CN207781590U - High reliability compact rectifier bridge structure - Google Patents

Abstract

The utility model discloses a kind of high reliability compact rectifier bridge structure, including：The first, second, third, fourth diode chip for backlight unit coated by epoxy packages body and the first Z-shaped input pin, the second Z-shaped input pin, L-shaped anode input pin and the L-shaped cathode output pin for exposing epoxy packages body；The L-shaped anode input pin and L-shaped cathode output pin are made of wafer support area, direct current output lead portion and the second bending part between wafer support area, direct current output lead portion, the L-shaped anode input pin and L-shaped cathode output pin respective wafer support area intermediate region are provided with first through hole, and respectively wafer support area is provided with the second through-hole close to the side of direct current output lead portion for the L-shaped anode input pin and L-shaped cathode output pin.The utility model reduces structural stress and reduces effect of the epoxy injecting glue in the process to internal structural impact power.

Description

High reliability compact rectifier bridge structure

technical field

The utility model relates to a rectifying semiconductor device, in particular to a compact rectifying bridge structure with high reliability.

Background technique

The rectifier bridge device is a bridge structure composed of four rectifier diodes. It uses the unidirectional conduction characteristics of the diodes to rectify the alternating current. Since the utilization efficiency of the bridge rectifier for the input sine wave is twice that of the wave rectification, it is suitable for A significant improvement of diode half-wave rectification, it is widely used in circuits that convert alternating current to direct current.

The structure of the existing rectifier bridge device is limited by the space layout, and it cannot be packaged with a chip with a larger size above 60mil, which cannot meet the needs of miniaturization of end products. The product structure is stressed, and it is not suitable for packaging large-sized chips with a size above 60mil. The thickness of the product is generally large. It cannot meet the needs of compact design of end products, and the precision of the production process determined by the product structure is not high.

Contents of the invention

The purpose of the utility model is to provide a high-reliability compact rectifier bridge structure, which reduces the structural stress and the impact force on the internal structure during the epoxy glue injection process, and improves the device reliability.

In order to achieve the above purpose, the technical solution adopted by the utility model is: a high-reliability compact rectifier bridge structure, including: the first, second, third, and fourth diode chips covered by an epoxy package and the first Z-shaped input pin, the second Z-shaped input pin, the L-shaped positive input pin and the L-shaped negative output pin of the exposed epoxy package body;

The respective anodes of the first and second diode chips are electrically connected to the upper surface of the L-shaped positive input pin, and the respective negative electrodes of the third and fourth diode chips are electrically connected to the upper surface of the L-shaped negative output pin. The negative pole of the diode chip and the positive pole of the fourth diode chip are electrically connected to the first Z-shaped input pin through the first connecting piece, and the negative pole of the second diode chip and the positive pole of the third diode chip are connected to each other. electrically connected to the second Z-shaped input pin through the second connecting piece;

Both the L-shaped positive input pin and the L-shaped negative output pin are composed of a chip support area, a DC output pin part, and a second bending part between the chip support area and the DC output pin part. A first through hole is opened in the middle area of the respective chip supporting areas of the positive input pin and the negative output pin of the L shape, and the respective chip supporting areas of the positive input pin of the L shape and the negative output pin of the L shape are close to the DC output pin One side of the part is provided with a second through hole.

The scheme of further improvement in above-mentioned technical scheme is as follows:

1. In the above scheme, the first Z-shaped input pin and the second Z-shaped input pin are composed of a horizontal connection part, a horizontal input pin part, and a first pin between the horizontal connection part and the horizontal input pin part. The bending part is composed.

2. In the above solution, the included angle between the DC output pin part and the second bending part is 110°~150°.

Due to the application of the above-mentioned technical solutions, the utility model has the following advantages and effects compared with the prior art:

1. The high-reliability compact rectifier bridge structure of the present utility model has a first through hole in the middle area of the respective chip support areas of the L-shaped positive input pin and the L-shaped negative output pin, and the L-shaped positive input pin There is a second through hole on the side of the chip support area close to the DC output pin of the L-shaped negative output pin, which reduces the structural stress and the impact on the internal structure during the epoxy glue injection process. The reliability of the device is improved.

2. The high-reliability compact rectifier bridge structure of the utility model realizes the design requirement of encapsulating a larger chip size in a smaller product size through an optimized product structure, and the maximum chip size is increased from 60mil to 88mil, solving the problem of The structural stress problem caused by large-size chips has been solved, and the thickness of the product has been reduced to about 40% of the original. Through the optimized product structure and lead frame structure, the process efficiency has been increased by more than 1 times.

Description of drawings

Accompanying drawing 1 is the utility model high reliability compact rectifier bridge structure schematic diagram;

Accompanying drawing 2 is the schematic cross-sectional structure diagram of accompanying drawing 1.

In the above drawings: 1. Epoxy package; 2. The first diode chip; 3. The second diode chip; 4. The third diode chip; 5. The fourth diode chip; 6. The first Z-shaped input pin; 7. The second Z-shaped input pin; 8. The L-shaped positive input pin; 9. The L-shaped negative output pin; 101. The horizontal connection part; 102. The horizontal input pin; 103. The first bending part; 111. The chip support area; 112. The DC output pin part; 113. The second bending part; 12. The first through hole; 13. The second through hole; 14. The first connecting piece ; 15, the second connecting piece.

Detailed ways

Below in conjunction with accompanying drawing and embodiment the utility model is further described:

Embodiment 1: A high-reliability compact rectifier bridge structure, including: first, second, third, fourth diode chips 2, 3, 4, 5 and bare diode chips covered by epoxy package 1 The first Z-shaped input pin 6, the second Z-shaped input pin 7, the L-shaped positive input pin 8 and the L-shaped negative output pin 9 of the epoxy package 1;

The respective anodes of the first and second diode chips 2 and 3 are electrically connected to the upper surface of the L-shaped positive input pin 8, and the respective negative poles of the third and fourth diode chips 4 and 5 are connected to the L-shaped negative output pin. 9. The upper surface is electrically connected, the cathode of the first diode chip 2 and the anode of the fourth diode chip 5 are electrically connected to the first Z-shaped input pin 6 through the first connecting piece 14, and the second diode chip The negative pole of 3 and the positive pole of the third diode chip 4 are electrically connected to the second Z-shaped input pin 7 through the second connecting piece 15;

Both the L-shaped positive input pin 8 and the L-shaped negative output pin 9 are composed of a chip support area 111, a DC output pin portion 112, and a second bend between the chip support area 111 and the DC output pin portion 112. part 113, the L-shaped positive input pin 8 and the L-shaped negative output pin 9 respectively have a first through hole 12 in the middle area of the chip support area 111, and the L-shaped positive input pin 8 and the L-shaped negative output pin A second through hole 13 is opened on a side of the chip supporting area 111 of each output pin 9 close to the DC output pin portion 112 .

The above-mentioned first Z-shaped input pin 6 and the second Z-shaped input pin 7 are all composed of a horizontal connection part 101, a horizontal input pin part 102 and a first fold between the horizontal connection part 101 and the horizontal input pin part 102. The bent portion 103 is formed.

The included angle between the DC output pin portion 112 and the second bent portion 113 is 130°.

Embodiment 2: A high-reliability compact rectifier bridge structure, including: first, second, third, fourth diode chips 2, 3, 4, 5 and bare diode chips covered by epoxy package 1 The first Z-shaped input pin 6, the second Z-shaped input pin 7, the L-shaped positive input pin 8 and the L-shaped negative output pin 9 of the epoxy package 1;

The respective anodes of the first and second diode chips 2 and 3 are electrically connected to the upper surface of the L-shaped positive input pin 8, and the respective negative poles of the third and fourth diode chips 4 and 5 are connected to the L-shaped negative output pin. 9. The upper surface is electrically connected, the cathode of the first diode chip 2 and the anode of the fourth diode chip 5 are electrically connected to the first Z-shaped input pin 6 through the first connecting piece 14, and the second diode chip The negative pole of 3 and the positive pole of the third diode chip 4 are electrically connected to the second Z-shaped input pin 7 through the second connecting piece 15;

Both the L-shaped positive input pin 8 and the L-shaped negative output pin 9 are composed of a chip support area 111, a DC output pin portion 112, and a second bend between the chip support area 111 and the DC output pin portion 112. part 113, the L-shaped positive input pin 8 and the L-shaped negative output pin 9 respectively have a first through hole 12 in the middle area of the chip support area 111, and the L-shaped positive input pin 8 and the L-shaped negative output pin A second through hole 13 is opened on a side of the chip supporting area 111 of each output pin 9 close to the DC output pin portion 112 .

The included angle between the DC output pin portion 112 and the second bent portion 113 is 115°.

When the above-mentioned high-reliability compact rectifier bridge structure is adopted, it is actually implemented in a compact product. On the basis of not reducing the area of the heat sink, the creepage distance of the pins is effectively increased, the heat dissipation area of the product body is increased, and the reliability of the device is improved. Reliability and safety; secondly, the outer end surface of the positive input terminal close to the edge of the epoxy package has two spaced positive extension feet, and the outer end surface of the negative output terminal close to the edge of the epoxy package has two spaced distributions When cutting the input terminal during production, reduce the internal influence on the device.

The above-mentioned embodiments are only to illustrate the technical conception and characteristics of the present utility model, and its purpose is to allow those familiar with this technology to understand the content of the utility model and implement it accordingly, and not to limit the protection scope of the utility model. All equivalent changes or modifications made according to the spirit of the utility model shall fall within the protection scope of the utility model.

Claims (3)

1. A high-reliability compact rectifier bridge structure, characterized in that it includes: a first diode chip (2), a second diode chip (3) covered by an epoxy package (1), The third diode chip (4), the fourth diode chip (5), and the first Z-shaped input pin (6) and the second Z-shaped input pin (7) of the exposed epoxy package (1) ), L-shaped positive input pin (8) and L-shaped negative output pin (9); The anodes of the first diode chip (2) and the second diode chip (3) are electrically connected to the upper surface of the L-shaped anode input pin (8), the third diode chip (4), the fourth and second The respective cathodes of the diode chips (5) are electrically connected to the upper surface of the L-shaped negative output pin (9), and the cathode of the first diode chip (2) and the anode of the fourth diode chip (5) pass through the first A connection piece (14) is electrically connected to the first Z-shaped input pin (6), and the cathode of the second diode chip (3) and the anode of the third diode chip (4) are both connected through the second connection piece ( 15) Electrically connect with the second Z-shaped input pin (7); The L-shaped positive input pin (8) and the L-shaped negative output pin (9) are both composed of the chip support area (111), the DC output pin part (112) and the chip support area (111), the DC output lead The second bending part (113) between the feet (112), the middle area of the respective chip support area (111) of the L-shaped positive input pin (8) and the L-shaped negative output pin (9) is opened There is a first through hole (12), the L-shaped positive input pin (8) and the L-shaped negative output pin (9) are respectively opened on the side of the chip support area (111) close to the DC output pin part (112) There is a second through hole (13). 2. The high-reliability compact rectifier bridge structure according to claim 1, characterized in that: the first Z-shaped input pin (6) and the second Z-shaped input pin (7) are connected by a horizontal connection part (101), a horizontal input pin part (102) and a first bending part (103) located between the horizontal connection part (101) and the horizontal input pin part (102). 3. The high-reliability compact rectifier bridge structure according to claim 1, characterized in that: the included angle between the DC output pin part (112) and the second bending part (113) is 110°~150° °.