CN205944074U - Promote heat dispersion's rectifier bridge device - Google Patents

Abstract

The utility model relates to a rectifier bridge device for improving heat dissipation performance, comprising: first, second, third and fourth diode chips covered by an epoxy package body, a first L-shaped connecting piece, a second L-shaped The connecting piece, the first strip-shaped connecting piece and the second strip-shaped connecting piece, the first and second diode chips are located in the supporting area of the first L-shaped connecting piece, and the third and fourth diode chips are located in the second L-shaped connecting piece. The supporting area of the connecting strip, the first strip connecting strip connects the first and the third diode chip, the second strip connecting strip connects the second and the fourth diode chip; the positive input end, the negative output end, the first Both the first AC input end and the second AC input end expose the external surface of the epoxy package; the epoxy package has four recessed areas, and the four recessed areas are respectively located in the first, second, third, fourth and second The electrode chip is directly above. The partial thinning design of the rectifier bridge device of the utility model takes into account the avoidance of deformation of the body and the saving of epoxy, and the partial thinning of the main body is beneficial to heat dissipation of the internal chip.

Description

Rectifier bridge device with improved thermal performance

technical field

The utility model relates to a rectifying semiconductor device, in particular to a rectifying bridge device structure for preventing short circuit.

Background technique

The rectifier bridge device is a bridge structure composed of four rectifier diodes. It uses the unidirectional conduction characteristics of the diodes to rectify the alternating current. Since the utilization efficiency of the bridge rectifier for the input sine wave is twice that of the wave rectification, it is suitable for A significant improvement of diode half-wave rectification, it is widely used in circuits that convert alternating current to direct current.

For large-sized products in the existing rectifier bridge device structure, when the body thickness is too thin, it is easy to deform, and when the body thickness is too thick, epoxy waste is serious. When the body is too thick, it is not conducive to chip heat dissipation.

Contents of the invention

The purpose of the utility model is to provide a rectifier bridge device structure for preventing short circuit. The rectifier bridge device structure for preventing short circuit can be implemented in a compact product, and effectively increases the pin creepage distance without reducing the area of the heat sink. , which increases the heat dissipation area of the product body and improves the reliability and safety of the device.

In order to achieve the above purpose, the technical solution adopted by the utility model is: a rectifier bridge device for improving heat dissipation performance, including: first, second, third and fourth diode chips covered by an epoxy package, The first L-shaped connecting piece, the second L-shaped connecting piece, the first strip-shaped connecting piece and the second strip-shaped connecting piece, the first and second diode chips are located in the support area of the first L-shaped connecting piece, and the third , The fourth diode chip is located in the supporting area of the second L-shaped connecting piece, the first strip-shaped connecting piece is connected to the first and third diode chips, and the second strip-shaped connecting piece is connected to the second and fourth diodes chip;

The pin areas located at the respective ends of the first L-shaped connecting piece, the second L-shaped connecting piece, the first strip-shaped connecting piece and the second strip-shaped connecting piece are respectively used as positive input terminals, negative output terminals, first AC input terminals and The second AC input terminal, the positive input terminal, the negative output terminal, the first AC input terminal and the second AC input terminal are all exposed on the outer surface of the epoxy package; the epoxy package has four recessed areas, the four The recessed regions are respectively located directly above the first, second, third and fourth diode chips.

The scheme of further improvement in above-mentioned technical scheme is as follows:

In the above solution, the first AC input terminal and the second AC input terminal are located between the positive input terminal and the negative output terminal.

Due to the application of the above-mentioned technical solutions, the utility model has the following advantages and effects compared with the prior art:

The utility model improves the heat dissipation performance of the rectifier bridge device, and its epoxy package body has four recessed areas, and the four recessed areas are respectively located directly above the first, second, third, and fourth diode chips, and the body is partially reduced. The thin design takes into account the avoidance of deformation of the body and the saving of epoxy, and the local thinning of the body is conducive to the heat dissipation of the internal chip.

Description of drawings

Accompanying drawing 1 is the structure schematic diagram one of existing rectifier bridge device;

Accompanying drawing 2 is the structure schematic diagram II of existing rectifier bridge device;

Accompanying drawing 3 is a structural schematic diagram of a rectifier bridge device that improves heat dissipation performance of the present invention;

Accompanying drawing 4 is the rectifier bridge device structure schematic diagram two that the utility model improves heat dissipation performance;

Accompanying drawing 5 is the structural schematic diagram III of the rectifier bridge device of the utility model to improve the heat dissipation performance.

In the above drawings: 1. Epoxy package; 2. The first diode chip; 3. The second diode chip; 4. The third diode chip; 5. The fourth diode chip; 6. The first L-shaped connecting piece; 61, the positive input terminal; 7, the second L-shaped connecting piece; 71, the negative output terminal; 8, the first bar-shaped connecting piece; 81, the first AC input terminal; 9, the second piece Shaped connecting piece; 9, the second AC input end; 10, the recessed area.

detailed description

Below in conjunction with accompanying drawing and embodiment the utility model is further described:

Embodiment 1: A rectifier bridge device that improves heat dissipation performance, including: first, second, third, fourth diode chips 2, 3, 4, 5, first L-shaped connecting piece 6, the second L-shaped connecting piece 7, the first strip-shaped connecting piece 8 and the second strip-shaped connecting piece 9, the first and second diode chips 2, 3 are located on the first L-shaped connecting piece 6 The supporting area of the third and fourth diode chips 4,5 is located in the supporting area of the second L-shaped connecting sheet 7, the first strip-shaped connecting sheet 8 is connected to the first and third diode chips 2,4, and the first strip-shaped connecting sheet 8 is connected to the first and third diode chips 2,4. Two strip-shaped connecting pieces 9 are connected to the second and fourth diode chips 3, 5;

The pin areas at the respective ends of the first L-shaped connecting piece 6, the second L-shaped connecting piece 7, the first strip-shaped connecting piece 8 and the second strip-shaped connecting piece 9 are respectively used as positive input terminal 61, negative output terminal 71, The first AC input terminal 81 and the second AC input terminal 91, the positive input terminal 61, the negative output terminal 71, the first AC input terminal 81 and the second AC input terminal 82 are all exposed on the outer surface of the epoxy package 1; The epoxy package 1 has four recessed areas, and the four recessed areas are respectively located directly above the first, second, third, and fourth diode chips 2 , 3 , 4 , and 5 .

Embodiment 2: A rectifier bridge device that improves heat dissipation performance, including: first, second, third, fourth diode chips 2, 3, 4, 5, first L-shaped connecting piece 6, the second L-shaped connecting piece 7, the first strip-shaped connecting piece 8 and the second strip-shaped connecting piece 9, the first and second diode chips 2, 3 are located on the first L-shaped connecting piece 6 The supporting area of the third and fourth diode chips 4,5 is located in the supporting area of the second L-shaped connecting sheet 7, the first strip-shaped connecting sheet 8 is connected to the first and third diode chips 2,4, and the first strip-shaped connecting sheet 8 is connected to the first and third diode chips 2,4. Two strip-shaped connecting pieces 9 are connected to the second and fourth diode chips 3, 5;

The pin areas at the respective ends of the first L-shaped connecting piece 6, the second L-shaped connecting piece 7, the first strip-shaped connecting piece 8 and the second strip-shaped connecting piece 9 are respectively used as positive input terminal 61, negative output terminal 71, The first AC input terminal 81 and the second AC input terminal 91, the positive input terminal 61, the negative output terminal 71, the first AC input terminal 81 and the second AC input terminal 82 are all exposed on the outer surface of the epoxy package 1; The epoxy package 1 has four recessed areas, and the four recessed areas are respectively located directly above the first, second, third, and fourth diode chips 2 , 3 , 4 , and 5 .

The first AC input end 81 and the second AC input end 91 are located between the positive input end 61 and the negative output end 71 .

When the rectifier bridge device with improved heat dissipation performance is used, its epoxy package has four recessed areas, and the four recessed areas are respectively located directly above the first, second, third, and fourth diode chips, and the body is partially reduced. The thin design takes into account the avoidance of deformation of the body and the saving of epoxy, and the local thinning of the body is conducive to the heat dissipation of the internal chip.

The above-mentioned embodiments are only to illustrate the technical concept and characteristics of the present utility model, and its purpose is to enable those familiar with this technology to understand the content of the present utility model and implement it accordingly, and not to limit the protection scope of the present utility model. All equivalent changes or modifications made according to the spirit of the utility model shall fall within the protection scope of the utility model.

Claims (2)

1. A rectifier bridge device for improving heat dissipation, characterized in that: comprising: first, second, third and fourth diode chips (2, 3, 4) covered by an epoxy package (1) , 5), the first L-shaped connecting piece (6), the second L-shaped connecting piece (7), the first strip-shaped connecting piece (8) and the second strip-shaped connecting piece (9), the first, second and second The pole tube chips (2, 3) are located in the supporting area of the first L-shaped connecting piece (6), and the third and fourth diode chips (4, 5) are located in the supporting area of the second L-shaped connecting piece (7), The first strip-shaped connecting piece (8) is connected to the first and third diode chips (2, 4), and the second strip-shaped connecting piece (9) is connected to the second and fourth diode chips (3, 5); The pin areas at the respective ends of the first L-shaped connecting piece (6), the second L-shaped connecting piece (7), the first strip-shaped connecting piece (8) and the second strip-shaped connecting piece (9) are respectively used as positive input Terminal (61), negative output terminal (71), first AC input terminal (81) and second AC input terminal (91), the positive input terminal (61), negative output terminal (71), first AC input terminal (81) and the second AC input end (82) both expose the outer surface of the epoxy package (1); the epoxy package (1) has four recessed areas, and these four recessed areas are respectively located in the first, The second, third, and fourth diode chips (2, 3, 4, 5) are directly above. 2. The rectifier bridge device for improving heat dissipation performance according to claim 1, characterized in that: the first AC input terminal (81) and the second AC input terminal (91) are located at the positive input terminal (61) and the negative output end (71).