CN106255390B - A kind of cynapse formula radiator structure and method applied to large power supply - Google Patents
A kind of cynapse formula radiator structure and method applied to large power supply Download PDFInfo
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- CN106255390B CN106255390B CN201610824461.XA CN201610824461A CN106255390B CN 106255390 B CN106255390 B CN 106255390B CN 201610824461 A CN201610824461 A CN 201610824461A CN 106255390 B CN106255390 B CN 106255390B
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- cynapse
- cylindrical
- heater element
- radiator structure
- heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Resistance Heating (AREA)
Abstract
The present invention provides a kind of cynapse formula radiator structure and method applied to large power supply, the cynapse formula radiator structure includes: ontology and cylindrical cynapse radiating component, one or more cylindrical cynapse radiating components are provided on the ontology, it is provided with the hollow cavity for accommodating heater element in the cylindrical cynapse radiating component, fills heat-conducting glue between the heater element and hollow cavity.The present invention realizes the fixation and heat dissipation to heater element by cylindrical cynapse radiating component, simplifies the mounting structure and fixed form of heater element, reduces the quantity for pouring into heat-conducting glue, reduce thermal resistance, reduce volume, reduces weight of equipment, infrastructure cost is low, good heat dissipation effect；On this basis, the cynapse formula radiator structure is designed using combinable sub-unit, so that replacement and maintenance are more convenient.The present invention passes through actual test, compared with existing heat sink conception, enables to the temperature rise of power-supply device to reduce by 40 DEG C or so on the basis of original, effect highly significant.
Description
Technical field
The present invention relates to a kind of radiator structure applied to power supply more particularly to a kind of cynapses applied to large power supply
Formula radiator structure, and it is related to the cynapse formula heat dissipating method for the cynapse formula radiator structure.
Background technique
High-power heater element radiating mode is handle in the high-power heat-producing device of the routine used currently on the market or equipment
Heater element is placed in the device, is radiated by way of high surface area heat sink plus fan.Due to the volume of product, weight
Limitation, and the heat of heat sink material itself dissipates ability and is limited, both radiating modes all there is a problem of some inevitable: ratio
Such as, it in the scheme that heat dissipation is realized with traditional cooling fin, generallys use high surface area heat sink and the mode of fan is added to radiate, phase
For high-power heater element, heat-sinking capability be it is very limited, this mode will increase heat-sinking capability, general to use
Increase cooling fin and plus it is air-cooled or help cold mode, but after doing so, equipment volume, weight can become larger.If using air-cooled, wind
Road design is complicated, and air inlet and air outlet can make the IP of power-supply device protect reduction, and the oneself power consumption of cooling system is big, does not save
Can, and fan can bring noise, not environmentally.
Summary of the invention
The technical problem to be solved by the present invention is to need to provide one kind to save space, and save the use of heat-conducting glue
The cynapse formula radiator structure applied to large power supply of amount realizes the high efficiency and heat radiation to heater element, and provides for being somebody's turn to do
The cynapse formula heat dissipating method of cynapse formula radiator structure.
In this regard, the present invention provides a kind of cynapse formula radiator structure applied to large power supply, comprising: ontology and cylindrical
Cynapse radiating component is provided with one or more cylindrical cynapse radiating components, the cylindrical cynapse heat dissipation on the ontology
It is provided with the hollow cavity for accommodating heater element in component, fills heat-conducting glue between the heater element and hollow cavity.
A further improvement of the present invention is that the hollow cavity of each cylindrical cynapse radiating component is all set in one one
One corresponding heater element.
A further improvement of the present invention is that the cylindrical cynapse radiating component is using heat sink material integrated molding institute
Manufactured cynapse formula cylindrical body.
A further improvement of the present invention is that further including the splicing structure for multiple cynapse formula radiator structure assembly to be got up
Part, the splicing component are set to the edge of the ontology.
A further improvement of the present invention is that further including mounting portion, the mounting portion is arranged on the body, described
The cynapse formula radiator structure is mounted on power-supply device by body by mounting portion.
A further improvement of the present invention is that further including rubber pange sealing ring, the ontology is sealed by rubber pange
Circle is tightly connected with the power-supply device.
A further improvement of the present invention is that the heater element is heat-generating cylindrical part.
A further improvement of the present invention is that when being provided with multiple cylindrical cynapse radiating components on the ontology, institute
Multiple cylindrical cynapse radiating components are stated to be arranged on the body by the way of Heterogeneous Permutation.
The present invention also provides a kind of cynapse formula heat dissipating method applied to large power supply, the cynapse formula heat dissipating method is used
In a kind of cynapse formula radiator structure applied to large power supply as described above, and the following steps are included:
Heater element is placed in the hollow cavity of the cylindrical cynapse radiating component by step S1；
Step S2 fills heat-conducting glue between the heater element and hollow cavity, and then the heater element is fixed on
In the hollow cavity；
Cynapse formula radiator structure after populated heat-conducting glue is mounted on power-supply device by step S3.
A further improvement of the present invention is that further including step S4, it is arranged according to the heat dissipation region of the power-supply device more
A mutually independent cynapse formula radiator structure.
Compared with prior art, the beneficial effects of the present invention are: by cylindrical cynapse radiating component realize to fever
The fixation and heat dissipation of element simplify the mounting structure and fixed form of heater element, reduce the quantity for pouring into heat-conducting glue, subtract
Lack thermal resistance, reduced volume, reduces weight of equipment；Meanwhile radiating surface can be effectively increased using cylindrical cynapse radiating component
Product, compared with the prior art is directly opened, infrastructure cost is low；On this basis, the cynapse formula radiator structure use can spell
The sub-unit of dress designs, so that replacing and safeguarding more convenient.The present invention passes through actual test, with existing heat sink conception phase
Than enabling to the temperature rise of power-supply device to reduce by 40 DEG C or so on the basis of original, effect highly significant.
Detailed description of the invention
Fig. 1 is the positive structure schematic of an embodiment of the present invention；
Fig. 2 is the reverse structure schematic of an embodiment of the present invention；
Fig. 3 is the configuration schematic diagram of an embodiment of the present invention；
Fig. 4 is the structural representation being mounted on multiple cynapse formula radiator structures in an embodiment of the present invention on power-supply device
Figure.
Specific embodiment
With reference to the accompanying drawing, preferably embodiment of the invention is described in further detail:
As depicted in figs. 1 and 2, this example provides a kind of cynapse formula radiator structure applied to large power supply, comprising: ontology
1 and cylindrical cynapse radiating component 2, one or more cylindrical cynapse radiating components 2, the circle are provided on the ontology 1
Be provided with the hollow cavity 3 for accommodating heater element 4 in barrel type cynapse radiating component 2, the heater element 4 and hollow cavity 3 it
Between fill heat-conducting glue.Large power supply described in this example refers to 3000 watts or more of power supply or power-supply device.
The hollow cavity 3 of each cylindrical cynapse radiating component 2 of this example is all set in an one-to-one heater element
4.The cylindrical cynapse radiating component 2 is preferably the cynapse formula cylindrical body made using heat sink material integrated molding, such as
Cylindrical cynapse radiating component 2, also improves while production difficulty made of aluminum material using honeycomb radiator structure
Radiating efficiency.
As shown in figure 4, this example further includes the splicing component for multiple cynapse formula radiator structure assembly to be got up, the spelling
Connection member is set to the edge of the ontology 1.That is, each described cynapse formula radiator structure uses combinable point
Unit design dissipates in this way, it is possible to which multiple mutually independent cynapse formulas are arranged according to the heat dissipation region of the power-supply device 6
Heat structure, so that on the basis of installation is simple and convenient, additionally it is possible to so that replacing and safeguarding more convenient.It is described in the present embodiment
The heat dissipation region of power-supply device 6 is provided with 3 independent cynapse formula radiator structures, in practical applications, the cynapse formula heat dissipation
The quantity of structure is can be adjusted and be arranged according to specific cooling requirements.
As shown in figure 3, this example further includes mounting portion 5 and rubber pange sealing ring 7, the mounting portion 5 is set to described
On body 1, the cynapse formula radiator structure is mounted on power-supply device 6 by the ontology 1 by mounting portion 5；The power-supply device 6
Preferably include the large power supplies equipment such as three-phase imbalance distribution box and/or outdoor power system equipment 6, the large power supply equipment
Generally referred to as 3000 watts or more of power-supply device.The ontology 1 is close by rubber pange sealing ring 7 and the power-supply device 6
Envelope connection, and then realize sealing installation.
Heater element 4 described in this example is heat-generating cylindrical part, it is preferred that the heater element 4 be the calorific values such as inductance compared with
Big electronic component.
As shown in Figures 1 to 4, this example is described when being provided with multiple cylindrical cynapse radiating components 2 on the ontology 1
Multiple cylindrical cynapse radiating components 2 are set on the ontology 1 by the way of Heterogeneous Permutation.The mode of the Heterogeneous Permutation
Refer to the setting of dislocation, the advantages of this arrangement are as follows, it can make full use of between the cylindrical cynapse radiating component 2 of dislocation
Space enhance radiating efficiency.
This example also provides a kind of cynapse formula heat dissipating method applied to large power supply, and the cynapse formula heat dissipating method is used for
A kind of cynapse formula radiator structure applied to large power supply as described above, and the following steps are included:
Heater element 4 is placed in the hollow cavity 3 of the cylindrical cynapse radiating component 2 by step S1；
Step S2 fills heat-conducting glue between the heater element 4 and hollow cavity 3, and then the heater element 4 is fixed
In in the hollow cavity 3；
Cynapse formula radiator structure after populated heat-conducting glue is mounted on power-supply device 6 by step S3.
This example further preferably includes step S4, and multiple mutually independent institutes are arranged according to the heat dissipation region of the power-supply device 6
State cynapse formula radiator structure.
This example provides a kind of new cynapse formula radiator structures, and as shown in Figures 1 to 4, the cynapse formula radiator structure is adopted
With the radiator structure for being similar to neuron, radiator portion is cylindrical cynapse radiating component 2, compares the heat dissipation side of whole encapsulating
Case, this example save the extra space of original non-heat dissipation element, are changed to using the prominent of cylindrical cynapse radiating component 2
Structure is touched, goes to correspond to each heater element 4, so that between heater element 4 and the hollow cavity 3 of cylindrical cynapse radiating component 2
Fitting tight cooperation, gap is very small, can effectively reduce cylindrical cynapse made of heater element 4 and heat sink material and radiate
Thermal resistance between component 2, while also saving the dosage of heat-conducting glue greatly substantially need to only pour into whole encapsulating in the prior art
/ 10th heat-conducting glue, the heat-conducting glue are preferably heat conductive silica gel；On this basis, the cylindrical cynapse heat dissipation structure
The cooling surface area of part 2 also relatively increases much, and to sum up, this example is realized the efficient of heater element 4 and dissipated with lower cost
Heat.
This example realizes the fixation and heat dissipation to heater element 4 by cylindrical cynapse radiating component 2, simplifies heater element
4 mounting structure and fixed form, reduces the quantity for pouring into heat-conducting glue, reduces thermal resistance, reduces volume, reduces equipment weight
Amount；Meanwhile heat dissipation area can be effectively increased using cylindrical cynapse radiating component 2, compared with the prior art is directly opened,
Infrastructure cost is low；On this basis, the cynapse formula radiator structure is designed using combinable sub-unit, so that replacement and maintenance
It is more convenient.This example enables to the temperature rise of power-supply device 6 original by actual test compared with existing heat sink conception
On the basis of reduce by 40 DEG C or so, effect highly significant.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to of the invention
Protection scope.
Claims (5)
1. a kind of cynapse formula radiator structure applied to large power supply characterized by comprising ontology and cylindrical cynapse dissipate
Hot component, is provided with one or more cylindrical cynapse radiating components on the ontology, in the cylindrical cynapse radiating component
It is provided with the hollow cavity for accommodating heater element, heat-conducting glue, the heat-conducting glue are filled between the heater element and hollow cavity
The heater element is fixed in the hollow cavity；The hollow cavity of each cylindrical cynapse radiating component is all set in one
One-to-one heater element；The heater element is heat-generating cylindrical part；
It further include the splicing component for multiple cynapse formula radiator structure assembly to be got up, the splicing component is set to described
The edge of body；
Multiple cylindrical cynapse radiating components are provided on the ontology, the multiple cylindrical cynapse radiating component is using dislocation
The mode of arrangement is arranged on the body；
The cylindrical cynapse radiating component is to be integrally formed using heat sink material and cynapse formula made of honeycomb radiator structure
Cylindrical body radiating component.
2. the cynapse formula radiator structure according to claim 1 applied to large power supply, which is characterized in that further include peace
Dress portion, the mounting portion are arranged on the body, and the cynapse formula radiator structure is mounted on by the ontology by mounting portion
On power-supply device.
3. the cynapse formula radiator structure according to claim 2 applied to large power supply, which is characterized in that further include rubber
Glue foaming sealing ring, the ontology are tightly connected by rubber pange sealing ring and the power-supply device.
4. a kind of cynapse formula heat dissipating method applied to large power supply, which is characterized in that the cynapse formula heat dissipating method is used for
A kind of cynapse formula radiator structure applied to large power supply as described in claims 1 to 3 any one, and including following step
It is rapid:
Heater element is placed in the hollow cavity of the cylindrical cynapse radiating component by step S1；
Step S2, fills heat-conducting glue between the heater element and hollow cavity, and then the heater element is fixed on described
In hollow cavity；
Cynapse formula radiator structure after populated heat-conducting glue is mounted on power-supply device by step S3.
5. the cynapse formula heat dissipating method according to claim 4 applied to large power supply, which is characterized in that further include step
Multiple mutually independent cynapse formula radiator structures are arranged according to the heat dissipation region of the power-supply device in rapid S4.
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| CN201610824461.XA CN106255390B (en) | 2016-09-14 | 2016-09-14 | A kind of cynapse formula radiator structure and method applied to large power supply |
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| CN201610824461.XA CN106255390B (en) | 2016-09-14 | 2016-09-14 | A kind of cynapse formula radiator structure and method applied to large power supply |
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| CN106255390B true CN106255390B (en) | 2019-04-09 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106659034A (en) * | 2016-12-27 | 2017-05-10 | 艾思玛新能源技术（江苏）有限公司 | Apparatus used for accommodating heating elements |
| CN111741665A (en) * | 2020-07-30 | 2020-10-02 | 上海空间电源研究所 | Heat radiation structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201294705Y (en) * | 2008-10-28 | 2009-08-19 | 无锡斯达四方电气有限公司 | High-power power supply self-cooling type radiator |
| CN103582391A (en) * | 2012-07-27 | 2014-02-12 | Tdk株式会社 | Power supply device |
| CN104704933A (en) * | 2012-07-27 | 2015-06-10 | 伊利诺斯工具制品有限公司 | Rectifier module for power conversion circuits |
| CN105828573A (en) * | 2015-01-23 | 2016-08-03 | 洛克威尔自动控制技术股份有限公司 | Devices and methods for cooling bus capacitors |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203446168U (en) * | 2013-08-28 | 2014-02-19 | 深圳麦格米特电气股份有限公司 | Power element heat dissipation structure |
| CN105682415B (en) * | 2014-11-20 | 2019-04-19 | 深圳万讯自控股份有限公司 | A kind of heat dissipating method of radiator, driver and the driver |
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- 2016-09-14 CN CN201610824461.XA patent/CN106255390B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201294705Y (en) * | 2008-10-28 | 2009-08-19 | 无锡斯达四方电气有限公司 | High-power power supply self-cooling type radiator |
| CN103582391A (en) * | 2012-07-27 | 2014-02-12 | Tdk株式会社 | Power supply device |
| CN104704933A (en) * | 2012-07-27 | 2015-06-10 | 伊利诺斯工具制品有限公司 | Rectifier module for power conversion circuits |
| CN105828573A (en) * | 2015-01-23 | 2016-08-03 | 洛克威尔自动控制技术股份有限公司 | Devices and methods for cooling bus capacitors |
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