CN106255390A - A kind of synapse formula radiator structure being applied to large power supply and method - Google Patents
A kind of synapse formula radiator structure being applied to large power supply and method Download PDFInfo
- Publication number
- CN106255390A CN106255390A CN201610824461.XA CN201610824461A CN106255390A CN 106255390 A CN106255390 A CN 106255390A CN 201610824461 A CN201610824461 A CN 201610824461A CN 106255390 A CN106255390 A CN 106255390A
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- Prior art keywords
- synapse
- radiator structure
- formula
- heat
- cylindrical
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
The present invention provides a kind of synapse formula radiator structure being applied to large power supply and method, described synapse formula radiator structure includes: body and cylindrical synapse radiating component, one or more cylindrical synapse radiating component it is provided with on described body, described cylindrical synapse radiating component is provided with the cavity for accommodating heater element, between described heater element and cavity, fills heat-conducting glue.The present invention realizes fixing heater element and dispelling the heat by cylindrical synapse radiating component, simplifies mounting structure and the fixed form of heater element, decreases the quantity pouring into heat-conducting glue, decrease thermal resistance, reduce volume, reduce weight of equipment, infrastructure cost is low, good heat dissipation effect；On this basis, described synapse formula radiator structure uses the design of combinable subdivision so that changes and safeguards more convenient.The present invention is through reality test, compared with existing heat sink conception, it is possible to make the temperature rise of power-supply device reduce about 40 DEG C on the basis of original, effect highly significant.
Description
Technical field
The present invention relates to a kind of radiator structure being applied to power supply, particularly relate to a kind of synapse being applied to large power supply
Formula radiator structure, and relate to the synapse formula heat dissipating method of this synapse formula radiator structure.
Background technology
In the high-power heat-producing device of routine used currently on the market or equipment, high-power heater element radiating mode is handle
Heater element is placed in device, and the mode using high surface area heat sink to add fan is dispelled the heat.Due to the volume of product, weight
Limiting, and the heat of heat sink material itself dissipates limited ability, all there are some inevitable problems in both radiating modes: ratio
As, use traditional fin to realize in the scheme of heat radiation, the mode generally using high surface area heat sink to add fan is dispelled the heat, phase
For high-power heater element, its heat-sinking capability is very limited amount of, this mode heat-sinking capability to be strengthened, and typically uses
Strengthen fin and add air-cooled or help cold mode, but after do so, equipment volume, weight can become big.If using air-cooled, wind
Road design is complicated, and air inlet and air outlet can make the IP protection of power-supply device reduce, and the oneself power consumption of its cooling system is big, does not saves
Can, and fan can bring noise, not environmentally.
Summary of the invention
The technical problem to be solved is to need to provide one can save space, and saves the use of heat-conducting glue
The synapse formula radiator structure being applied to large power supply of amount, it is achieved that the high efficiency and heat radiation to heater element, and provide for being somebody's turn to do
The synapse formula heat dissipating method of synapse formula radiator structure.
To this, the present invention provides a kind of synapse formula radiator structure being applied to large power supply, including: body and cylindrical
Synapse radiating component, described body is provided with one or more cylindrical synapse radiating component, and described cylindrical synapse is dispelled the heat
Component is provided with the cavity for accommodating heater element, between described heater element and cavity, fills heat-conducting glue.
Further improvement of the present invention is, the cavity of each cylindrical synapse radiating component may be contained within one one
The heater element of one correspondence.
Further improvement of the present invention is, described cylindrical synapse radiating component is for using the one-body molded institute of heat sink material
The synapse formula cylinder made.
Further improvement of the present invention is, also includes the splicing structure for multiple synapse formula radiator structure assembly being got up
Part, described splicing component is arranged at the edge of described body.
Further improvement of the present invention is, also includes that installation portion, described installation portion are arranged on described body, described
Described synapse formula radiator structure is arranged on power-supply device by body by installation portion.
Further improvement of the present invention is, also includes that rubber pange sealing ring, described body are sealed by rubber pange
Circle is tightly connected with described power-supply device.
Further improvement of the present invention is, described heater element is heat-generating cylindrical part.
Further improvement of the present invention is, when being provided with multiple cylindrical synapse radiating component on described body, and institute
Stating multiple cylindrical synapse radiating component uses the mode of Heterogeneous Permutation to be arranged on described body.
The present invention also provides for a kind of synapse formula heat dissipating method being applied to large power supply, and described synapse formula heat dissipating method is used
In a kind of synapse formula radiator structure being applied to large power supply, and comprise the following steps:
Step S1, is positioned over heater element in the cavity of described cylindrical synapse radiating component；
Step S2, fills heat-conducting glue between described heater element and cavity, and then is fixed on by described heater element described
In cavity；
Step S3, is arranged on the synapse formula radiator structure after populated heat-conducting glue on power-supply device.
Further improvement of the present invention is, also includes step S4, arranges many according to the heat dissipation region of described power-supply device
Individual separate described synapse formula radiator structure.
Compared with prior art, the beneficial effects of the present invention is: realized heating by cylindrical synapse radiating component
Fixing and the heat radiation of element, simplifies mounting structure and the fixed form of heater element, decreases the quantity pouring into heat-conducting glue, subtract
Lack thermal resistance, reduced volume, reduce weight of equipment；Meanwhile, cylindrical synapse radiating component is used can be effectively increased radiating surface
Long-pending, compared with die sinking direct with prior art, its infrastructure cost is low；On this basis, described synapse formula radiator structure uses and can spell
The subdivision design of dress so that change and safeguard convenient.The present invention is through reality test, with existing heat sink conception phase
Ratio, it is possible to make the temperature rise of power-supply device reduce about 40 DEG C on the basis of original, effect highly significant.
Accompanying drawing explanation
Fig. 1 is the Facad structure schematic diagram of an embodiment of the present invention；
Fig. 2 is the inverse layer structure schematic diagram of an embodiment of the present invention；
Fig. 3 is the detonation configuration schematic diagram of an embodiment of the present invention；
Fig. 4 is the structural representation being arranged on power-supply device by multiple synapse formula radiator structures in an embodiment of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings, the preferably embodiment of the present invention is described in further detail:
As depicted in figs. 1 and 2, this example provides a kind of synapse formula radiator structure being applied to large power supply, including: body 1 He
Cylindrical synapse radiating component 2, described body 1 is provided with one or more cylindrical synapse radiating component 2, described cylindrical
Synapse radiating component 2 is provided with the cavity 3 for accommodating heater element 4, fills out between described heater element 4 and cavity 3
Fill heat-conducting glue.Large power supply described in this example refers to power supply or the power-supply device of more than 3000 watts.
The cavity 3 of each cylindrical synapse radiating component 2 of this example may be contained within a heater element one to one
4.Described cylindrical synapse radiating component 2 is preferably and uses the one-body molded made synapse formula cylinder of heat sink material, such as
Use the cylindrical synapse radiating component 2 that the aluminum of cellular radiator structure is made, also improve while production difficulty
Radiating efficiency.
As shown in Figure 4, this example also includes the splicing component for multiple synapse formula radiator structure assembly being got up, described spelling
Connection member is arranged at the edge of described body 1.It is to say, each described synapse formula radiator structure uses combinable point
Unit designs, so, it becomes possible to arranges multiple separate described synapse formula according to the heat dissipation region of described power-supply device 6 and dissipates
Heat structure so that install simple and convenient on the basis of, additionally it is possible to make change and safeguard convenient.In the present embodiment, described
The heat dissipation region of power-supply device 6 is provided with 3 independent synapse formula radiator structures, and in actual applications, described synapse formula is dispelled the heat
The quantity of structure is can be adjusted according to concrete cooling requirements and arrange.
As it is shown on figure 3, this example also includes that installation portion 5 and rubber pange sealing ring 7, described installation portion 5 are arranged at described
On body 1, described synapse formula radiator structure is arranged on power-supply device 6 by described body 1 by installation portion 5；Described power-supply device 6
Preferably include the large power, electrically source device such as three-phase imbalance distribution box and/or outdoor power system equipment 6, described large power, electrically source device
The power-supply device of generally referred to as more than 3000 watts.Described body 1 is close with described power-supply device 6 by rubber pange sealing ring 7
Envelope connects, and then realizes sealing installation.
Described in this example, heater element 4 is heat-generating cylindrical part, it is preferred that described heater element 4 be the caloric values such as inductance relatively
Big electronic devices and components.
As shown in Figures 1 to 4, this example is when being provided with multiple cylindrical synapse radiating component 2 on described body 1, described
Multiple cylindrical synapse radiating components 2 use the mode of Heterogeneous Permutation to be arranged on described body 1.The mode of described Heterogeneous Permutation
Refer to the setting of dislocation, so arrange and be advantageous in that, it is possible to make full use of between the cylindrical synapse radiating component 2 of dislocation
Space strengthen radiating efficiency.
This example also provides for a kind of synapse formula heat dissipating method being applied to large power supply, and described synapse formula heat dissipating method is used for
A kind of synapse formula radiator structure being applied to large power supply, and comprise the following steps:
Step S1, is positioned over heater element 4 in the cavity 3 of described cylindrical synapse radiating component 2；
Step S2, fills heat-conducting glue between described heater element 4 and cavity 3, and then described heater element 4 is fixed on institute
State in cavity 3；
Step S3, is arranged on the synapse formula radiator structure after populated heat-conducting glue on power-supply device 6.
This example further preferably includes step S4, arranges multiple separate institute according to the heat dissipation region of described power-supply device 6
State synapse formula radiator structure.
This example provides a kind of new synapse formula radiator structure, as shown in Figures 1 to 4, described synapse formula radiator structure is adopted
With being similar to the radiator structure of neuron, radiator portion is cylindrical synapse radiating component 2, the heat radiation side of the overall encapsulating of contrast
Case, the unnecessary space of original non-heat dissipation element is saved by this example, changes into using the prominent of a cylindrical synapse radiating component 2
Touch structure, remove each heater element 4 corresponding so that between the cavity 3 of heater element 4 and cylindrical synapse radiating component 2
Fitting tight coordinates, and its gap is the least, it is possible to effectively reduce the cylindrical synapse heat radiation that heater element 4 is made with heat sink material
Thermal resistance between component 2, saves the most greatly the consumption of heat-conducting glue, the most only need to pour into overall encapsulating in prior art
The heat-conducting glue of 1/10th, described heat-conducting glue is preferably heat conductive silica gel；On this basis, described cylindrical synapse heat radiation structure
The cooling surface area of part 2 also relatively increases much, and to sum up, this example is with relatively low cost, it is achieved that efficiently dissipating of heater element 4
Heat.
This example realizes, to the fixing of heater element 4 and heat radiation, simplifying heater element by cylindrical synapse radiating component 2
The mounting structure of 4 and fixed form, decrease the quantity pouring into heat-conducting glue, decreases thermal resistance, reduces volume, reduces equipment weight
Amount；Meanwhile, use cylindrical synapse radiating component 2 can be effectively increased area of dissipation, compared with die sinking direct with prior art, its
Infrastructure cost is low；On this basis, described synapse formula radiator structure uses the design of combinable subdivision so that changes and safeguards
Convenient.This example is through reality test, compared with existing heat sink conception, it is possible to make the temperature rise of power-supply device 6 originally
On the basis of reduce about 40 DEG C, effect highly significant.
Above content is to combine concrete preferred implementation further description made for the present invention, it is impossible to assert
Being embodied as of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of present inventive concept, it is also possible to make some simple deduction or replace, all should be considered as belonging to the present invention's
Protection domain.
Claims (10)
1. the synapse formula radiator structure being applied to large power supply, it is characterised in that including: body and cylindrical synapse dissipate
Hot component, described body is provided with one or more cylindrical synapse radiating component, in described cylindrical synapse radiating component
It is provided with the cavity for accommodating heater element, between described heater element and cavity, fills heat-conducting glue.
The synapse formula radiator structure being applied to large power supply the most according to claim 1, it is characterised in that each circle
The cavity of tub synapse radiating component may be contained within a heater element one to one.
The synapse formula radiator structure being applied to large power supply the most according to claim 1, it is characterised in that described drum
Formula synapse radiating component is to use the one-body molded made synapse formula cylinder of heat sink material.
4., according to the synapse formula radiator structure being applied to large power supply described in claims 1 to 3 any one, its feature exists
In, also include that described splicing component is arranged at described for the splicing component multiple synapse formula radiator structure assembly got up
The edge of body.
5., according to the synapse formula radiator structure being applied to large power supply described in claims 1 to 3 any one, its feature exists
In, also including that installation portion, described installation portion are arranged on described body, described synapse formula is dispelled the heat by described body by installation portion
Structure is arranged on power-supply device.
The synapse formula radiator structure being applied to large power supply the most according to claim 5, it is characterised in that also include rubber
Glue foaming sealing ring, described body is tightly connected with described power-supply device by rubber pange sealing ring.
7., according to the synapse formula radiator structure being applied to large power supply described in claims 1 to 3 any one, its feature exists
In, described heater element is heat-generating cylindrical part.
8., according to the synapse formula radiator structure being applied to large power supply described in claims 1 to 3 any one, its feature exists
In, when being provided with multiple cylindrical synapse radiating component on described body, the plurality of cylindrical synapse radiating component uses
The mode of Heterogeneous Permutation is arranged on described body.
9. the synapse formula heat dissipating method being applied to large power supply, it is characterised in that described synapse formula heat dissipating method is used for
A kind of synapse formula radiator structure being applied to large power supply as described in claim 1 to 8 any one, and include following step
Rapid:
Step S1, is positioned over heater element in the cavity of described cylindrical synapse radiating component；
Step S2, fills heat-conducting glue between described heater element and cavity, and then is fixed on by described heater element described
In cavity；
Step S3, is arranged on the synapse formula radiator structure after populated heat-conducting glue on power-supply device.
The synapse formula heat dissipating method being applied to large power supply the most according to claim 9, it is characterised in that also include
Step S4, arranges multiple separate described synapse formula radiator structure according to the heat dissipation region of described power-supply device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610824461.XA CN106255390B (en) | 2016-09-14 | 2016-09-14 | A kind of cynapse formula radiator structure and method applied to large power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610824461.XA CN106255390B (en) | 2016-09-14 | 2016-09-14 | A kind of cynapse formula radiator structure and method applied to large power supply |
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| Publication Number | Publication Date |
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| CN106255390A true CN106255390A (en) | 2016-12-21 |
| CN106255390B CN106255390B (en) | 2019-04-09 |
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| CN201610824461.XA Active CN106255390B (en) | 2016-09-14 | 2016-09-14 | A kind of cynapse formula radiator structure and method applied to large power supply |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106659034A (en) * | 2016-12-27 | 2017-05-10 | 艾思玛新能源技术（江苏）有限公司 | Apparatus used for accommodating heating elements |
| CN111741665A (en) * | 2020-07-30 | 2020-10-02 | 上海空间电源研究所 | Heat radiation structure |
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| CN201294705Y (en) * | 2008-10-28 | 2009-08-19 | 无锡斯达四方电气有限公司 | High-power power supply self-cooling type radiator |
| CN103582391A (en) * | 2012-07-27 | 2014-02-12 | Tdk株式会社 | Power supply device |
| CN203446168U (en) * | 2013-08-28 | 2014-02-19 | 深圳麦格米特电气股份有限公司 | Power element heat dissipation structure |
| CN104704933A (en) * | 2012-07-27 | 2015-06-10 | 伊利诺斯工具制品有限公司 | Rectifier module for power conversion circuits |
| CN105682415A (en) * | 2014-11-20 | 2016-06-15 | 深圳万讯自控股份有限公司 | Radiating apparatus, driver and radiating method for driver |
| CN105828573A (en) * | 2015-01-23 | 2016-08-03 | 洛克威尔自动控制技术股份有限公司 | Devices and methods for cooling bus capacitors |
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2016
- 2016-09-14 CN CN201610824461.XA patent/CN106255390B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201294705Y (en) * | 2008-10-28 | 2009-08-19 | 无锡斯达四方电气有限公司 | High-power power supply self-cooling type radiator |
| CN103582391A (en) * | 2012-07-27 | 2014-02-12 | Tdk株式会社 | Power supply device |
| CN104704933A (en) * | 2012-07-27 | 2015-06-10 | 伊利诺斯工具制品有限公司 | Rectifier module for power conversion circuits |
| CN203446168U (en) * | 2013-08-28 | 2014-02-19 | 深圳麦格米特电气股份有限公司 | Power element heat dissipation structure |
| CN105682415A (en) * | 2014-11-20 | 2016-06-15 | 深圳万讯自控股份有限公司 | Radiating apparatus, driver and radiating method for driver |
| CN105828573A (en) * | 2015-01-23 | 2016-08-03 | 洛克威尔自动控制技术股份有限公司 | Devices and methods for cooling bus capacitors |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106659034A (en) * | 2016-12-27 | 2017-05-10 | 艾思玛新能源技术（江苏）有限公司 | Apparatus used for accommodating heating elements |
| CN111741665A (en) * | 2020-07-30 | 2020-10-02 | 上海空间电源研究所 | Heat radiation structure |
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| Publication number | Publication date |
|---|---|
| CN106255390B (en) | 2019-04-09 |
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