CN203446168U - Power element heat dissipation structure - Google Patents
Power element heat dissipation structure Download PDFInfo
- Publication number
- CN203446168U CN203446168U CN201320529515.1U CN201320529515U CN203446168U CN 203446168 U CN203446168 U CN 203446168U CN 201320529515 U CN201320529515 U CN 201320529515U CN 203446168 U CN203446168 U CN 203446168U
- Authority
- CN
- China
- Prior art keywords
- base plate
- housing
- power component
- layer
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a power element heat dissipation structure. The power element heat dissipation structure comprises a heating element and a housing. The housing comprises a base plate and a cylindrical shell; the lower end of the cylindrical shell is fixed on the base plate; the circumference of the base plate is provided with installation flanges of the housing; the heating element is arranged in a cavity formed by the cylindrical shell and the base plate; and a heat-conducting glue is poured and encapsulated in the gap between the heating element and the housing. A separate irregular heating element is fixed to the metal housing through one-time glue pouring so that the heat dissipation capacity of the irregular element is improved, the fixation and heat dissipation problems of the separate irregular heating element are effectively solved, and the reliability of an electronic product is enhanced.
Description
[technical field]
The utility model relates to cooling electronic component, relates in particular to a kind of radiator structure of power component.
[background technology]
Discrete power component inductance for example in electronic product, transformer, and the heat dissipation problem of the irregular element of profile in naturally cold heat dissipation environment such as large electrochemical capacitor is to be relatively difficult to processing.The profile of these elements is normally circular, and arc etc. are irregularly shaped, after being installed on pcb board, can not be contiguously fine with plane heating panel, and cause the difficulty of conducting heat.
In order to address this problem, conventionally upper end or the side increase elastic heat conducting material at discrete heater element contacts heat radiation with planar heat spreader, but because contact area and contact are less, the effect of the heat radiation of this radiating mode is also bad, cause temperature of heating elements high, affect the Performance And Reliability of product.
[summary of the invention]
The technical problems to be solved in the utility model is to provide a kind of power component radiator structure of good heat dissipation effect.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is, a kind of power component radiator structure, comprise heater element and housing, described housing comprises the shell of base plate and tubular, and the lower end of cylindrical outer casing is fixed on base plate, the installation bead that the periphery of base plate is housing; Described heater element is arranged in the inner chamber of cylindrical outer casing and base plate formation, and in the space between heater element and housing, embedding has heat-conducting glue.
Above-described power component radiator structure, described base plate is metal substrate.
Above-described power component radiator structure, described base plate comprises solder mask, weld layer, insulating barrier and heat dissipating layer from top to bottom successively, solder mask comprises annular window; Described window is inserted in the lower end of cylindrical outer casing, welds with weld layer.
Above-described power component radiator structure, described weld layer is copper foil layer, described heat dissipating layer is metal level.
Above-described power component radiator structure, described base plate is copper base or aluminium base.Described metal level is copper coin layer or aluminum layer.
The utility model is by discrete Xenotype heating element, and disposable glue-filling solid fixes in metal shell, has improved the heat-sinking capability of shaped element, has effectively solved the fixing and heat dissipation problem of discrete Xenotype heating element, improves the reliability of electronic product.
[accompanying drawing explanation]
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is the stereogram of the utility model embodiment power component radiator structure.
Fig. 2 is the cutaway view of the utility model embodiment power component radiator structure.
Fig. 3 is the vertical view of the utility model embodiment power component radiator structure.
Fig. 4 is the cutaway view of the utility model embodiment power component radiator structure base plate.
Fig. 5 is the vertical view of the utility model embodiment power component radiator structure base plate.
[embodiment]
As shown in Figures 1 to 5, the utility model embodiment power component radiator structure comprises heater element 100 and housing 200, housing 200 comprises the metal shell 2 of base plate 1 and tubular, the periphery of base plate 1 is the installation bead of housing 200, install in bead and have 4 installing holes 101, be convenient to housing 200 to be fixed on the flat board of radiator.
The shape of the metal shell 2 of tubular can be circular, can be also square, according to the component profile of heating, determines.Shell 2 should have solderability, is suitable for the reflow soldering of SMT tin cream.
If Fig. 2 and Fig. 4 base plate 1 are copper base or aluminium base.Base plate 1 comprises solder mask 102, weld layer 103, insulating barrier 104 and heat dissipating layer 105 from top to bottom successively.Wherein, weld layer 103 is copper foil layer, and heat dissipating layer 105 is copper coin layer or aluminum layer.
Solder mask has an annular window 102a, and window 102a exposes below the Copper Foil of weld layer 103, and the shape of the shape of window 102a and shell 2 lower surfaces is basic identical.Window 102a is inserted in the lower end of cylindrical outer casing 2, by the reflow soldering of SMT and the Copper Foil of weld layer 102, welds together.
The above embodiment shell of the utility model and base plate utilize the reflow solder technique of SMT welded together, by discrete Xenotype heating element, disposable glue-filling solid fixes in metal shell, improved the heat-sinking capability of shaped element, fixing and the heat dissipation problem that has effectively solved discrete Xenotype heating element, has reduced follow-up assembly work.This structural entity is attractive in appearance, practical, very convenient when a large amount of production, and improves the reliability of electronic product.
Claims (5)
1. a power component radiator structure, comprises heater element, it is characterized in that, comprises housing, and described housing comprises the shell of base plate and tubular, and the lower end of cylindrical outer casing is fixed on base plate, the installation bead that the periphery of base plate is housing; Described heater element is arranged in the inner chamber of cylindrical outer casing and base plate formation, and in the space between heater element and housing, embedding has heat-conducting glue.
2. power component radiator structure according to claim 1, is characterized in that, described base plate is metal substrate.
3. power component radiator structure according to claim 2, is characterized in that, described base plate comprises solder mask, weld layer, insulating barrier and heat dissipating layer from top to bottom successively, and solder mask comprises annular window; Described window is inserted in the lower end of cylindrical outer casing, welds with weld layer.
4. power component radiator structure according to claim 3, is characterized in that, described weld layer is copper foil layer, and described heat dissipating layer is metal level.
5. power component radiator structure according to claim 4, is characterized in that, described base plate is copper base or aluminium base, and described metal level is copper coin layer or aluminum layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320529515.1U CN203446168U (en) | 2013-08-28 | 2013-08-28 | Power element heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320529515.1U CN203446168U (en) | 2013-08-28 | 2013-08-28 | Power element heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203446168U true CN203446168U (en) | 2014-02-19 |
Family
ID=50097174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320529515.1U Expired - Fee Related CN203446168U (en) | 2013-08-28 | 2013-08-28 | Power element heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203446168U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255390A (en) * | 2016-09-14 | 2016-12-21 | 深圳市泰昂能源科技股份有限公司 | A kind of synapse formula radiator structure being applied to large power supply and method |
| CN107426940A (en) * | 2016-05-24 | 2017-12-01 | 上汽通用五菱汽车股份有限公司 | A kind of automobile-used DC/DC converters heat dissipating method |
-
2013
- 2013-08-28 CN CN201320529515.1U patent/CN203446168U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107426940A (en) * | 2016-05-24 | 2017-12-01 | 上汽通用五菱汽车股份有限公司 | A kind of automobile-used DC/DC converters heat dissipating method |
| CN107426940B (en) * | 2016-05-24 | 2019-04-30 | 上汽通用五菱汽车股份有限公司 | A kind of automobile-used DC/DC converter heat dissipating method |
| CN106255390A (en) * | 2016-09-14 | 2016-12-21 | 深圳市泰昂能源科技股份有限公司 | A kind of synapse formula radiator structure being applied to large power supply and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102333414B (en) | Heat dissipation structure, manufacturing method for same and electronic device with same | |
| CN108617082B (en) | Heat dissipation assembly and electronic device | |
| CN105188318A (en) | Heat radiation device, electronic equipment and manufacturing method | |
| CN203446168U (en) | Power element heat dissipation structure | |
| CN101087505A (en) | Heat radiator | |
| JP2007305695A (en) | Cement resistor | |
| CN109588023B (en) | Heat dissipation structure and related equipment | |
| CN110868796B (en) | PCB heat dissipation device | |
| CN106982544A (en) | A kind of radiator structure of high power density Switching Power Supply | |
| CN103384465B (en) | The heat-conducting system of electronic power component attachment in the circuit board | |
| CN212367615U (en) | Power tube heat radiation structure | |
| CN201682690U (en) | Heat dissipation device for printed circuit board | |
| CN203086840U (en) | Heat conduction structure of surface-mount power components on circuit board | |
| CN213847398U (en) | Circuit board heat radiation structure and electrical equipment | |
| CN203590670U (en) | Heat radiation structure of radio frequency power amplifier | |
| CN201869439U (en) | Metal-based circuit board with high heat radiation | |
| CN213958942U (en) | Radiating mechanism of patch power device | |
| CN103747657A (en) | Heat-dissipating apparatus | |
| CN203775579U (en) | Heat dissipation device | |
| US9347712B2 (en) | Heat dissipating device | |
| CN202307863U (en) | Radiator for vertical MOS-transistor-type electronic component | |
| CN203136347U (en) | Metal-core printed circuit board jointed plate sealing edge | |
| CN102036470A (en) | Low-thermal-resistance and high-radiation metal-base circuit board | |
| CN105744724A (en) | Heat dissipation structure of electronic device, wearable electronic equipment and heat dissipation method of electronic device | |
| WO2016115702A1 (en) | Heat dissipation apparatus for small-size device and circuit board heat dissipation system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140219 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |