip is a CSP white light LED chip, and the fourth LED chip is welded on the first, second or third LED chip.

10. An LED package, characterized in that: comprising the LED chip stack structure according to any one of claims 1 to 9.